PROBLEM 9.

27
KNOWN: Vertical circuit board dissipating 5W to ambient air.
FIND: (a) Maximum temperature of the board assuming uniform surface heat flux and (b)
Temperature of the board for an isothermal surface condition.
SCHEMATIC:

ASSUMPTIONS: (1) Either uniform qs or Ts on the board, (2) Quiescent room air.
PROPERTIES: Table A-4, Air (Tf =(TL/2 + T)/2 or (Ts + T)/2, 1 atm), values used in
iterations:
Iteration
1
2
3
4

Tf(K)

10 (m /s)

312
324
319
320

17.10
18.30
17.80
17.90

k10 (W/mK)
27.2
28.1
27.7
27.8

10 (m /s)
24.3
26.1
25.3
25.4

Pr
0.705
0.704
0.704
0.704

ANALYSIS: (a) For the uniform heat flux case (see Section 9.6.1), the heat flux is
qs = hTL / 2
where
TL / 2 = TL / 2 T
and

(1,2)

qs = q / As = 5W / ( 0.150m ) = 222 W / m 2 .
2

The maximum temperature on the board will occur at x = L and from Eq. 9.28 is
Tx = 1.15 ( x / L )

1/ 5

TL / 2

(3)

TL = Tmax = T + 1.15 TL / 2 .
The average heat transfer coefficient h is estimated from a vertical (uniform Ts) plate
correlation based upon the temperature difference TL/2. Recognize that an iterative
procedure is required: (i) assume a value of TL/2, use Eq. (2) to find TL/2; (ii) evaluate the
Rayleigh number
Ra L = g TL / 2 L3 /

(4)

and select the appropriate correlation (either Eq. 9.26 or 9.27) to estimate h; (iii) use Eq. (1)
with values of h and TL/2 to find the calculated value of qs ; and (iv) repeat this procedure
2
until the calculated value for qs is close to qs = 222 W/m , the required heat flux.
Continued ..

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PROBLEM 9.27 (Cont.)

To evaluate properties for the correlation, use the film temperature,
Tf = ( TL / 2 + T ) / 2.

(5)

Iteration #1: Assume TL/2 = 50C and from Eqs. (2) and (5) find
D
D
TL / 2 = ( 50 27 ) C = 23D C
Tf = ( 50 + 27 ) C / 2 = 312K.
From Eq. (4), with = 1/Tf, the Rayleigh number is
Ra L = 9.8m / s

(1/ 312K ) 23D C ( 0.150m )3 /

(17.10 10

)(

m / s 24.3 10

m / s = 5.868 10 .

Since Ra L < 109 , the flow is laminar and Eq. 9.27 is appropriate
4
0.670 Ra1/
hL
L
Nu L =
= 0.68 +
4/9
k
1 + ( 0.492 / Pr )9 /16

6 1/ 4
2
9 /16 4 / 9
/ 1 + ( 0.492 / 0.705 )
0.68 + 0.670 5.868 10
= 4.71 W / m K.

0.150m

Using Eq. (1), the calculated heat flux is

qs = 4.71W / m 2 K 23D C = 108 W / m 2 .
hL =

0.0272 W / m K

Since qs < 222 W/m , the required value, another iteration with an increased estimate for
TL/2 is warranted. Further iteration results are tabulated.
TL/2(C)

Iteration TL/2(C)

2
3
4

75
65
68

48
38
41

Tf(K)

324
319
320

h W / m2 K

RaL
7

1.02610
6
8.74910
6
9.32110

5.57
5.29
5.39

qs W / m 2

268
201
221

After Iteration 4, close agreement between the calculated and required qs is achieved with
TL/2 = 68C. From Eq. (3), the maximum board temperature is
D

TL = Tmax = 27D C + 1.15 ( 41) C = 74D C.

<

(b) For the uniform temperature case, the procedure for estimation of the average heat transfer
coefficient is the same. Hence,
Ts = TL / 2 qs = 68D C.
COMMENTS: In both cases, q = 5W and

<

h = 5.38 W / m 2 . However, the temperature

distributions for the two cases are quite
different as shown on the sketch. For qs =
1/5

constant, Tx ~ x

according to Eq. 9.28.

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in
courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted by Sections 107 or 108 of the 1976
United States Copyright Act without the permission of the copyright owner is unlawful.