Mark Montrose Presentation PCB Design-4 Hours

1996/2000. Montrose, M.I., Printed Circuit Board Design Techniques for EMC Compliance. Wiley/IEEE Press.
1999. Montrose, M.I., EMC and the Printed Circuit Board - Design Theory and Layout Made Simple. Wiley/IEEE Press.
Introduction to
Printed Circuit Board Design
For EMC Compliance

Mark Montrose
Principle Consultant
Montrose Compliance Services, Inc.
+ 1 (408) 247-5715
mark@montrosecompliance.com
www.montrosecompliance.com
1
Fundamentals of Signal Integrity
2
What is Signal Integrity

The ability of electrical signals to travel from a source to load through a
dielectric without loss of signal amplitude or parametric values

In order to solve a signal integrity problem, one must first understand
transmission lines and how they function both in theory and reality

There are two kinds of design engineers:
Those that have signal integrity problems, and those that will

3
Signal Integrity Concerns

It only takes one item listed below to cause a signal integrity problem
Incorrect transmission line routing
Improper terminations
Power and/or return plane bounce
Improper RF return current path
Mode conversion
Rise time degradation
Lossy transmission lines at higher
frequencies
Poor power distribution network
Hidden parasitics (RLC)
Propagation delays
Skin depth and dielectric loss
Non-monotonic edges
Excessive inductance in the
transmission line
Excessive ringing and reflection
Lossy transmission lines
Poor printed circuit board material
Overshoot and undershoot
Impedance discontinuities
Delta I noise
RC delay
Crosstalk
Stubs and their lengths
Excessive capacitive loaded lines
IR drops
Via stubs
Excess attenuation
Non-monotonic edges
Signal skew
Gaps in planes
Dispersion
Impedance discontinuities
Unknown parasitic
Intra line skew
High dielectric losses
4
Aspects of High-Speed Problems

Four aspects of high-speed problems are present in system designs

1. Signal quality: Reflections and distortions from impedance discontinuities
in the signal or return path can affect the quality of the signal. A transmitted
signal should see the same impedance throughout all interconnects
(includes vias and connectors).
2. Crosstalk between nets: Mutual capacitance and inductance exists, both
within an ideal and non-ideal return path. One must keep spacing of traces
greater than a minimal value while minimizing mutual inductance, keeping
the return path impedance as low as possible.
3. Rail collapse: A voltage drop within the power and return system when
digital components switch logic states. One must minimize the impedance
of the power and return path along with the delta-I (current).
4. EMI: Can be developed as a result of poor signal integrity within a
transmission line. Must minimize bandwidth, ground impedance and
common-mode coupling.

Details on impedance discontinuities, transmission line routing, terminations,
and simulations are presented later.

5
total total pd
o
o
o C L t
I(x)
V(x)
=
C
L
= Z =
Lossless Transmission Line Equivalent Circuit Within a PCB
6
Lossy Transmission Line Equivalent Circuit Within a PCB
( ) ( ) C j G L j R j L L L L + + + = + =
( )
( ) C j G
L j R
Zo
L L
L L
+
+
=
characteristic impedance Zo =
length line L =
may vary with frequency G , R L L
jt x V x V o = ) exp( ) exp( ) , (
7
Lossy Transmission Lines

1. Resistive losses - Constant with frequency. Attenuation, usually measured in
dB/unit distance, is proportional to the resistance per unit length of the
conductor.

2. Skin effect losses - Proportional to the square root of frequency. As signal
frequency increases, current flow retreats to the surface of the conductor
flowing in a "skin" which becomes thinner with increasing frequency.
Resistivity of the material stays the same, it is the cross section that decreases
related to AC current flow.

3. Dielectric losses - The PCB material (core and prepreg) absorbs some of the
electric field energy, which is directly proportional to frequency. Dielectric loss
or dissipation factor (magnitude of energy loss) is not the same as dielectric
constant (speed of signal travel).

4. Resonances - Typically caused by improperly terminated traces and split
planes in addition to the lumped magnitude of both capacitance and inductance
within power distribution networks.
8
Typical Transmission Line System

Minimum reflections will occur when Z
out
= Z
o
and Z
o
= Z
load

Maximum energy transfer occurs when Z
out
= Z
o
= Z
load

If the load is not matched, a voltage is reflected back toward the source. The value of
reflected voltage (V
r
) and the percentage of the propagation signal reflected back towards
the source (%) is:

where V
r
=reflected voltage
V
o
=source voltage
R
L
= load resistance
Z
o
=characteristic impedance of the transmission path

When R
L
is less than Z
o
, a negative reflected wave exist. If R
L
is greater than Z
o
, a positive
wave is observed. This reflected wave will bounce back and forth between source and
driver until dielectric losses absorbs the signal.
Zo
V
Source
Zout
R
Load
V
load
V
source
o Load
o Load
o r
Z + R
Z - R
V = V 100
Z + Z
Z - Z
= reflection %
o L
o L

RG174 - 50
RG58 - 50
RG59 - 75
RG62 - 93
TV Antenna - 300
Cable TV - 75
Twisted pairs - 70-120

9
Reflections Poor Signal Integrity

Reflections will occur within a transmission line if not properly terminated. The
following causes reflections.
Changes in trace width
Improperly matched termination networks
Lack of terminations
T-stubs, branched or bifurcated traces
Varying loads and logic families
Connector transitions
Any changes in impedance of the transmission line routing
Ringing indicates Rounding indicates
excessive capacitance reflections (excessive inductance)
10
Crosstalk Fundamental Aspects of Coupling
Z
v
=
Z
s (v)
x Z
L (v)
Z
s (v)
Z
L (v) +
Source Trace
Victim Trace
Victim Trace
Source Trace
Lm
Csv
C
sv
C
vg
=Capacitance between source trace and victim trace
=Capacitance between victim trace and ground
C
sg
=Capacitance between source trace and ground
Source Trace
Victim Trace
C
sv
C
vg
Z
L (source)
Z
L (victim)
~
Z
s (source)
V
s
Z
s (victim)
Inductive coupling
C
sg
Ground plane or reference structure
Lm
Csv
A
C
C
A
B
B
D
D
Lm
11
Vs
Rs
Ls
Rv Lv
Zg
Csg
Cvg
Z
Z
L1
L2
Z
s1
Vv
Z
s2
G (0V)
Schematic representation of a three wire circuit
Msv
Csv
C
sv
C
vg
=Capacitance between source trace and victim trace
=Capacitance between victim trace and ground
C
sg
=Capacitance between source trace and ground
Z
L1
Z
L2
Csv
Msv
Vs
Z
s1
Vv
Z
s2
G (0V)
t
Vs
Source signal
t
Vv
Crosstalk on
victim trace
Cvg Csg
Zg
Vs Vv
Z
s1
Z
s2
Z
L1
Z
L2
Ground plane
Dielectric
Parallel traces over a ground plane
G (0V)
material
12
13
Stuck low
Coupled lines
Agressor line
Victim line
0.000 4.000 8.000 12.000 16.000 20.000
Time (ns)
Voltage -V-
-3.000
-2.000
-1.000
0.000
1.000
2.000
3.000
4.000
5.000
6.000
7.000
Agressor line (source) - clock stimulus
Agressor line (load)
Victim line (source) - stuck low
Victim line (load)
0.010"
0.010"
0.010"
Signal
Power
Ground
Signal
0.008 0.008 0.008
8.0 inches (20.3 cm) long, 72.1 ohms
Propagational delay: 1.126 ns
Oscillator: 66 MHz, 49% duty cycle
CMOS, 3.3V, Fast
Traces: 0.008" wide and 0.008" apart (.20mm)
Distance to reference plane: 0.010" (.25mm)
Far End Cross Talk
Only appears in surface traces and scales with coupling length, inversely
with rise time and depends on line to line spacing. Reduce it by shorter
coupling lengths, longer rise time, larger spacing, or best of all, route in
stripline.

Near End Cross Talk
Saturates with coupling length when coupling TD > RT (rise time),
predominantly affected by line to line spacing and can be reduced with
lower dielectric constant.
.
Common Forms of Crosstalk
14
Sample List of Design Techniques to Prevent Crosstalk

To prevent crosstalk within a PCB, the following design and layout techniques are
useful.
Crosstalk will increase with a wider trace width as mutual capacitance, Cm, increases.
With long parallel traces, greater mutual inductance, Lm, is present.
Crosstalk also increases with faster edge rates and frequency of operation.

1. Group logic devices according to functionality.
2. Minimize routed distance between components.
3. Minimize parallel routed trace lengths.
4. Locate components away from I/O interconnects and areas susceptible to field
corruption.
5. Provide terminations for traces rich in harmonic energy.
6. Avoid routing of traces parallel to each other with adequate separation between the
tracks.
7. Route adjacent signal layers (either microstrip or stripline) orthogonally to prevents
capacitive and inductive coupling between two planes in parallel.
8. Reduce signal-to-ground reference distance separation.
9. Reduce trace impedance and/or signal drive level.
10. Isolate signal layers routed in the same axis by a solid planar (typical of backplane
designs).
15
Power and/or Return Plane Bounce
dt
dI
L = V
discharge
rn power/retu rn power/retu
Q3
Q4
C
V
CC
L
VCC
L
GND
Hi to Lo transition ;
C discharges
Lo to Hi transition
C charges
V
Out
GND
Gate 2
I
D
V
GND (PCB)
L
Vcc (PS)
DC power source
R
trace (
PCB
)
L
GND
) L
GND ( PS)
V
GND
Gate 1
(PCB
16
Typical Bounce Waveform

Power and/or return bounce increases under the following conditions:
Capacitive loading is increased.
Load resistance is decreased.
Lead and trace inductance is increased.
Multiple gates (devices) switch simultaneously.

Methods to minimize bounce include:
1. Load control - lower the capacitance and increase resistance.
2. Layout - minimize trace inductance during layout of the PCB.
3. Component packaging - use devices with a ground reference pin in the center of
the device (i.e., 4 nH instead of the corners 15 nH) or physically adjacent. Surface
mount devices are preferred over through hole components for this reason.
4. Provide a separate connection for each power and return pin directly to their
respective planes.
Ground bounce on ground plane
Digital switching pulse
positive bounce
negative bounce
17
Fundamentals of EMC
18
Definition of EMC Terms

Electromagnetic Compatibility - The capability of electrical and electronic systems, equipment,
and devices to operate in their intended electromagnetic environment within a defined margin of
safety, and at design levels or performance, without suffering or causing unacceptable degradation
as a result of electromagnetic interference. (ANSI C64.14-1992).

Electromagnetic Interference - The lack of EMC, since the essence of interference is the
lack of compatibility. EMI is the process by which disruptive electromagnetic energy is
transmitted from one electronic device to another via radiated or conducted paths (or both).
In common usage, the term refers particularly to RF signals, but EMI can occur in the
frequency range from "DC to daylight."

Radio Frequency - A frequency range containing coherent electromagnetic radiation of energy
useful for communication purposes; roughly the range from 10 kHz to 100 GHz. This energy may
be transmitted as a by-product of an electronic devices operation. RF is transmitted through two
basic modes:

Radiated Emissions - The component of RF energy that is transmitted through a medium as
an electromagnetic field. RF energy is usually transmitted through free space, however, other
modes of field transmission may occur.

Conducted Emissions - The component of RF energy that is transmitted through a medium
as a propagating wave, generally a wire or interconnect cables. LCI (Line Conducted
Interference) refers to RF energy in a power cord or AC mains input cable. Conducted
signals do not propagate as fields, but may propagate as conducted waves.
19
Susceptibility - A relative measure of a device or systems propensity to be disrupted or damaged by
EMI exposure. It is the lack of Immunity.

Immunity - A relative measure of a device or systems ability to withstand EMI exposure while
maintaining a pre-defined performance level.

Electrostatic Discharge - A transfer of electric charge between bodies of different electrostatic
potential in proximity or through direct contact. This definition is observed as a high-voltage pulse
that may cause damage or loss of functionality to susceptible devices. Although lightning qualifies
as a high-voltage pulse, the term ESD is generally applied to events of lesser amperage, and more
specifically to events that are triggered by human beings. However, for the purposes of discussion,
lightning is included in the ESD category because the protection techniques are very similar,
although differing in magnitude.

Radiated Immunity - The relative ability of a product to withstand electromagnetic energy that
arrives via free-space propagation.

Conducted Immunity - The relative ability of a product to withstand electromagnetic energy that
penetrates it through external cables, power cords and I/O interconnects.

Containment - Preventing RF energy from exiting an enclosure, generally by shielding a product within
a metal enclosure (Faraday cage or Gaussian structure) or by using a plastic housing with RF
conductive paint. By reciprocity, we can also speak of containment as preventing RF energy from
entering the enclosure.

Suppression - The process of reducing or eliminating RF energy that exists without relying on a
secondary method, such as a metal housing or chassis.

20
Basic Aspects and Elements of EMC

General rule of thumb when observing an EMC event
Higher the frequency - coupling path is generally observed is radiated.
Lower the frequency - coupling path generally observed is conducted.

There are five aspects for an EMC event to be observed
Frequency - Where in the frequency spectrum is the problem observed?
Amplitude - How strong is the source of the RF energy and its potential to cause
harmful interference?
Time - Is the problem continuous (periodic signals) or does the problem exist only
during certain cycles of operation (e.g., disk drive write operation)?
Impedance - What is the impedance of both the source and receptor unit?
Dimensions - What are the physical dimensions of the device?

Three basic elements for an EMC event to be observed
There must be a source of energy.
There must be a receptor that is upset by this energy.
There must be a coupling path between the source and receptor for the
unwanted energy to transfer to.

The propagation path may be either by radiated or conducted means.
21
Component Characteristics at RF Frequencies
(The Hidden Schematic)
22
How RF Energy is Created Maxwell Made Simple

Maxwells four equations describe the relationship of electric and magnetic
fields. Equations are derived from:

Amperes Law
Faradays Law
Two from Gausss Law.

To overly simplify Maxwell, use Ohms law

Ohms Law (time domain-DC currents)
V = I R

Ohms Law (frequency domain-AC currents)
V
rf
= I
rf
Z
23
Right Hand Rule
(Faradays Law)
Field or Flux Line
I (Current in the wire)
(Magnetic Flux)
Where is the electric field? In the direction of current flow.
Only the magnetic field is shown as a flux line.
24
Maxwell's Equations

(For Reference Purposes)
total
s
s
s
v s
I ds
t
D
J dl H
t
D
+ J = H
Ampere) (from Current Electric : Law Fourth
ds
t
B
- = dl E
t
B
- = E
Faraday) (from Potential Electric : Law Third
0 ds B 0 B
Gauss) (from Flux Magnetic : Law Second
0 dv ds D = D
Gauss) (from Flux Electric : Law First
m
e
=
+ =

= = =
= = =

25
Electric and Magnetic Field Impedance

A plane wave is a combination of both electric and magnetic field components
(Poynting vector). Fields propagate from a field source near the velocity of
light.

where
o
= 410
-7
H/m

o
= 8.8510
-12
F/m

Electric field component is measured in volts/meter (Note-voltage)
Magnetic field component is in amps/meter (Note-current)

The ratio of both electric field (E) to magnetic field (H) is identified as the
"impedance" of free space. This impedance ratio is described by:

Energy carried in the wave front is measured in Watts/meter
2
(Note-power)
8
o o 10 x 3 = 1/ = c
ohms 377 =
= H E = Z
o
o
o
26
(Note-resistance)
27
Plane wave
Zs = 377 ohms
Magnetic field predominates
Electric field predominates
Unknown field impedance
H
i
g
h

s
o
u
r
c
e

i
m
p
e
d
a
n
c
e
L
o
w

s
o
u
r
c
e

i
m
p
e
d
a
n
c
e
W
a
v
e

i
m
p
e
d
a
n
c
e
,

o
h
m
s
Distance from source, normalized to /2
far field near field
10 1
10
0.1
100
1000
10k
transition region
d
1
H
d
E
1
3
d
1
H
d
E
2
1
2
d
1
H
d
E
3
1
Electric and Magnetic Field Representation

Dipole Antenna Loop Antenna
28
Closed Loop Circuit

If a continuous, conductive low impedance RF return path is not present
(transmission line impedance is greater than 377 ohms), the return path will be
free space (377 at /4), which may be much less than the impedance of a
localized RF return path.
Signal path
Return path
Switch
29
Radiated Emissions from a Closed Loop Circuit
Loop Area
Radiated energy
Return current
Signal path
This configuration is for a single- or double-sided PCB.
For a multi-layer PCB, loop area is in the plane directly below the signal path.
30
Loop Area Between Circuits or Components Different Layers

31
Return Current Path of Travel Multilayer Assembly
High frequency operation Low frequency operation
Illustration provided courtesy: Dr. Howard J ohnson
32
Circuit Return Current Simulation @ F=1 Hz Circuit Return Current Simulation @ F=100 kHz
Circuit Return Current Simulation @ F=5 GHz
Courtesy of Alexander Perez, Agilent Technologies
33
Loop Area Between Components

EMI is created from currents flowing between components. A small loop is one
whose dimensions are smaller than a quarter wavelength (/4) at a particular
frequency of interest.

Maximum electric field strength from a loop in free space

where A = loop area in cm
2
, f (MHz) is the frequency of I
s
, the source current in
mA and r is the distance from the radiating element to the receiving antenna.

Differential-mode radiation from a cable affixed to the PCB with a return reference

Common-mode radiation from a cable affixed to the PCB with a return reference
meter per volts
r
1
) I A (f 10 131.6 E s
2 16
=

meter per volts
r
1
) I A (f 10 263 E s
2 16
=

meter per volts
r
1
) I L (f 10 1.27 E s
=
6
34
Common-Mode and Differential-Mode Currents

Differential-mode
1. Conveys desired information.
2. Does not cause interference as the fields generated oppose each other and cancel out.

Common-mode
1. The major source of cable radiation.
2. Contains no useful information.
3. Has no useful purpose.
4. Causes a system (traces, cables, etc.) to radiate as a monopole antenna.
I1
E
~
I2
Z
~
Noise source
in load
I2
Common-mode current
I =
I 1 + I2
total
Differential-mode current
I
= I 1 - I2
total
E
~
Z
Noise source
in load
I1
~
+
+
I2
'
2 2
CM
DM
CM
DM
35
Summary on How EMI Is Developed Within the PCB

1. Current transients are created by the production of high frequency periodic
signals injected into the power and return distribution network.
2. An RF voltage drop develops across any impedance within a transmission
line.
3. Common-mode RF currents are created by this RF voltage drop on
unbalanced RF current return path.
4. Radiated emissions, created by these common-mode RF currents, are
observed on internal antenna structures by virtue of poor RF ground loop or
return path control.
5. When any time-variant current is injected into a trace, magnetic flux is
developed, which in turn creates an electric field. The combination of
electric and magnetic fields create a propagating plane wave.
6. Lack of a proper RF current return path exacerbates EMI.
36
Basic EMC Suppression
and Grounding Concepts
37
Grounding Hierarchy
Earth ground
Equipotential
Chassis
Reference point
Reference plane
Return

In reality, there is only one grounding methodology
Single point
38
Different Types of Grounds

Signal Ground
Common Ground
Analog Ground
Digital Ground
Safety Ground
Noisy Ground
Quiet Ground
Earth Ground
Hardware Ground
Single-point Ground
Multi-point Ground
Shield Ground

What about: RF Ground?

Often a ground reference may serve multiple needs,
each with a different application.
39

Symbol Function
Circuit ground
Chassis ground
Digital return
D
A
Analog return
Application
Connection to the
electrical ground structure
Connection to any
non-current carrying chassis
Path carrying the return of
a digital signal
Path carrying the return of
an analog signal
Common Ground Symbols
If there is more than one ground in a system,
there will always be employment for EMC engineers
40
41
Lower frequencies signals are well behaved
Higher frequencies create EMI problems

The principle of Path of Least Inductance applies to:
Circuit grounding design and topologies
Power decoupling on PCBs
Transmission line layout and routing on PCBs

Few principles in EMC are as important as this principle
for understanding the design of any printed circuit board
Path of Least Inductance Principle
What the Rule Says
Defining Ground
Power/safety ground
Intended (neutral) and unintended (safety ground, generally the green wire)
50/60/400 Hz

Lightning ground
A controlled path for lightning to reach the earth through a rod or metallic
structure
Generally a 1 MHz event and up to 100 kAmps per millisecond
Requires a high quality low ground resistance and inductance

Circuit/signal ground
Provides a return path for intended signal flow and for AC/DC power return;
mA to Amps
Requires a minimum low impedance path
Generally implemented as a ground plane or grids within a printed circuit
board

42
Defining Ground (continued)
EMI ground
Provides a controlled path for RF currents; DC to daylight, A to Amps
Requires a minimum ground impedance

ESD ground
Provides a controlled path for ESD currents
0.7-3 ns rise times, 100-300 MHz, 10-50 Amps

RF ground
Provides an RF return path for flux to return to its source
Covers the entire frequency spectrum
Requires minimum impedance for maximum current/flux flow
43
44
A ground system topology is determined by
Signal characteristics
System dimensions
System-specific separation and isolation requirements
Electrical safety requirements
Primary ground system topologies includes
A floating system
Single-point (star) ground (SPG)
Multi-point ground
Hybrid ground
Grounding System Topologies
Three Primary Grounding Methodologies

Single-Point Grounding: Series and Parallel
Multi-Point
1 2 3
2 1
3
I3 I2 I1
I =I1+I2+I3
SINGLE-POINT: SERIES CONNECTION
2 1 3
I3
I2
I1
SINGLE-POINT: PARALLEL CONNECTION
MULTI-POINT GROUNDING CONNECTIONS
L2
L3 L2
L1
L3 L2 L1
L1
L3
I3 I2+I3
45
Single-Point: Best for use when signals are below 1 MHz.
Most sensitive circuit returns should be connected closest to the final
equipotential point.
Provides for greatest amount of loop currents to flow.
May be used between 1 and 10 MHz if longest conductor is < /20 of a
wavelength of highest frequency generated in the system.
Divided into two type: series and parallel.

Multi-Point: Preferred for frequencies above 1 MHz.
Minimized loop currents and ground impedance of the planes. A good low
inductance ground is necessary for high-frequency digital logic circuits.
Ground plane(s) provides a low inductance ground return for RF currents.
Lead inductance must be kept extremely short.
Provides for maximum EMI suppression at the PCB level.

Hybrid: For mixed technology products.
A combination of both single-point and multi-point grounding in the same
system

46
Resonance in a Multi-Point Ground
Printed circuit board.
Mounting plate or chassis Mounting posts
Eddy currents
Internal power plane capacitance
Inductance in the power planes
Z
Z I
cm
V
cm
by eddy currents
across impedance
(Z)
post.
LC resonance in mounting posts
from mounting
produced
APPLICATION MODEL OF MULTIPOINT GROUNDING
Z
t
Z
t
cm2
V
cm2
V
cm
I
Z
B
V
cm1
Chassis
ELECTROMAGNETIC MODEL OF MULTI-POINT GROUNDING
V
cm2
is reduced by the mounting posts (ground stitch locations).
Resonance is thus controlled, along with enhanced RF suppression.
47
RF Current Density Distribution

where I(d) = signal current density, (A/inch or A/cm)
Io = total current (A)
H = height of the trace above the ground plane (in. or cm)
D = perpendicular distance from the center line of the trace (in. or cm)

2
1
1
H
D
H
I
= d I
o
) (
48
Ground Slots Created with Through-Hole Components
Equivalent circuit showing inductance in the return
path. This inductance is approximately 1 nH/cm.
I.C. I.C.
Through-holes (multiple holes in one straight line)
creates a slot in the ground plane. Return current
must travel around the slot.
Optimal method of routing traces if through-hole
Through-holes (multiple holes spaced apart)
components must be used.
Signal trace
Ground
Plane
RF return current
Signal trace
Return current in ground plane
E
E = L dI/dT = plane radiation
49
Functional Partitioning
Slow speed I/O
CPU and clock logic
interconnects
Memory
Video Audio
Memory section
Power supply
Adapter cards
Support logic
Analog processing
50
Bypassing and Decoupling
(Power Distribution Networks)
51
The Need for Optimal Power Distribution
Provides a stable voltage reference between components to ensure functional
operation
Distribute optimal power to all logic devices to minimize planar bounce

Key items of concern
Use low impedance connections between logic gates:
The impedance between power pins on gates should be just as low as the
impedance between the return pins on the same device
A low impedance path must always be provided between power and return
Input
+
-
+
-
+
-
Load C
Inductance in the Power Path
Charging current for capacitor C flows through
the inductance of the power distribution network
I
Signal
Inductance in the Return Path
52
Power Distribution Networks as Transmission Lines
Power distribution networks can be represented as a two conductor transmission
line with a defined characteristic impedance and propagation delay.
Cx dx
Power
Return
Lx dx
+
-
C C
C C C
Real-Life Power Distribution Network Multiple Loads
Power
Return
+
-
C C
C C C
Ideal Power Distribution Network Multiple Loads
53
Primary Requirements for Enhanced Power Distribution
The amplitude of power supply transients are directly proportional to the
characteristic impedance of the power distribution system, Z
0
:

To reduce Z0
Reduce inductance
Increase capacitance

Both are achieved by
Reduction of loop area between conductors (less inductance)
Placing conductors as close together as possible (greater capacitance)
Increase of conductors width (less inductance and greater capacitance,
with respect to another conductor)
(x)
(x)
o
o
o
I
V

C
L
= Z =
54
Defining Capacitor Usage

Capacitors are used for one of three primary functions.

Bulk Used to maintain constant DC voltage and current levels on a global basis
due to IR drops within the power distribution network, and to recharge the
distribution network (i.e., planes) cause by dI/dt consumption from
components (typically 1-100 F).

Bypassing Diverts or steers RF currents from one location to another. Shunts
unwanted common-mode RF currents from components or cables from
entering susceptible areas in addition to providing other functions of filtering
(bandwidth limited).

Decoupling Provides a localized source of DC power, and are particularly useful in
reducing peak current surges propagated across the board. Prevents RF
currents from being injected into the power distribution network during
digital component edge transitions.

Switching transient capacitance (0.01 F) Used to supply short-term
energy demands of the silicon during switching states.
Line charging capacitance (0.1 F) Used to charge capacitive
transmission lines as well as supplying current necessary for the driver.
55
Effective Range of Decoupling Systems and Target Impedance
(Artwork provided courtesy Ansoft Corporation)
56
1. Supply current bursts for fast switching circuits (power delivery system
issues-PDS) to prevent power and return bounce.
2. To lower the impedance of the power delivery system and prevent energy
transference from one circuit to another sharing the same voltage levels.
3. To provide an AC shunt connection between power and return planes for
RF signal return current (layer jumping) to ensure flux cancellation, which
minimizes radiated emissions and prevents crosstalk between traces.
4. Controls EMI internal to the PCB by reducing the injection of common-
mode current into the power distribution system. An RF modulating plane
will propagate RF currents throughout the entire assembly causing
disruption to all components sharing that voltage rail.
Basic Functions of Decoupling Capacitor Use
57
Capacitance of the power and ground planes is defined by:

where
C
pp
= capacitance of parallel plates (pF)
r
= dielectric constant of the board material
A = area between the parallel plates (square inches or cm)
D = distance spacing between the plates (inches or cm)
k = conversion constant (0.2249 for inches, 0.884 for cm)

D
A
k C
r
pp

=
A
D
r
Calculating Power and Return Plane Capacitance
58
Self-resonant frequency
Through-hole capacitors
0.001
0.01
0.1
1
10
100
1000
10000
1.00 10.00 100.00 1000.00
Impedance (Ohms)
Frequency (MHz)
100 pF
0.001 uF
0.01 uF
0.1 uF
Capacitors and Resonance
1/4 inch or 0.64 cm leads 15 nH
59
Self Resonant Frequency - SMT Capacitors
0.001
0.01
0.1
1
10
100
1000
10000
1 10 100 1000
Impedance (Ohms)
100 pF
0.01 uF
0.1 uF
Frequency (MHz)
0.001 uF
60
Effects of Capacitors in Parallel Different Values
61
Effects of Capacitors in Parallel Same Capacitor Values
How to calculate number of capacitors with
the same capacitive value in parallel:

(Plot provided courtesy AVX Corp.)
2 2
1
=
=
=
=
nC n
ESL
n
ESR
Z
n
ESR
ESR
n
L
L
C n C
total
otal
total
62
Power and Ground Plane Capacitance
C
plane
L
cap
L
board
C
board
C
cap
Z (ohms)
Frequency
Decoupling
Bare board
0.1
1
10
100
Frequency
h
m
s
o
Z Z
ESL
C
ESR
|Z|=
1
2 f C
(f < f )
s
Discrete decoupling capacitor
Frequency
h
m
s
o
Z
Bare board without decoupling
Power and ground plane configuration
(Bare board configuration)
Z
ESL 0
C
|Z|=
1
2 f C
63
Conflicting Rules for PCB Decoupling
Use small-valued capacitors for high-frequency decoupling
Use 0.01 F for local decoupling
Locate capacitors near the
power pins of active devices
Locate capacitors near the
ground pins of active devices
Avoid capacitors with a low ESR
Use capacitors with a low ESR!
Use 0.001 F for local decoupling
Locate of the decoupling
capacitors is not relevant
Use the largest valued capacitors
you can find in a given package size
Local decouping capacitors should have
a range of values from 100 pf to 1 F
Never put traces on decoupling capacitors
List created by Todd Hubing
64
Summary - Guidelines for Power Distribution Networks

1. Determine board impedance requirements.
To maximize total, plane impedance must be held below a maximum level.
Calculate this value by estimating maximum current required by active devices
and dividing that value into the maximum noise margin that can be tolerated.

2. Establish total amount of capacitance required.
More capacitance results in lower power bus impedance. When using embedded
capacitance, the value should be greater than or equal to the amount of discrete
components it is replacing with bulk capacitors remaining. Embedded capacitance
usually replaces discrete (local) decoupling capacitors (i.e., capacitors with a value
of 0.01 F or smaller).

3. Ensure resonances are damped.
When board dimensions exceed wavelength, power bus resonances may occur,
causing EMI and signal integrity problems. Damp resonances using resistive
elements, or space power and ground planes at a distance less than 0.010 mils
(0.0025 mm) apart.

4. Estimate total board impedance.
This can only be achieved using sophisticated, complex numerical modeling
software. Planes must be modeled as finite radial transmission lines.
65
Interconnects and I/O
66
Introduction to Interconnects and I/O

Most RF emissions in I/O circuitry is generated from a combination of
Common-mode RF coupling inside I/O interface logic components
Power plane noise coupled into I/O circuits and cables
Clock signals coupling into I/O cables; both conductive and radiated modes
Lack of data line filtering on connectors and signals traces (common-mode
and differential-mode)
Improper connection of chassis, signal, frame, digital and analog ground
reference
Use of improper I/O connectors (plastic versus metal or unshielded versus
shielded)

I/O control logic must be physically located as close to the I/O connector as
possible to minimize trace lengths and to minimize the risk that these signals will
receive coupling from other signals. Filtering of data signals is often required.
This filter is placed between the driver/receiver and connector.
67
Partitioning

Functional Subsystems
A group of components along with their respective support circuitry performing a
common function.

Quiet Areas
Sections physically isolated from other functional areas to prevents noise
sources from corrupting susceptible circuits in the quiet zone.

Internal Radiated Noise Coupling
Radiated RF coupling may occur between different functional subsections. To
prevent this coupling, a fence or shield barrier may be required. A fence is a
metal barrier secured to the ground plane(s) at intervals appropriate for the
highest frequencies anticipated (at /20 wavelength intervals) and tall enough in
height to prevent direct line RF radiated field coupling.
68
Isolation (Moating)
L
Isolation transformer
Moat
Data line filter
I/O connector
moated area. Do not use an inductor
Ferrite bead-on-lead to bridge power (only) into the
Ground trace, if required, 3x wider than power trace
DLF
(common-mode choke)
Optional decoupling capacitor, usually necessary
to ground, not across the moat
Absence of
voltage and
ground planes
(to minimize
coupling capacitance
across the DLF)
Best location for ground connection
69
Moat
Data line filter
Isolation transformer or optical isolators
Absence of
voltage and
ground planes
DLF
Shield-shell
ground connection
to chassis
I/O connector
Power
Ground
Decoupling capacitors
Ferrite filter (with fuse)
Non-isolated
power and shield
grounds to chassis
70
Bridging
I/O
Moat
Connection to chassis ground
Bridge in moat
Vcc
Vcc
Vcc
Vcc
Vcc
Vcc
Ferrite bead-on-lead for optional power, if required, over a
separate moat for power plane. (dotted line).
Vcc connector
Location of
optional
grounds to
chassis
71
Image Plane or Moat Violation
Signal Trace
Large loop
area allows
for common-
mode RF energy to
exist due to lack of
an image plane
along the entire trace
route.
Moat violation
Signal Return
Correct use of moating
72
Solution to All EMC Problems
73

Mark Montrose Presentation PCB Design-4 Hours

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1996/2000. Montrose, M.I., Printed Circuit Board Design Techniques for EMC Compliance. Wiley/IEEE Press.

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