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In CMOS circuits, resistances can either be passive or active. Active resistances are
usually the resistance of the transistors when they are biased to operate in linear or
saturation region. The passive resistors are designed and implemented with different
materials on the chip.
e have two types of resistors in a !"SI circuit# useful and parasitic.
$%SISTA&C% '%SI(&
Resistance
t W
L
A
L
R
)
) ) = =
hat are the parameters that we have control over as a
designer*
, "
and +some control on selection of
,. 'ifferent resistivity,
, is achieved by using
diffusion, metal, poly, &-ell and .-ell materials.
Since thic/ness is process dependent then
t
ds
d
"
&
+neglecting channel modulation effect,
If the channel length modulation is not neglected, then
Conductance 0
=
> ?
=
t $s
n
" " Resistance 0
=
> ?
=
t $s n
" "
Conclusion' &n saturation re$ion, resistance (etween )rain and Source is usuall* a hi$h
value!
.age : of 34
3, 'rain2 Sources $esistance6
$'+S, 0 $sh ) number of s1uares < contact resistance.
The value of the drain and source resistances should be added to the channel resistance,.
A more accurate resistance, $channel, is given below ta/ing channel length modulation and
!
=
into account
$
CD
3
CE
"
----- !
(S
!
T
( )
!
'S
[ ]
----------------------------------------------------------------E
=
=, Channel $esistance6
This depends on the region of operation6
R
CH
2
K'
W
L
----- V
GS
V
T
( )
2
----------------------------------------------------
=
Contact resistance:
The contact resistance Rc is defined as $c0
c2A where
$
i
n
.
/
$
i
n
.
0
VD
D
Vo
VDD-VT
(VDSAT)
Merging the two e1uations,
dt
Cd"
" "
ds
tn $s
n
=
=
> ?
=
=
"))
"tn ")) tn $s n
ds
t
t
" "
d" C
dt
G . 9
=
=
3
> ?
. =
= 3
, +
, 3 . 9 + =
tn dd n
dd tn L
" "
" " C
t
=
"tn "))
"))
ds
ds tn $s n
ds
t
t
" " " "
d" C
dt
3 . 9
=
=
3
> ?
.
,
dd
tn
"
"
n =
(rouping all the constants into C, the fall time is given as6
dd n
L
"
C
- t
=
, where - is a constant (etween . and / dependin$ on the process
If the same analysis are done for the trise +tr, we have
dd p
L
r
"
C
- t
=
trise and tfall, are dependent on 2", C" and !dd. e can only change C" and 2" through
design. !'' depends on the process.
#n order to e2uali3e t
rise
and t
fall
- ,a4e n r p
W W =
where
p
n
r
=
.age 39 of 34
&esign 5uidelines:
6eep the rise and fall ti,es e2ual and s,aller than the propagation delay of the
inverter. This will have an i,pact on speed and the power consu,ption of the
circuit.
"ropagation &elay
The following factors influence the delay of the inverter6
"oad Capacitance
Supply !oltage
Transistor SiIes
Kunction Temperature
Input Transition Time
7or any given process, we can e5press the delay +td, for an inverter as6
t
phl
0
, , + p "t " p
Cload
))
?
p "t "
p "t
)) ,
, =
< ln +
3
, , + :
))
))
"
p "t "
, >
t
plh
.
, , + n "t " n
Cload
))
?
n "t "
n "t
)) ,
, =
< ln +
3
, , + :
))
))
"
n "t "
, >
Since &, . are design parameters and !'' is technology dependent while n and p are
constants for a given process then the delay can be e5pressed as6
n
L
n
phl
C
A t
=
,
p
L
p plh
C
A t
=
The coefficients LAnM or LApM is obtained for a given process from analytical calculations
or better through S.IC% Simulation. That is, for a /nown C" and n, we usually
determine td+spice, for either tphl or tplh and then determine An or Ap. Once An and Apare
obtained, it can be used repeatedly for the same process. ie6
L
n spice d
n
C
t
A
=
Su,,ari3ing then-
t
phl
0
, , + p "t " p
Cload
))
?
p "t "
p "t
)) ,
, =
< ln +
3
, , + :
))
))
"
p "t "
, >
t
plh
.
, , + n "t " n
Cload
))
?
n "t "
n "t
)) ,
, =
< ln +
3
, , + :
))
))
"
n "t "
, >
.age 33 of 34
t.D" 0
")) n
A C , L
E
t."D 0
")) p
A C n L
E
t
r
C
"
C
.
!'' 3 p < + ,
---------------------------------------
= N + , 3 p < + ,
3 p < + ,
---------------------------- 3G =9p < + , ln < 0
t
r
:C
"
AE
.
C
.
!''
--------------------- 0
Assume normaliIed voltages
vin= !in2 !''
vo= !o2 !''
n 0 !T&2 !''
p 0 !T.2 !''
t
"7L
and t
f
decrease with the increase of 89L of the '(OS
t
"L7
and t
r
decrease with the increase of 89L of the "(OS
The delay of the inverter increases with the increase of the input
transition ti,es t
r
and t
f
.age 3= of 34
%ffect of the input Slope
All the previous e1uations involve the use of a step unit signal as input. Dowever real-life
signals are often ramps. In that case we will use the following e1uation to incorporate the
effect of the slope of tr and tf6
7irst Order Model
= =
,
=
+
r
phl
phl
t
t t
step
+ =
= =
,
=
+
plh
plh
t
t t
step
+ =
, +
=
3
plh phl d
t t t + =
Alternative 'elay Model +for the rise time,
, = 3 +
;
p
t
t t
dr dr
step
+ = ,
dd
t
"
"
p =
A"T%$&ATI!% '%"AO +tp, 7O$M@"A
7or the short channel transistor the following delay e1uation is also used6
,
3
+
=
+ ,
L
p
C
t
+
=
Also in the short channel model the source resistance becomes important and it has to be
ta/en into account, since it affects both the current and the voltage threshold.
Oet another model
tp 0
, +
T ))
)) L
" " A
" C
here A is a constant and P is another constant between 3.: and = depending upon the
technology us
.age 3B of 34
"L%AS% 'OT%6 All models presented here are appro5imate# we only use them as
guidelines when implementing circuits. Accurate delays are obtained only through
S#(+LAT#O'
Assignment #4
!"SI 'esign, CO%& :43
A CMOS inverter +I&!3,, with a physical layout shown in 7ig.3, drives a similar
inverter, and operates at a supply voltage of B.B!.
a. 'etermine the delay of the inverter I&!3.
b. hat will be the ma5imum speed of operation of I&!3 if it drives ten similar inverters
c. One of the methods to speed up the operation is to increase the siIe of the driver.
'etermine the 2"s of the .MOS and the &MOS transistors of I&!3 so that the speed in
part +b, is doubled, assuming that the supply voltage has been reduced by 39F. +Dint6
@se twice the diffusion capacitance of 7ig.3,.
d. 'etermine the dynamic power dissipation of the inverter +I&!3, for part c.
@se CMC technology parameters CMOSIS4Q
.age 3: of 34
7ig. 3 Inverter for design
.age 34 of 34
M3 !''
!in
:.9R
!out M3
;.4 R
=.4 R
B.9 R (nd
9.4 R
=.4R
B.9 R
=.9R