www.ti.

com

FUNCTIONAL DIAGRAM
8
2
3
4
7
6
V
CC
A
B
V
BB
Y
Z
2 Gbps
2
23
- 1 PRBS
V
CC
= 3.3 V
V
ID
= 200 mV
V
IC
= 1.2 V
Horizontal Scale= 200 ps/div
Vert.Scale= 200 mV/div
EYE PATTERN
1 GHz
SN65LVDS100 and SN65LVDS101
2
3
7
6
A
B
Y
Z
110
SN65LVDT100 and SN65LVDT101

www.ti.com

www.ti.com

www.ti.com

www.ti.com

Y
Z
A
B V
ID
V
OD
V
IB
V
IA
V
O(Z)
V
O(Y)
I
IB
I
IA
V
IA
+V
IB
V
IC
2
V
OC
I
O
V
BB
V
BB
+
-
V
OD
100
3.74 k
3.74 k
_
+
0 V V
(test)
2.4 V
Y
Z
V
OC
49.9 1%
Y
1 pF
V
OC(PP)
V
OC(SS)
V
OC
1.4 V
B
A
1.0 V
49.9 1%
Z
A
V
ID
B

www.ti.com
50
V
OY
V
OZ
50
V
OD
+
-
V
CC
- 2V
+
-
1.4 V
1 V
t
PLH
0.4 V
0 V
V
IA
V
IB
V
ID
80%
100%
0%
t
PHL
20%
t
f
t
r
V
OD
0 V
Y
Z
A
B
V
ID
1 pF
V
IB
V
IA
V
OD 100
-0.4 V
50
50
V
CC
- 2V
+
-
OR
V
OD
0 V
CLOCK INPUT
1/fo
IDEAL OUTPUT
0 V
1/fo
ACTUAL OUTPUT
0 V
t
c(n)
0 V
PRBS INPUT
0 V
ACTUAL OUTPUT
0 V
PRBS OUTPUT
Period Jitter Cycle to Cycle Jitter
t
jit(per)
= |t
c(n)
- 1/fo|
t
c(n)
t
c(n+1)
t
jit(cc)
= |t
c(n)
- t
c(n+1)
|
t
jit(pp)

www.ti.com
Pattern
Generator
Oscilloscope
EVM
Power Supply 1
+
-
Power Supply 2 +
-
VCC
EVM
GND
DUT
GND
1.22V
3.3V
Matched
Cables
SMA to SMA
Matched
Cables
SMA to SMA
J2
J7
J6
J5
J4
J3 J1
100 W
50 W 50 W
DUT
(Note A)
(Note B)
Tektronix
TDS6604
Agilent
E4862B

V
CC
Y
Z
GND
8
7
6
5
1
2
3
4
NC
A
B
V
BB
D AND DGK PACKAGE
(TOP VIEW)
V
CC
Y
Z
GND
8
7
6
5
1
2
3
4
NC
A
B
NC
D AND DGK PACKAGE
(TOP VIEW)
NC = Not Connected
SN65LVDS100 and SN65LVDS101 SN65LVDT100 and SN65LVDT101

www.ti.com

V
CC
V
CC
A
B
INPUT
V
CC
Y Z
OUTPUT
(SN65LVDS100 and SN65LVDT100)
7 V
7 V
7 V 7 V
R R
Y
Z
V
CC
OUTPUT
(SN65LVDS101 and SN65LVDT101)
V
CC
7 V
7 V
R R
V
CC
V
CC
(SN65LVDT only)
215 m A
110 W
350 m A
215 m A
350 m A

www.ti.com

15
25
35
45
55
0 200 400 600 800 1200
Frequency - MHz
-

S
u
p
p
l
y

C
u
r
r
e
n
t

-

m
A
I
C
C
1000
LVDS100
LVDS101= Loaded
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1.2 V
V
ID
= 200 mV
10
20
30
40
50
60
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - C
-

S
u
p
p
l
y

C
u
r
r
e
n
t

-

m
A
I
C
C
V
CC
= 3.3 V
V
IC
= 1.2 V
V
ID
= 200 mV
f = 750 MHz
LVDS101 = Loaded
LVDS100
200
300
400
500
600
700
0 200 400 600 800 1000 1200
f - Frequency - MHz
-

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
o
l
t
a
g
e

-

m
V
V
O
D
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1.2 V
V
ID
= 200 mV
LVDS101
LVDS100
300
350
400
450
500
550
600
0 1 2 3 4 5
V
IC
- Common-Mode Input Voltage - V
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
t
PLH
t
PHL
V
CC
= 3.3 V
T
A
= 25C
V
ID
= 200 mV
f = 150 MHz
350
400
450
500
550
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - C
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
V
CC
= 3.3 V
V
ID
= 200 mV
f = 150 MHz
t
PHL
t
PLH
450
500
550
600
650
700
750
0 1 2 3 4 5
V
IC
- Common-Mode Input Voltage - V
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
V
CC
= 3.3 V
T
A
= 25C
V
ID
= 200 mV
f = 150 MHz
t
PLH
t
PHL
450
500
550
600
650
700
750
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - C
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
V
CC
= 3.3 V
V
ID
= 200 mV
f = 150 MHz
t
PHL
t
PLH
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
2300
V
OC
= 3.3 V
T
A
= 25C
V
IC
= 400 mV
Input = PRBS 2
23
-1
V
ID
= 0.5 V
V
ID
= 0.3 V
V
ID
= 0.8 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.8 V
V
ID
= 0.5 V
V
ID
= 0.3 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 400 mV
Input = Clock

www.ti.com
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 400 mV
Input = Clock
V
ID
= 0.5 V
V
ID
= 0.8 V
V
ID
= 0.3 V
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 400 mV
Input = PRBS 2
23
-1
2300
V
ID
= 0.3 V
V
ID
= 0.5 V
V
ID
= 0.8 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.5 V
V
ID
= 0.8 V
V
ID
= 0.3 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1.2 V
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1.2 V
Input = PRBS 2
23
-1
V
ID
= 0.3 V
V
ID
= 0.8 V
2300
V
ID
= 0.5 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1.2 V
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.5 V
V
ID
= 0.8 V
2300
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1.2 V
Input = PRBS 2
23
-1
V
ID
= 0.3 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 2.9 V
Input = Clock
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 2.9 V
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 2.9 V
Input = PRBS 2
23
-1
2300

www.ti.com
0
10
20
30
40
50
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - C
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
V
IC
= 1.2 V
V
ID
= 200 mV
Input = 2 Gbps 2
23
-1
LVDS100
LVDS101
0
50
100
150
200
250
300
350
400
0 500 1000 1500 2000 2500
0
10
20
30
40
50
60
70
80
f - Frequency - MHz
-

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
o
l
t
a
g
e

-

m
V
V
O
D
P
e
r
i
o
d

J
i
t
t
e
r

-

p
s
Added Random Jitter
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25C,
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 2.9 V
Input = PRBS 2
23
-1
2300
300
380
460
540
620
700
0 400 800 1200 1600 2000
0
10
20
30
40
50
f - Frequency - MHz
-

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
o
l
t
a
g
e

-

m
V
V
O
D
P
e
r
i
o
d

J
i
t
t
e
r

-

p
s
Added Random Jitter
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25C,
Input = Clock
0
20
40
60
80
100
0 1000 2000 3000 4000
Data Rate - Mbps
P
e
a
k
-
t
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25C,
Input = PRBS 2
23
-1
0
20
40
60
80
100
0 1000 2000 3000 4000 5000
Data Rate - Mbps
P
e
a
k
-
t
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25C,
Input = PRBS 2
23
-1

www.ti.com
LVPECL-to-LVDS
Horizontal Scale= 200 ps/div
LVPECL-to-LVDS
Horizontal Scale= 100 ps/div
LVDS-to-LVPECL
Horizontal Scale= 200 ps/div
LVDS-to-LVPECL
Horizontal Scale= 100 ps/div

www.ti.com
0
-5
-15
-20
0 1 2 3 4 5
I
n
p
u
t

V
o
l
t
a
g
e

T
h
r
e
s
h
o
l
d

-

m
V
5
15
20
Common-Mode Input Voltage - V
10
-10
3 V, 85C
3 V, 85C
3.6 V, 85C
3.6 V, 85C
3.6 V, -40C
3.6 V, -40C
3 V, -40C
3 V, -40C
V
IT+
V
IT-
|V
OD
| = 250 mV,
R
L
= 100 ,
Nominal Process

www.ti.com

V
CC
V
EE
50 W 50 W
V
CC
-2 V
SN65LVDS100
100 W
SN65LVDS100
ECL
LVDS
50 W 50 W
SN65LVDT101
LVDS
3.3 v
PECL
V
EE
50 W 50 W
3 V
SN65LVDS101
50 W 50 W
ECL
5 V
3.3 v
PECL
50 W 50 W
V
TT
SN65LVDS100 or
SN65LVDS101
CML

www.ti.com
LVDS
V
EE
SN65LVDS100
50 W
ECL
3.3 V
V
BB
22 kW
0.01 mF
Z
0
= 50 W
100 W
* closest standard value
LVDS 100 W
CMOS
1 V < V
DD
< 4 V
V
DD
SN65LVDS100
V
DD
/600 mA*
V
DD
/600 mA* 0.01 mF
* closest standard
value
CMOS
1 V < V
DD
< 4 V
V
DD
SN65LVDS101
V
DD
/600 mA*
V
DD
/600 mA* 0.01 mF
50 W 50 W
3.3 v
PECL
C
C
0.01 mF
50 W
50 W
22 kW
SN65LVDS100 or
SN65LVDS101
V
BB

www.ti.com

1.6 k
1.6 k
100
3.3 V

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN65LVDS100D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN65LVDT100DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
SN65LVDS100DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDS100DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDS101DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDS101DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDT100DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDT100DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDT101DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDT101DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65LVDS100DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDS100DR SOIC D 8 2500 367.0 367.0 35.0
SN65LVDS101DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDS101DR SOIC D 8 2500 367.0 367.0 35.0
SN65LVDT100DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDT100DR SOIC D 8 2500 367.0 367.0 35.0
SN65LVDT101DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDT101DR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2012, Texas Instruments Incorporated