DEPARTMENT OF TECHNICALEDUCATION

ANDHRAPRADESH
Name : Smt. Rani Kavati
Designation : Lecturer
Branch : AEIE
Institute : S.G.P.R Govt. Polytechnic, kurnool
Semester : V Semester
Subject : Linear IC Applications
Subject code : AEI-505
Topic : Introduction To Op-amp
Duration : 50 min
Sub Topic : Operational amplifier
Teaching Aids : Diagrams.
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 Objectives

Upon the completion of this topic the

student will be able to
• Name commonly used manufacturing
methods of IC’s
• Name and sketch package styles of IC’s.
• Draw the pin diagram of typical IC 741.

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 Integrated ICs

Hybrid circuits Monolithic circuits

Bipolar Uni polar

Dielectric PN junction
Isolation MOS FET JFET
Isolation
Thick film Thin film

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 Package Types

• The flat pack type.

• The Metal can (TO) Type.
• The Dual-in-line Package (DIP).

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Fig:1(a) 14 - lead version

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fig:1(b) 8- lead version

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fig:1(c)8,10,and 12 - lead version

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fig:1(d)

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fig:1(e)

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8-PIN MINI DIP

fig:1(f)

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14-PIN DIP

fig:1(g)

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8-PIN METAL CAN

fig:1(h)

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 Summary

We have discussed about

• Package styles of IC’s.

• Pin diagram of typical IC 741.

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 Quiz

1. Mention one IC package styles.

a) Flat pack type.

b) Hybrid type.

c) Linear type.

d) Digital type.

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 Quiz contd…

1. Mention one IC technology’s.

a) Digital IC’s

b) Linear IC’s

c) Monolithic IC’s

d) None

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 Frequently Asked Questions

3. List manufacturing methods of IC’s .

5. Draw package styles of IC’s.

3. Draw the pin diagram of typical IC 741.

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