COPPER-TIN ALLOYS

The important alloys of copper and tin from an industrial point of view are the bronzes comprised within certain limits of tin content. As in the case of the brasses, the addition of tin to copper results in the formation of a series of solid solutions. The addition of tin to copper results in the formation of a series of solid solutions which, in accordance with usual practice, are referred to in order of diminishing copper content as the , , , etc., constituents.

PHASE DIAGRAM Sn-Cu

Figure show the phase diagram for Sn-Cu

PHYSICAL PROPERTIES
(Atomic arrangement sn-cu)

Figure: Projection of the structure of Yb3.63Cu23.13Sn10.83 along the c axis. Open, full and double circles represent atoms at heights 0, 1/2 and 1/4 , respectively. The Yb1 atoms are inside the highlighted polyhedra, while Yb2 (open large circles) and Cu4 (small full circles) are at the vertices of the unit cell.

(Defects) The concept of a defect phase diagram is introduced which quantifies the effects of Cu and Pb additions to electrodeposited Sn films on surface defect formation, including but not limited to the formation of Sn whiskers. Transitions were observed in both the defect densities and the morphologies of hillocks and whiskers as Cu and Pb film compositions were systematically varied. Changes in crystallographic texture were also reported for a subset of the Sn-Cu-Pb alloys examined. The transitions between different defect types and the coexistence of certain defect types help to interpret the role of grain boundary pinning in hillock and whisker formation.

(Density) High-density area-array 3-D interconnects are a key enabling technology for 3-D integrated circuits. This paper presents results of the fabrication and testing of large 640 by 512 area arrays of Cu/Sn-Cu interconnects positioned on 10- centers. The processes used to create the interconnects are designed to be compatible with CMOS wafer requirements. Through testing of the electrical continuity of long chains of interconnects, bond yield is estimated to be greater than 99.99% in the large arrays. The properties of Cu/Sn-Cu interconnects remain stable through exposure to thermal cycling and high-humidity testing

SOLIDIFICATION FOR Sn-Cu

The important alloys of copper and tin from an industrial point of view are the bronzes comprised within certain limits of tin content. As in the case of the brasses, the addition of tin to cooper results in the formation of a series of solid solutions. The constitutional diagram of copper-tin alloys is very complex, but that part of it which deals with alloys of industrial importance is reproduced in Fig. 1.

Figure 1: Constitutional Diagram of the Copper-Tin Alloys

The addition of tin to copper results in the formation of a series of solid solutions which, in accordance with usual practice, are referred to in order of diminishing copper content as the , , , etc., constituents. The diagram may be summarized as follows:

Percentage composition Copper 100 to 87 87 to 86 86 to 78 78 to 74 Tin 0 to 13 13 to 14 14 to 22 22 to 26

Constituent just below the freezing point + + >( + )

Constituent after slow cooling to 400C + +

Further changes on cooling from 400C to room temperature are so sluggish that they only occur in conditions very far removed from actual practice. The solution is the softest of the constituents; it may be rolled or stamped cold, but it hardens under this treatment much more rapidly decreases than -brass. The and a constituents do not exist in the alloy slowly cooled to room temperature: this is due to successive changes occurring at 586C and 520C whereby is resolved into + and into + . The constituent has the crystal structure of -brass. It has a narrow range of composition corresponding approximately to the formula Cu3lSn8 and, like all intermetallic compounds, is extremely hard and brittle. The -> ( + ) change at 350C does not occur in commercial practice, though alloys richer in tin may contain the a constituent, which corresponds to Cu3Sn, and the solid solution, which approximates to the composition CuSn.

SOLID SOLUBILITY Sn-Cu (hume-rothery rule)

On cooling from the liquid condition, the solid solution which first forms contains only about 2 percent of tin. Thus the cast metal has a cored structure and the coring is very marked because of the long range between liquidus and solidus; but it may be eliminated by diffusion on cooling more slowly or by annealing. Any absorption of oxygen occurring during manufacture results in the presence of SnO2 in the alloy, tending to make it brittle. A deoxidizer such as zinc is therefore frequently added. The addition of zinc, as in coinage bronze, causes no change in the microscopical appearance of the homogeneous constituent. The zinc, however, exerts its deoxidizing effect in the liquid, and slight hardening effect on the solid solution. The structure of a bronze coin shows marked deformation of the crystals. On annealing, recrystallization takes place with subsequent crystal growth. Twinning is a characteristic feature of the cold-worked and annealed alloy.

PHASES
(Occurance) The selection and evaluation of Pb-free solders requires information that is best determined through a knowledge of ternary and higher order phase diagrams. As part of an ongoing program on Pb-free solder phase diagrams at the National Institute of Standards and Technology, a thermodynamic model is formulated for the Sn-Bi-Ag phase diagram. Thermodynamic functions for the various phases obtained by fitting measured data for the three constituent binary systems are extrapolated to the ternary system using the method of Muggianu. Modeling results are compared to preliminary experimental data for the ternary system and are applied in the calculation of the solidification path.

(Stability) A method of limiting cracking in the Cu6Sn5 intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the hightemperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.

PHASE TRANSFORMATION
Copper tin alloys or tin bronzes are known for their corrosion resistance. Tin bronzes are stronger and more ductile than red and semi red brasses. They have high wear resistance and low friction coefficient against steel. Tin bronzes, with up 15.8% tin, retain the structure of alpha copper. The tin is a solid solution strengthener in copper, even though tin has a low solubility in copper at room temperature. The room temperature phase transformations are slow and usually do not occur, therefore these alloys are single phase alloys. The tin bronzes are used in bearings, gears, piston rings, valves and fittings. The cast tin bronzes are designated by UNS C90200 through C91700. Lead is added to tin bronzes in order to improve machinability and pressure tightness. Lead decreases the tensile strength and ductility of the tin bronzes, but the composition can be adjusted to balance machinability and strength requirements. High leaded tin bronzes are primarily used for sleeve bearings. These alloys have a slow fail mechanism that temporarily prevents galling and seizing. The slow fail mechanism works by lead seeping out of the alloy and smearing over the surface of the journal. The cast leaded tin bronzes are designated as UNS C92200 through C94500.

The microstructure of the cast tin bronzes consists of cored dendrites, they have a composition gradient of increasing tin as they grow. The last liquid to solidify is enriched with tin upon cooling, and forms alpha and delta phases. The alpha and delta phases fill in the areas between the dendrite arms. the microstructure of the leaded tin bronzes are similar to the nonleaded materials with the addition of lead particles in the inter-dendritic boundaries. The lead is practically insoluble in solid copper and it solidifies last as almost pure lead in the grain boundaries.

THREE PHASE REACTION

Eutectic transformation

Eutectoid transformation

Peritectic reaction transformation

Peritectoid reaction transformation

Copper tin phase diagram showing a peritectic point

The peritectic reaction (see diagram above) is an important example of a microstructural transformation. Sn 21wt.%Cu exhibits this transformation from a solid phase and a liquid phase to a different, solid phase. Before the transformation begins the system is comprised of the phase and liquid. Below 415C the equilibrium solid phase is The peritectic transformation begins to take place at 415C; the new phase precipitates heterogeneously on the surface of precipitates. The growing layer of on the surface of the epsilon precipitates prevents the copper diffusing out to remove inhomogeneities, so some of the copper is trapped within the precipitates and the liquid has a lower Cu concentration than the bulk composition. This means the peritectic reaction never goes to completion (i.e. all liquid and solid going to the second solid). In this example the liquid continues to cool until it reaches the eutectic temperature, 227C, when it transforms.

MECHANICAL PROPERTIES
Tin (Sn)

TIN coatings were deposited on hot working steel substrates by ion beam assisted deposition technique. The deposition process was conducted at two different temperatures 50 and 400 C. the influence of applied deposition temperature on the mechanical properties, adhesion strength and surface morphology of TIN coatings was studied. The mechanical Properties. i.e. hardness, modulus of elasticity and coating strength was evaluated by generally accepted scraptch test testnique. In addition, HRC adhesion test was utilized to compare adhesion of different coatings qualitatively. Surface morphology was analyzed by atomic force microscopy before and after the film deposition. The coating deposited at higher temperature displayed higher hardness, and also higher critical loads were obtained during the deposition process enhances the adatom mobility allowing the deposition of coatings with high hardness and adhesion strength even at low temperatures.

Copper (Cu)

The mechanical properties and microstructures of copper and brass soldered with eutectic tin-bismuth solder have been determined and the joints examined using metallographic techniques. Joints made with copper were stronger than those made with brass. At the copper/solder interface a uniform layer 2m thick of Cu5.2Sn5 was formed and at the brass/solder interface a uniform layer 2 m thick of (Cu, Zn)2.9Sn and an irregular layer 2 to 5m thick of (Cu, Zn)5.7Sn5 were formed. Copper joints fractured etthocopper/solder interface and brass joints fractured in the internmetalic layer. Copper joints soldered with eutectic Sn-Bi were stronger than copper joints soldered with eutectic Sn-Pb and the reverse was true for brass joints. Results are also given for the effect of thermal shock on copper and brass joints soldered with Sn-Bi and Sn-Pb solders, and also for We fatigue and creep behaviour of joints soldered with eutectic SnBi solder.

APPLICATION FOR Sn-Cu

(Electric motors) Main article: Copper in energy efficient motors Coppers greater conductivity versus other metallic materials enhances the electrical energy efficiency of motors. This is important because motors and motordriven systems account for 43%-46% of all global electricity consumption and 69% of all electricity used by industry.[73] Increasing the mass and cross section of copper in a coil increases the electrical energy efficiency of the motor. Copper motor rotors, a new technology designed for motor applications where energy savings are prime design objectives, are enabling general-purpose induction motors to meet and exceed National Electrical Manufacturers Association (NEMA) premium efficiency standards.

(Wire and cable)

Main article: Copper wire and cable Despite competition from other materials, copper remains the preferred electrical conductor in nearly all categories of electrical wiring with the major exception being overhead electric power transmission where aluminium is often preferred. Copper wire is used in power generation, power transmission, power distribution, telecommunications, electronics circuitry, and countless types of electrical equipment. Electrical wiring is the most important market for the copper industry. This includes building wire, communications cable, power distribution cable, appliance wire, automotive wire and cable, and magnet wire. Roughly half of all copper mined is used to manufacture electrical wire and cable conductors. Many electrical devices rely on copper wiring because of its multitude of inherent beneficial properties, such as its high electrical conductivity, tensile strength, ductility,creep (deformation) resistance, corrosion resistance, low thermal expansion, high thermal conductivity, solderability, and ease of installation.

REFERENCES
http://link.springer.com/article/10.1007%2FBF03029299?LI=true#page-1 http://www.chemguide.co.uk/physical/phaseeqia/snpb.html http://www.copper.org/resources/properties/microstructure/cu_tin.html http://www.keytometals.com/Article70.htm http://en.wikipedia.org/wiki/Tin http://en.wikipedia.org/wiki/Copper http://www.mas.bg.ac.rs/istrazivanje/biblioteka/publikacije/Transactions_FME/Volume40/ 1/06_PTerek.pdf)