Professional Documents
Culture Documents
January 2008
General Description
The 74F245 contains eight non-inverting bidirectional buffers with 3-STATE outputs and is intended for busoriented applications. Current sinking capability is 24mA at the A Ports and 64mA at the B Ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active HIGH) enables data from A Ports to B Ports; Receive (active LOW) enables data from B Ports to A Ports. The Output Enable input, when HIGH, disables both A and B Ports by placing them in a High Z condition.
Ordering Information
Order Number
74F245SC 74F245SJ 74F245MSA 74F245MTC 74F245PC
Package Number
M20B M20D MSA20 MTC20 N20A
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard.
www.fairchildsemi.com
Connection Diagram
Logic Symbols
IEEE/IEC
Truth Table
Inputs OE
L L H
T/R
L H X
Output
Bus B Data to Bus A Bus A Data to Bus B High Z State
Description
Output Enable Input (Active LOW) Transmit/Receive Input Side A Inputs or 3-STATE Outputs Side B Inputs or 3-STATE Outputs
U.L. HIGH/LOW
1.0/2.0 1.0/2.0 3.5/1.083 150/40 (38.3) 3.5/1.083 600/106.6 (80)
www.fairchildsemi.com 2
Symbol
TSTG TA TJ VCC VI II Storage Temperature
Parameter
Ambient Temperature Under Bias Junction Temperature Under Bias VCC Pin Potential to Ground Pin Input Voltage(1) Input Current(1) Voltage Applied to Output in HIGH State (with VCC = 0V) Standard Output 3-STATE Output Current Applied to Output in LOW State (Max.) ESD Last Passing Voltage (Min.)
Rating
65C to +150C 55C to +125C 55C to +150C 0.5V to +7.0V 0.5V to +7.0V 30mA to +5.0mA 0.5V to VCC 0.5V to +5.5V twice the rated IOL (mA) 4000V
Symbol
TA VCC Free Air Ambient Temperature Supply Voltage
Parameter
Rating
0C to +70C +4.5V to +5.5V
www.fairchildsemi.com 3
DC Electrical Characteristics
Symbol
VIH VIL VCD VOH
Parameter
Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 10% VCC 10% VCC 5% VCC
VCC
Conditions
Recognized as a HIGH Signal Recognized as a LOW Signal
Min.
2.0
Typ.
Max.
Units
V
0.8 1.2 2.4 2.0 2.7 0.5 0.55 5.0 7.0 0.5 50 4.75 3.75 1.2 70 650 60 100 70 95 85 150 225 500 90 120 110
V V V
Min. Min.
IIN = 18mA IOH = 3mA (An) IOH = 15mA (Bn) IOH = 3mA (An)
VOL IIH IBVI IBVIT ICEX VID IOD IIL IIL + IOZL IOS IZZ ICCH ICCL ICCZ
Min. Max. Max. Max. Max. 0.0 0.0 Max. Max. Max. Max. 0.0V Max. Max. Max.
IOL = 24mA (An) IOL = 64mA (Bn) VIN = 2.7V VIN = 7.0V (OE, T/R) VIN = 5.5V (An, Bn) VOUT = VCC (An, Bn) IID = 1.9A, All Other Pins Grounded VIOD = 150mV, All Other Pins Grounded VIN = 0.5V (T/R, OE) VOUT = 2.7V (An, Bn) VOUT = 0.5V (An, Bn) VOUT = 0V (An) VOUT = 0V (Bn) VOUT = 5.25V(An, Bn) VO = HIGH VO = LOW VO = HIGH Z
V A A mA A V A mA A A mA A mA mA mA
Input HIGH Current Breakdown Test Input HIGH Current Breakdown (I/O) Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current Output Leakage Current Output Short-Circuit Current Bus Drainage Test Power Supply Current Power Supply Current Power Supply Current
www.fairchildsemi.com 4
AC Electrical Characteristics
TA = +25C, VCC = +5.0V, CL = 50pF Symbol
tPLH, tPHL tPZH, tPZL tPHZ, tPLZ
Parameter
Propagation Delay, An to Bn or Bn to An Output Enable Time Output Disable Time
Min.
2.5 2.5 3.0 3.5 2.0 2.0
Typ.
4.2 4.2 5.3 6.0 5.0 5.0
Max.
6.0 6.0 7.0 8.0 6.5 6.5
Max.
7.5 7.5 9.0 10.0 9.0 10.0
Min.
2.0 2.0 2.5 3.0 2.0 2.0
Max.
7.0 7.0 8.0 9.0 7.5 7.5
Units
ns ns ns
www.fairchildsemi.com 5
Physical Dimensions
13.00 12.60 11.43
20 B 11 A
0.51 0.35
0.25
M
10
1.27
C B A
1.27
0.65
2.65 MAX
SEE DETAIL A
0.33 0.20
0.10 C SEATING PLANE
X 45
0.30 0.10
A) THIS PACKAGE CONFORMS TO JEDEC MS-013, VARIATION AC, ISSUE E B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS. D) CONFORMS TO ASME Y14.5M-1994 E) LANDPATTERN STANDARD: SOIC127P1030X265-20L F) DRAWING FILENAME: MKT-M20BREV3
SEATING PLANE
DETAIL A
SCALE: 2:1
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specications do not expand the terms of Fairchilds worldwide terms and conditions, specically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/
www.fairchildsemi.com 6
Figure 2. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specications do not expand the terms of Fairchilds worldwide terms and conditions, specically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/
www.fairchildsemi.com 7
Figure 3. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specications do not expand the terms of Fairchilds worldwide terms and conditions, specically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/
www.fairchildsemi.com 8
Figure 4. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specications do not expand the terms of Fairchilds worldwide terms and conditions, specically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/
www.fairchildsemi.com 9
26.92 24.89
PIN #1
7.11 6.09
(0.97)
1.78 1.14
7 TYP
7.87
NOTES:
Figure 5. 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specications do not expand the terms of Fairchilds worldwide terms and conditions, specically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/
www.fairchildsemi.com 10
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. PDP-SPM SyncFET Power220 Power247 The Power Franchise POWEREDGE Power-SPM PowerTrench TinyBoost Programmable Active Droop TinyBuck QFET TinyLogic QS TINYOPTO QT Optoelectronics TinyPower Quiet Series TinyPWM RapidConfigure TinyWire Fairchild SMART START Fairchild Semiconductor SerDes SPM FACT Quiet Series UHC STEALTH FACT Ultra FRFET SuperFET FAST UniFET SuperSOT-3 FastvCore VCX * SuperSOT-6 FlashWriter SuperSOT-8 * EZSWITCH and FlashWriter are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I32
ACEx Build it Now CorePLUS CROSSVOLT CTL Current Transfer Logic EcoSPARK EZSWITCH *
FPS FRFET Global Power ResourceSM Green FPS Green FPS e-Series GTO i-Lo IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MillerDrive Motion-SPM OPTOLOGIC OPTOPLANAR
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
www.fairchildsemi.com 11