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Helios SA-600
Features
Performance
Control System
High Precision +/- 0.5um Handle Small Die 0.2mm x 0.2mm Low Bonding Force 30g min Rotary Bonding tool Voice Coil bond force control Gentle Pickup Synchronize Ejector
PC Based Control system Interactive menu driven control User customizable menu USB interface for data exchange
Vision System
Material Handling
256 grey levels PR system Geometric Features recognition Die Alignment Ink dot detection
Bond Head
Die Handling
Precision Ball Screw Servo Driven No stick Z pickup linear bearing Easy maintenance
HEATING METHOD Resistance Heating Digital PID Max. Temperature 500C Temp. Ramp Rate 450C within 10 seconds Ramp Overshoot < 5C +/- 2C 8 Stages (user programmable)
Product that requires certain degree of customization is available. Please consult PISTOS for such inquiries.
Helios SA-600
EUTECTIC DIE BONDER
Helios SA-600
EUTECTIC DIE BONDER
Helios SA-600
EUTECTIC DIE BONDER
Bond Head
Multiple Optics
Windows GUI
Helios SA-600
Specifications
Die Size Package Handling 8 x 8mil 200 x 200mil PCB, Ceramic, Flex Circuit
75mm x 180mm
30 200g 2um
Pattern Recognition System PRS 256 Grey Level Camera resolution 640pixel x 480pixel Positional accuracy +/- pixel System Accuracy XY Positional Angle Facilities Required Voltage Frequency Compressed air Dimension & Weight LxBxH Weight
Pistos Solutions Pte Ltd Block 996 Bendemeer Road. #04-01 Kallang Basin Industrial Estate. Singapore 339944 EMAIL: Enquiry@pistos-solutions.com