OPA335

OPA334
OPA2334
OPA335
OPA2335
OPA3
35
OPA2
OPA2
334
335
OPA23
35
SBOS245D JUNE 2002 REVISED JULY 2003
0.05V/C max, SINGLE-SUPPLY

CMOS OPERATIONAL AMPLIFIERS
Zer-Drift Series
FEATURES
DESCRIPTION
The OPA334 and OPA335 series of CMOS operational

amplifiers use auto-zeroing techniques to simultaneously
provide very low offset voltage (5V max), and near-zero drift
over time and temperature. These miniature, high-precision,
low quiescent current amplifiers offer high input impedance
and rail-to-rail output swing. Single or dual supplies as low as
+2.7V (1.35V) and up to +5.5V (2.75V) may be used.
These op amps are optimized for low-voltage, single-supply
operation.
The OPA334 (single version with shutdown) comes in

MicroSIZE SOT23-6. The OPA335 (single version without
shutdown) is available in SOT23-5, and SO-8. The OPA2334
(dual version with shutdown) comes in MicroSIZE MSOP-10.
The OPA2335 (dual version without shutdown) is offered in
the MSOP-8 and SO-8 packages. All versions are specified
for operation from 40C to +125C.
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
0.050
0.045
0.025
0.020
0.015
0.010
Absolute Value;
Centered Around Zero
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
Population
Population
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
0.040
TRANSDUCER APPLICATIONS
TEMPERATURE MEASUREMENT
ELECTRONIC SCALES
MEDICAL INSTRUMENTATION
BATTERY-POWERED INSTRUMENTS
HANDHELD TEST EQUIPMENT
0.005
0.035
APPLICATIONS
The OPA334 family includes a shutdown mode. Under logic

control, the amplifiers can be switched from normal operation
to a standby current of 2A. When the Enable pin is connected high, the amplifier is active. Connecting Enable low
disables the amplifier, and places the output in a highimpedance state.
0.030
LOW OFFSET VOLTAGE: 5V (max)

ZERO DRIFT: 0.05V/C (max)
QUIESCENT CURRENT: 285A
SINGLE-SUPPLY OPERATION
SINGLE AND DUAL VERSIONS
SHUTDOWN
MicroSIZE PACKAGES
Offset Voltage (V)
Offset Voltage Drift (V/C)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2002-2003, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage .................................................................................... +7V

Signal Input Terminals, Voltage(2) ........................... 0.5V to (V+) + 0.5V
Current(2) .................................................. 10mA
Output Short Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. 40C to +150C
Storage Temperature ..................................................... 65C to +150C
Junction Temperature .................................................................... +150C
Lead Temperature (soldering, 10s) ............................................... +300C
This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these, or any other conditions beyond those specified,
is not implied. (2) Input terminals are diode-clamped to the power-supply
rails. Input signals that can swing more than 0.5V beyond the supply rails
should be current-limited to 10mA or less. (3) Short-circuit to ground, one
amplifier per package.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
SOT23-6
DBV
40C to +125C
OAOI
"
"
"
"
OPA334AIDBVT
OPA334AIDBVR
Tape and Reel, 250

Tape and Reel, 3000
MSOP-10
DGS
40C to +125C
BHE
"
"
"
"
OPA2334AIDGST
OPA2334AIDGSR
Tape and Reel, 250

Tape and Reel, 2500
SOT23-5
DBV
40C to +125C
OAPI
"
"
"
"
SO-8
40C to +125C
OPA335
"
"
"
"
OPA335AIDBVT
OPA335AIDBVR
OPA335AID
OPA335AIDR
Tape and Reel, 250

Tape and Reel, 3000
Rails, 100
Tape and Reel, 2500
SO-8
40C to +125C
OPA2335
"
"
"
"
MSOP-8
DGK
40C to +125C
BHF
"
"
"
"
OPA2335AID
OPA2335AIDR
OPA2335AIDGKT
OPA2335AIDGKR
Rails, 100
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
Shutdown Version
OPA334
"
OPA2334
"
Non-Shutdown Version
OPA335
"
OPA335
"
OPA2335
"
OPA2335
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN CONFIGURATIONS
OPA335
Out
+In
OPA2334
OPA335
5
V+
In
NC(1)
NC(1)
Out A
In
V+
In A
+In
Out
NC(1)
10 V+
9
Out B
In B
A
+In A
3
B
SOT23-5
+In B
Enable A
Enable B
SO-8
MSOP-10
OPA2335
OPA334(2)
OAOI
V+
Out A
V 2
Enable
In A
+In 3
In
+In A
Out 1
A
B
V+
Out B
In B
+In B
SOT23-6
SO-8, MSOP-8
NOTES: (1) NC indicates no internal connection. (2) Pin 1 of the SOT23-6 is

determined by orienting the package marking as indicated in the diagram.
OPA334, OPA2334, OPA335, OPA2335

www.ti.com
SBOS245D
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = 40C to +125C.
At TA = +25C, VS = +5V, RL = 10k connected to VS /2, and VOUT = VS /2, unless otherwise noted.
OPA334AI, OPA335AI
OPA2334AI, OPA2335AI
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
Long-Term Stability(1)
Channel Separation, dc
CONDITION
VOS
dVOS /dT
PSRR
VCM = VS /2
TYP
1
0.02
1
VS = +2.7V to +5.5V, VCM = 0, Over Temperature
MAX
UNITS
V
V/C
V/V
0.05
2
See Note (1)

0.1
INPUT BIAS CURRENT

Input Bias Current
Over Temperature
Input Offset Current
IOS
70
1
120
en
in
1.4
20
IB
NOISE
Input Voltage Noise, f = 0.01Hz to 10Hz
Input Current Noise Density, f = 10Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
MIN
VCM
CMRR
VCM = VS /2
(V) 0.1V < VCM < (V+) 1.5V, Over Temperature
(V) 0.1
110
INPUT CAPACITANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain, Over Temperature AOL
Over Temperature
50mV < VO < (V+) 50mV, RL = 100k, VCM = VS /2

100mV < VO < (V+) 100mV, RL = 10k, VCM = VS /2
110
110
V/V
200
400
pA
nA
pA
VPP
fA/ Hz
130
(V+) 1.5
V
dB
1
5
pF
pF
130
130
dB
dB
2
1.6
MHz
V/s
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
OUTPUT
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Short-Circuit Current
Capacitive Load Drive
GBW
SR
G = +1
RL = 10k, Over Temperature
RL = 100k, Over Temperature
ISC
CLOAD
SHUTDOWN
tOFF
tON(2)
VL (shutdown)
VH (amplifier is active)
Input Bias Current of Enable Pin
IQSD
POWER SUPPLY
Operating Voltage Range
Quiescent Current: OPA334, OPA335
IQ
Over Temperature
OPA2334, OPA2335 (totaltwo amplifiers)
Over Temperature
15
100
1
50
50
See Typical Characteristics
s
s
V
V
pA
A
5.5
350
450
700
900
V
A
A
A
A
+125
+150
+150
C
C
C
C/W
C/W
C/W
1
150
0
0.75 (V+)
+0.8
5.5
50
2.7
IO = 0
285
IO = 0
570
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
JA
SOT23-5, SOT23-6 Surface-Mount
MSOP-8, MSOP-10, SO-8 Surface-Mount
40
40
65
200
150
mV
mV
mA
NOTES: (1) 500-hour life test at 150C demonstrated randomly distributed variation approximately equal to measurement repeatability of 1V. (2) Device requires
one complete cycle to return to VOS accuracy.
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
www.ti.com
TYPICAL CHARACTERISTICS
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.005
0.010
Absolute Value;
Centered Around Zero
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
Population
Population
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Offset Voltage (V)
Offset Voltage Drift (V/C)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE

1200
+125C
5.5V
2.7V
+125C
Input Bias Current (pA)
Output Voltage Swing (V)
(V+)
+25C
(V+) 1
40C
+25C
(V) + 1
40C
+125C
(V)
1000
800
600
400
40C
+25C
200
0
10
0.5
1.0
1.5
2.0
2.5
3.0
Output Current (mA)
Common-Mode Voltage (V)
INPUT BIAS CURRENT vs TEMPERATURE
QUIESCENT CURRENT (per channel)

vs TEMPERATURE
3.5
400
1000
Quiescent Current (A)
Input Bias Current (pA)
350
100
VS = +5.5V
300
250
200
VS = +2.7V
150
100
50
0
10
40
20
20
40
60
80
100
40
120
20
40
60
80
100
120
Temperature (C)
Temperature (C)
20
OPA334, OPA2334, OPA335, OPA2335

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SBOS245D
TYPICAL CHARACTERISTICS (Cont.)

LARGE-SIGNAL RESPONSE
OPEN-LOOP GAIN/PHASE vs FREQUENCY

140
80
100
80
110
120
Gain
40
130
20
140
150
20
0.1
10
100
1k
10k
100k
1M
Output Voltage (1V/div)
100
60
G = 1
CL = 300pF
90
Phase
Phase ()
AOL (dB)
120
160
10M
Time (5s/div)
Frequency (Hz)
POSITIVE OVER-VOLTAGE RECOVERY
200mV/div
G = +1
CL = 50pF
0
Input
10k
1V/div
Output Voltage (50mV/div)
SMALL-SIGNAL RESPONSE
+2.5V
Output
100
0
OPA335
2.5V
Time (25s/div)
Time (5s/div)
NEGATIVE OVER-VOLTAGE RECOVERY
COMMON-MODE REJECTION vs FREQUENCY
Input
0
0
10k
1V/div
+2.5V
100
Output
OPA335
Common-Mode Rejection (dB)
200mV/div
140
2.5V
120
100
80
60
40
20
0
Time (25s/div)
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
www.ti.com

POWER-SUPPLY REJECTION RATIO vs FREQUENCY
SAMPLING FREQUENCY vs SUPPLY VOLTAGE

11.0
10.9
120
+PSRR
10.8
100
Frequency (kHz)
Power-Supply Rejection Ratio (dB)
140
80
60
40
PSRR
10.7
10.6
10.5
10.4
10.3
10.2
20
10.1
10.0
10
100
10k
100k
1M
2.7
3.2
3.7
4.2
4.7
Frequency (Hz)
Supply Voltage (V)
NOISE vs FREQUENCY
0.01Hz TO 10Hz NOISE
5.2
5.5
400nV/div
Noise (nV/Hz)
1000
1k
100
10
1
10
100
1k
10k
100k
10s/div
Frequency (Hz)
SAMPLING FREQUENCY vs TEMPERATURE

13
50
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE

(VS = 2.7V to 5V)
RL = 10k
12
40
Overshoot (%)
Sampling Frequency (kHz)
45
11
10
35
30
25
20
15
10
5
0
40
10
20
50
80
110 125
10
Temperature (C)
100
1000
Load Capacitance (pF)
OPA334, OPA2334, OPA335, OPA2335

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SBOS245D

SETTLING TIME vs CLOSED-LOOP GAIN
COMMON-MODE RANGE vs SUPPLY VOLTAGE

4.5
Unity-gain
requires one
complete Auto-Zero
Cyclesee text.
4.0
Common-Mode Range (V)
Settling Time (s)
100
0.01%
10
0.1%
3.5
Maximum Common-Mode
3.0
2.5
2.0
1.5
1.0
0.5
Minimum Common-Mode
0
0.5
1
1
10
100
2.7
3.2
Gain (V/V)
4.2
4.7
5.2
5.5
Supply Voltage (V)
APPLICATIONS INFORMATION
The OPA334 and OPA335 series op amps are unity-gain
stable and free from unexpected output phase reversal. They
use auto-zeroing techniques to provide low offset voltage
and very low drift over time and temperature.
Good layout practice mandates use of a 0.1F capacitor
placed closely across the supply pins.
For lowest offset voltage and precision performance, circuit
layout and mechanical conditions should be optimized. Avoid
temperature gradients that create thermoelectric (Seebeck)
effects in thermocouple junctions formed from connecting
dissimilar conductors. These thermally-generated potentials
can be made to cancel by assuring that they are equal on
both input terminals.
Use low thermoelectric-coefficient connections (avoid dissimilar metals).
Thermally isolate components from power supplies or
other heat-sources.
Shield op amp and input circuitry from air currents, such as
cooling fans.
Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can cause thermoelectric voltages of 0.1V/C or higher, depending on
materials used.
OPERATING VOLTAGE
The OPA334 and OPA335 series op amps operate over a
power-supply range of +2.7V to +5.5V (1.35V to 2.75V).
Supply voltages higher than 7V (absolute maximum) can
permanently damage the amplifier. Parameters that vary
over supply voltage or temperature are shown in the Typical
Characteristics section of this data sheet.
OPA334 ENABLE FUNCTION

The enable/shutdown digital input is referenced to the V
supply voltage of the amp. A logic high enables the op amp. A
valid logic high is defined as > 75% of the total supply voltage.
The valid logic high signal can be up to 5.5V above the negative
supply, independent of the positive supply voltage. A valid
logic low is defined as < 0.8V above the V supply pin. If dual
or split power supplies are used, be sure that logic input signals
are properly referred to the negative supply voltage. The
Enable pin must be connected to a valid high or low voltage, or
driven, not left open circuit.
The logic input is a high-impedance CMOS input, with separate logic inputs provided on the dual version. For batteryoperated applications, this feature can be used to greatly
reduce the average current and extend battery life.
The enable time is 150s, which includes one full auto-zero
cycle required by the amplifier to return to VOS accuracy.
Prior to this time, the amplifier functions properly, but with
unspecified offset voltage.
Disable time is 1s. When disabled, the output assumes a
high-impedance state. This allows the OPA334 to be operated as a gated amplifier, or to have the output multiplexed
onto a common analog output bus.
INPUT VOLTAGE
The input common-mode range extends from (V) 0.1V to
(V+) 1.5V. For normal operation, the inputs must be limited
to this range. The common-mode rejection ratio is only valid
within the valid input common-mode range. A lower supply
voltage results in lower input common-mode range; therefore, attention to these values must be given when selecting
the input bias voltage. For example, when operating on a
single 3V power supply, common-mode range is from 0.1V
below ground to half the power-supply voltage.
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
3.7
www.ti.com
Normally, input bias current is approximately 70pA; however,

input voltages exceeding the power supplies can cause
excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply can be tolerated
if the input current is limited to 10mA. This is easily accomplished with an input resistor, as shown in Figure 1.
Current-limiting resistor
required if input voltage
exceeds supply rails by
0.5V.
swing limit of a single-supply op amp. A good single-supply

op amp may swing close to single-supply ground, but will not
reach ground. The output of the OPA334 or OPA335 can be
made to swing to ground, or slightly below, on a singlesupply power source. To do so requires use of another
resistor and an additional, more negative, power supply than
the op amps negative supply. A pull-down resistor may be
connected between the output and the additional negative
supply to pull the output down below the value that the output
would otherwise achieve, as shown in Figure 2.
+5V
V+ = +5V
IOVERLOAD
10mA max
OPA335
VOUT
VOUT
OPA335
VIN
5k
VIN
RP = 40k
Op Amps V = Gnd
FIGURE 1. Input Current Protection.
5V
Additional
Negative
Supply
INTERNAL OFFSET CORRECTION

The OPA334 and OPA335 series op amps use an auto-zero
topology with a time-continuous 2MHz op amp in the signal
path. This amplifier is zero-corrected every 100s using a
proprietary technique. Upon power-up, the amplifier requires
one full auto-zero cycle of approximately 100s to achieve
specified VOS accuracy. Prior to this time, the amplifier
functions properly but with unspecified offset voltage.
This design has remarkably little aliasing and noise. Zero
correction occurs at a 10kHz rate, but there is virtually no
fundamental noise energy present at that frequency. For all
practical purposes, any glitches have energy at 20MHz or
higher and are easily filtered, if required. Most applications
are not sensitive to such high-frequency noise, and no
filtering is required.
Unity-gain operation demands that the auto-zero circuitry
correct for common-mode rejection errors of the main amplifier. Because these errors can be larger than 0.01% of a fullscale input step change, one calibration cycle (100s) can be
required to achieve full accuracy. This behavior is shown in
the typical characteristic section, see Settling Time vs ClosedLoop Gain.
ACHIEVING OUTPUT SWING TO THE OP AMPS

NEGATIVE RAIL
Some applications require output voltage swing from 0V to a
positive full-scale voltage (such as +2.5V) with excellent
accuracy. With most single-supply op amps, problems arise
when the output signal approaches 0V, near the lower output
FIGURE 2. Op Amp with Pull-Down Resistor to Achieve

VOUT = Ground.
The OPA334 and OPA335 have an output stage that allows
the output voltage to be pulled to its negative supply rail, or
slightly below using the above technique. This technique only
works with some types of output stages. The OPA334 and
OPA335 have been characterized to perform well with this
technique. Accuracy is excellent down to 0V and as low as
2mV. Limiting and non-linearity occurs below 2mV, but
excellent accuracy returns as the output is again driven
above 2mV. Lowering the resistance of the pull-down resistor will allow the op amp to swing even further below the
negative rail. Resistances as low as 10k can be used to
achieve excellent accuracy down to 10mV.
LAYOUT GUIDELINES
Attention to good layout practices is always recommended.
Keep traces short. When possible, use a PCB ground plane
with surface-mount components placed as close to the device pins as possible. Place a 0.1F capacitor closely across
the supply pins. These guidelines should be applied throughout the analog circuit to improve performance and provide
benefits such as reducing the EMI (electromagnetic-interference) susceptibility.
OPA334, OPA2334, OPA335, OPA2335

www.ti.com
SBOS245D
4.096V
REF3040
+5V
+
0.1F
R9
150k
R1
6.04k
R5
31.6k
D1
+5V
0.1F
R2
2.94k
+ +
R2
549
R4
6.04k
VO
OPA335
R6
200
K-Type
Thermocouple
40.7V/C
Zero Adj.
R3
60.4
FIGURE 3. Temperature Measurement Circuit.
IIN
R1
IIN
R1
+5V
+2.5V
Photodiode
Photodiode
OPA343
OPA343
2.5V
C1
1M
1M
C1
+5V
+2.5V
R2
R2
NOTE: (1) Optional pull-down

resistor to allow below
ground output swing.
OPA335
C2
OPA335
C2
40k(1)
2.5V
5V
a. Split Supply.
b. Single Supply.
FIGURE 4. Auto-Zeroed Transimpedance Amplifier.
VEX = +2.5V
VEX
R1 = 105
R1
Select R1 so bridge
output VCMmax.
+5V
R R
R R
300
Bridge
VOUT
OPA335
@ VS = 2.7V,
VCMmax = 1.2V
R2
+2.7V
OPA335
R1
VOUT
R2
VREF
VREF
a. 5V Supply Bridge Amplifier.
b. 2.7V Supply Bridge Amplifier.
FIGURE 5. Single Op Amp Bridge Amplifier Circuits.
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
www.ti.com
R2
R1
R1
R2
+5V
VREF
G=1+
+5V
1/2
OPA2335
R R
R R
1/2
OPA2335
R2
R1
VOUT
R3(1)
40k
5V
NOTE: (1) Optional pull-down resistor

to allow accurate swing to 0V.
FIGURE 6. Dual Op Amp IA Bridge Amplifier.
11.5k
+5V
5V
FS = 0.63V
Load
50mV
Shunt
OPA335
R3(1)
40k
RS
ADS1100
I2C
1k
G = 12.5
5V
(PGA Gain = 8)
5V FS
NOTE: (1) Pull-down resistor

to allow accurate swing to 0V.
FIGURE 7. Low-Side Current Measurement.
10
OPA334, OPA2334, OPA335, OPA2335

www.ti.com
SBOS245D
R1
4.12k
C1
56pF
+5V
C2
0.1F
R3
100
Photodiode
2pF
VOUT
OPA353
R2(1)
2k
C3
1nF
1MHz Bandwidth
VOS 10V
5V
C4
10nF
Photodiode
Bias
+5V
R7
1k
C6
0.1F
C7
1F
R4
100k
R6
49.9k
OPA335
R5(1)
40k
C5
10nF
5V
NOTE: (1) Pull-down resistors to allow accurate swing to 0V.
FIGURE 8. High Dynamic Range Transimpedance Amplifier.
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
www.ti.com
11
PACKAGE DRAWINGS
DBV (R-PDSO-G6)
PLASTIC SMALL-OUTLINE
0,95
6X
6
0,50
0,25
0,20 M
1,70
1,50
0,15 NOM
3,00
2,60
Gage Plane
3,00
2,80
0,25
0 8
0,55
0,35
Seating Plane
1,45
0,95
0,05 MIN
0,10
4073253-5/G 01/02
NOTES: A.
B.
C.
D.
12
All linear dimensions are in millimeters.

This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
OPA334, OPA2334, OPA335, OPA2335

www.ti.com
SBOS245D
PACKAGE DRAWINGS (Cont.)
DGS (S-PDSO-G10)
PLASTIC SMALL-OUTLINE PACKAGE

0,27
0,17
0,50
10
0,08 M
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
1
0 6
5
3,05
2,95
0,69
0,41
Seating Plane
1,07 MAX
0,15
0,05
0,10
4073272/B 08/01
NOTES: A.
B.
C.
A.

Falls within JEDEC MO-187
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
www.ti.com
13
DBV (R-PDSO-G5)
PLASTIC SMALL-OUTLINE
0,50
0,30
0,95
5
0,20 M
1,70
1,50
0,15 NOM
3,00
2,60
Gage Plane
3,00
2,80
0,25
0 8
0,55
0,35
Seating Plane
1,45
0,95
0,05 MIN
0,10
4073253-4/G 01/02
NOTES: A.
B.
C.
D.
14

OPA334, OPA2334, OPA335, OPA2335

www.ti.com
SBOS245D
D (R-PDSO-G**)
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
8
0.010 (0,25)
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
0.010 (0,25)
0 8
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.004 (0,10)
0.069 (1,75) MAX
PINS **
0.004 (0,10)
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047/E 09/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).

Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
OPA334, OPA2334, OPA335, OPA2335

SBOS245D
www.ti.com
15

DGK (R-PDSO-G8)

0,38
0,25
0,65
8
0,08 M
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
1
0 6
4
3,05
2,95
0,69
0,41
Seating Plane
1,07 MAX
0,15
0,05
0,10
4073329/C 08/01
NOTES: A.
B.
C.
D.
16

OPA334, OPA2334, OPA335, OPA2335

www.ti.com
SBOS245D
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
OPA2334AIDGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
BHE
OPA2334AIDGST
ACTIVE
VSSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
BHE
OPA2334AIDGSTG4
ACTIVE
VSSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
BHE
OPA2335AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDGKR
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDGKRG4
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDGKT
ACTIVE
VSSOP
DGK
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDGKTG4
ACTIVE
VSSOP
DGK
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA334AIDBVR
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA334AIDBVRG4
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA334AIDBVT
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA334AIDBVTG4
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA335AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
OPA335AIDBVR
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
Addendum-Page 1
Samples
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
OPA335AIDBVRG4
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
OPA335AIDBVT
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
OPA335AIDBVTG4
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
OPA335AIDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
OPA335AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
OPA335AIDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
(1)
The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
Samples
www.ti.com
10-Jun-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2335 :
Military: OPA2335M
NOTE: Qualified Version Definitions:
Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION

www.ti.com
31-Dec-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins

Type Drawing
OPA2334AIDGSR
VSSOP
DGS
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2334AIDGST
VSSOP
DGS
10
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2335AIDGKR
VSSOP
DGK
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2335AIDGKT
VSSOP
DGK
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2335AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA334AIDBVR
SOT-23
DBV
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
OPA334AIDBVT
SOT-23
DBV
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
OPA335AIDBVR
SOT-23
DBV
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
OPA335AIDBVT
SOT-23
DBV
250
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
OPA335AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com
31-Dec-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2334AIDGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
OPA2334AIDGST
VSSOP
DGS
10
250
210.0
185.0
35.0
OPA2335AIDGKR
VSSOP
DGK
2500
366.0
364.0
50.0
OPA2335AIDGKT
VSSOP
DGK
250
366.0
364.0
50.0
OPA2335AIDR
SOIC
2500
367.0
367.0
35.0
OPA334AIDBVR
SOT-23
DBV
3000
180.0
180.0
18.0
OPA334AIDBVT
SOT-23
DBV
250
180.0
180.0
18.0
OPA335AIDBVR
SOT-23
DBV
3000
180.0
180.0
18.0
OPA335AIDBVT
SOT-23
DBV
250
180.0
180.0
18.0
OPA335AIDR
SOIC
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
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OPA334

SBOS245D JUNE 2002 REVISED JULY 2003

0.05V/C max, SINGLE-SUPPLY

The OPA334 and OPA335 series of CMOS operational

The OPA334 (single version with shutdown) comes in

OFFSET VOLTAGE PRODUCTION DISTRIBUTION

OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION

The OPA334 family includes a shutdown mode. Under logic

LOW OFFSET VOLTAGE: 5V (max)

Offset Voltage (V)

Offset Voltage Drift (V/C)

Copyright 2002-2003, Texas Instruments Incorporated

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage .................................................................................... +7V

This integrated circuit can be damaged by ESD. Texas

Tape and Reel, 250

Tape and Reel, 250

Tape and Reel, 250

NOTES: (1) NC indicates no internal connection. (2) Pin 1 of the SOT23-6 is

OPA334, OPA2334, OPA335, OPA2335

VS = +2.7V to +5.5V, VCM = 0, Over Temperature

See Note (1)

INPUT BIAS CURRENT

(V) 0.1V < VCM < (V+) 1.5V, Over Temperature

50mV < VO < (V+) 50mV, RL = 100k, VCM = VS /2

OPA334, OPA2334, OPA335, OPA2335

OFFSET VOLTAGE PRODUCTION DISTRIBUTION

OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION

Offset Voltage (V)

Offset Voltage Drift (V/C)

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE

Input Bias Current (pA)

Output Voltage Swing (V)

Output Current (mA)

Common-Mode Voltage (V)

INPUT BIAS CURRENT vs TEMPERATURE

QUIESCENT CURRENT (per channel)

Quiescent Current (A)

Input Bias Current (pA)

OPA334, OPA2334, OPA335, OPA2335

TYPICAL CHARACTERISTICS (Cont.)

OPEN-LOOP GAIN/PHASE vs FREQUENCY

Output Voltage (1V/div)

POSITIVE OVER-VOLTAGE RECOVERY

Output Voltage (50mV/div)

NEGATIVE OVER-VOLTAGE RECOVERY

COMMON-MODE REJECTION vs FREQUENCY

Common-Mode Rejection (dB)

OPA334, OPA2334, OPA335, OPA2335

TYPICAL CHARACTERISTICS (Cont.)

POWER-SUPPLY REJECTION RATIO vs FREQUENCY

SAMPLING FREQUENCY vs SUPPLY VOLTAGE

Power-Supply Rejection Ratio (dB)

Supply Voltage (V)

0.01Hz TO 10Hz NOISE

SAMPLING FREQUENCY vs TEMPERATURE

SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE

Sampling Frequency (kHz)

Load Capacitance (pF)

OPA334, OPA2334, OPA335, OPA2335

TYPICAL CHARACTERISTICS (Cont.)

SETTLING TIME vs CLOSED-LOOP GAIN

COMMON-MODE RANGE vs SUPPLY VOLTAGE