1 2 3 4 5 6 7 8 9 10 11 12

DESIGN INFORMATION DESIGN AND FABRICATION TABLE

LAND SIZE
PRINTED CIRCUIT BOARD MANUFACTURING PROCESS MANUFACTURING DRAWINGS SHOULD INCLUDE A DESIGN AND
FABRICATION TABLE AS SHOWN BELOW. THE DRAWING SHALL
CONTAIN DIMENSIONS REFERENCING NPTH AND PTH HOLES
A TRACK TO PAD HOLE SIZE A
TO AN ORIGIN OR DATUM. FOR FULL DETAILS ON DIMENSIONING
AND TOLERANCING OF PRINTED BOARDS REFER IPC-D-300G.
CUSTOMER
MULTI- LAYER BOARDS ONLY Copies of this table are available from Morris Productions in a DXF file or Protel formats.
PAD
TRACK WIDTH
TO PREFERRED INPUTS NEEDED
STORE
ELECTRICAL TEST DESIGN INFORMATION
PAD NPTH - EG. BURIED VIAS
ACCOUNTS SUPPLIERS MATERIAL ISSUE
- GERBER FILES
TRACK TO TRACK BOARD TECHNOLOGY : BOARD SIZE :
- PROTEL PCB FILE
TRACK TO BOARD EDGE TRACK TO NPTH X (mm)
- 1:1 PHOTOPLOTS IMAGE ETCH STRIP DRY FILM PRESSING
MATERIAL LAY-UP (MIN. TRACKS/PADS/CLEARANCE IN 0.025mm (0.001") (REFER ALSO PROFILING INFORMATION)
ORDER MATERIALS - SPECIFIED MATERIAL INNER LAYER(S) INNER LAYER(S) INNER LAYER(S) PREPARATION
- MANUFACTURING DRAWINGS CUT
EXTERNAL SIGNAL LAYERS INTERNAL SIGNAL LAYERS ACCEPTANCE PURCHASING CUT TO REQUIRED
SHOWING ALL DIMENSIONS & FORMAT SIZE - LAMINATE DRY FILM - REMOVE UNWANTED - REMOVE PHOTO - BLACK OXIDE (IMPROVES - ALL LAYERS LAID - HIGH PRESSURE/ TEMPERATURE (MINIMUM ANNULAR RING 0.05mm (0.002")
FEATURE STANDARD SPECIAL FEATURE STANDARD SPECIAL SPECIFICATIONS (PHOTO SENSITIVE COPPER RESIST ADHESION AT BONDING TOGETHER, INTER- VACUUM CURING CYCLE
* PTH - LAND SIZE +0.50mm ON * PTH - LAND SIZE +0.50mm ON RESIST) STAGE) LEAVED WITH PREPREG, - CONTROLLED COOLING CYCLE CIRCUIT TYPE : SS DS PTH ML No. OFF _____
* NPTH - LAND SIZE APPLICATION - DIMENSIONED - INSPECT ( Q.C) - VISUAL INSPECTION MOULD RELEASE FILM
+0.70mm APPLICATION
OUTLINE DRAWING - PUNCH REGISTRATION - CONDITION ( REMOVE AND PRESS PLATES.
TRACK WIDTH 0.20mm 0.125mm TRACK WIDTH 0.20mm 0.125mm
ENGINEERING PRODUCTION FINGER CONNECTOR DIM PER : AS SHOWN
TRK/PAD TO PAD/TRK TRK/PAD TO PAD/TRK 0.20mm 0.125mm PCB DESIGN NORMALISE HOLES MOISTURE)
0.20mm 0.125mm PLANNING TOOLING
TRK TO EDGE (min) ** TRK TO EDGE (min) ** 0.50mm 0.50mm - NC DRILL AND
0.53mm 0.53mm No. OFF TOTAL ONE SIDE TWO SIDES
TRK TO NPTH (min) ** TRK TO NPTH (min) ** 0.50mm 0.50mm ROUT FILES - IMAGE (EXPOSE WITH
0.53mm 0.53mm 4 LAYER BOARD
NEGATIVE PHOTOTOOL)
* Land-to-hole relationship is established by the following equation: - TECHNICAL STANDARDS
- CHECK CUSTOMER - CHECK REGISTRATION - PROVIDES STRESS AS EXAMPLE 18um Foil VIAS : FEED THROUGH TENTED BURIED LAYER SEQ ____________
B (DESIGN RULES USED)
DOCUMENTATION, DATA, RELIEF AND AIDS
- DEVELOP
B
GERBER FILES / ARTWORK - ENSURE DRILL PATTERN DIMENSIONAL BLIND LAYER SEQ ____________
Refer to IPC-2221 Section 9.0 - Holes/Interconnections. This standard is also endorsed as Military Standard. NONE UNIQUE DRILL MIXED
SPECIFICATIONS ON TEST BOARD MATCHES STABILITY PREPREG (0.35mm)
FR4 SUBSTRATE
Land size, minimum = a + 2b +c
ARTWORK
(TYP. 0.71mm)
LAYER CONSTRUCTION PER : LAMINATION SEQUENCE AS SHOWN
- PERFORM DESIGN
where: PHOTO PHOTO REMOVE PREPREG (0.35mm)
RULE CHECKS - ADD VENTING, LOGOS BASE COPPER
a = Maximum diameter of the finished hole RESIST RESIST UNWANTED
CODING ETC. TYP. 18/35um
b = Minimum annular ring requirements ( see 9.1.2) COPPER
- STEP UP ARTWORK
TO DESIRED FORMAT SIZE - PREPARE FINAL NC 18um Foil ARTWORK : MANUAL CAD TYPE
** Min. distance between conductive area and the edge of a board is calculated by adding 0.4mm to the minimum electrical
TOOLING FILES FR4 SUBSTRATE
clearance as determined in IPC-2221, IPC-2222. Table 6-1.
- PRODUCE DRILL AND (TYP. 0.71mm)
For 0-100 Volts a spacing of 0.13mm is required for a PCB with external conductors. (Thus 0.4mm + 0.13mm = 0.53mm).
For 0-100 Volts a spacing of 0.10mm is required for a PCB with internal conductors. (Thus 0.4mm + 0.1mm= 0.5mm).
ROUT FILES - ENSURE ARTWORK MEETS REFER TO MORRIS' STANDARD MULTI-LAYER COMBINATIONS ARTWORK/PATTERN MASTER LIST
MANUFACTURING FOR DETAILS ON TYPICAL LAYUPS USING MATERIALS
Lands for surface mounting are covered extensively in this Standard and IPC - SM - 782A, as well as the various recommendations COMMONLY HELD IN STOCK.
- PRODUCE ELECTRICAL REQUIREMENTS TRACK PAD TRACK PAD TRACK PAD DESCRIPTION DRAWING No./CAD FILE REF. ISS ARTWORK/FILM REF GERBER FILE REF ISS
laid down by component manufacturers. TEST JIG FILES
- GENERATE PRODUCTION
INTERNAL POWER AND GROUND LAYERS
- PREPARE WORK AFTER PRESSING AND TRIMMING OF THE BOARD, THE MANUFACTURING
GND AND PWR LAND FEATURE STANDARD SPECIAL INSTRUCTIONS
PROCESS IS THE SAME AS FOR DOUBLE SIDED BOARDS.
CLEARANCE PAD SIZE LAND SIZE * D<=3.0mm +0.50mm ON
(Fin Hole D+) D>=3.0mm +0.55mm APPLICATION
CLEAR. PAD *D<=3.0mm +0.90mm "
(Fin Hole D+) D>=3.0mm +1.00mm "
WEB (CONDUCTOR) * 0.25mm "
AIR
GAP
AIR GAP
PWR/GND TO BRD EDGE **
0.25mm
1.27mm
"
"
DOUBLE SIDED AND MULTI-LAYER BOARDS MATERIAL :
C WEB PWR/GND TO NPTH ** 0.50mm 0.50mm
GLASS FIBRE EPOXY RESIN NEMA GRADE FR4 (IPC - 4101) C
FIN HOLE SIZE (D)
FIN HOLE * For further details on land size calculations refer IPC -2221 REFLOW SOLDER PROCESS OTHER
SIZE (D) IPC-2222. This standard is also endorsed as Military Standard.
Typically, web size is determined by dividing 60% of the minimum THICKNESS : 0.8mm 1.2mm 1.6mm 2.4mm 3.2mm
land size by the number of webs required. If a larger land size is
NI/GOLD PLATE TOLERANCE : IN A/W IPC - D - 300G CLASS OTHER + / -
used, the web size is reduced to allow adequate soldering dwell
NPTH AIR EDGE CONTACTS
GAP time. (Ensure that the web size is not thinner than the minimum
BOW AND TWIST : IN A/W IPC - D - 300G CLASS AS SHOWN
- LAB TEST
LAND ** Min. distance between conductive area and the edge of a board
SIZE
is calculated by adding 0.4mm to the minimum electrical STRIP SOLDER
COPPER (FINISHED) :
PWR AND GND TO NPTH clearance as determined in IPC-2221, IPC-2222. Table 6-1. EDGE CONTACTS OUTER : 18um 35um 70um
For 0-100 Volts a spacing of 0.1mm is required for a PCB
with internal conductors. (Thus 0.4mm + 0.1mm = 0.5mm). INNER SIG : 18um 35um 70um
PWR/GND TO However, for PWR/GND to board edge a clearance of 1.27mm
CLEAN REFLOW SOLDER INSPECT SOLDER MASK INNER PWR : 18um 35um 70um
BOARD EDGE is preferred.
It is not necessary to have a land around a pin which does not
make connection to anything on that plane. If a land is placed STRUCTURE : STANDARD 'MORRIS PRODUCTIONS' LAYUP
around a component lead, it increases the chance of a short
occuring if a small slither of copper bridges the land and a plane AS PER DRAWING AS SHOWN

DRILLING :
PAD TO RESIST
VIEWED FROM : COMPONENT SIDE WIRING SIDE
ELECTRICAL TEST
SOLDER RESIST ELECTROLESS NICKEL / IMMERSION GOLD PROCESS REFERENCE : AS SHOWN PATTERN MASTER LIST NC_DRILL FILES
D D
FEATURE STANDARD PTH MINIMUM COPPER THICKNESS : 20um OTHER
PAD TO RESIST:- NPTH : TENTED PADS REMOVED REMOVE PADS
(LIQUID PHOTOIMAGEABLE) 0.05mm (min)
(EPOXY SCREEN PRINT) 0.25mm FINAL 2nd DRILL BOTH AS SHOWN
0.15mm ELECTROLESS SCREEN PRINT
MASK TO MASK BLOCKOUT STRIP SOLDER INSPECT CLEAN SOLDER MASK PROFILING ACCEPTANCE DESPATCH
NICKEL / IMMERSION LEGEND
HOLE FIRST COPPER STRIP DRY TESTING
MASK TO MASK BLOCKOUT DRILLING
PREPARATION
IMAGE SECOND PLATE ETCH GOLD BOARD FINISH : ETCHING REFER PATTERN MASTER LIST
Vias which are to be tented &/or filled with resist must be PLATE FILM
- PHOTOIMAGEABLE
specified in your documentation. Note also, vias which are to be SOLDER REMOVED SOLDER MASK NICKEL / GOLD LEGEND / SCREEN PRINT : NONE COMP. SOLD.
- REMOVE - Q.C
tented (covered) with solder resist, must have a maximum
finished hole size no greater than 0.6mm. A unique hole size
- HIGH PRESSURE - CHEMICAL - LAMINATE DRY - 2ND COPPER PLATE - REMOVE UNWANTED COLOUR : WHITE YELLOW OTHER
WATER RINSE DEPOSITION OF FILM (PHOTO (BUILD UP COPPER PHOTO COPPER (TIN/LEAD - LAB TEST
should be used for these vias so that they can be identified
VIA (TENTED) COPPER TO ALL SENSITIVE TO FINAL RESIST PROTECTS COPPER
during manufacture.
- VISUAL CHECK DRILLED HOLES RESIST) THICKNESS) PATTERN) SOLDER RESIST : LIQUID PHOTOIMAGEABLE SCREEN PRINT
VIA (MASKED) - VISUAL
Morris Productions uses solder resist that complies with
- DESMEAR/ - 1ST COPPER - IMAGE (EXPOSE WITH - TIN/LEAD PLATE INSPECTION COLOUR : GREEN BLUE YLW/GRN OTHER
MIL-I-46058 and meets the requirements of IPC-SM-840.
ETCHBACK PLATE POSITIVE PHOTOTOOL) SOLDER RESIST
Available in both liquid imageable and screen print, typical
- LAB TEST MATTE GLOSS
thickness is 15-20um and 20-25 um respectively.
- LAB TEST - DEVELOP
Photoimageable solder resists are preferred for surface mount HOT AIR LEVEL (SMOBC) PROCESS
applications. UL approved resists are also available. Typical TRACK FINISH : SELECTIVE SOLDER REFLOW TIN/LEAD
- INSPECT (Q.C)
colours available are green, green / yellow, and blue : other
ELECTROLESS Ni/Au - 0.1 / 0.2um GOLD OVER 3.0um NICKEL
DEPOSITION OF
NPTH (LANDLESS ELECTROLESS COPPER PHOTO RESIST AND REFER PATTERN MASTER LIST OTHER
THICKNESS LINES AND TEXT
OTHERWISE 2ND NOM. THK 2.0 um UNWANTED COPPER
LEGEND DRILLING) PHOTO RESIST REMOVED
SCREEN PRINT NI/GOLD PLATE
E LEGEND EDGE CONTACTS
EDGE BOARD 1.3um HARD GOLD OVER 5.0um NICKEL E
FEATURE MINIMUM
R1 TEXT HEIGHT - LAB TEST
CONTACTS : HARD FINISH GOLD PLATE OTHER
LINE THICKNESS 0.15mm
LEGEND
TEXT THICKNESS 0.15mm STRIP SOLDER
STRIP SOLDER INSPECT CLEAN SOLDER MASK HOT AIR LEVEL AS SHOWN REFER
TEXT HEIGHT 1.00mm EDGE CONTACTS
LEGEND TO PAD 0.25mm - SOLDER APPLIED COPPER
LEGEND TO EDGE 0.25mm
COMPONENT HOLE
- PHOTOIMAGEABLE TO BARE COPPER PROFILING : AS DIMENSIONED , MEASURED AND CUT FROM SPECIFIED DATUM.
LEGEND TO PAD DRY FILM TIN/LEAD OVER COPPER SOLDER MASK (PADS, VIAS ETC) TIN/LEAD
0R VIA TENTS(COVER) NPTH REFER PCB BLANK DWG No.
Typical colours available are white, yellow and black ; and ELECTROLESS NICKEL / GOLD
- Q.C USE PROFILE/ROUT TAPE SUPPLIED REFER PATTERN MASTER LIST
made
LEGEND TO BOARD EDGE
NOTES. 1: LAB TEST INCLUDES ALL TESTS THAT ARE REQUIRED TO PROVE PROCESS CAPABILITIES, SOLDER REMOVED - LAB TEST SELECTIVE SOLDER SOLDER RESIST SQUARE CUT N.C. ROUT V- GROOVE BLANK
BUT ALSO THOSE TESTS (SUCH AS MICROSECTIONS), AND DOCUMENTATION NEEDED TO
MEET CUSTOMER REQUIREMENTS INCLUDING IPC CERTIFICATION LEVELS AND MILITARY PHOTO RESIST ACCEPTABILITY : MATERIALS AND WORKMANSHIP FOR ALL PRINTED WIRING BOARDS
ARTWORK ALLOWANCES SPECIFICATIONS.
MUST MEET OR EXCEED THE REQUIREMENTS OF :
CONDUCTOR WIDTH : - To obtain minimum design conductor width refer tables such as those in IPC - 2221, IPC-2222 2 : THE PROCESSES SHOWN IN THIS DIAGRAM ARE TYPICAL OF MOST PCB MANUFACTURERS.
for the relevant current ratings. To allow for processing effects such as pits, nicks, undercut etc, PLEASE CHECK WITH YOUR MANUFACTURER WITH REGARD TO SPECIAL REQUIREMENTS.
IPC - 6011, IPC - 6012 CLASS 1 2 3
artwork track width should be drawn 0.05mm (0.002") wider for 35um (1oz) foil. SOLDER RESIST U.L CERTIFICATION
CONDUCTOR SPACING : - Refer electrical conductor spacing table as published in IPC -2221, IPC-2222 . To ensure minimum MIL -P- 55110D OTHER __________________
spacing allow 0.05mm (0.002") on artworks with 35um (1oz) copper.

ADDITIONAL REQUIREMENTS :

F RECOMMENDED MULTILAYER LAYUP COMBINATIONS ARTWORK REQUIREMENTS DRILLING, ROUTING & V-GROOVE QUALITY ASSURANCE DESIGN SERVICE MICROSECTION : NONE SAMPLE PLAN MIL - P - 55110D F
CERTIFICATION : NONE MIL - P - 55110D IPC CLASS 1 2 3
mm

Artwork Design Rules

Drill Design Rules Certifications QUALITY RELEASE REPORT OTHER __________________
Morris Productions offer our customers a PCB design service.
Morris Productions produce PCB'S to 24 layers . Unless there is a need to specify certain dielectric separations(eg.
- finished hole size should be specified rather than drill size ELEC. TEST : NONE REQUIRED PER ORDER REFER ______
Controlled To aid our Pre-production Engineers the designer should ensure that the following is adhered to : - Morris Productions has a committment to Quality. As a means of continuous improvement in our
- via hole size typically fall in the range of 0.3 to 0.7mm( via holes < 0.2mm should be avoided to ensure hole integrity) The service provides a number of facilities dependent on your requirements : -
Impedence), the thickness of core material or quantity of prepreg used between each successive conductive layer is
- if via hole size is < 0.2mm then land size should equal 0.5mm
manufacturing and technical capibilities Morris has gained the following certifications: ** Schematic Capture and laser plots MANUFACTURER'S LOGO : FOIL LEGEND OTHER __________
best left to the manufacturer. Most boards should have a minimum of 0.09mm separation between conductive layers. - separate file per artwork and layer sequence is specified..
- aspect ratio should not exceed 1:8 ie. finished hole size divided by board thickness (Refer IPC - 2221, IPC - 2222) ** Bill of Materials
The layup should be kept balanced i.e. the distribution of layers, copper thickness, and layer separations shou ld be - Gerber files, aperture file & drill file formats eg.2,4 inch format or 3,3 metric Quality Management Systems - AS/NZS ISO9001: 1994 (Certified by LRQA) MANUFACTURER'S CERTIFICATION : AS/NZS ISO 9001 NONE
- preferred format for drill files is ASCII 2,4 inch leading zero's but will accept other formats (please specify) ** Board Layout (From Schematic or Netlist)
symmetrical to prevent warping, however some designs require large copper areas on the outside layers. Ensure these areas - Gerber 274X (Embedded Apertures) preferred Scope - "Design and Manufacture of single, double sided and multilayer printed circuit boards".
- separate drill fil es for Plated and Non-plated holes - Photoplots PACKAGING AND HANDLING : PER ORDER REFER ______
are cross- hatched to reduce the possibility of blistering or warping in the soldering process. Listed below are Morris' most - Gerber files are registered to one another ( has the same offset). Certification Number : 926131
- number of different drill sizes should be minimised, but there are no limits on the number of drill changes - Checkplots
common multilayer layups using materials generally kept in stock. Other layups are available on request. - files should be viewed from the "component side " (primary side).
- Photoplot Files
- use design standards (such as IPC-2221, IPC-2222) and adequate allowances for processing. Laboratory (N.A.T.A certified)
These layups are for 1.6mm nominal thickness. For thicker or thinner PCB's, please contact our Sales Engineer or PCB Designer. Tenting (NPTH) - Drill Files
- each corner should have corner delineation marks.
Foil lamination uses a 0.05mm maximum thickness resin backed foil. - NPTH less than 6.5mm dia should have pads removed to allow tenting of the hole during processing.
Registration Number : 365 - Shape Based Routing HOLE DATA
It is common for PCB's to have a mix of Plated(PTH) and Non-plated holes(NPTH). To aid in the positional tolerance ** Manufacturing Drawings
- ensure that legend markings are 0.25mm (0.010") from lands and/or holes. Underwriters Laboratories
of PTH to NPTH, drilling can be done in one operation. It is then necessary to tent (cover) the NPTH with photo- ** Arrangement of Production SYMBOL
- if you require gold edge connectors add a plating bar 5mm away from the fingers and extend the length UL approval to MP194V-0 and MP-2
4 LAYER BOARD 8 LAYER BOARD sensitive film during processing. There must be sufficient surface area around the NPTH for the tent to hold so it is ** Design advice
of the connector. The thickness of the bar and connections to the fingers to be 0.5mm (0.020"). SIZE (FIN)
important to have no land around the hole nor should there be any copper pattern within 2 x the diameter of the hole. ** Up to date information on current trends in manufacturing and specifications
Foil Lamination (Preferred) Conventional Build Foil Lamination (Preferred) Conventional Build - to aid in routing, at least two(2) diagonally opposite NPTH holes should be provided at the board
Maximum hole size for tenti ng NPTH is 4.5mm. If these design rules are not met, 2nd drilling will be necessary . ** Extract gerber files from Protel generated PCB files and amend
* SHEETS CORE Cu (um) * SHEETS CORE Cu (um)
* SHEETS CORE Cu (um) SHEETS CORE Cu (um) extremities, the diameter of which should be between 2.5 - 6.0mm. Preferred size is 3.175mm (1/8"). Conformance Testing TYPE
PREPREG THK(mm) PER SIDE PREPREG THK(mm) PER SIDE
PREPREG THK(mm) PER SIDE PREPREG THK(mm) PER SIDE
Rout Design Rules QUANTITY
Foil 18/00
Foil 18/00 .25 18/00 Morris can provide customers with a range of Quality Assurance Certifications dependent on need.
2xA .25 35/35
2xB 2xA - the smallest rout bit diameter should be equal to or greater than the board thickness Certificates of Conformance can be attained to customer's own specification, IPC-6011, IPC -6012 HOLE SIZE NPTH HOLES PTH HOLES
.18 35/35 Note - phototools and their condition are vital to PCB manufacture. For example, the maximum layer to
2xA - rout bit tolerance(+/-0.1mm) should be taken into consideration when determining finished board size or Military Standards such as MIL-P-55110D. Microsectioning is the means by which Quality TOLERANCE + / - 0.05
layer misregistration of pattern features should not exceed 0.003" (0.075mm) at full size. In this way Morris Assurance can be tested but requires the destruction of a good board. Rather than destroying a good 0 TO 0.8 + / - 0.03
.71 35/35 .50 35/35 especially panelised boards
G Pre-production engineers can perform a comprehensive design rule check, step and repeat artwork to a ON HOLE + / - 0.05 G
2xB 2xA
1xB

.18 35/35 2xA

.25 35/35
standard format size, add venting (to aid in the flow of prepreg for multilayer boards, and to give mechanical
- if panelised then breakout point positioning and number must taken into consideration to aid in the mechanical
strength of the PCB. Typically the distance between breakouts is 50 - 80 mm. Refer to drawing below.
board, Test Coupons (refer IPC-2221, IPC -2222 Section 12.4.3.1) positioned alongside and/or
between pairs ( or as a "popout" within the board outline) will exhibit all the basic qualities of the
SOLDER PASTE STENCILS SIZE
0.81 TO 1.6
1.61 TO 5.0
+ / - 0.05
+ / - 0.08 + / - 0.10
Foil 18/00 .25 18/00 strength and stability) and most importantly, ensure the accuracy and stability of the diazo's production board. Tests and Inspections that can be carried out are as follows:-
- preferred router bit size is 2.0mm
(phototools) used in manufacture.
1xB .25 35/35 VISUAL PHYSICAL ELECTRICAL MICROSECTION Head Office :
Morris stocks a full range of both drill and router bits. Quality, service and fast turn around have made us leaders in the Australian Market
.18 35/35 Stock drill bit sizes range from : 0.35 to 3.20mm in 0.05 increments and 3.30 to 6.5mm in 0.10 increments. General Appearance Plating adhesion Continuity Plating Thickness for Chemically milled Solder Paste and Glue Stencils. These are available with a shim
2xA
Cleanliness Conductor Peel Strength Current Carrying Capacity Plating Quality
2-12 Harp Street, P.O. Box 196, Campsie,
Stock rout bit sizes range from : 0.8, 1.0, 1.2, 1.5, 1.6, 1.8, 2.0, 2.4, 3.0 & 3.175mm.Other sizes available on request. thickness range of 0.010", .008" , .006", .005" and .004".
2xA
Foil 18/00
.25 35/35
BARE BOARD TESTING Holes greater than 6.50mm are either stitched drilled, hand machined or routed, and preferably nonplated.
Plating Appearance
Etched line widths
Solderability
Thermal Stress (solder
Co-Planer and layer to
layer insulation. Dielectric
Interconnection
hole/inner layer
.
It is strongly recommended that you contact your printed circuit board assembler to
N.S.W., Australia 2194
Telephone: (02) 97896200
and Spacings. float test) withstanding voltage test Hole Quality determine the desired aperture size opening, fiducial marks, mounting position and the
6 LAYER BOARD 10 LAYER BOARD Morris Productions employs advanced, flexible and fully integrated Bare Board testing systems.
Typical routing breakout methods 5.0 +/- 0.2mm to IPC -6011, IPC-6012 Annular Ring (internal) thickness of the stencil. Morris prefers to work from Gerber Files and aperture table. Facsimile: (02) 97872529
class 3 (1 KV DC for 30 Layer Registration The ap erture size should be the same as for the lands used on your track artwork. There
Foil Lamination (Preferred) Conventional Build Foil Lamination (Preferred) Conventional Build Modem: (02) 97188671
Viking Digital Bed of Nails Testing Probot - Flying Probe Testing 2.4mm +/- 0.1mm TYP ROUTER DIA 2.4mm +/- 0.1mm Copper thickness (inner) is no need to reduce the size of the lands on the solder paste artwork, as Morris must
* SHEETS
PREPREG
CORE
THK(mm)
Cu (um)
PER SIDE
* SHEETS CORE Cu (um) * SHEETS
PREPREG
CORE
THK(mm)
Cu (um)
PER SIDE
SHEETS
PREPREG
CORE
THK(mm)
Cu (um)
PER SIDE
2.5 +/- 0.2mm TYP ROUTER DIA Pre-production Integrity Checks Dielectric Separations reduce your artwork to allow for etch factors. If the assembler requires a smaller Email : Sales@morris.com.au
PREPREG THK(mm) PER SIDE
Board Integrity following
Capabilities Capabilities aperture opening than the land size used, then Morris will allow for this as well. For Web Site: www.morris.com.au
0.5 +/- 0.1mm

Foil 18/00 Foil 18/00

.15 18/00 We recommend customers approve production tooling generated from their own information. Gerber files,
2xA 2xA .15 35/35 - testing to known good board or netlist - netlist testing
2xA
- analyse and create netlist for PCB's upto 24 layers - analyse and create netlist for PCB's upto 24 layers This may reveal errors in design, manufacturability or potential design improvements. For large it is preferred if you create your pads as flashes ( rather than as shape fills).
.15 35/35 2xA - high complexity designs - high complexity designs production runs, we also recommend that pre-production samples be obtained. Both Morris and our
.38 35/35 .25 35/35 This publication is copyright and all rights are reserved. Other than as permitted under the Copyright Act, no part may be reproduced by any
- Fine Pitch SMD to 0.5mm pitch and below - Fine Pitch SMD to 0.25mm pitch and below customers are then assured of the boards suitability for manufacture, and can see at first hand the Morris can provide you with the stencil only, the stencil mounted in your frame, or, the
1xB .15 35/35 4 NPTH HOLES process without the written permission of Morris Productions Pty Limited. The information contained in this publication is based upon IPC
1xB 4xA - high volume work - low volume work
2.0 +/- 0.2mm 0.8 +/- 0.1mm quality expected. If either option is not requested the customer must accept responsibility for errors stencil mounted in a frame by us. The frame will be custom designed to your
.15 35/35 0.6 to 0.8 DIA standards. The information is advisory only and its use or adaption is entirely voluntary. Morris Productions Pty Limited and its servants or
2xA - Fault Finding capability for Netlist Testing - high speed discharge test due to incorrect data supplied.
EQUALLY SPACED agents shall not be responsible for continued currency of the information or fo r any errors, omissions or inaccuracies in this publication
.38 35/35 .25
35/35 - Simultaneous Double sided Testing - Ball Grid Array Handling & Storage of PCB's
1xB STANDARD BRIDGE METHOD INTERNAL BREAKOUT METHOD arising from negligence or otherwise howsoever or for any consequense arising therefrom.
2xA .15 35/35 - Fault Finding capability for Netlist Testing
2xA
0

Foil 18/00 .15 18/00 .15 35/35 Aging and storage of your PCB's impacts upon solderability and flatness therefore the following
2xA V - Groove Detail MORRIS CIRCUITS &
ORDER DRAWN EXAM APPD DATE
* Overall thickness of the board can be altered by varying the quantity & type of prepreg.
Test Parameters Test Parameters Board V -Groove general guidelines should be applied:
MORRIS GRAPHICS
CHKD AMENDMENTS ISS MORRIS PRODUCTIONS
1xB - clean, tidy environment,
H Morris standard prepreg types are as follows: .15 35/35 Thickness Width
CERTIFIED BY : - PL PL JF GE 25.5.92 1 H
Test Method - 12 volt digital Test Method - Analogue - avoid allowing the board to come into contact with silicones (hand creams, etc), MORRIS CIRCUITS
0.8mm = 0.4 +/-0.1
1.6mm = 0.5 +/-0.1
2.4mm = 0.6 +/-0.1

A = 1 piece of 1080 prepreg with an approximate finished thickness of 0.07mm .15 35/35 Board Dimensions 0.8mm = 0.16mm 0.5 mm Min
2xA sulphur -containing material which may degrade solderability.
B = 1 piece of 7628 prepreg with an approximate finished thickness of 0.175mm.
Voltage Test - 12 volt Voltage Test - 0.5 to 500 VDC (programmable) * Min Size = 80 x 80mm 1.6mm = 0.50mm GR PL REDRAWN JF GE 6.3.95 2
2xA Resistance Test - breakpoint 70 kOhms Resistance Tests - 1Ohm to 500MOhms 2.4mm = 0.80mm 45 +/- 5 - avoid abrasive materials,moisture and handling edge contacts. PRINTED CIRCUIT BOARD
DO NOT SCALE Note - approximate finished thickness can vary with the amount of copper area. .15 35/35 Max Size = 400 x 400mm Track PL REDRAWN
Foil 18/00 - boards should be left in sealed and dessicated bags GR JF GE 10.7.98 3
DIMENSIONS IN (programmable) * - not applicable to panelised boards
MILLIMETRES The fibreglass core thickness does not include the foil (copper thickness). The required Card Size (Maximum)
or Pad
- should be stoved flat for a min. 6 hrs at 115 - 120 deg C in an air circulating oven immediately DESIGNERS GUIDE
board thickness should be stated as the finished size (after plating and addition of solder Single Sided Test Card Size (Maximum) prior to assembly to remove moisture wicking (ingress of moisture absorbed by epoxy glass at
Tolerances
resist), however, in critical areas, such as edge connectors, the thickness tolerance may be - 488 mm x 406mm board edge). Failure to perform this function and applying rapid heating (eg. hand soldering) can
V-Groove depth = +/- 0.1mm BLOCK DIAGRAM
more stringent . Overall board thickness tolerances in general, (including double and single Double Sided Simultaneous Test - 863 x 609mm result in localised separation of the inner layer surfaces(delamination)..
V-Groove to V-Groove = +/- 0.2mm
boards) should be in as per IPC - D - 300G, and typically + / - 0.2mm. - 325mm x 244mm (Top) 3.5 mm Min 0.1 max deviation SHEET 1
V-Groove to Board Edge = +/- 0.2mm
Specific inspection, acceptability, packaging and handling methods are detailed in IPC-2221, AS/NZS ISO 9001 : 1994 MD1001 OF 1

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PCBPRO7A C Copyright Morris Productions Pty. Limited 1998 A1