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Helios SA-600

EUTECTIC DIE BONDER

A High Precision and Flexible Solution for your Eutectic Applications

Helios SA-600
Features

Performance

Control System

High Precision +/- 0.5um Handle Small Die 0.2mm x 0.2mm Low Bonding Force 30g min Rotary Bonding tool Voice Coil bond force control Gentle Pickup Synchronize Ejector

PC Based Control system Interactive menu driven control User customizable menu USB interface for data exchange

Vision System

Material Handling

256 grey levels PR system Geometric Features recognition Die Alignment Ink dot detection

Thin Substrate handling PCB/Ceramic substrate

Bond Head

Die Handling

Precision Ball Screw Servo Driven No stick Z pickup linear bearing Easy maintenance

Waffle Pak Gel Pak

HEATING METHOD Resistance Heating Digital PID Max. Temperature 500C Temp. Ramp Rate 450C within 10 seconds Ramp Overshoot < 5C +/- 2C 8 Stages (user programmable)

COOLING METHOD Free Air or Force Air

Product that requires certain degree of customization is available. Please consult PISTOS for such inquiries.

Trusted Technology. Creative Engineering

Helios SA-600
EUTECTIC DIE BONDER

Temperature stability chart : 400 C is less than+/- 1.5 C

Temperature ramp up performance chart From 200 C to 450 C just in 1 second

Multiple temperature linear or exponential ramp chart

Helios SA-600
EUTECTIC DIE BONDER

Trusted Technology. Creative Engineering

Helios SA-600
EUTECTIC DIE BONDER

Waffle Pak Handling

Pulse Heat Workholder

Bond Head

Multiple Optics
Windows GUI

Helios SA-600
Specifications
Die Size Package Handling 8 x 8mil 200 x 200mil PCB, Ceramic, Flex Circuit

Substrate Size Length Width Thickness

1 (25mm) 1 (25mm) 0.002 0.25 (0.050 6.35mm)

Wafer Stage XY Table Travel


Bond Head Bond force Resolution

75mm x 180mm

30 200g 2um

Pattern Recognition System PRS 256 Grey Level Camera resolution 640pixel x 480pixel Positional accuracy +/- pixel System Accuracy XY Positional Angle Facilities Required Voltage Frequency Compressed air Dimension & Weight LxBxH Weight

+/- 0.5 um +/- 0.1 deg

110/220/230VAC (pre set at factory) 50/60Hz (pre-set at factory) 80 PSI (Min)

1000mm x 800mm x 1650mm 350kg (Depend on configurations)

Pistos Solutions Pte Ltd Block 996 Bendemeer Road. #04-01 Kallang Basin Industrial Estate. Singapore 339944 EMAIL: Enquiry@pistos-solutions.com

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