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CONTENTS

SECTION 1. SUMMARY
SERVICING PRECAUTIONS ..................................................................................................................... 1-2
ESD PRECAUTIONS .................................................................................................................................. 1-3
SPECIFICATIONS ...................................................................................................................................... 1-4

SECTION 2. ELECTRICAL
ADJUSTMENTS .......................................................................................................................................... 2-1
INTERNAL BLOCK DIAGRAM of ICS ........................................................................................................ 2-6
BLOCK DIAGRAM .................................................................................................................................... 2-11
WIRING DIAGRAM(Deck Mechanism) ..................................................................................................... 2-12
SCHEMATIC DIAGRAM ............................................................................................................................ 2-13
PCB LAYOUT ............................................................................................................................................ 2-15
MAIN P.C. BOARD(SOLDER SIDE) ....................................................................................................... 2-15
MAIN P.C. BOARD(COMPONENT SIDE) ............................................................................................... 2-17
FPONT P.C. BOARD ............................................................................................................................... 2-19
RF P.C. BOARD ..................................................................................................................................... 2-19

SECTION 3. CABINET MAIN CHASSIS & MECHANSIM


EXPLODED VIEW & PART LIST .................................................................................................................. 3-1

SECTION 4. REPLACEMENT PARTS LIST ........................................................................................... 4-1

- 1-1 -

SECTION 1. SUMMARY
SERVICING PRECAUTIONS
1. Always disconnect the power source before:
1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.
2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.
3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.
CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in
an explosion hazard.
2. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service
manual might be equipped.
3. Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state
device heat sinks are correctly installed.
4. Always connect a test instruments ground lead to the instrument chassis ground before connecting
the test instrument positive lead. Always remove the test instrument ground lead last.
1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing,
follow the printed or indicated service precautions and service materials.
2) The Components used in the unit have a specified conflammability and dielectric strength. When
replacing any components, use components which have the same ratings. Components marked
in
the circuit diagram are important for safety or for the characteristics of the unit. Always replace with the
exact components.
3) An insulation tube or tape is sometimes used and some components are raised above the printed writing
board for safety. The internal wiring is sometimes clamped to prevent contact with heating components.
Install them as they were.
4) After servicing always check that the removed screws, components and wiring have been installed
correctly and that the portion around the service part has not been damaged. Further check the insulation
between the blades of attachment plug and accessible conductive parts.

- 1-2 -

ESD PRECAUTIONS
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are
integrated circuits and some field-effect transistors and semiconductor chip components. The following
techniques should be used to help reduce the incidence of component damage caused by static electricity.

1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain


off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging wrist strap device, which should be removed for potential
shock reasons prior to applying power to the unit under test.

2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4) Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static
can generate electrical charges sufficient to damage ESD devices.

5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.

6) Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together
by conductive foam, aluminum foil or comparable conductive material).

7) Immediately before removing the protective material from the leads of a replacement ESD device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless
motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor
can generate static electricity sufficient to damage an ESD device).

- 1-3 -

SPECIFICATIONS
1. GENERAL
Power requirements ..................................................................................................................... DC12V~15V
Ground system ................................................................................................................................... Negative
Dimensions(W x H x D) ...................................................................................................... 188 x 58 x 166mm
Weight .............................................................................................................................................. Net: 1.3kg

2. RADIO SECTION
FM
.................................
Frequency range
65.0~74.0MHz(Optional),
87.5~108MHz
Intermediate frequency ....................... 10.7MHz
Usable sensitivity ................................ 10dBV
Signal to noise ratio ............................ 60dB

AM(MW)
522~1,620kHz
(Optional:530~1,710kHz/
520~1,620kHz)
450kHz
28dBV
50dB

LW(Optional)
144~281kHz

450kHz
35dBV
50dB

3. TAPE SECTION
Tape type ................................................................................................................. 2 track 2 channel system
Tape speed .................................................................................................................................... 4.75cm/sec
Wow and flutter .......................................................................................................................... 0.2%(WRMS)
Signal to noise ratio ................................................................................................................................. 50dB

4. AUDIO SECTION
Maximum output power ....................................................................................................................... 40W x 4
Frequency response ............................................................................................................ 40Hz to 14,000Hz
Speaker impedance ............................................................................................................... 4 x 4 or 8 x 4
Signal to noise ratio ................................................................................................................................. 60dB

NOTE: The design and specifications are subject to change without notice in the sourse of product
improvement.

- 1-4 -

SECTION 2. ELECTRICAL
ADJUSTMENTS
1. Test & Adjustment point

A
B

T101

C
D

E
VR301

<BOTTOM VIEW>

<TOP VIEW>
Figure 1. MAIN PCB Board

L206

L256

T202

T201

L254

L204

L255
L205

Figure 2. RF PCB Board

- 2-1 -

2. FM Adjustment

Figure 3.

(1) The impedance of FM antenna terminal is 75


Therefore, connect coaxial cable (3C-2V etc.) between FM SG and antenna terminal when wiring.
Item

FM SSG Attenuator
Indication

Available
Power Ratio

Antenna
Terminal Voltage

Open indication type

0dB
60dB

5.2dBf
65.2dBf

6dB/V
66dB/V

Load or close
indication type

0dB
54dB

11.2dBf
65.2dBf

12dB/V
66dB/V

Type

(2) There are two kind in indication of FM SG output attenuator.


1) Attenuator with Marking of 75 open...open indication type.
2) Attenuator with marking of 75 load or close...load or close indication type.
(3) FM SG output level in this FM adjustment are described as open indication type. The left table shows
relations among FM SG attenuator indication(dB), available power ratio(dBf) and antenna terminal
voltage(dB/V) in each indication type.
Notes:

1. BAND Switch ........................................................................................................................................ FM


2. BALANCE ....................................................................................................................................... Center
3. TREBLE/BASS ................................................................................................................................ Center
4. Connect as shown in figure 3.
5. Refer to figure 1~2 for Adjustment Points.
STEP

SUBJECT

FEED SIGNAL
FROM

TO

Discriminator

98MHz 60dB
22.5kHz Dev.
1kHz FM SSG

ANT Jack
or
A
Point XX

MPX
Adjustment

98MHz 60dB
Same as
75kHz Dev.1kHz above
FM SSG

MEASURE OUTPUT

ADJUSTMENT

C & Point
Between Point XX
D DC Volt Meter.
XX,

T101

DC 0V10mV

E & GND,
Between Point XX
Frequency Counter

VR301

76kHz50Hz

- 2-2 -

ADJUST FOR

3. AM(MW) Adjustment

Figure 4.

Notes:

1. BAND Switch ................................................................................................................................... AM(MW)


2. Connect as shown in figure 4.
3. Refer to figure 1~2 for Adjustment Points.
STEP

SUBJECT

520 or 522kHz

FEED SIGNAL
FROM

TO

No Input

MEASURE OUTPUT
LCD Display
(Reception Frequency)

Tuning Voltage
Adjustment

B and GND,
Between Point XX
DC Volt Meter

IF Coil
Adjustment

600kHz or
603kHz ANT
input, 30dB,
400Hz (30%
MOD) SSG.

600kHz or
600kHz or
603kHz
603kHz ANT
RF Adjustment input, 30dB,
400Hz (30%
MOD) SG.

ADJUSTMENT
TUNE +/- Button

L206

ANT Jack
A
or PointXX

Output L or R ch,
VTVM & Oscilloscope

T201 & T202

Same as
above

LCD Display
(Reception Frequency)

TUNE +/- Button

Output L or R ch,
VTVM & Oscilloscope

L204 & L205

- 2-3 -

ADJUST FOR
520 or 522kHz

DC 1.2V 0.05V
Max. Output

600 or 603kHz

Max. Output

4. LW Adjustment(Optional)

Figure 5.

Notes:

1. BAND Switch ........................................................................................................................................... LW


2. Connect as shown in figure 5.
3. Refer to figure 1~2 for Adjustment Points.

STEP
1

SUBJECT
144kHz

FEED SIGNAL
FROM

TO

No Input

LCD Display
(Reception Frequency)

Tuning Voltage
Adjustment
2

150kHz
150kHz
RF Adjustment ANT input,
30dB, 400Hz
(30% MOD)
SSG.

MEASURE OUTPUT

Between Point XX
B and GND,
DC Volt Meter
ANT Jack
A
or PointXX

ADJUSTMENT
TUNE +/- Button

L256

LCD Display
(Reception Frequency)

TUNE +/- Button

Output L or R ch,
VTVM & Oscilloscope

L254 & L255

- 2-4 -

ADJUST FOR
144kHz

DC 1.2V 0.05V

150kHz

Max. Output

5. Cassette Deck Adjustment


(1) Before this adjustment, clean PLAYBACK head surface.
(2) For this adjustment, use test tape MTT-114.
(3) VOLUME ...................................... Center
(4) BALANCE .................................... Center
(5) TREBLE/BASS ............................ Center
(6) Connect as shown in figure 6.

Figure 6.

Screw Driver

Reverse Head Azimuth


Adjustment Screw

Forward Head Azimuth


Adjustment Screw
Head

Figure 7.

SUBJECT

MEASURE OUTPUT

SETTING

ADJUSTMENT

ADJUST FOR

REMARKS

P.B Head
Adjustment

L-CH, R-CH, VTVM and


Scope See figure 6.

Playback(FWD &
REV) the TEST
TAPE MTT-114

Adjust the azimuth


adjusting screw
(in figure 7).

Max. Output
both channels
on FWD and
REV PLAY

After this
adjustment, lock
the screw with
paint.

- 2-5 -

INTERNAL BLOCK DIAGRAM of Ics


IC101 DBL 1018(LA 1140)

IC201 DBL 1019 (LA1135)

- 2-6 -

IC301 KIA6043S

IC401 KIC9256P

NOTE: Mark terminals are not existence in KIC9256P, KIC9256F


Terminal name of KIC9256P, KIC9256F is shown in parentheses.
Others are common terminals.

- 2-7 -

IC402 PD789104GS-204
PIN Port

P-NAME

I/O Act

DESCRIPTION

P23

FRTCLK

O
I

FRONT IC CLOCK Data OUTPUT


DIODE MATRIX as DIO IN2 line

P24

ACC IN

ACC DETECT INPUT ACTIVE = LOW

P25

CDC DI

Avdd

CD CHANGER DATA INPUT


A/D Reference Voltage (5V)

P60

KEYIN

P61

DIR

P62

SD

P63

STIN

AD KEY - IN input.
Used for also front panel detecting.
Less than 0.17V : regarded as the panel opened.
Refer to application circuit.
H/L TAPE DIRECTION INPUT (H = FORWARD)
Tuner SEEK stop detector input
- Seek Stop threshold voltage :
AM : 1.2V, FM : 1.5V

FM Stereo detect input Active = Low

AVSS

GROUND

10

NC

11 P50

CDCO

CDC Data Output : Should be connected to CDCI

12 P51

PEVDATA

E VR Communication DATA OUT

13 P52

MUTE/LED

Used as Power IC mute. Active = Low


Used as blinking LED. On duty = 10%

14 P53

TPMUTE

15 P00

FRTDO/
DIO IN0

O
I

16 P01

CDON

When CDC mode this port is high output


(future function)

17 P02

POWER

When system is on, this port is used as power out


port

18 P03

TAPE IN

For tape mode, Active high voltage should be applied.


L = RADIO mode.

19

RESET

RESET INPUT

20

IC

Connect to GROUND

21

NC

NO CONNECTION

22

X2

X-tal

23

X1

X-tal

24

Vss

System ground

25

Vdd

System Power Supply (5V)

26 P10

FINH

27 P11

PERI/
DIO OUT2

O
O

PLL IC PERIODE communication port


Diode matrix DIO OUT 2 line

28 P20

PEVCLK
DIO OUT0

O
O

PLL IC and E. VOL IC CLOCK communication port


Diode matrix DIO OUT 0 line

29 P21

PDATA
DIO OUT1

O
O

PLL IC DATA communication port


Diode matrix DIO OUT 1 line

30 P22

FRTCE
DIO IN1

O
I

FRONT IC CE communication port


Diode matrix DIO IN 1 line

NO CONNECTION

TAPE MUTE INPUT (LOW = MUTE)


FRONT IC DATA Out communication port
Diode matrix IN0 input

Front IC INH port.

- 2-8 -

When not used

REMARK

IC501 LA3160

IC601 PT2313L

- 2-9 -

TDA 8567Q

IC901 LC75833E

- 2-10 -

BLOCK DIAGRAM

NOTE: Block diagram for this model are subject to change for improvement without prior notice.
- 2-11 -

WIRING DIAGRAM(Deck Mechanism)

- 2-12 -

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