Professional Documents
Culture Documents
Renewable energy
Agriculture Electronics
Consumer Electronics
1. railway gate 2. irrigation system 3. wind solar system 4. Protection of industrial ware houses 5. solar energy harvesting 6. Fertilizer sprayer 7. Cow-milk 8. Medical herbs 9. Portable Pirith player
7 7 7 7 7 7 7
Industrial Electronics 7 7
Industrial Electronics
Industrial Robots CNC Injection moulding Welding Prototyping machine Printing machines EDM machine(Electric discharge) Heat treatment machines Packeting machine
Actuators
Electrical actuators motors relays/ solenoids cylinders/ pistons valves motors cylinders valves motors festo website
Pneumatic actuators
Hydraulic actuators
Motors
less inertia - accelerate/deaccelarate easily Servo motors long in length, smaller in diameter usually discrete no of positions to set up Stepper motors
Sensors
Presssure Temperature Humidity Viscosity EN3
6 sensors proximity
linear guide
no sliding => ball screws => minimum friction => very accu
To control velocity & position feed back position encoders along with it => phase diff in controls signal?? standard full step half step stepping depend on driver micro stepping
celarate easily
meter usually
to set up
CNC Machine
3 axis 3 servo motors
Computer Numeric Control Accuray: postion upto 1 micro meter for accuracy movement we have bulit-in encoders
EN2
EN1
Types
AC Brushless DC
rack and penior??-> cant be used due to backlash-> lack of accuracy so we use Ball Screw in order to eliminate backlash> 5000 pulse per revolution
since balls fill the dead end gap, no place for back lashing
Industrial Robots 6 degree of freedom minimum required ?? Accuracy linear guide ball screw back lash eliminated gears 1 Harmonic drivers => called Gear reduction boxes
encoder is built into the shaft of the motor need of backlash free transmission
->
http://www.kuka-robotics.com/en/
8219245, 8319467,7443124
Values?
to use the minerals like ilmanite, graphite or others, we requir Is it possible for EN ppl to work on it?
Injection Molding
mould->inject->cool->eject-> repeat fast -> slow->clamp->inject mechanism to push mould and eject mould if ejection is done manually -> semi auto mode
Injection Cylinder
Injection Cylinder
LC
Thermo coupple
COntrol panel
Output port
Input port Relay
PLC Timer
PID controller
relay
use semi amplifier ->analog signal monitor temp->cool->heat accordign to mould size etc controlling->electronic part
fast slow Inj.Cyl.Forward high pressure high pressure Inj.Cyl.Back Mould cooling
Injection Cylinder
Injection Cylinder
load backward high pressure Mould open slow Mould open fast eject Auto here we direction go back to mould close here the operator will do control after that
Semi auto
heater
servo z axis
control panel
pulse on
pulse off
spark duration
Ramp up
ramp
Ramp up
ramp speed
not too high voltage current maybe 50A 100/200 V not continous current->it's pulse current
spark duration
ramp
servo
ramp speed
Initially drill a hole then work piece controlled by x,y servos in a oil bath, spark gap must be controlled
Vaccum transistor
70's
VLSI
10000 gates
ULSI
100000 gates
VLSI
Top down approach in VLSI design http://www.indovina.us/~mai/a_top_down_approach_to_ic_design.pdf HDL code->Functional verification->Logic synthesis->external timing -> timing verification
only send metal layer mask to fabricator non recurrent engineering cost
Timing verification Design Rule checking Mask Lithography for VLSI Foundry Clean rooms for Semi conductor processing Classes ??
http://en.wikipedia.org/wiki/Integrated_circuit
http://en.wikipedia.org/wiki/Transistor_count http://en.wikipedia.org/wiki/65_nanometer The first integrated circuits contained only a few transistors. Called "small-scale integration" (SSI), digital circuits c SSI circuits were crucial to early aerospace projects, and aerospace projects helped inspire development of the te The next step in the development of integrated circuits, taken in the late 1960s, introduced devices which contain They were attractive economically because while they cost little more to produce than SSI devices, they allowed m Further development, driven by the same economic factors, led to "large-scale integration" (LSI) in the mid-1970s Integrated circuits such as 1K-bit RAMs, calculator chips, and the first microprocessors, that began to be manufact
OR
AND
FF flip flops are kept together?? systems based on this apttern less numbe of masks(5) less NR engineering cost moderate volume then use Semi custome des timeing is a problems where gatesa re located for apart timeing verification is critical
integration" (SSI), digital circuits containing transistors numbering in the tens provided a few logic gates for example, while early linear IC ped inspire development of the technology. Both the Minuteman missile and Apollo program needed lightweight digital computers for the introduced devices which contained hundreds of transistors on each chip, called "medium-scale integration" (MSI). ce than SSI devices, they allowed more complex systems to be produced using smaller circuit boards, less assembly work (because of fewe ntegration" (LSI) in the mid-1970s, with tens of thousands of transistors per chip. essors, that began to be manufactured in moderate quantities in the early 1970s, had under 4000 transistors. True LSI circuits, approachin
for example, while early linear ICs such as the Plessey SL201 or the Philips TAA320 had as few as two transistors. The term Large Scale Int htweight digital computers for their inertial guidance systems; the Apollo guidance computer led and motivated the integrated-circuit tec tion" (MSI). s assembly work (because of fewer separate components), and a number of other advantages.
stors. True LSI circuits, approaching 10,000 transistors, began to be produced around 1974, for computer main memories and second-gen
ansistors. The term Large Scale Integration was first used by IBM scientist Rolf Landauer when describing the theoretical concept[citation otivated the integrated-circuit technology,[16] while the Minuteman missile forced it into mass-production. The Minuteman missile progr
g the theoretical concept[citation needed], from there came the terms for SSI, MSI, VLSI, and ULSI. ion. The Minuteman missile program and various other Navy programs accounted for the total $4 million integrated circuit market in 196
n integrated circuit market in 1962, and by 1968, U.S. Government space and defense spending still accounted for 37% of the $312 millio
ounted for 37% of the $312 million total production. The demand by the U.S. Government supported the nascent integrated circuit marke
e nascent integrated circuit market until costs fell enough to allow firms to penetrate the industrial and eventually the consumer markets
eventually the consumer markets. The average price per integrated circuit dropped from $50.00 in 1962 to $2.33 in 1968.[17] Integrated
2 to $2.33 in 1968.[17] Integrated circuits began to appear in consumer products by the turn of the decade, a typical application b
profit
http://www.epo.org/searching/free/espacenet.html
how solar cell is made not using , but using silicon di oxid
Solarpanel manufacturering process involves four main st 1. Crystal growing 2. Wafering 3. Solar cell production 4. Solar panel assembly
Non-crystalline Si
Crystalline Ingot Pulling US 8002893 heat, rotate rod, pull silicon out?
cut
Disk US7025665
Method and apparatus for cutting ultra thin silico High efficiency silicon solar cells and method of f
wafering,cutting cut->polish->texture fabrication electrical contacts formation metal contacts? polish texturing Wafer 6429035 2947770 solar cells
s for cutting ultra thin silicon wafers solar cells and method of fabrication
Technology
Efficiency
Cost
0.84
C Si Poly Si Amorphous Si
0.75
Cost
20-25 14 12-13.4
Eff
Consumer Electronics TV DVD,VCD Cameras , Printers, Scanner, Projector Telephone, mobile phones Washing machine Microwave ovens Computer blah blah blah