Automation Systems & IT

within Intels High Volume

Manufacturing

2006 MIT Manufacturing Summit

Bimal Dey / Anthony Maggi

AGENDA

Intels Manufacturing Environment

Automation Drivers/Domains
Focus Topic: Automated Matl Handling
Focus Topic: Process Control Systems

Environment: Highly Global

Washington

Ireland

Systems Mfg

China

Fab 14/24

Pudong/Chendu A/T
Sub-con Mfg

Colorado

Fab 23

Oregon

Israel

Mass.

Dev D1C/D1D
Fab 15/20
Board Mfg

Fab 8/18/28

Fab 17

California

Dev D2

New Mexico

Fab 7/11/11X

Arizona

Fab12/22/32
A/T Dev
Wafer
Wafer Fab
Fab
Assembly/Test
Assembly/Test

Taiwan

Thailand

Costa Rica

Sub-con Mfg
Vietnam-AT

San Jose A/T

Malaysia

Penang A/T
Kulim A/T
Kulim Board/Module Mfg
Brazil
Sub-con Mfg
Sub-con Mfg.

Sub-con Mfg
Philippines

Manila A/T
Cavite A/T

Systems/Sub-con
Systems/Sub-con

Challenge: Deploy CE! IT capabilities across the globe

3

Manufacturing Environment Vectors

Technologies

Global
18 month
cycles dispersion

Computing
security
Automation
reliability

Affordability

Competitive
challenges

Quality
expectations

Cost of
excursions

Supply
chain
optimization

Each are drivers as well as opportunities for IT

4

IT Infrastructure Challenges in Mfg

Environmental vectors are confound by key
challenges including

Complexity
Exploitation of security vulnerabilities
Explosive usage growth of products and
services
Equates to continued cost pressures

AGENDA

Intels Manufacturing Environment

Automation Drivers/Domains
Focus Topic: Automated Matl Handling
Focus Topic: Process Control Systems

Key Automation Drivers for Mfg

Rapid
Factory
Cycle Time

High
Equipment
Availability &
Utilization

Zero set
up time

Rapid New
Product Switch
over
WIP Matched
to Current
Needs

Higher
People
Productivity
Lot size
reduction

Error free
processing

Optimized Space
Management
7

AGENDA

Intels Manufacturing Environment

Automation Drivers/Domains
Focus Topic: Automated Matl Handling
Focus Topic: Process Control Systems

Automation/IT role in 300mm Mfg

100% AMHS

Pervasive
FDC / SPC

Automated
Dispatching

Remote Diagnostics
Communication Bus

Run to Run Control

with APC
Framework

CYBER SECURITY

Process Equipment
OHT

New MES

Yield Analysis

Wafer/Unit Trace

Tool Reliability Tracking

Process Equipment

Litho

Etch

Films

Thermal Planar Metrology

Factory Wide User

Interfaces

Remote Command Centers

Real Time
Tool View

AMHS Components
Interbay
transport

OHV

Stocker
Equipment

Process Equipment
Intrabay
Key Points:
I/Fs
controller
Process or
Interbay
E-5-SECS II
Metrology
1. Production Equipment
standards
and
capabilities
controller
Equipment
E-30-GEM
E-37 HSMS
were Critical to achieving 100% Intrabay
E-87 Carrier Mgmt
AMHS
Equipment
I/Fs
Automation
Tool
E-90 Substrate Tracking
Embedded
E5 SECS II E82 IBSEM
E-40 Process Job Mgmt
Controller
E84
Parallel
I/O
E30
GEM
2. AMHS E88
Standards
enable mix and matchE-84
ofParallel
supplier
I/O for
Stocker SEM
E37 HSMS
tools to get Best In Class equipment E-94OHV
Control Job Mgmt
Material Control
Execution
Station
3. Major
time
focus
was
spent
integrating
software
System
(MCS)
Control (EC)
Controllers
capabilities with Production and AMHS Equipment
Information
Bus equipment must
4. All in-line process
and metrology
be [and
has
to Manufacturing
the AMHSExecution
Reticle
Scheduler
/ been] connected
FOUP

Dispatcher

Tracking

System (MES)

300mm Automation Fully Integrated

Goal: Direct Tool to Tool WIP
Movement without human
intervention

F11x  2.6miles of track

11

Remote Operations Center in F11x

12

AMHS Summary

Intel has achieved 100% Integrated Intrabay

AMHS in its 300mm Fabs
100% integrated intrabay could not have been
achieved in the same timeframe without open
industry standards
Rapid throughput AMHS transport systems are
needed to meet demanding lot cycle times, fast
run rate production equipment, and complex
process technology scenarios
Future capabilities are planned to extend the
current technology to fully (near 100%)
automated decision making for intrabay
scheduling and dispatching

Process Control Systems

Automated Process Control (On Line)

Fault Detection Systems (On Line)

Statistical Process Control Systems (Off

Line)

14

Overview of Process Control Systems

Typical Usage of Process Control at a Process Tool
FDC Monitor equipment
event and time series data.
Stop tool when ranges or
profiles are exceeded
Pervasive Implementation

SPC Monitor statistical

data and stop the tool if
trending to OOC
100% of the Fab
Step N

Step N-1
Essential Data
standards include SEMI
E40, E94, E90 for wafer
level control & tracking

UI

Metrology
Equipment

Step N+1
UI

Process
Equipment

UI

Metrology
Equipment

Run to Run APC - Use feedback and feed forward

metrology and sensor data to adjust processing at the lot
and wafer level. Drive for multi-step control.
Various % - Decision is based on problem being solved

15

Sensors Use 3rd

party and embedded
sensors to provide
FDC & R2R APC data
Various % - Decision
is based on problem
being solved

Capability and Efficiency

Evolution of Intel Process Control

300mm
Gen 4
Point solutions for SPC
spread across the factory
Ad hoc and limited FDC
and Run to Run APC
Control Systems
Rudimentary Control
Analytics

300mm
Gen 2

200mm
Gen 3
200mm
Gen 1

Factory wide systems &

usage of SPC & FDC
Point Solutions for Run
to Run APC
Basic FDC & APC
Control & Yield Analysis

200mm Wafers
1st Generation
(1993)

200mm Wafers
3rd Generation
(1999)

Factory wide systems &

usage of SPC & FDC
Maturing FDC & APC
Control Analytics
Reusable Run to Run
APC Framework with
litho coverage
Advanced Yield
Analysis and Analytics

300mm Wafers
2nd Generation
(2006)
Time axis
16

Factory wide systems

and usage of PCS (SPC
+ FDC + APC)
Advanced FDC & APC
Control Analytics
Advanced Yield
Analysis and Analytics
moving toward
predictive models

300mm Wafers
4th Generation
(2007)

SUMMARY

High Volume manufacturing in Semi

industry presents many unique
challenges
Advances in AMHS and PCS has been
key to addressing some of these
challenges
Continued advances needed in these
two areas to keep pace with the
Moores law and rapid pace of the
Semi technology
17

Questions

18

References

J. Wu, O. Rozmarin and B. Li, A Flexible Execution Control Framework for

300mm Factory Automation in Semiconductor Manufacturing, 2003
Nimish Shah , ASMC Keynote Presentation 2005
E. Bass, D. Pillai, J. Dempsey, 300mm Full-Factory Simulations for 90nm
and 65nm IC Manufacturing in Proceedings of the International Symposium
of Semiconductor Manufacturing (ISSM), 2003
B. Li and J. Wu, Factory Throughput Improvement Through Intelligent
Integrated Delivery in 300mm Wafer Manufacturing in Proceedings of the
International Symposium of Semiconductor Manufacturing (ISSM), 2003
J. Wu and R. Madson, APF in Intels 300mm Execution Control Strategy in
Brooks Worldwide Automation and Performance Symposium, 2002
J. Pettinato and M. Honma, Factory Integration Roadmap at the
International Technology Roadmap for Semiconductors (ITRS) Conference,
2002
B. Sohn, D. Pillai, N. Acker, 300mm Factory Design for Operational
Effectiveness, IEEE/ASMC Conference, SEMICON Europa, Munich,
Germany, April 2000e