HSDL - 9100

Surface-Mount Proximity Sensor

Data Sheet

Description
The HSDL-9100 is an analog-output reective sensor with an integrated high eciency infrared emitter and photodiode housed in a small form factor SMD package. The optical proximity sensor is housed in a specially designed metal-shield to ensure excellent optical isolation resulting in low optical cross-talk. HSDL-9100 has an option for 2.7 or 2.4mm height parts with its small form SMD package and at a detection range from near zero to 60mm. It is specically optimized for size, performance and ease of design in mobile constrained applications such as mobile phones and notebooks. HSDL-9100 has extremely low dark current and high signal to noise ratio (SNR) where high SNR is achieved with a pair of highly ecient infrared emitter and highly sensitive detector.

Features
x Excellent optical isolation resulting in near zero optical cross-talk x High eciency emitter and high sensitivity photodiode for high signal-to-noise ratio x Low cost & lead-free miniature surface-mount package Height 2.40 or 2.70 mm Width 2.75 mm Length 7.10 mm x Can be paired up with signal conditioning IC (APDS-9700) x Detect objects from near zero to 60mm x Low dark current x Guaranteed Temperature Performance -40C to 85C x Lead-free and RoHS Compliant

Application Support Information

The Application Engineering Group is available to assist you with the application design associated with HSDL-9100 Proximity Sensor. You can contact them through your local sales representatives for additional details.

Applications
x Mobile phones x Notebooks x Industrial Control x Printers, Photocopiers and Facsimile machines x Home Appliances x Vending Machines

Order Information
Part Number
HSDL-9100-021 HSDL-9100-024

Description
2.7mm Height 2.4mm Height

Packaging Type
Tape & Reel Tape & Reel

Package
SMD SMD

Quantity
2500 2500

Block Layout
LED 1 LED_A 2 LED_K Photodiode 4 DET_K 3 DET_A

Pins Conguration Table

Pin
1 2 3 4
TOP VIEW

Symbol
LED_A LED_K DET_A DET_K

Description
LED Anode LED Cathode Photodiode Anode Photodiode Cathode

Notes
1 -

Figure 1. Block Layout of HSDL-9100

Notes: Voltage to supply across the LED; VLED

Absolute Maximum Ratings (Ta=25C) Ratings Parameter

Emitter Continuous Forward Current Coupled Total Power Dissipation (refer to Figure 1) Operating Temperature Storage Temperature Reow Soldering Temperature

Symbol
IDC PTOT TOP TSTG TSOL

Min.
-40 -40 -

Max
100 165 +85 +100 260

Units
mA mW C C C

Electrical-Optical Characteristics (Ta=25C) Ratings Parameter

Emitter Forward Voltage Reverse Voltage Peak Wavelength Spectrum Width of Half Value Detector Dark Current Forward Voltage Reverse Breakdown Voltage Coupled Output Current Peak Output Distance Operating Cross Talk Current Rise Time (LED) Fall Time (LED) Rise Time (Photodiode) Fall Time (Photodiode)
** L = 0 (zero light condition) Note: 1. ILed = 300mA Pulse, 5% Duty Cycle (Kodak 18% Reectance Gray Card)

Symbol
VF VR lp Dp IDark VF VBR IO DO IFD TRL TFL TRD TFD

Test Condition
IF = 100mA IR = 10PA IF = 20mA IF = 20mA VR = 10V, L** = 0 IF = 10mA , L=0 IR = 100uA, L = 0 Refer to Fig 2 Refer Note 1 Refer to Fig 3 RL = 50: RL = 50: RL = 5.1K: RL = 5.1K:

Min
5 0.5 -

Typ
1.50 940 50 2 10 5 50 50 6 6

Max
1.65 10 1.3 35 200 -

Units
V V nm nm nA V V PA mm nA ns ns Ps Ps

Output Current Test Condition (Ta=25C)

Dark Current Test Condition (Ta=25C)

LIGHT SEALED DARK BOX

KODAK GRAY CARD 18% REFLECTION

LED PHOTODIODE

LED

PHOTODIODE

IF

IO

IF

IDARK

Figure 2.
Test Condition used are D = 5mm 18% Gray Card, ILED = 300mA Pulse, 5% Duty Cycle

Figure 3.
Test Condition used are ILED = 300mA Pulse, 5% Duty Cycle

Response Time Test Condition (Ta=25C)

KODAK GRAY CARD 18% REFLECTION

LED PHOTODIODE

5mm

INPUT

90%
IF R LED PULSE GENERATOR RL IO

OUTPUT
SCOPE

10% TF

TR

Figure 4. Response Time Test Condition

Typical Radiation Prole for HSDL-9100

HSDL-9100 Typical LED Angular Emitting Prole
1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle (degree)

HSDL-9100 Typical Photodiode Angular Responsivity Prole

1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle (degree)

Normalized radiant intensity

Normalized Responsivity

Typical Characteristics
LED Forward Current Vs Temperature 100 90 80 70 Forward Current Power (mW) 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 Temperature (C) 200 180 160 140 120 100 80 60 40 20 0 0 10 20 30 40 50 Temperature (C) 60 70 80 90 Power Dissipation Vs Temperature

LED Forward Current Vs Forward Voltage @ Across Temperature 0.12 0.1 0.08 0.06 0.04 0.02 25 -25 85

(Photodiode) Forward Current Vs Forward Voltage@Across Temp

.0 20 0

E-3
25 -25 85

10

-3 .0E .0E -3 -3

Forward Current (A)

Forward Current (A)

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6

80

60 40 20

.0E

.0E

-3

.0E

-3

0 Forward Voltage (V)

0 00

.0E

+0

0.2

0.4

0.6 0.8 1 Forward Voltage (V)

1.2

1.4

1.6

Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.3V 0.1 0.09 0.08 0.07 Forward Current (A) 0.06 0.05 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 60 80 100 Temperature (C) 1V 1.3V Response Time (us)
E 1.0 0 E+ 0 . 0 90 E+0 0.0 80 E+0 0.0 70 E+0 0.0 60 E+0 0.0 50 E+0 0.0 40 E+0 0.0 30 E+0 0.0 20 E+0 0.0 10 E+0 0.1 0.0 00 +3

(Photodiode) Rise/Fall Time Vs Load Resistance@Room Temp, ILED=300mA Pulse (Rise (Fall)

Mean (Fall)

10 100 Load Resistance (kohm)

1000

10000

(Photodiode) Dark Current Vdet = 3/6/9V vs Across Temperature

Output Voltage vs Distance @ Room Temp and RL = 100K Ohm ILED = 100mA, 200mA and 300mA Pulse
1.0 3 E+

1.0 E-6

3V 6V 9V
Output Voltage (mV)

300mA 200mA 100mA

Dark Current (A) 10 10 0.0 .0E E-9 -9

10

0.0

E+

90
10 .0E +0

1.0 E-9

-40

-20

20

40

60

80

100

1.0

E+

Temperature (C)

10 20 3 0 4 0 50 60 8 0 100 120 300 400 450 Distance (mm)

1000 900 800 Output Voltage (mV) 700 600 500 400 300 200 100 0 -10 -8

Output Voltage Vs Edge Distance @ Room Temp and RL=100K Ohm ILED=300mA, D=3/4/5mm 3mm 4mm 5mm

The diagram below illustrates the explanation of edge distance. Edge detection is labeled as D in the diagram below.

18% Reflection Gray Card

-6

-4 -2 0 Edge Distance (mm)

Distance = D(mm)

LED Distance = -D(mm) PIN

5mm

HSDL-9100 Package Outlines

3.88
.9 0 R0

Mounting Centre
R1

1.375

2.35 2.48 3.55 6.9

Tx
0.10

Rx
0.10

2.7

0.05 2.35 7.10

0.8

2.75 0.05

2
2.35

3 4
0.6 1.1

0.625

Pin 1 - LED Anode Pin 2 - LED Cathode Pin 3 - Photodiode Anode Pin 4 - Photodiode Cathode

Photodiode direction mark

Figure 5a. HSDL-9100-021 Package dimensions

3.88

Mounting Centre
R1
2.35 2.48

1.375

R0

.9

Tx
0.1

3.55 6.9

Rx
0.1

2.4

0.05 2.35 7.10 0.625

0.8

2.75 0.05

2
2.35

3 4
2 0.6 1.1

Pin 1 - LED Anode Pin 2 - LED Cathode Pin 3 - Photodiode Anode Pin 4 - Photodiode Cathode

Photodiode direction mark

Figure 5b. HSDL-9100-024 Package dimensions 6

HSDL-9100-021/024 Tape and Reel Dimensions

Rx Cathode Rx Anode 0.35 40.1 20.1 1.550.05 1.75 7.5 Tx Cathode Tx Anode 80.1 2.950.1 PROGRESSIVE DIRECTION UNIT: MM EMPTY (40 mm MIN.) PARTS MOUNTED LEADER (400 mm MIN.) EMPTY (40 mm MIN.) A A B OPTION # 001 021 UNIT: mm "B" 178 330 "C" 60 80 QUANTITY 500 2500 DETAIL A 2.0 0.5 13.0 0.5 B C R 1.0 LABEL 21 0.8 DETAIL A 16.4 +2 0 2.0 0.5 Figure 6. Tape and Reel Dimensions 16 1.5

B-B Section

2.780.07

7.350.1

5 (MAX)

HSDL-9100 Moisture Proof Packaging

All HSDL-9100 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3.

Baking Conditions Chart

Units in A Sealed Moisture-Proof Package

Baking Conditions
If the parts are not stored in dry conditions, they must be baked before reow to prevent damage to the parts.

Package
In reels In bulk

Temp
60 C 100 C 125 C

Time
t 48hours t 4hours t 2 hours

Package Is Opened (Unsealed)

Baking should only be done once.

Environment less than 30 deg C, and less than 60% RH Yes

Recommended Storage Conditions

Storage Temperature Relative Humidity 10C to 30C below 60% RH
No Baking Is Necessary Yes

Package Is Opened less Than 168 hours

Time from unsealing to soldering

After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions.

No

No Perform Recommended Baking Conditions

Figure 7. Baking conditions chart

Recommended Reow Prole

255 T - TEMPERATURE (C) 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS)
MAX 260C

R3

R4

R2 R1

60 sec to 120 sec Above 217C

R5

Process Zone
Heat Up Solder Paste Dry Solder Reow Cool Down Peak Temperature

Symbol
P1, R1 P2, R2 P3, R3 P3, R4 P4, R5

'T
25C to 150C 150C to 200C 200C to 260C 260C to 200C 200C to 25C > 217C 260C > 255C 25C to 260C

Maximum 'T/'time or Duration

3C/s 100s to 180s 3C/s -6C/s -6C/s 60s to 120s 20s to 40s 8mins

Time maintained above liquidus point , 217C Time within 5C of actual Peak Temperature Time 25C to Peak Temperature

The reow prole is a straight-line representation of a nominal temperature prole for a convective reow solder process. The temperature prole is divided into four process zones, each with dierent 'T/'time temperature change rates or duration. The 'T/'time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections.

Process zone P3 is the solder reow zone. In zone P3, the

temperature is quickly raised above the liquidus point of solder to 260C (500F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid.

In process zone P1, the PC board and component pins are

heated to a temperature of 150C to activate the ux in the solder paste. The temperature ramp up rate, R1, is limited to 3C per second to allow for even heating of both the PC board and component pins.

Process zone P2 should be of sucient time duration (100

to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder.

Process zone P4 is the cool down after solder freeze.

The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reow soldering no more than twice.

Appendix A: HSDL-9100 SMT Assembly Application Note Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See Table 1 below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern.

Recommended land pattern

0.525 7.7 7.1

0.5

0.6 0.6 2.1 2.4

Table 1. Combinations of metal stencil aperture and metal stencil thickness

Stencil thickness, t (mm)

Solder / stencil opening for each pad is 2.4mm x0.6mm

Figure 10. Land Pattern

Aperture size (mm) Length, l Width, w

0.55+/-0.05 0.55+/-0.05
w l Apertures as per Land Dimensions

0.6

0.152 0.127

1.60+/-0.05 1.92

Adjacent Land Keep out and Solder Mask Areas

Adjacent land keep out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2mm.It is recommended that two ducial crosses be placed at mid length of the pads for unit alignment. Also do take note that there should not be any electrical routing with the component placement compartment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended Solder Mask

Figure 11. Solder stencil aperture

k j

Component placement

Mounting Center l

Solder Pad, Mask and Metal Stencil

Metal stencil for solder paste printing Stencil Aperture Land Pattern Dim. h l k j mm 4.15 11 5.5 3.5

Figure 12. Keep-out area

Solder Mask

PCBA

Figure 9. Stencil and PCBA

10

2.75

Appendix B: General Application Guide for the HSDL-9100 Description

The Proximity sensor has several possible applications for multimedia product, Automation, and Personal handled. The proximity sensor is basically made up of the emitter (infrared LED) and detector (photodiode). The block diagram of the sensor is shown in Figure 13. The emitter will emit IR light pulse. This light travels out in the eld of view and will either hit an object or continue. No light will be reected when no object is detected. On the other hand, the detector will detect the reected IR light when it hits the object.

Interface to the Recommended I/O chip

The HSDL-9100 is general interface with the GPIO pin of the controller chipset. The LED_A, pin1 is connected to the PWM port alternatively the external timer circuitry can be used to drive the LED. The DET_K, pin 4 is interface to the signal conditioning before driving the GPIO port. Figure 14 shows the hardware reference design with HSDL-9100.

Photodiode 3 Photodiode anode 2 LED cathode LED 1 LED anode 4 Photodiode cathode

Figure 13. Proximity sensor block diagram (refer to Pins Conguration Table)

STN/TFT LCD Panel

Key Pad

LCD Control Touch Panel A/D

Peripherial interface IrDA interface

IR Transceiver

Mobile Application chipset

AC97 sound

PCM Sound

Memory Expansion

Logic Bus Driver

Memory I/F Baseband controller GPIO

I2S PWM

Audio Input

ROM FLASH SDRAM

Power Management

Antenna *IR LED driver Signal Conditional

The LED can be driven by the PWM output or the external timer circuitry.

HSDL-9100

Figure 14. Mobile Application Platform 11

The next section discusses interfacing conguration with general processor including the recommended signal conditional circuitry. The DET_A pin of HSDL-9100 is connected to the lter circuit then to the comparator before interfacing with the GPIO pin. The lter circuit is implement to provide the ambient light lter. The PWM is pulse to drive the LED_K pin alternative the external timer 555 can also be replaced. The detector distance can be varies with the increase/decrease of the LED current supply.

Interfacing circuitry with signal conditional circuitry

VCC HSDL-9100 LEDA LEDK DETK DETA

PWM

220 36 K BC848

VCC VCC 22 K 220 pf 10 GND GND 24 K VCC GND 47 k BC846B 1 M

GPIO 300 GND Signal conditioning circuitry

controller chipset

Figure 15. HSDL9100 conguration with controller chipset

12

Appendix C: Recommended window and light guide for HSDL-9100

Some constraints on the design and position of the window are required so that the cross talk from the emitter to the photodiode is minimized. Four recommendations of window design are suggested as below: x Put the optical sensor close to the window material. (See option 1) x Using bae in between emitter and detector will reduce the crosstalk caused by bottom surface. It is recommended to extend the bae into the at window as to reduce the crosstalk caused by top surface too. (See option 2) x Using opaque material of light pipes with two holes as light path. The structure need to be carefully designed to minimize the signal loss and crosstalk. (See option 3) x Using separate pieces of light guide bonded together for emitter and photo sensor respectively. Insert a bae in between the two light guides. (See option 4)
Photodiode Close to the window Option 1 Option 2 LED

Flat Window (Transmission rate >85%)

Flat Window (Transmission rate >85%)

LED

LED Photodiode

Flat Window (Transmission rate >85%)

Flat Window (Transmission rate >85%)

LED

Recommended Window Material

Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface nish of the plastic should be smooth, without any texture. The thickness of the window material is recommended to be less than 0.5mm. An IR lter dye may be used in the window to make it look black to the eye but the total optical loss of the window should be 10% or less for best optical performance. Light loss should be measured at 875nm. The recommended plastic materials for use as a cosmetic window are available for General Electric Plastics.
Photodiode Option 3

Photodiode Option 4

Recommended Plastic Materials:

Material #
Lexan 141 Lexan 920A Lexan 940A

Light Transmission
88% 85% 85%

Haze
1% 1% 1%

Refractive Index
1.586 1.586 1.586

Note: 920A and 940A are more ame retardant than 141. Recommended Dye: Violet #21051 (IR transmissant above 625 nm)

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2009 Avago Technologies. All rights reserved. Obsoletes AV02-0779EN AV02-2259EN - November 26, 2009