Technical Product Guide For Tri-GP v3 Systems PDF

Technical Product Guide
Triconex General Purpose v3 Systems
Introduction .......................................................................... 1
System Overview................................................................. 5
Setting up a Tri-GP System ............................................... 15
Product Specifications ....................................................... 19
Communication Capabilities .............................................. 47
TriStation 1131 Developers Workbench ........................... 49
CEM Programming Language Editor................................. 53
Sequence of Events (SOE) Capability............................... 55
Safety View ABM ............................................................... 57
Glossary............................................................................. 61
Part No. 9791040-004
September 2014
Preface
Information in this document is subject to change without notice. Companies, names and data used in
examples herein are fictitious unless otherwise noted. No part of this document may be reproduced or
transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express
written permission of Invensys Systems, Inc, now part of Schneider Electric.
2010-2014 Invensys Systems, Inc. All rights reserved.
Invensys, Foxboro, Foxboro Evo, ArchestrA, InTouch, Triconex, Tricon, Trident, TriStation, and Wondeware
are trademarks of Invensys Limited. All other brands may be trademarks of their respective owners.
DISCLAIMER
Because of the variety of uses for this equipment and because of the differences between this fault-tolerant
equipment and traditional programmable logic and process controllers, the user of, and those responsible for
applying, this equipment must satisfy themselves as to the acceptability of each application and the use of the
equipment.
The illustrations, charts and layout examples shown in this manual are intended solely to illustrate the text of
this manual. Because of the many variables and requirements associated with any particular installation,
Invensys Systems, Inc. cannot assume responsibility or liability for actual use based upon the illustrative uses
and applications.
In no event will Invensys Systems, Inc. be responsible or liable for indirect or consequential damages
resulting from the use or application of this equipment.
INVENSYS SYSTEMS, INC. DISCLAIMS ANY IMPLIED WARRANTY OF FITNESS FOR A
PARTICULAR PURPOSE.
Invensys Systems, Inc. reserves the right to make changes at any time in order to improve design and to supply
the most reliable product. No patent or copyright liability is assumed by Invensys Systems, Inc. with respect
to use of information, circuits, equipment or software described in this text.
TECHNICAL SUPPORT
Customers in the U.S. and Canada can obtain technical support from the Global Customer Support (GCS)
center at the numbers below. International customers should contact their regional support center.
Telephone:
Toll-free number
Toll number
866-746-6477
508-549-2424 (outside U.S.)
Fax:
Toll number
508-549-4999
The Tri-GP controller is state-of-the art and provides fault tolerance

by means of Triple-Modular Redundant (TMR) architecture.
Introduction
What is Fault-Tolerant Control?
Fault-tolerance in a control system
identifies and compensates for failed
system elements and allows repair
while continuing to control an industrial process without interruption. A
high-integrity control system such as
the Triconex General Purpose
(Tri-GP) controller can be used in
critical process applications that require
a significant degree of safety and availability.
What is the Tri-GP Controller?
The Tri-GP controller is a state-of-the
art programmable logic controller that
provides fault tolerance by means of
Triple-Modular Redundant (TMR)
architecture. TMR integrates three
isolated, parallel control systems and
extensive diagnostics in one control
system. The system uses two-out-ofthree voting to provide high-integrity,
error-free, uninterrupted process operation.
The Tri-GP controller uses three identical channels. Each channel independently executes the application in
parallel with the other two channels.
Specialized hardware and software
voting mechanisms qualify and verify
all digital inputs and outputs from the
field, while analog inputs are subject to
a mid-value selection process.
Because each channel is isolated from
the others, no single-point failure in any
channel can pass to another. If a hardware failure occurs on one channel, the
other channels override it. Meanwhile,
the faulting module can be easily
removed and replaced while the
controller is online without interrupting
the process.
Tri-GP System Mounted on a Panel
Setting up applications is simplified

with the triplicated Tri-GP system,
because it operates as a single control
system from a customers point of view.
You can terminate sensors and actua-
tors at a single wiring terminal and

program the Tri-GP controller with one
set of application logic. The Tri-GP
controller manages the rest.
1
Introduction
Extensive diagnostics on each channel,
module, and functional circuit immediately detect and report operational
faults by means of indicators or alarms.
All diagnostic fault information is
accessible to the application and the
operator. This diagnostic data can be
used to modify control actions or to
direct maintenance procedures.
Other features of the Tri-GP controller
that ensure the highest possible system
integrity include:
Ability to withstand harsh industrial
environments.
Optimized for applications with
small to medium point counts.
Support for remote and distributed
I/O.
Wall- or skid-mounting outside of
control room and enclosures.
Version 3.x supports 25 total I/O
Baseplates.
Hot-spare I/O modules for critical
applications where prompt attention
from the operator is not possible.
Integral support for redundant field
power and logic power sources.
Integration of I/O modules with field
termination assemblies.
Field installation and repair at the
module level while the controller
remains online and without
disturbing field wiring
Execution of applications developed
and debugged using the TriStation
1131 Developers Workbench.
TriStation 1131 and Modbus
communication from the Main
Processor (MP), Communications
Integration Module (CIM), or
Communication Module (CM).
What are Typical UserCreated Applications?
What is TriStation 1131

Developer's Workbench?
Each day Tri-GP systems supply

increased safety, reliability, and availability to a worldwide installed base.
The following sections describe typical
applications. For details on the value
Tri-GP can bring to your applications,
ask your sales representative for additional documentation and customer
references.
The TriStation 1131 Developer's Workbench is an integrated tool for developing, testing, and documenting
applications for the Tri-GP controller.
The programming methodology, user
interface, and self-documentation capabilities make TriStation 1131 software
superior to traditional and competing
engineering tools. TriStation 1131 software complies with Part 3 of the IEC
61131 International Standard for
Programmable Controllers and follows
the Microsoft Windows guidelines
for graphical user interfaces.
Emergency Safety Shutdown

(ESD)
Tri-GP controllers provide continuous
protection for safety-critical units in
refineries, petrochemical and chemical
plants, and other industrial processes.
For example, in reactor and compressor
units, plant trip signalsfor pressure,
product feed rates, expander pressure
equalization and temperatureare
monitored and shutdown actions taken
if an upset condition occurs. Traditional
shutdown systems implemented with
mechanical or electronic relays may
provide shutdown protection, but can
also cause dangerous nuisance trips.
Boiler Flame Safety
Process steam boilers are a critical
component in most refinery applications. Protection of the boiler from
upset conditions, safety interlock for
normal startup and shutdown, and
flame-safety applications are combined
in one integrated Tri-GP system.
In traditional applications, these functions are provided by separate, nonintegrated components. With the faulttolerant, fail-safe Tri-GP controller, the
boiler operations staff can use a critical
resource more productively while
maintaining safety at or above the level
of electromechanical protection
systems.
What about Communication

Capabilities?
The Tri-GP controller provides
communication capabilities through
ports on the Main Processor (MP) and
the Communications Integration
Modules (CIM) or the Communication
Modules (CM).
Ports on the MP support Modbus slave
and TriStation 1131 protocols.
Ports on both the CIM and the CM
support:
Modbus slave (ASCII or RTU)
Modbus master (RTU)
Modbus master or slave (TCP)
TriStation 1131 software
TCP/IP
TSAA (UDP/IP)
TSAA with IP multicast (UDP/IP)
Triconex Time Synchronization
(UDP/IP or SNTP)
Triconex Peer-to-Peer (UDP/IP)
HP JetDirect (TCP/IP)
Introduction
Ports on only the CIM support:
Enhanced Peer-to-Peer
OPC UA
The CIM Baseplate can contain one or
two CIMs.
Ports on only the CM support:
(DLC)
Triconex Peer-to-Peer (DLC)
The CM Baseplate can contain one or
two CMs.
For more information, see page 47.
Notes
The Tri-GP controller is designed with a fully triplicated

architecture throughout, from the input modules through the Main
Processors to the output modules.
System Overview
Fault tolerance in the Tri-GP controller
is achieved through the Triple Modular
Redundant (TMR) architecture. The
Tri-GP provides error-free, uninterrupted control in the event of hard failures of components or transient faults
from internal or external sources.
The Tri-GP is designed with a fully
triplicated architecture throughout,
from the input modules through the
MPs to the output modules. Each
module houses the circuitry for three
independent channels. Each channel on
an input module reads the process data
and passes it to the corresponding MP.
The three MPs communicate with each
other using a proprietary, high-speed
bus called the TriBus.
Each I/O Baseplate supports two

modules in one logical slot which
means both the active and hot-spare
module receive the same information
from the field termination wiring.
Main Processor Module
The MPs switch control between the

two healthy I/O modules approximately
every hour, so that each module undergoes complete diagnostics on a regular
basis.
A dedicated I/O control processor on

each MP manages the data exchanged
between the MP and the I/O modules. A
triplicated I/O bus, located on the baseplates, extends from one column of I/O
modules to the next column using I/O
bus cables.
If a fault is detected on the active

module, Tri-GP automatically switches
control to the hot-spare module,
allowing the system to continuously
work in triplicated control. The faulty
module can then be removed and
replaced. For details, see Online
Module Repair on page 13.
Every Tri-GP system contains three

MPs. Each MP controls a separate
channel and operates in parallel with
the other two MPs.
The I/O control processor polls the

input modules and transmits the new
input data to the MPs. The MPs then
assemble the input data into tables
which are stored in memory for use in
Once per scan, the MPs

synchronize and communicate with their neighbors over
the TriBus. The TriBus sends
copies of all analog and
digital input data to each MP,
then compares output data
from each MP. The MPs vote
the input data, execute the
application, and send outputs
generated by the application
to the output modules.
In addition, the Tri-GP
controller votes the output
data on the output modules as
close to the field as possible.
This allows the Tri-GP to
detect and compensate for
any errors that could occur
between the TriBus voting
and the final output driven to
the field.
Simplified Tri-GP Architecture
System Overview
Program Processor
I/O Processor
Dual 24 V
Power Inputs
Redundant
Alarm
Relays
Alarm 1
Alarm 2
Debug (RJ-12)
System
Alarm
Dual-Power
Regulators
+3.3 V
+5 V
3.6 V
Battery
and Monitor
Program
Alarm
Debug (RJ-12)
I/O Bus
Modbus (DB-9)
Reserved (DB-9)
MPC860A
Ethernet
Network (RJ-45)
Clock/NVRAM
8 KB
Flash
6 MB
Tribus
(to other MPS)
TriBus
FPGA
MPC860A
Shared
Memory
128 K
36-Bit Bus
Down Stream
Up Stream
Down Stream
Diagnostic Bus
Channels
(to other MPs)
Main Processor Architecture
the voting process. The input table in

each MP is transferred to its neighboring MP by the TriBus. After this
transfer, voting takes place. The TriBus
uses a programmable device with direct
memory access to synchronize,
transmit, and compare data among the
three MPs.
application in parallel with the neighboring MP and generates a table of

output values that is based on the table
of input values according to userdefined rules. The I/O control processor
on each MP manages the transmission
of output data to the output modules by
means of the I/O bus.
If a disagreement occurs, the signal

value found in two out of three tables
prevails, and the MPs correct the third
table accordingly. One-time differences
which result from sample timing variations are distinguished from a pattern of
differing data. The MPs maintain data
about necessary corrections in local
memory. Built-in fault analyzer
routines flag any disparity and use it at
the end of each scan to determine
whether a fault exists on a particular
module.
Using the table of output values, the I/O

control processor generates a smaller
table for each output module and transmits these tables to the appropriate
channels of the output modules over the
I/O bus. For example, MP A transmits a
table to Channel A of each output
module over I/O Bus A. The transmittal
of output data has priority over the
routine scanning of all I/O modules.
The MPs send the corrected data to the

application. The 32-bit MP executes the
A failure of one power source does not

affect controller performance. If the
controller loses power, the application
and all critical data are retained indefinitely.
Ports on the MPs enable the Tri-GP to
communicate with TriStation 1131
software and with external devices by
means of Modbus and Ethernet
protocol.
36-Bit Bus
DRAM
16 MB
DRAM
16 MB
Up Stream
flash EPROM and loaded in DRAM for

execution. The MPs receive power
from redundant 24-volt DC power
sources. In the event of an external
power failure, all critical retentive data
is stored in NVRAM (Non-Volatile
Random Access Memory).
Each MP provides 16 megabytes of

DRAM for the user-written application,
sequence-of-events (SOE) and I/O
data, diagnostics, and communication
buffers. The application is stored in
Each MP provides:
One Ethernet (IEEE 802.3) TriStation 1131 port for downloading the
application to the Tri-GP controller
and uploading diagnostic information. This port can also be used to
download Tri-GP firmware to the
Flash ROM.
One Modbus RS-232 or RS-485
serial port which acts as a slave
while an external device is the
master. Typically, a distributed
control system (DCS) monitors
and optionally updatesthe Tri-GP
controller data directly through an
MP.
Bus and Power Distribution

Power
Supply
#1
The triplicated I/O bus and redundant

logic power (shown in the figure to the
right) are carried from baseplate to
baseplate by user-installed Interconnect
Assemblies, I/O Extender Modules and
I/O Bus Cables.
I/O Bus
Channel A
Channel B
Channel C
~ ~~
The TriBus, which is local to the MP

Baseplate, consists of three independent, serial links operating at 25 megabits per second. The MPs synchronize
at the beginning of every scan, then
each MP sends its data to its upstream
and downstream neighbors. Next, the
TriBus takes these actions:
EM
CM
I/O
Communication
Bus
An important feature of the Tri-GP

architecture is the use of a single transmitter to send data to both the upstream
and downstream MPs. This ensures that
the same data is received by the
upstream processor and the downstream processor.
Each column of modules must have a
separate logic power connection.
Field signal distribution is local to each
I/O Baseplate. Each I/O module transfers signals to or from the field through
its associated baseplate assembly. The
two I/O module slots on the baseplate
tie together as one logical slot. Either
position can hold the active I/O module
while the other position holds the hotspare I/O module.
Each field connection on the baseplate
extends to both active and hot-spare I/O
modules. Consequently, both the active
module and the hot-spare module
receive the same information from the
field termination wiring.
(25 I/O
Baseplates
Maximum)
(8 I/O
Baseplates
Maximum
per Column)
I/O Bus
Interconnect
Assembly
Transfers input, diagnostic and

communication data
Compares data and identifies
disagreements with the output data
and application memory of the
previous scan
Power
Supply
#2
I/O
I/O Bus
MP
I/O
I/O
Power
Bus
Power
Bus
EM
EM
I/O Bus and Logic Power Distribution
A triplicated I/O bus between the I/O

modules and the MPs transfers data at 2
megabits per second. The I/O bus is
contained within an I/O column and can
be extended to another I/O column
using a set of three I/O bus cables (one
for each TMR channel).
Isolation is provided between field and

logic power on all I/O modules.
Each column is typically limited to

eight baseplates due to vertical space
restrictions.
Logic power for the modules in each
I/O column is distributed using two
independent power rails. Each I/O
column draws power from both power
rails through redundant DC-DC power
converters. Each channel is powered
independently by these redundant
power sources.
7
System Overview
On an Analog Input (AI) Module, each

channel measures the input signals
asynchronously and places the results
into a table of values. Each input table
is passed to its associated MP over the
corresponding I/O bus. The input table
in each MP is transferred to its neighbors over the TriBus.
In TMR mode, the mid-value data is
used by the application; in dual mode,
the average is used.
Analog Input Module Typical Point (1 of 32)
ADC
ADC
ADC
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
DAC
Analog Input Module Schematic
Analog Input/Digital Input Module Typical Point (1 of 32)
ADC
The Analog Input/Digital Input

Module has 16 digital input points
(points 116) and 16 analog input
points (points 1732).
For analog input points, each channel

receives variable voltage signals from
each point, converts them to digital
values, and transmits the values to the
three MPs on demand.
Isolated
Bus
Transceiver
DAC
Each AI Module is guaranteed to

remain in calibration for the life of the
controller. Periodic manual calibration
is not required.
Isolation
Filtering
Triplicated
I/O Bus
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
*
DAC
Individual Point
Field Terminations
The AI/DI Module has three isolated

sets of electronics, called channels,
which independently process field data
input to the module. Sensing of each
input point is performed in a manner
that prevents a single failure on one
channel from affecting another channel.
ASIC
DAC
AI Modules continuously execute

Forced Value Diagnostics (FVD) which
is a self-test diagnostic that detects and
signals an alarm for all stuck-at and
accuracy fault conditions typically in
less than 500 milliseconds. This safety
feature allows unrestricted operation
under a variety of multiple-fault
scenarios.
Analog Input/Digital Input

Module
Triplicated
I/O Bus
Isolation
Filtering
Individual Point
Field Terminations
Analog Input Module
ADC
*
DAC
ADC
*
DAC
For digital input points, an ASIC on

each channel scans each input point,
compiles data, and transmits it to the
MPs on demand.
8
*On DI points only
Analog Input/Digital Input Module Schematic
For all points, the MPs vote the data

before passing it to the control
program. In TMR mode, the data
passed is mid-value. In dual mode, the
data passed is the average.
AI/DI Modules sustain complete,
ongoing diagnostics for each channel.
If the diagnostics detect a failure on any
channel, the Fault indicator turns on
and activates the system alarm. The
Fault indicator identifies a channel
fault, not a complete module failure.
AI/DI Modules are guaranteed to
operate properly in the presence of a
single fault and may continue to operate
properly with multiple faults.
AI/DI Modules include the hot-spare
feature which allows online replacement of a faulty module. The AI/DI
Triplicated
I/O Bus
Module is mechanically keyed to

prevent improper installation in a
configured baseplate.
Analog Output Module
On an Analog Output (AO) Module,
each channel includes a proprietary
ASIC that receives its output table from
the I/O communication processor on its
corresponding MP. AO Modules use
special shunt circuitry to vote on the
individual output signals before they
are applied to the load. Voter circuitry
ensures only one output channel (A, B,
or C) is driving the field load. The shunt
output circuitry provides multiple
redundancy for all critical signal paths,
guaranteeing safety and maximum
availability.
I/O Controller(s)
Isolated
Bus
Transceiver
Proc
A
AO Modules continuously execute

Forced Switch Diagnostics (FSD) on
each point. By carefully forcing error
conditions and observing proper
behavior of the voting circuitry, high
reliability and safe operation is ensured.
This safety feature allows unrestricted
operation under a variety of multiplefault scenarios.
Each AO Module is guaranteed to
remain in calibration for the life of the
controller. Periodic manual calibration
is not required.
Field Circuitry Typical Point (4)
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Isolated
Bus
Transceiver
Proc
B
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Isolated
Bus
Transceiver
Proc
C
Output
Termination
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Analog Output Modules Schematic
System Overview
Digital Input Module
A Digital Input (DI) Module contains
the circuitry for three identical channels
(A, B and C). Although the channels
reside on the same module, they are
completely isolated from each other
and operate independently. Each
channel conditions signals independently. A fault on one channel cannot
pass to another. Each channel includes
a proprietary ASIC which handles
communication with its corresponding
MP, and supports run-time diagnostics.
Each input channel on the DI Module
measures the input signals from each
point on the baseplate asynchronously,
determines the respective states of the
input signals, and places the values into
input tables A, B and C respectively.
Each input table is interrogated at
regular intervals over the I/O bus by the
I/O communication processor located
on the corresponding MP. For example,
MP A interrogates Input Table A over
I/O Bus A.
DI Modules continuously execute
Forced Value Diagnostics (FVD) which
is a self-test diagnostic that detects and
signals an alarm for all stuck-at fault
conditions typically in less than 500
milliseconds. This safety feature allows
unrestricted operation under a variety
of multiple-fault scenarios.
Digital Input Module Schematic
output signals just before they are

applied to the load.
point is momentarily reversed on one of

the output drivers, one after another.
This voter circuitry is based on parallelseries paths which pass power if two
out of three channels (A and B, or B and
C, or A and C) command them to close.
The Quad Voter circuitry has multiple
redundancy on all critical signal paths,
availability.
Loop-back circuitry on the module

allows each ASIC to read the output
value for the point to determine
whether a latent fault exists within the
output circuit.
During Output Voter Diagnostic (OVD)

execution, the commanded state of each
The output signal transition is guaranteed to be less than 2 milliseconds (500

microseconds is typical) and is transparent to most field devices. For
devices that cannot tolerate a signal
DI Module diagnostics are specifically

designed to monitor devices which hold
points in one state for long periods of
time. The diagnostics ensure complete
fault coverage of each input circuit
even if the actual state of the input
points never changes.
Digital Output Module
On the Digital Output (DO) Module,
each channel includes a proprietary
ASIC which receives its output table
from the I/O communication processor
on the corresponding MP. Digital
Output Modules use the patented Quad
Voter circuitry to vote on the individual
10
Digital Output Module Schematic
transition of any length, OVD can be

disabled on a per-point basis from
TriStation 1131 software.
DO Module diagnostics are specifically
designed to monitor outputs which
remain in one state for long periods of
time. The OVD diagnostics ensure
complete fault coverage of each output
circuit even if the actual state of the
output points never changes.
Triplicated
I/O Bus
PI Module Typical Point (1 of 6)
+
Isolation
Filtering
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
Isolation
Filtering
On a Pulse Input (PI) Module, six sensitive, high-frequency inputs can be individually configured for non-amplified
and amplified magnetic speed sensors
common on rotating equipment, such as
turbines or compressors.
The PI Module senses voltage transitions from the speed sensors. Every
input transition is sampled and time is
measured for an optimized number of
input gear pulses. The resulting count
and time are used to generate a
frequency (revolutions per minute),
which is transmitted to the MPs.
PI Modules have three independent
input channels. Each input channel
receives pulse input voltages from each
point, converts the values to frequency
(RPM) data, and transmits the values to
the MPs on demand. To ensure correct
data for each scan, one value is selected
using a mid-value selection algorithm.
Sensing of each input point is designed
to prevent a single failure on one
Individual Point
Field Terminations
Pulse Input Module

Isolation
Filtering
Isolation
Filtering
Isolation
Filtering
Isolation
Filtering
Pulse Input Module Schematic
11
System Overview
Solid-State Relay Output Module
On a Solid-State Relay Output (SRO)
Module, output signals are received
from the MPs on each of three channels. The three sets of signals are voted
and the voted data is used to drive the
32 individual relays. Each output has a
loop-back circuit which verifies the
operation of each relay switch independently of the presence of a load.
Ongoing diagnostics test the operational status of the SRO Module.
The SRO Module is a non-triplicated
module for use on non-critical points
which are not compatible with highside, solid-state output switches; for
example, interfacing with annunciator
panels.
HART Communication
Highway Addressable Remote Transducer protocol (HART) is a bi-directional industrial field communication
protocol used to communicate between
intelligent field instruments and host
systems over 420 mA instrumentation
wiring. Invensys offers these components to enable HART communication
between HART devices in the field and
Configuration and Asset Management
Software running on a PC.
2354S2 Analog Input HART
Baseplate
2354AS2 Analog Input HART
Hazardous Location Baseplate
2483S2 Analog Output HART
Baseplate
2483AS2 Analog Output HART
Hazardous Location Baseplate
Triconex 4850 HART multiplexer
System Diagnostics
and Status Indicators
The Tri-GP controller uses online diagnostics and specialized fault-monitoring circuitry to detect and alarm all
single-fault and most multiple-fault
conditions. The circuitry includes I/O
12
Triplicated
I/O Bus
Field Circuitry Typical Point (2 of 32)
Intelligent I/O Controller(s)
C1
A
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
ASIC
Com
C2
Solid-State Relay Output Module Schematic
loop-back, watch-dog timers, loss-ofpower sensors, and other proprietary

diagnostic mechanisms. Using the
alarm information, you can tailor the
response of the system to the specific
fault sequence and operating priorities
of the application.
All internal diagnostic and alarm data is

available for remote logging and report
generation. Reporting is done through a
local or remote PC running TriStation
1131 software or host computer. For
more information on reporting, see the
TriStation 1131 Developers Guide.
Any I/O module can activate the system

integrity alarm, which consists of
redundant normally closed (NC) relay
contacts on each MP. Any failure
condition, including loss or brown-out
of system power, activates the alarm to
summon plant maintenance personnel.
The front panel of every I/O module
includes light-emitting diode (LED)
indicators that display the status of the
module or the external systems to
which it is connected. Pass, Fault and
Active indicators are common to all I/O
modules. Other indicators are modulespecific.
Normal service of a Tri-GP system
consists of replacing plug-in modules.
A lighted Fault indicator shows that the
module has detected a fault and must be
replaced.
System Status Indicators
Online Module Repair

Because the logical slot for Tri-GP
modules can contain two identical I/O
modules, a faulted module can be
repaired online without interrupting the
control process.
In the case where there are two identical
I/O modules in the slot, Tri-GP periodically switches control between each
module. When one module is active,
the other acts as a hot-spare module
powered, but inactive.
Ideally, at least one hot-spare module

should be installed for every type of I/O
module used in the system. For
example, if a Tri-GP system normally
operates with four DI Modules, at least
one hot-spare DI Module should be
installed at all times. With this arrangement, the hot-spare module is tested
regularly and can be used for online
replacement of any DI Module in the
system.
Tri-GP switches control between the

two healthy I/O modules approximately
every hour, so that each module undergoes complete diagnostics on a regular
basis.
If a fault is detected on the active
module, the Tri-GP system automatically switches control to the hot-spare
module, allowing the system to continuously work in triplicated control. The
faulty module can then be removed and
replaced.
In the case where there is only one I/O
module in the slot and a fault occurs, a
second I/O module can be inserted in
the slot. After the replacement module
passes a diagnostic test, it becomes the
active module.
If a fault occurs on a system that does
not have a hot-spare module, the Fault
indicator turns on, but the module
remains active in dual control. When a
replacement module is inserted and
passes the diagnostic test, Tri-GP
switches control to the second I/O
module and returns to triplicated
control.
After the replacement module becomes
active, the faulty module can be
removed and sent to Invensys for
repair. This method demonstrates the
Tri-GPs ability to automatically transition from triplicated to dual control and
back again without process interruption.
13
Notes
A typical Tri-GP system is configured into one or more vertical I/O

columns guided by DIN rails and mounted on a sheet-metal panel.
Setting up a Tri-GP System

A Tri-GP system consists of:
MPs and I/O modules
Communication Module
(CM)
Optional CIMs or CMs
Analog Input (AI)
The baseplates on which the

modules are mounted
Analog Input/Digital
Input (AI/DI)
Field wiring connections
Digital Input (DI)
A programming workstation
running TriStation 1131 software
Analog Output (AO)
A typical Tri-GP system is configured

into one or more vertical I/O columns
guided by DIN rails and mounted on a
sheet-metal panel, as shown in the
figure at the right.
Pulse Input (PI)
Multiple I/O columns are connected by

means of extender modules and I/O bus
cables. The completed panel is installed
in a floor- or wall-mounted enclosure
such as a Rittal cabinet or a Hoffman
box.
For more information on available
baseplates, modules, and accessories,
see Product Specifications on
page 19.
Planning a System
Configuration
Before a Tri-GP system can be physically installed, its configuration must
be planned, based on the requirements
described in this section.
A Tri-GP system must include three
MPs and the MP Baseplate.
The system can also include any combination of these module types and baseplates:
Communications Integration
Module (CIM)
Digital Output (DO)

Solid-State Relay Output
(SRO)
Triconex General Purpose
systems can include 25 total
I/O Baseplates (requires
TriStation 1131 v4.9 software or later).
Triconex General Purpose
systems support:
25 I/O Baseplates
maximum
416 AI points maximum
(13 AI baseplates, 13
AI/DI baseplates, or any
combination that does
not exceed 416 total AI
or AI/DI points)
20 AO points maximum
(5 baseplates)
Typical System Configuration
640 DI points maximum (20 DI

baseplates, 25 AI/DI baseplates, or
any combination that does not
exceed 640 total DI points)
For information on other Tri-GP

versions, see the Planning and Installation Guide for Triconex General
Purpose v2-v3 Systems.
320 DO points maximum

(20 baseplates)
Performance and other considerations

may limit the maximum number of I/O
points in some applications.
30 PI points maximum
(5 baseplates)
640 SRO points maximum
(20 baseplates)
Please contact the Global Customer

Support (GCS) center for help configuring large systems.
15

Interconnection of Baseplates
Baseplates are connected by Interconnect Assemblies that carry I/O
messages, logic power, and system
power across baseplates. The MP Interconnect is connected to an I/O Baseplate, and the I/O Interconnects are
connected to other I/O Baseplates.
Extending the I/O Bus
I/O Extender Modules (EM) and I/O
Bus Cables carry I/O messages from
one I/O column to another and to
supply logic power connections for
each I/O column.
Modules mounted in two columns must
be connected together by an Interconnect Assembly. Two I/O Extender
Modules are linked by I/O Bus Cables,
as shown in the figure on page 15.
Module
Model
Number
Maximum
Logic Power
(Watts)a
Maximum Field Power (Watts)b

Primary
Spare
Main Processor
3101S2
Not applicable
Not applicable
Communication
Module
3201S2
Not applicable
Not applicable
Communications
Integration
Module with
Media Adapter
3211
13.7
Not applicable
Not applicable
Analog Input
3351S2
Negligible
Analog Input/
Digital Input
3361S2
Negligible
Analog Output
3481S2
Negligible
Analog Output
3482S2
Negligible
Digital Input
3301S2
Negligible
Digital Input
3311S2
Negligible
Digital Output
3401S2
Negligible
Required Accessories
Digital Output
3411S2
20
Negligible
End caps, terminal covers, and slot

covers are used to minimize the exposure of Tri-GP components to dust,
liquids, and corrosive atmospheres.
Pulse Input
3382S2
Negligible
Negligible
Solid-State
Relay Output
3451S2
Negligible
End caps protect the top and bottom of

each end-of-column baseplate. They
are available for both MP Baseplates
and I/O Baseplates.
I/O slot covers protect unused I/O slots.
Terminal covers protect terminal baseplates.
Power and Cooling
Considerations
Before operating a Tri-GP system, the
logic power consumption and cooling
requirements should be determined.
The heat load dissipated by the system
is calculated by adding the logic power
and field power for all of the modules,
using the table on this page.
For maximum reliability, the average
ambient temperature of a Tri-GP
system should be below 120 F (50 C).
Adequate convection or forced-air
cooling should be provided. In vented
applications, air should flow into vents
16
a.To convert watts to British thermal units: BTU = watts x 3.414.

b.Field power is the percentage of field circuit power that is dissipated within the baseplate.
at the bottom of the enclosure and exit

at the top.
ible units and supported distances,

contact your regional customer center.
I/O Bus Length
Addressing of System
Components
If the total length of the I/O bus is less

than 20 feet (6 meters), the I/O bus can
be operated without termination.
If the I/O bus length is greater than 20
feet, the bus should be terminated.
The maximum I/O bus length is 650
feet (200 meters) which includes the
following:
The MP and CIM or CM (if used) are

identified by the Address Plug located
at the bottom-left part of the MP Baseplate. The Address Plug is the node
number for the system. In TriStation
1131 software, the number is used for
the configuration setup. (Node numbers
can be from 1 to 63.)
Length of all baseplates

Length of I/O Extender Modules
Length of I/O bus extension cables
Note: For distances greater than 650
feet or for applications requiring isolation, fiber-optic transceivers are
commercially available. For compat-
The I/O modules also have Address

Plugs which are used to identify field
point connections and are the equivalent of traditional Rack-Slot addresses.
In TriStation 1131 software, the

numbers are also used for the configuration setup.
Mounting Components on a Sheet-Metal Panel
Placing an I/O Module on a Baseplate
17

Mechanical Installation
A Tri-GP system is physically set up by
installing the following components on
a user-supplied sheet-metal panel:
One MP Baseplate with three MP
Modules
One Communications Integration
Baseplate with one or two CIMs
The basic steps for installing Tri-GP

components include:
Connecting to a PC Running
TriStation 1131 Software
Installing DIN rails
The Tri-GP controller communicates

with the TriStation 1131 PC through
Ethernet network ports on the CIM,
CM, or MP or through serial ports on
the CIM or CM.
Fastening the baseplates onto the

panels
Joining the baseplates together with
interconnect assemblies
One Communication Baseplate with

one or two CMs
Connecting multiple columns of

baseplates with extender modules
and I/O bus cables
For more information, see the

TriStation 1131 Developers Guide and
the Communication Guide for Triconex
General Purpose v2-v3 Systems.
I/O Baseplates with one or two I/O

modules each
Installing the MP, CIM or CM, and

I/O modules onto the baseplates
Connecting Field Devices
Interconnect Assemblies for

connecting baseplates
Typical Enclosures
I/O bus extenders and cables for

connecting I/O columns
End caps for the top and bottom of
each I/O column
Panel Mounting of Baseplates
and Modules
The sheet-metal panels on which baseplates are mounted and the DIN rails
used for guidance are user-supplied.
The panels should be made of 12-gauge
or heavier steel and the DIN rails should
be compatible with the DIN 50-022
standard.
Invensys recommends installing DIN
rails to act as guides prior to mounting
the baseplates.
When all baseplates, modules, and

connective devices are securely
mounted on a panel, the entire system is
placed in a user-supplied metal enclosure with a sealed bottom and a closed
door.
Either of the following can be used:
A floor-mounted enclosure such as a
Rittal cabinet for one I/O column
A wall-mounted enclosure such as a
Hoffman box for two or more I/O
columns
Connecting Logic Power
and Field Power
The Tri-GP controller offers a flexible
power-handling system.
Logic Power
Logic power is distributed down each
column. This distribution is redundant
and both must be wired. If not wired, a
system alarm is generated. If a single
power source is used, it must be jumpered to the redundant termination
points.
Field Power
Field power is also redundant and both
wiring points must be wired. Each baseplate is isolated from all other baseplates. This configuration provides you
with a wide range of possibilities for
field power distribution.
18
Field devices are wired to the termination strips mounted on either the baseplate or the external termination panel.
The Tri-GP controller supports a complete range of modules

for applications with low point counts and distributed I/O.
Product Specifications
The Tri-GP controller supports a range
of modules for applications with low
point counts and distributed I/O. This
section provides detailed specifications
for each product in the Tri-GP family.
Also included are:
International approvals (page 25)
Environmental specifications
(page 27)
Dimensions and clearances (page 28)
Main Processor Modules
and Baseplates
Every Tri-GP system is controlled by
three MP Modules that reside on a single
baseplate. Each MP Module acts as one
channel of the triplicated Tri-GP system.
For details, see page 28.
Module/Communication Module
and Baseplates
The Communications Integration
Module (CIM) and the Communication
Module (CM) are three-to-one interfaces to the MPs that enable use of
industry-standard communication
protocols. A single Tri-GP controller
can support up to two CIMs or CMs on
one CIM or CM Baseplate with each
CIM or CM operating independently.
Two CIMs or CMs can provide redundant communication connections or
independent communication ports. For
details, see page 30.
Analog Input Module
and Baseplates
Each AI Module has three isolated channels which independently process
analog inputs from field devices. Each
channel transmits the data to the MP
associated with the channel. The MPs

vote the data before passing it to the
application. In addition to the standard
AI baseplate, a HART AI baseplate and
a hazardous location HART AI baseplate are available. For details, see
page 36.
Analog Input/Digital Input Module
and Baseplates
Each AI/DI Module has three isolated
channels which independently process
analog and digital inputs from field
devices. Each channel transmits the data
to the MP associated with the channel.
The MPs vote the data before passing it
to the application. For details, see
page 36.
Digital Input Modules
and Baseplates
Each DI Module has three isolated channels which independently process digital
input from field devices. Each channel
transmits the data to the MP associated
with the channel. For details, see
page 39.
Analog Output Modules
and Baseplates
Each AO Module has three isolated
channels which independently accept
data from the MPs. Voter circuitry
selects a single channel to drive the
output and shunts output from the other
channels. In addition to the standard AO
baseplate, a HART AO baseplate and a
hazardous location HART AO baseplate
are available. For details, see page 38.
Digital Output Modules
and Baseplates
Each DO Module has three isolated
data from the MP associated with each

channel. For details, see page 40.
Pulse Input Modules
and Baseplate
Each PI Module has three isolated channels which independently receive
voltage transitions from each point and
converts the transitions to frequency
(RPM) data. For details, see page 41.
and Baseplate
Each SRO Module has three isolated
channel. The channels provide input to a
voter circuit which uses the voted value
to drive the coil of the relay. For details,
see page 43.
I/O Extender Modules
I/O Extender Module Kits are used to
carry I/O messages from one I/O column
to another and to provide logic power
terminals for each I/O column. For
Interconnect Assemblies
Tri-GP baseplates within a single I/O
column are connected by Interconnect
Assemblies that carry I/O messages and
logic power across the baseplates. For
Accessories such as end caps, terminal
covers, and slot covers are required to
protect Tri-GP components from dust,
liquids, and corrosive atmospheres. For
details, see page 45. Components for the
Tri-GP system are offered in TriPaks
and kits, as well as by individual parts.
For details, see page 20.
19
Standard Tri-GP Products
Model
Product Name
5101S2
Main Processor TriPak
5201S2
Description
Consists of
3
1

Main Processor Baseplate Kit
3101S2
2101S2
Communication Module TriPak
1
1
Communication Module
Communication Module Baseplate Kit
3201S2
2201S2
5211S2
Module TriPak
1
1
1
Communications Integration Module

Communications Integration Module Baseplate Kit
Communications Integration Module Media Adapter
3211S2
2211S2
2211-100S2
5351S2
Analog Input TriPak
1
1
Analog Input Module

Analog Input Baseplate Kit
3351S2
2351S2
5361S2

TriPak
1
1
Analog Input/Digital Input Module

Analog Input/Digital Input Baseplate Kit
3361S2
2361S2
5352S2
Analog Input TriPak, RTD/TC/420 mA
1
1
Analog Input Module

Analog Input Baseplate, RTD/TC/4-20 mA
3351S2
2352S2
5354S2
Analog Input TriPak, HART
1
1
1
Analog Input Module

Analog Input Baseplate Kit, HART,
Triconex 4850 HART Multiplexer
3351S2
2354S2
1600106-001
5354AS2
Analog Input TriPak, HART,

Hazardous Location
1
1
1
Analog Input Module

Analog Input Baseplate Kit, HART, Hazardous Location
3351S2
2354AS2
1600106-001
5481-1S2
Analog Output TriPak
1
1

AO Module Baseplate Kit
3481S2
2481S2
5482-1S2
Analog Output TriPak, HighCurrent
1
1
High-Current Analog Output Module

AO Module Baseplate Kit
3482S2
2481S2
5301S2
Digital Input TriPak
1
1

Digital Input Baseplate Kit
3301S2
2301S2
5311S2
Digital Input TriPak, High

Resolution
1
1
Digital Input Module, High Resolution

3311S2
2301S2
5312S2-F

Resolution, High Voltage
1
1
Digital Input Module, High Resolution

Digital Input Baseplate Kit, High Voltage
3311S2
2302S2-F
5302S2-F

Voltage
1
1

Digital Input Baseplate Kit, High Voltage
3301S2
2302S2-F
5401S2
Digital Output TriPak
1
1

Digital Output Baseplate Kit
3401S2
2401S2
5401LS2
Digital Output TriPak, Low

Current
1
1

Digital Output Baseplate Kit, Low Current
3401S2
2401LS2
5411HS2
Digital Output TriPak,

Supervised, High Current
1
1
Digital Output Module, Supervised

Digital Output Baseplate Kit, High Current
3411S2
2401HS2
5402S2-F
Digital Output TriPak, High

Voltage
1
1

Digital Output Baseplate Kit, High Voltage
3401S2
2402S2-F
5451S2
Solid-State Relay Output TriPak
1
1

Solid-State Relay Output Baseplate Kit
3451S2
2451S2
5382-1S2
Pulse Input TriPak, Enhanced
1
1
Pulse Input Module, Enhanced

Pulse Input Baseplate Kit
3382S2
2381S2
5382AS2
Pulse Input TriPak, Enhanced,

Hazardous Location
1
1
Pulse Input Module, Enhanced

Pulse Input Baseplate Kit, Hazardous Location
3382S2
2381AS2
20
Qty
Standard Tri-GP Products (Continued)

Model
Product Name
5483S2
Analog Output TriPak, HART
5483AS2
Qty
Description
Consists of
1
1
1

Analog Output Baseplate Kit, HART
3481S2
2483S2
1600106-001
Analog Output TriPak, HART,

Hazardous Location
1
1
1

Analog Output Baseplate Kit, HART, Hazard. Location
3481S2
2483AS2
1600106-001
2101S2
Main Processor Baseplate Kit
1
1
1
1
1
1
1
1
MP Baseplate
MP Interconnect Assembly
Accessories Kit
Top End Cap I/O
Top End Cap MP
Bottom End Cap I/O
Bottom End Cap MP
Triconex User Documentation CD
3000671-110
2920
8401
2910
2912
2911
2913
Contact
Invensys
2281
I/O Bus Extender Module Kit
2
3
1
1
1
I/O Extender Module

2-ft. I/O Bus Cables
I/O Interconnect Assembly
Top End Cap I/O
Bottom End Cap I/O
3000678-100
4000212-002
2921
2910
2911
2291
I/O Bus Termination Kit, I/O

Baseplate
1
1
1
I/O Extender Module

I/O Bus Terminator Kit (Set of 3)
3000678-100
2921
3900064-003
2292
I/O Bus Termination Kit, MP

Baseplate
1
1
1
I/O Extender Module

3000678-100
2920
3900064-003
2301S2
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000673-030
2921
2900
2901
2302S2-F
Digital Input Baseplate Kit, High

Voltage
1
2
1
1
2
I/O External Termination Baseplate

External Termination Panel (Solid State Relay Input)
Slot Cover
Interface Cable, 10 ft
3000721-310
3000762-110
2921
2900
4000187-310
SSR Input Modules for use with SSR Input ETP

100 to 240 VAC (ordered separately)
1300447-001
2302AS2-F
Digital Input Baseplate Kit,

Hazardous Location
1
1
1
1
1

External Termination Panel Kit
Slot Cover
Terminal Cover
3000989-315
9573-610F
2921
2900
2901
2342S2

Baseplate Kit, External
Termination
1
1
1

Slot Cover
3000721-140
2921
2900
2342AS2-F

Baseplate Kit, Hazardous
Location
1
1
1
1

Slot Cover
AI/DI ETP Kit, Hazardous Location
3000989-145
2921
2900
9793-610F
21
Model
Product Name
2351S2
Analog Input Baseplate Kit
2352S2
Description
Consists of
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000675-030
2921
2900
2901
Analog Input Baseplate Kit for

TC, RTD, and 4-20mA (requires
2 of part number 9764-510F)
1
1
1

Slot Cover
3000721-110
2921
2900
2352AS2-F
Analog Input Baseplate Kit,

Hazardous Location
1
1
1
1

Slot Cover
3000989-115
9792-310F
2921
2900
2354S2

HART
1
1
1
1
I/O HART Baseplate

Slot Cover
Terminal Cover
3000851-020
2920
2900
2901
2354AS2

HART, Hazardous Location
1
1
1
1
I/O HART Baseplate

Slot Cover
Terminal Cover
3000851-120
2920
2900
2901
2361S2

Baseplate Kit
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000675-040
2921
2900
2901
2381S2
Pulse Input Baseplate Kit
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000719-110
2921
2900
2901
2381AS2
Pulse Input Baseplate Kit,

Hazardous Location
1
1
1
1
I/O Hazardous Location Baseplate

Slot Cover
Terminal Cover
3000719-210
2921
2900
2901
2401S2
Digital Output Baseplate Kit
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000674-040
2921
2900
2901
2401HS2
Digital Output Baseplate Kit,

High Current
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000975-040
2921
2900
2901
2401LS2

Low Current
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000715-040
2921
2900
2901
22
Qty

Model
Product Name
2402S2-F

High Voltage
Qty
1
1
1
1
1
Description
Consists of
I/O Baseplate
External Termination Panel (Relay Output ETP)
Slot Cover
3000764-310
3000763-110
2921
2900
4000188-310
Relay Output Modules for use with Relay Output ETP

(ordered separately)
SSR, 2 A at 75 to 264 VAC
SSR, 2 A at 4 to 60 VDC
SSR, 1.5 A at 40 to 200 VDC
Power (Dry Contact) Relay; 440 VAC max, 125 VDC max
1300462-001
1300471-001
1300472-001
1300463-001
2402AS2-F

Hazardous Location
1
1
1
1

Slot Cover
3000764-315
9671-610F
2921
2900
2451S2

Baseplate Kit
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000676-320
2921
2900
2901
2480AS2-F
Analog Output Baseplate Kit,

Hazardous Location
1
1
1
1

Slot Cover
3000764-515
9863-610F
2921
2900
2481S2
Analog Output Baseplate Kit
1
1
1
1
I/O Baseplate
Slot Cover
Terminal Cover
3000674-020
2921
2900
2901
2483S2

HART
1
1
1
1
I/O HART Baseplate

Slot Cover
Terminal Cover
3000852-030
2920
2900
2901
2483AS2

HART, Hazardous Location
1
1
1
1
4
I/O HART Baseplate

Slot Cover
Terminal Cover
MTL4546 Intrinsic Safety BarrierIsolator
3000852-130
2920
2900
2901
1600107-001
8401
Trident/Triconex General
Purpose Accessory Kit
1
2
1
1
1
1
1
Set of Spare Fuses

Set of Address Plugs (1 through 10)
3000698-010
3000698-020
3000698-030
3000698-040
3000698-050
3000698-060
9573-610F
Digital Input Termination Panel

Kit, Hazardous Location
(for use with Model 2302AS2-F)
2
2
External Termination Panel, DI

Interface Cable, 10 ft, DI
3000771-880
4000195-310
9671-610F
Digital Output Termination Panel

1
1
External Termination Panel, DO

Interface Cable, 10 ft, DO
3000769-390
4000196-310
23
Model
Product Name
9764-510F
RTD/TC/AI Termination Panel

Kit (for use with Model 2352S2)
Qty
1
1
Description
Consists of
External Termination Panel, RTD/TC/AI

3000712-100
4000189-510
Signal Conditioning Modules for use with 9764-510F

(ordered separately)
420 mA
32 F to 392 F (0 C to 200 C), RTD
32 F to 1112 F (0 C to 600 C), RTD
32 F to 1400 F (0C to 760 C), Type J TC
32 F to 2372 F (0 C to 1300 C), Type K TC
32 F to 752 F (0 C to 400 C), Type T TC
32 F to 1652 F (0 C to 900 C), Type E TC
Shorting Plug
1600048-220
1600048-030
1600048-040
1600048-110
1600048-120
1600048-130
1600048-140
1600048-300
9792-310F
Analog Input Termination Panel

1
1
External Termination Panel, AI

Interface Cable, 10 ft, AI
3000771-710
4000197-510
9793-610F

Termination Panels Kit,
Hazardous Location
1
1
1
1
External Termination Panel, AI

External Termination Panel, DI
Interface Cable, 10 ft, AI
Interface Cable, 10 ft, DI
3000771-710
3000771-880
4000197-510
4000195-310
9863-610F
Analog Output Termination Panel

1
1
External Termination Panel, AO

Interface Cable, 10 ft, AO
3000770-960
4000198-510
Triconex 4850
Triconex 4850 HART

Multiplexer
1600106-001
Contact Invensys
for current model
number
TriStation 1131 and Diagnostic

Software
TriStation 1131 v4.x Software License
Contact
Invensys
1
1
1
Enhanced Diagnostic Monitor v2.x and later

Triconex DDE Server v4.x
SOE Recorder v4.x
Contact
Invensys
Contact Invensys
for current model
number
Triconex User Documentation

CD
CD containing user documentation in PDF format
Contact
Invensys
NOTE
It is possible to upgrade older systems, which may contain models not listed in the table above, to system version 3.x. Contact
the Global Customer Support (GCS) center for detailed compatibility information.
Tri-GP Equipment Certified for Use in Marine Environments

Bureau Veritas (BV) has certified specific Tri-GP products as being in full compliance with the following internationally recognized standard and qualified for use in marine environments.
BV NR467:2013, Part C, Ch 2-3 Rules for the Classification of Steel Ships; Part C - Machinery, Electricity, Automation
and Fire Protection; Chapters 2-3
Bureau Veritas Environmental Category, EC Code: 31BC
The following table lists the model numbers of Trident equipment certified for use in marine environments. Refer to the Planning and Installation Guide for Triconex General Purpose v2-v3 Systems for application-specific installation instructions.
24
NOTE
All contents of TriPaks and Kits in the following table are certified for use in marine environments. See Standard Tri-GP Products on page 20 for details about TriPak and Kit contents.
Tri-GP Equipment Certified for Use in Marine Environments
Model
Product Name
Model
Product Name
5101S2
Main Processor TriPak
2302AS2-F
Digital Input Baseplate Kit, Hazardous Location
5211S2
Communications Integration Module

TriPaka
2342S2
Analog Input/Digital Input Baseplate Kit, External

Termination
5201S2
Communication Module TriPakb
2342AS2-F
Analog Input/Digital Input Baseplate Kit, Hazardous

Location
5351S2
Analog Input TriPak
2352AS2-F
Analog Input Baseplate Kit, Hazardous Location
5361S2
Analog Input/Digital Input TriPak
2402AS2-F
Digital Output Baseplate Kit, Hazardous Location
5481-1S2
Analog Output TriPak
2480AS2-F
Analog Output Baseplate Kit, Hazardous Location
5482-1S2
Analog Output Tripak, High-Current
2920
5301S2
Digital Input TriPak
8401
Accessories Kit
5311S2-F
Digital Input TriPak, High Resolution
2910
Top End Cap I/O
5401S2
Digital Output TriPak
2912
Top End Cap MP
5401LS2
Digital Output TriPak, Low Current
2911
Bottom End Cap I/O
5411HS2
Digital Output TriPak, Supervised, High

Current
2913
Bottom End Cap MP
5451S2
Solid-State Relay Output TriPak
3000678-100
I/O Extender Module
5382-1S2
Pulse Input TriPak, Enhanced
4000212-002
2-ft. I/O Bus Cables
5382AS2
Pulse Input TriPak, Enhanced, Hazardous

Location
2921
2281
I/O Bus Extender Module Kit
3900064-003
2291
I/O Bus Termination Kit, I/O Baseplate
TriStation 1131 Developers Workbench 4.10.165 for

Tri-GP
2292
I/O Bus Termination Kit, MP Baseplate
Enhanced Diagnostic Monitor 2.7.132
a.Tri-GP systems with CIMs must be at system version 3.0.

b.Tri-GP systems with CMs must be at system version 2.2.
International Approvals
Canadian Standards Association
The Tri-GP controller has been certified

as complying with multiple internationally recognized standards by the following
internationally
recognized
certification agencies, these certifications have qualified the Tri-GP controller for use around the world in safety
critical applications. Test reports from
the various certification agencies are
available upon request.
Canadian Standards Association (CSA)

has certified that the Tri-GP v3.x
controller is in full compliance with the
following internationally recognized
electrical safety standards and is qualified for general use in North American
and other jurisdictions requiring
compliance with these standards.
European Union CE Mark
Based upon the independent TV evaluation and test results, Invensys has
certified the Tri-GP v3.x controller

suitable to use in the European Union
and all other jurisdictions requiring
compliance with the European Union
EMC Directive No. 89/336/EEC and
Low Voltage Equipment Directive No.
72/23/EEC. See Certificate of Compliance for details. To ensure maximum
reliability and trouble-free operation,
the Tri-GP and associated wiring must
be installed following the guidelines
outlined in the Planning and Installation Guide for Triconex General
Purpose v2-v3 Systems.
25
To comply with the CE Mark requirement for emissions and conducted
susceptibility, and EU directives, these
guidelines must be followed:
The entire Tri-GP system must be
installed in a metal enclosure with a
sealed bottom and a closed door,
connected to Safety Ground.
Field power supplies must be
approved for use in safety extra-low-
Certifying Agency
Canadian Standards
Association
voltage (SELV) circuits according to

the requirements of IEC 61010-1.
To comply with the requirements of EN
54-2:1997, the system must be located
in an area with an access level greater
than 2.
To comply with standards related to
conducted disturbance, a Schaffner
FN 2410 line filter, or equivalent, must
Standard Number
Title
be installed between power supplies

and baseplates.
Bureau Veritas (BV)
BV has certified specific Tri-GP products as being in full compliance with
the internationally recognized standard
listed on page 25 and qualified for use
in marine environments.
CAN/CSA-C22.2 No.0-M91
General RequirementsCanadian Electrical Code, Part II
CSA Std C22.2 No.0.4-M1982
Bonding and Grounding of Electrical Equipment (Protective Grounding)
CAN/CSA C22.2 No 1010.1-92
Safety Requirements for Electrical Equipment for Measurement, Control, and

Laboratory Use, Part 1: General Requirements
UL 3121-1 1998-07-14
Process Control Equipment
European Union CE
Mark
IEC 61131-2
Programmable Controllers Part 2: Equipment Requirements and Test.

Overvoltage Category II is assumed.
Factory Mutual
3611
Electrical Equipment for use in Class I-Division 2; Class II-Division 2; and

Class III-Divisions 1 and 2, Hazardous Locations
3810
Electrical and Electronic Test, Measuring and Process Control Equipment
3600
Electrical Equipment for Use in Hazardous (Classified) Locations-General

Requirements
Bureau Veritas
BV NR467:2013, Part C, Ch 2-3 Rules for the Classification of Steel Ships; Part C - Machinery, Electricity,
Automation and Fire Protection; Chapters 2-3
TV Rheinland
IEC 61508, Parts 1-7, 2010
Functional safety of electrical/electronic/programmable electronic safety-related

systems
IEC 61511:2004
Functional safety - Safety instrumented systems for the process industry sector
IEC 61131-2:2007
Programmable Controllers Part 2: Equipment Requirements and Test.

Overvoltage Category II is assumed.
IEC 61326-3-1:2008
Electrical equipment for measurement, control and laboratory use - EMC

requirements - Part 3-1: Immunity requirements for safety-related systems and
for equipment intended to perform safety-related functions (functional safety) General industrial applications
ANSI/ISA-84.00.01-2004
(IEC 61511-1 Mod)
Functional Safety: Safety Instrumented Systems for the Process Industry Sector
- Part 1: Framework, Definitions, System, Hardware and Software Requirements
EN50156-1:2004
Electrical equipment for furnaces and ancillary equipment. Requirements for

application design and installation
EN 50178:1998
Electronic equipment for use in power installations
NFPA 72:2007
National Fire Alarm Code
NFPA 85:2007
Boiler and Combustion Systems Hazards Code, 2007 Edition
NFPA 86:2011
Standards for Ovens and Furnaces
EN 298:203
Automatic gas burner control systems for gas burners and gas burning
appliances with or without fans
EN 54-2:1997/A1:2006a
Fire detection and fire alarm systems. Control and indicating equipment.
a.To comply with the requirements of EN 54-2:1997/A1:2006, the Tri-GP system must be installed in a metal enclosure with a sealed bottom and a closed door,
connected to Safety Ground, and it must be installed in an area with an access level greater than 2.
26
TV Rheinland
Feature
Specification
TV has certified that the Tri-GP v3.x

controller is in full compliance with the
internationally recognized standards
listed on page 25.
Operating temperature
-4 F to +158 F (-20 C to +70 C) ambient (which is the

air temperature measured at the bottom of the baseplate),
per IEC 60068-2-14, tests Na and Nb
Storage temperature
-40 F to +185 F (-40 C to +85 C) per IEC 60068-2-2,

test Bb, IEC 60068-2-1, test Ab, and IEC 60068-2-30, test
Db
Relative humidity
5% to 95%, non-condensing
Corrosive environment
Class G3 Level as defined in ISA Standard S71.04, based

on exposure testing according to EIA Standard 364-65A,
Class IIIA
Sinusoidal vibrations per axis
1.75 mm displacement @ 5 to 8.4 Hz (continuous)

0.5 g acceleration @ 8.4 to 150 Hz (continuous)
3.5 mm displacement @ 5 to 8.4 Hz (occasional)
1.0 g acceleration @ 8.4 to 150 Hz (occasional)
All tests per IEC 60068-2-6, test Fc
Factory Mutual
Factory Mutual (FM) has certified the
Tri-GP v3.x controller is in full compliance with the internationally recognized standards listed on page 25 and is
qualified for use in Class I, Division 2
Temperature T4, Groups A, B, C, and D
hazardous indoor locations. In North
America, the field signals used with
ATEX-compliant external termination
panels are certified for use in Class 1,
Division 2, Groups C and D. For
hazardous location applications, redundant power sources must be used for
system power. Also, any signal going to
or through a hazardous atmosphere
must use hazardous location protection,
such as an intrinsically safe (IS) barrier.
Shock
15 g, 11 ms, half-sine, 3 axis, per IEC 60068-2-27, test Ea
Electrostatic discharge
IEC 61000-4-2, 4 kV contact, 8kV air
Conducted susceptibility
IEC 61000-4-4, Fast Transient/Burst, 2 kV power &

unshielded AC I/O, 1 kV signal and communication lines
IEC 61000-4-5, Surge Withstand, 2 kV CM2/1 kV DM2
AC power and I/O, 1 kV CM2 I/O, shielded and
communication, 0.5 kV CM2/0.5 kV DM2 DC power
IEC 61000-4-6, RFI, 0.15-80 MHz, 10 V
IEC 61000-4-18, Damped Oscillatory Wave, 0.5 kV CM
shielded, 2.5 kV CM/1 kV DM unshielded AC I/O &
power, 1 kV CM/0.5 kV DM I/O
Radiated susceptibility
IEC 61000-4-3, Radio Frequency Electromagnetic Fields,

801000 MHz: 10 V/m, 1.42.0 GHz: 3 V/m, 2.02.7
GHz: 1 V/m
Conducted emissions
CISPR 16, Class A, 0.15-30MHz, 73-79db when installed

per the guidelines of the Planning and Installation Guide
for Triconex General Purpose v2-v3 Systems.
Radiated emissionsa
CISPR 11, Class A, 30-1000 MHz @ 10m, 4-47 db when

installed per the guidelines of Planning and Installation
Guide for Triconex General Purpose v2-v3 Systems.
Environmental Specifications
Designed for critical applications, the
Tri-GP performs predictably in a
hostile industrial environment. The
specifications listed in the table on the
preceding page confirm this built-in
reliability. However, due to the number
of diverse items that make up a Tri-GP
system, not all of the listed specifications apply to every item. Please
contact Invensys to obtain the specifications for particular items.
Power interruptions
IEC 61000-4-29, 1 ms battery, 10 ms DC power supply
Cable flame test ratingb
Interface cables
(connect external termination panels to baseplates):
FT4 Vertical Flame Test-Cables in Cable Trays per C.S.A.
C22.2 No. 0.3-92 Para 4.11.4c
I/O bus cables
(connect columns of baseplates):
FT6 Horizontal Flame & Smoke Test-per C.S.A. C22.2
No. 0.3-92 Appendix Bd
a. For European Union CE Mark and conducted susceptibility compliance, the Tri-GP system must be
mounted in a metal enclosure with a sealed bottom and a closed door, connected to Safety Ground. Additionally, the system must be located in an area with an access level greater than 2 to comply with the
requirements of EN 54-2:1998.
b.Applies to cables shipped after April 1, 2009.
c.Cables will be marked with FT4 or CMG rating, but they all actually meet the more stringent FT4 rating.
d.Cables will be marked with FT6 or CMP rating, but they all actually meet the more stringent FT6 rating.
27
Dimensions and Clearances
The dimensions given on the figure to
the left are predicated on the vertical
mounting of Tri-GP baseplates on a
panel.
The dimensions include the following:
The MP Baseplate, AI HART Baseplates, and AO HART Baseplates
are 9 inches (229 millimeters) wide
by 9.79 inches (249 millimeters)
long
Clearance should always allow

adequate air flow around Tri-GP
modules. For typical applications, there
should be at least 5 inches (15 centimeters) of clearance between active
modules and the walls of the enclosure.
The DIN rails and baseplate assemblies
should be arranged on the panel to
allow for the installation of wiring
channels (such as Panduit) along the
left side of vertical columns.

Every Tri-GP system is controlled by
three MP Modules that reside on a
single baseplate. Each MP Module acts
as one channel of the triplicated Tri-GP
system and provides the following
features:
An RS-232 or RS-485 Modbus port
for direct TMR connection to a DCS
(or other external host) without the
need for any other modules
A 10BaseT Ethernet (IEEE 802.3)
port for connection to the TriStation
1131 programming workstation
I/O Baseplates other than AI and AO

HART are 7.0 inches (178 millimeters) wide by 9.79 inches (249 millimeters) long
A lock lever that

indicates
whether the
module is
properly locked
on the baseplate
All Tri-GP I/O modules have the same

dimensions, which are:
Height = 8.65 inches (220 mm)
Width = 1.75 inches (44 mm)
PASS
FAULT
ACTIVE
MODE
REMOTE
RUN
PROGRAM
Alarm Indicators
Depth = 6.65 inches (169 mm)
9.00 in.
229 mm
(MP, CIM, CM, HART AI, and HART AO Baseplates)
The Tri-GP faultmonitoring circuitry

is able to detect and
signal an alarm for
all single faults and
most multiple
faults. The
following alarm
indicators are on the
front panel of each
MP:
HALT
ALARMS
FIELD POWER
LOGIC POWER
SYSTEM ALARM
PROGRAM ALARM
OVER TEMPERATURE
LOCK
COMMUNICATIONS
IO BUS
The Field Power

alarm indicates
loss of field
power or faulty
field power
supply
9.79 in.
249 mm
8.55 in.
217 mm
SERIAL
TX
RX
TX
RX
LINK
TRISTATION
TX
RX
MP3101S2
The Logic Power

alarm indicates a MP Front Panel
missing or faulty
system power supply
The System Alarm indicates
problems with the application or
system integrity
1.25 in.
32 mm
7.00 in.
178 mm
(I/O Baseplates)
28
COMM BUS
TX
RX
The Program Alarm indicates

problems that are defined by the
user-written application
The Fault indicator identifies when

the processor has an internal fault.
The Over Temperature alarm indicates

when the module is over 183 F (84 C)
Other indicators on the MP include the

following:
System Status Indicators
Mode indicators (Remote, Run,

Program, and Halt) identify the
operating state of the entire Tri-GP
system.
The system status indicators identify

the processing state of the module. The
status indicators include the following:
The Pass indicator identifies when
the module is operating normally.
The Active indicator blinks once per
scan when executing an application.
Other Indicators
Communication indicators that

identify the type of communication
occurring
Physical Description
Each MP provides 16 megabytes of
DRAM for the user-written application,
sequence-of-events (SOE) and I/O
data, diagnostics, and communication
buffers.
The three MPs compare their respective
data during every scan using the
TriBus, a high-speed, fault-tolerant
inter-processor bus. The MPs communicate with the I/O modules over a
TMR HDLC I/O bus that operates at 2
megabits per second.
In addition to the TriStation 1131 and
Modbus ports and alarm connectors,
DSP1
Logic Power
Fuses
DSP2
Logic Power
and Alarm
Terminal Blocks
+
DSP3
FUSE
Fuses and Blown

Fuse Indicators
DSP4
FUSE
Modbus Ports
for Direct DCS
Connections
TriStation
Connectors
Debug
Connectors
MP Baseplate
Node
Address
MP Baseplate Connectors
29
the MP Baseplate provides redundant,
24-volt fused logic power connectors.
Logic power supplied here can operate
the MPs and carry to the I/O Baseplates
as well, so that no other logic power
supplies are needed for the column.
Communication Modules
The communication modules (CIMs
and CMs) are a one-to-one interface to
the MPs. The Tri-GP v2 and later CMs
and the Tri-GP v3 and later CIMs
enable communication with:
rable for Modbus point-to-point or

multi-point (network) connections.
Transmission rates up to 115 kilobits
per second per port can be selected.
100Base-TX twisted-pair connections

to convert the CIM network ports to
other Ethernet media types or to extend
network distances.
Network Ports
Each CIM Media Adapter provides two
network ports which are configured as
follows:
Two 100-megabit copper twisted pair
Ethernet ports each with an RJ-45
connector.
Two small form-factor pluggable (SFP)
slots that may be used in place of the
External host computers

Distributed control systems (DCS)
Open networks
Network printers
Other Tri-GP v2 or v3 and later
systems
NET 1
SFP
Tricon version 910 systems

A single Tri-GP controller can support
up to two CIMs or CMs on one Model
221S2 CIM Baseplate or one Model
2201S2CM Baseplate. Each CIM or
CM operates independently and
supports three RS-232 or RS-485 serial
ports and two Ethernet ports per
CIM/CM. Two CIMs or CMs can
provide redundant communication
connections or additional independent
communications ports.
NET 2
SFP
NET 1
RJ45
NET 2
RJ45
Serial ports
PASS
FAULT
ACTIVE
FIRMWARE
NETWORK
COMMUNICATIONS
SFP
LINK
NET 1
TX
RX
NET 2
SFP
LINK
TX
RX
NET 1
SFP
NETWORK
COMMUNICATIONS
SFP
LINK
NET 1
TX
RX
NET 2
NET 2
SFP
NET 1
RJ45
SFP
LINK
TX
RX
POWER
NET 2
RJ45
POWER
SERIAL 1
LOCK
SERIAL 1
LOCK
SERIAL 2
Module (CIM) Capabilities
Each CIM provides the following
communication capabilities, through
the CIM Media Adapter:
PASS
FAULT
ACTIVE
FIRMWARE
SERIAL 3
SERIAL 2
SERIAL
COMMUNICATIONS
TX
SERIAL 1
RX
SERIAL 2
TX
RX
SERIAL 2
TX
RX
SERIAL 3
TX
RX
SERIAL 3
TX
RX
DEBUG
CIM MEDIA ADAPTER
MA
SERIAL
COMMUNICATIONS
TX
SERIAL 1
RX
SYNCHRONIZATION
SYNC 1
SYNC 2
SERIAL 3
DEBUG
CIM MEDIA ADAPTER
MA
SYNCHRONIZATION
SYNC 1
SYNC 2
Network ports
Multiple protocol support
Serial Ports
Each CIM Media Adapter provides
three optically isolated RS-232 or RS485 serial ports that are user-configu-
30
Model 2211S2 CIM Baseplate with CIMs and Media Adapters
Supported Protocols
Each CIM serial port supports these
protocols:
Modbus master (RTU)
NET 1
SFP
NET 2
SFP
Each CIM network port supports these

protocols:
TSAA (UDP/IP)
TSAA with IP Multicast (UDP/IP)
TriStation 1131
NET 1
RJ45
NET 2
RJ45
POWER
Peer-to-Peer (UDP/IP)
PASS
FAULT
ACTIVE
FIRMWARE
NETWORK
COMMUNICATIONS
SFP
LINK
NET 1
TX
RX
Modbus master or slave (TCP)

Triconex Time Synchronization via
UDP/IP
NET 2
SNTP Triconex Time

Synchronization
SFP
LINK
TX
RX
JetDirect Network Printer Server

TCP/IP
SERIAL 1
Enhanced Peer-to-Peer
LOCK
OPC UA
SERIAL 2
NOTE
The Tri-GP CIM supports a maximum
of 16 Modbus TCP ports.
SERIAL 3
DEBUG
SERIAL
COMMUNICATIONS
TX
SERIAL 1
RX
SERIAL 2
TX
RX
SERIAL 3
TX
RX
CIM MEDIA ADAPTER
MA 2211-100S2
CIM Media Adapter

Front Panel
SYNCHRONIZATION
SYNC 1
SYNC 2
3211S1
CIM Front Panel
31
Communication Module (CM)
Capabilities
Each CM provides the following
communication capabilities:
Serial ports
Network ports
Multiple protocol support
Serial Ports
Each CM provides three optically
isolated RS-232 or RS-485 serial ports
which are user-configurable for
Modbus point-to-point or multi-point
(network) connections.
Transmission rates up to 115 kilobits
per second per port can be selected.
Network Ports
Each CM provides two network ports
which are configured as follows:
One 10-megabit Ethernet port, with the
following connectors:
10BaseT
CM Baseplate Connectors
Attachment unit interface (AUI) for

a 10-megabit media adapter unit
(MAU)
Each CM network port supports these

protocols:
One 100-megabit Ethernet port, with

the following connectors:
TSAA with IP Multicast (UDP/IP)
TSAA (UDP/IP)
100BaseTX
TriStation 1131
Media independent interface (MII)

for a 100-megabit MAU
Peer-to-Peer (UDP/IP)
Media adapter units may be used in

place of the 10/100 BaseT RJ-45
twisted-pair connections to convert the
CM network ports to other Ethernet
media types or to extend network
distances.
Modbus Master or Slave (TCP)
Supported Protocols
JetDirect Network Printer Server

TCP/I
Each CM serial port supports these

protocols:
Modbus master (RTU)
32
Peer-to-Peer (DLC)

UDP/IP
SNTP Triconex Time
Synchronization
NOTE
The Tri-GP CM supports a maximum of
four Modbus TCP ports.
Each CM Net1 network port supports

DLC.
Logic Power for CIMs and CMs

Logic power for CIMs and CMs is supplied by the MP Baseplate, as described in the following table.
Feature
Specification
Nominal input voltage
24 VDC
Specified operational voltage range
24 VDC 15% or +20% + 5% AC ripple

(19.2 to 30 VDC)
CIM logic power (without SFPs)

100 Mb SGMII type Media Adapter (SFP)
11.5 W maximum
1.0 Watt per SFP
CM logic power (without MAUs)

10 Mb AUI type MAU
100 Mb MII type MAU
8 W maximum
6 W maximum additional per MAU
3.75 W maximum additional per MAU
Absolute maximum input voltage
33 VDC
Absolute maximum reverse input voltage
0.6 VDC
Input power interruption time from nominal value

Repetition rate
CIM: 10 ms maximum
CM: 1 ms maximum
1 sec minimum
Reverse current isolation input to input
500 A maximum
Inrush current per input
2.4 A maximum, typically 1.2 A for 50 ms
Short circuit current limit per input
2.4 A maximum
Functional earth to logic ground isolation
0 V, no isolation
Protective earth to functional earth isolation
500 VDC
CM +12 V AUI output power
12 V 10%, 6 W maximum, current limited
CM +5 V MII output power
5 V 5%, 3.75 W maximum, current limited
33
Common Features for
I/O Modules and Baseplates
depending on which module is in

control.
The Digital Input (DI) Module and

Baseplate shown below serve as examples for all of the Tri-GP I/O modules
and baseplates whose appearance is
similar. The following pages provide
detailed specifications for all of the I/O
modules and baseplates.
All types of I/O modules support a hotspare module. Each module is mechanically keyed to prevent improper installation in a configured baseplate.
Each I/O module occupies one of two

slots on the baseplate that constitute an
I/O set. The left module occupies the
slot below the L label on the baseplate and the right module occupies the
slot below the R label. At any time,
the status of either the left or right
module can be active or hot-spare
The maximum operating temperature

for all types of I/O modules is 158 F
(70 C) ambient.
Each I/O Baseplate includes one I/O

Interconnect Assembly, one Slot Cover,
and one Terminal Cover.
For most types of I/O Baseplates, the
wiring for field devices is connected
directly to terminals on the baseplate,
which are compression terminals that
are compatible with 24 to 12
(0.2 mm2 to 3.3 mm2) AWG wiring.
PASS
FAULT
ACTIVE
FIELD PWR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
LOCK
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
DI 3301S2
24v
DI Front Panel
DI Baseplate
34
Common Specifications for All I/O Modules

The following tables identify the logic and field power specifications for all I/O modules.
Logic Power
Feature
Specification
24 VDC
Voltage range
24 VDC 15% or +20% +5% AC ripple (+19.2 to +30 VDC)
Logic power
<3 W
33 VDC
0.6 VDC
Input power interruption time from nominal
1 ms maximum
Power interruption interval
1 sec minimum
Reverse current isolation input to input
500 A maximum
Inrush current per input
2.4 A maximum
Short circuit current limit per input
2.4 A maximum
Functional earth to logic ground isolation
0 V, no isolation
Protective earth to functional earth isolation
500 VDC, minimum
Field Power
Feature
Specification
Nominal field voltage
24 VDC
24 VDC 15% or +20% +5% AC ripple (+19.2 to +30 VDC)a
Power
See module specifications
33 VDC
0.6 VDC
Input power interruption time from nominal
Not applicable
Power interruption interval
Not applicable
Reverse current isolation
500 A maximum
Functional earth to protective earth isolation
500 VDC, minimum
Functional earth to functional earth (logic ground) isolation
800 VDC, minimum
a.For the PI Module, the voltage range is configurable in TriStation 1131 software.
35
Analog Input Module
Each TMR Analog Input Module has
three isolated sets of electronics, called
channels, which independently process
field data input to the module. Each
channel places the processed data in an
array and transmits this array, on
request, to the MP associated with that
channel. The MPs vote the data before
passing it to the application. In TMR
mode, the data passed is mid-value. In
dual mode, the data passed is the
average.
AI Modules include complete, ongoing
diagnostics for each channel. If the
diagnostics detect a failure on any
fault, not a complete module failure. AI
Modules are guaranteed to operate
properly in the presence of a single fault
and may continue to operate properly

with multiple faults.
AI Modules support a hot-spare
module. Each AI Module is mechanically keyed to prevent improper installation in a configured baseplate.
The Model 3351S2 AI Module can be
used with these baseplates:
Model 23512351S2, which is used
in typical 4-20 mA applications.
AI External Termination Baseplate,
which is used with the Model 9764510F RTD/TC/AI External
Termination Panel or the Model
9792-310F AI Hazardous Location
External Termination Panel.
Model 2354S2, which is used in 420 mA applications and enables
communication between HART
field devices and Configuration and
Asset Management Software
running on a PC.
Model 3351S2 Analog Input Module Specifications
36
Feature
Specification
Points
32, commoned
Nominal input current
420 mA DC
Specified operational current range
222 mA DC
Absolute maximum field voltage
33 VDC
Absolute maximum reverse field voltage
0.6 VDC
Absolute maximum input current
50 mA DC
Input bandwidth (3dB)
16 Hz
Source impedance
180
Input impedance (with baseplate)
250
I to V resistor
100 0.01%
Resolution
12 bits
Absolute error
0.15% of full scale (20 mA)
Diagnostic
Force-to-value diagnostic (FVD)
Scan time
< 1 ms for all 32 points
Functional earth to protective earth isolation
500 VDC, minimum
Functional earth to functional earth (logic) isolation
800 VDC, minimum
Model 2354AS2, which is used in 420 mA applications in hazardous

locations and enables
running on a PC.
Model 3361S2 Analog Input/Digital Input Module Specifications

Features Common to all Points
Specification
Points
32, commoned
(16 DI, points 116; 16 AI, points
1732)
Functional earth to protective earth

isolation
500 VDC, minimum
Functional earth to functional earth (logic)

isolation
800 VDC, minimum
Features of AI Points
Specification
Nominal input current
420 mA DC
Specified operational current range
222 mA DC
Absolute maximum field voltage
33 VDC
Absolute maximum reverse field voltage
0.6 VDC
Absolute maximum input current
50 mA DC
Input bandwidth (3dB)
16 Hz
Source impedance
180
Input impedance (with baseplate)
250
I to V resistor
100 0.01%
Resolution
12 bits
Absolute error
0.15% of full scale (20 mA)
Diagnostic
Force-to-value diagnostic (FVD)
Scan time
< 1 ms for all 32 points
Features of DI Points
Specification
024 VDC
Operational voltage range
1530 VDC
33 VDC
0.6 VDC
Input Delay
< 10 ms, On to Off, Off to On
Input impedance
> 100 k without baseplate

~ 3 k with baseplate
Input power
0.2 W/pt, @ 24 VDC

0.5 W/pt, @ 33 VDC
Input threshold
05 VDC = Off region

614 VDC = transition region
1530 VDC = On region
Diagnostic (loss of view)
Force-to-value diagnostic (FVD),

< 2 ms/test
Maximum input toggle rate to maintain

diagnostic fault coverage
< 20/sec
FVD Off state glitch

Duration
Magnitude
Output impedance
< 2 ms
36% test voltage
05 VDC, 100 k
ADC scan time
< 1 ms for all DI points

Module
The Analog Input/Digital Input Module
has 16 digital input points (116) and
16 analog input points (1732).
The AI/DI Module has three isolated
sets of electronics, called channels,
which independently process field data
input to the module. Sensing of each
input point is performed in a manner
that prevents a single failure on one
For analog input points, each channel
receives variable voltage signals from
each point, converts them to digital
values, and transmits the values to the
three MPs on demand.
For digital input points, an ASIC on
each channel scans each input point,
compiles data, and transmits it to the
MPs upon demand.
For all points, the MPs vote the data
before passing it to the control
program. In TMR mode, the data
passed is mid-value. In dual mode, the
data passed is the average.
AI/DI Modules sustain complete,
AI/DI Modules are guaranteed to
operate properly in the presence of a
single fault and may continue to operate
properly with multiple faults.
Analog Input/Digital Input Modules
include the hot-spare feature which
allows online replacement of a faulty
module. The AI/DI Module is mechanically keyed to prevent improper installation in a configured baseplate.
The Model 3361S2 AI/DI Module is
compatible with the Model 2361S2
AI/DI Baseplate and the AI/DI External
Termination Baseplate.
37
Analog Output Modules
Each TMR Analog Output Module has
channels, which independently accept
channel. The channels provide input to
voter circuitry to select a single channel
to drive the output. Special circuitry is
used to ensure that the channels that are
not driving the output are shunted so
they cannot affect the output.
AO Modules include complete,
AO Modules are guaranteed to operate
AO Modules support a hot-spare

module. Each AO Module is mechanically keyed to prevent improper installation in a configured baseplate.
The Model 3481S2 AO Module can be
used with these baseplates:
Termination Panel in hazardous

locations.
The Model 3482S2 High-Current AO
Module is compatible with only the
Model 2481S2 Analog Output Baseplate.
Model 2481S2, which is used in

typical applications.
Model 2483S2, which enables
running on a PC.
Model 2483AS2, which is used in
hazardous locations and enables
running on a PC.
AO External Termination Baseplate,
which is used with the
Model 9863-610F External
Analog Output Module Specifications

Model Number
3481S2
3482S2
Points
4, commoned-return, DC-coupled
4, commoned-return, DC-coupled
Isolated points
None
None
Output current range
440 mA output, controlled

420 mA output, controlled
1.3242.68 mA over-range
0.6621.34 mA over-range
0.66 mA output capability (step function < 2 mA) 1.32 mA output capability (step function <4 mA)a
Output accuracy
<0.25% (in range of 420 mA) of FSR (022

mA), from 32 F to 158 F (0 C to 70 C)
< 0.25% (in range of 440 mA) of FSR

(044 mA), from 32 F to 122 F (0 C to 50 C)a
Type
TMR
TMR
Resolution
12 bits
12 bits
Diagnostic
Forced-switch diagnostic (FSD)
Forced-switch diagnostic (FSD)
External loop power (reverse

voltage-protected)
32 VDC, maximum
24 VDC, nominal
32 VDC, maximum
24 VDC, nominal
Output loop power requirements

for specified load
300 @ >16 VDC (1 A minimum)


340 @ >28 VDC (1 A minimum)a
Over-range protection
36 VDC, continuous
0 VDC, continuous
36 VDC, continuous
0 VDC, continuous
Switch time on leg failure
1 ms, typical
3 ms, maximum
1 ms, typical
3 ms, maximum
a.This specification applies to points 3 and 4. The specification for points 1 and 2 is the same as for Model 3481S2
38
Digital Input Modules

Each TMR Digital Input Module has
channels, which independently process
field data to the module. Each channel
places the processed data in an array
and transmits this array, on request, to
the MP associated with that channel.
The MPs vote on the data before
passing it to the application.
DI Modules include complete, ongoing

The DI Module continuously verifies
the ability of the system to detect transitions to the opposite state. DI
lution of one millisecond or less and

with an accuracy of one millisecond or
less.
DI Modules support a hot-spare

module. Each DI Module is mechanically keyed to prevent improper installation in a configured baseplate.
DI External Termination Baseplate,

which is used with the Solid State
Relay Input External Termination
Panel in high-voltage applications,
or the Model 9573-610F DI
Hazardous Location External
Termination Panel.
The Model 3311S2 DI Module reports

Sequence of Events (SOE) with a reso-
The Model 3301S2 and 3311S2 DI

Modules can be used with these baseplates:
Model 2301S2, which is used with
Digital Input Module Specifications

Model Number
3301S2
3311S2
Points
32, commoned
32, commoned
24 VDC
24 VDC
19.230 VDC
19.230 VDC
33 VDC
33 VDC
0.6 VDC
0.6 VDC
Input delay
ON to OFF or OFF to ON
Time constant = 2.86 msec, - 3dB @ 55 Hz
ON to OFF or OFF to ON
Time constant = 0.13 msec, - 3dB @ 1.2 kHz
Input impedance
>30 k, without baseplate

3 k, with baseplate
>30 k, without baseplate

3 k, with baseplate
Input power
0.2 W/pt, @ 24 VDC

0.5 W/pt, @ 33 VDC
0.2 W/pt, @ 24 VDC

0.5 W/pt, @ 33 VDC
Input threshold
05 VDC = Off region

05 VDC = Off region

Diagnostic (loss of view)

<2 ms/test

<2 ms/test
Force-to-trigger diagnostic (FTD),
<2 ms/test
Maximum input toggle rate to maintain

diagnostic fault coverage
<20/sec
<20/sec
FVD Off state glitch

Duration
Magnitude
Output Impedance
<2 ms
36% test voltage
05 VDC, 100 k
<2 ms
36% test voltage
05 VDC, 100 k
ADC scan time
<1 ms for all 32 points
<1 ms for all 32 points

isolation
500 VDC, minimum
500 VDC, minimum
Functional earth to functional earth (logic

ground) isolation
800 VDC, minimum
800 VDC, minimum
39
Digital Output Modules
Quad Voter circuitry has multiple

redundancy on all critical signal paths,
availability.
Each TMR Digital Output Module has

channels, which independently accept
channel. The channels use the patented
Quad Voter circuitry to vote on individual output signals as they are applied
to the load.
This voter circuitry is based on parallelseries paths which pass power if two
out of three switches (channels A and
B, or channels B and C, or channels A
and C) command them to close. The
For each point, the DO Module periodically executes the Output Voter Diagnostic (OVD) routine. To allow
unrestricted safe operation under a
variety of multiple-fault scenarios,
OVD detects and alarms these types of
faults:
Pointsall stuck-on and stuck-offs
are detected.
Switchesall stuck-on or stuck-off

switches or their associated drive
circuitry are detected.
DO Modules include complete,
DO Modules are guaranteed to operate
with certain multiple faults.
Digital Output Module Specifications

Model Number
3401S2
3411S2
Points
16, commoned
16, commoned
Nominal output voltage
24 VDC
24 VDC
19 to 30 VDC
19 to 30 VDC
Absolute maximum output voltage
33 VDC
45 VDC
Absolute maximum reverse input

voltage
0.6 VDC
0.6 VDC
Minimum required field load
n/a
30 mA
<4.8 A, self-limiting
3.0 A, typical
700 mA maximum, self limiting
<4.8 A, self-limiting
3.0 A, typical
700 mA maximum, self limiting
(See the Planning and Installation Guide for
Triconex General Purpose v2-v3 Systems for
extended carry current limits and conditions.)
Field alarms
Loss of field power, output point shorted On or

Off
Loss of field power, output point shorted On or

Off
Loop-back thresholds
05 VDC = Off region

05 VDC = Off region

Leakage to load (Off state)
<1 mA
<1 mA
Diagnostic glitch duration
<2 ms, maximum

500 s, typical
<2 ms, maximum

500 s, typical
Diagnostic fault coverage

Maximum toggle rate
Minimum toggle rate
>20 ms
Not applicable
>20 ms
Not applicable
On state voltage drop
<1.0 VDC @ 1.5 A
<1.6 VDC @ 1.6 A
Loop-back scan time
<1.0 ms for all 16 points
<8.0 ms for all 16 points

isolation
500 VDC, minimum
500 VDC, minimum
Functional earth to functional earth

(logic) isolation
800 VDC, minimum
800 VDC, minimum
Output current
Switching
Carry
40
DO Modules support a hot-spare

module. Each DO Module is mechanically keyed to prevent improper installation in a configured baseplate.
These baseplates can be used with the
Model 3401S2 DO Module:
Model 2401S2, which is used with
Model 2401LS2, which is used with
low-current applications where
integral current limiting is required.
Each output is provided with a
180 ohm series resistor.
DO External Termination Baseplate,
which is used with the Relay Output
External Termination Panel in highvoltage applications, or the Model
9671-610F DO Hazardous Location
These baseplates can be used with the
Model 3411S2 DO Module:
Model 2401HS2, which is
recommended for use with highcurrent power loads.
DO External Termination Baseplate,
which is used with the Relay Output
External Termination Panel in highvoltage applications, or the Model
9671-610F DO Hazardous Location
Pulse Input Modules

Each TMR Pulse Input Module has
channels, which independently receive
voltage transitions from each point and
converts the transitions to frequency
(RPM) data. Each channel places the
processed data in an array and transmits
the array, on request, to the MP associated with that channel. The MPs vote
the data before passing it to the application.
The six sensitive, high-frequency
inputs can be individually configured
for non-amplified and amplified
magnetic speed sensors which are
common on rotating equipment, such as
turbines or compressors. The module is
capable of counting over 32,000 transitions per second.
The PI Module senses voltage transitions from the speed sensors, samples
every input transition, and measures
time to optimize the number of input
gear pulses. To ensure correct data for
each scan, one value is selected using a
mid-value selection algorithm. Sensing
of each input point is designed to
prevent a single failure on one channel
from affecting another channel. The
resulting count and time are used to
generate a frequency (revolutions per
minute), which is transmitted to the
Main Processors.
to any type of waveform distortion that

could result in erroneous measurements. Consequently, ringing on the
input signal can result in many additional transitions being counted.
PI Modules include complete, ongoing
fault, not a complete module failure. PI
The Model 3382S2 PI Module enables
the controller to provide better control
response by providing the control
program with an accurate measurement
of angular acceleration. This can reduce
the response time of the controller to
one or two scan times.
PI Modules support a hot-spare
module. Each PI Module is mechanically keyed to prevent improper installation in a configured baseplate.
The Model 3382S2 PI Module is
compatible with the Model 2381S2 PI
Baseplate and the Model 2381AS2 PI
Hazardous Location Baseplate.
The type of speed sensor typically used

with the PI Module consists of an
inductive coil and rotating teeth. The
sensor is physically close to the teeth of
a gear on the rotating shaft. The output
frequency is proportional to the rotational speed of the shaft and the number
of teeth. As the teeth move past the
sensor, the resulting change in the
magnetic field causes a sinusoidal
signal to be induced in the sensor.
Although the circuitry is designed for
high-frequency operation with debounced edge detection, it is sensitive
41
Pulse Input Module Specifications
Model
3382S2
Points
Input type
Differential: channel-isolated
Single-ended: commoned ground
Sensor compatibility
Magnetic, active, open collector
Maximum operating voltage
33 VDC
Minimum operating voltage

Differential
500 mV P-P, 2 Hz to 32,000 Hz

1 V P-P, 0.5 Hz to 2 Hz
1 V P-P, 2 Hz to 32,000 Hz
2 V P-P, 0.5 Hz to 2 Hz
Single-ended
Speed range
n/a
c
Input frequency range
0.5 Hz to 32 kHz
Duty cycle
20% to 80%, or 10 s minimum pulse width (positive and negative)
Maximum continuous slew rate

Maximum continuous RPM slew rate
n/a
Number of gear teeth per point (programmable) 1255a

Termination resistor
Pull-up resistor
Baseplate configurable
Baseplate configurable
Resolution
n/a
b
Absolute error of input frequency
0.01%, 2,000 to 32,000 Hz

0.1%, 0.5 to 2,000 Hz
Absolute error
n/a
Maximum acceleration rate
4,000 Hz/sec
Absolute error of acceleration (Hz/sec)b
< 0.01 times the numeric value of the input frequency when the frequency range is
3kHz32 kHz
Maximum jerk rate
500,000 Hz/sec2
2 b
Absolute error of jerk (Hz/sec )
< 2.5 times the numeric value of the input frequency when the frequency range is 3
kHz32 kHz
Measurement algorithm
Gear multiple tracking
Diagnostic
Precision frequency reference test
Scan update rate
<32 ms
Functional-to-protective-earth isolation
500 VDC, minimum
Functional-to -functional-earth (logic) isolation
800 VDC, minimum
a.Absolute error of speed, acceleration, and jerk, may exceed the specified values if the number of gear teeth per point G is not within the range of
255 > n*G >= 240, where n is an integer.
b.Absolute error of speed, acceleration, and jerk, does not include error introduced by the field device. The reporting of speed acceleration and jerk is susceptible
to noise and inaccuracies in the gear manufacturing (tooth-tooth spacing)
c. For input frequencies of 32 Hz or greater, the scan update rate is less than 32 ms. However, for input frequencies of less than 32 Hz, the scan update rate is
the period of the input frequency.
42

Module
Each Solid-State Relay Output Module
has three isolated sets of electronics,
called channels, which independently
accept data from the MP associated with
each channel. The channels provide input
to a voter circuit which uses the voted
value to drive the coil of the relay. The
output portion of this module is Simplex.
The SRO Module is a non-triplicated
module for use on non-critical points
which are not compatible with high-side,
solid-state output switches; for example,
interfacing with annunciator panels. The
SRO Module receives output signals
from the MPs on each of three channels.
The three sets of signals are voted and the
voted data is used to drive the 32 individual relays. Each output has a loopback circuit which verifies the operation
of each relay switch independently of the
presence of a load. Ongoing diagnostics
test the operational status of the SRO
Module.
SRO Modules include complete, ongoing

diagnostics for each channel. If the diagnostics detect a failure on any channel,
the Fault indicator turns on and activates
the system alarm. The Fault indicator
identifies a channel fault, not a complete
module failure. SRO Modules are guaranteed to operate properly in the presence of a single fault and may continue to
operate properly with multiple faults.
SRO Modules support a hot-spare
module. Each SRO Module is mechanically keyed to prevent improper installation in a configured baseplate.
The Model 3451S2 SRO Module is
compatible with the Model 2451S2 SRO
Baseplate.
Model 3451S2 Solid-State Relay Output Module Specifications

Feature
Specification
Points
32, commoned in pairs
24 V
30 V
Maximum switching voltage
33 V peak
Maximum switching power
15 W resistive
Maximum off-state leakage
<100 A
Maximum nominal current
0.5 A per channel
Maximum over current
0.7 A per channel
Voltage drop at baseplate
<0.25 V @ 0.5 A
Fuses, mounted on baseplate
1 per output, 0.75 A, fast-acting

isolation
500 VDC, minimum
Functional earth to functional earth (logic)

isolation
800 VDC, minimum
43
I/O Extender Module Kits
I/O Extender Module Kits are used to:
Carry I/O messages from one I/O
column to another
Provide logic power terminals for
each I/O column
You must connect 24 volt logic power
sources to every I/O column by using an
I/O Extender Module or an MP Baseplate.
Connectors for
I/O Bus Cables
Each I/O Extender Module Kit includes:

Two I/O Extender Modules
Three two-foot I/O Bus Cables
One I/O or MP Interconnect
Assembly
The main components on an I/O
Extender Module are:
Logic Power
Terminals
I/O Extender Module
Two 24-volt logic power input

terminal blocks, each with fuse and
blown-fuse indicators
A protective earth (safety ground)
terminal
Three DB-9-pin I/O bus connectors,
one per channel
In a typical Tri-GP system, a maximum
of eight baseplates may be connected
end-to-end in an I/O column. To extend a
system beyond eight baseplates or to
distribute the baseplates into multiple I/O
columns, I/O Extender Modules and I/O
Bus Cables are used, as shown on the
figure at the right.
I/O Bus Cables
An I/O bus cable is required for each
TMR channel and is terminated at each
end by a male DB-9-pin connector.
Various cable lengths are available.
If the I/O bus is longer than 20 feet (6
meters), the bus should be terminated by
adding an I/O Bus Terminator Kit to both
open ends of the system. The maximum
allowable I/O bus length is 650 feet (200
meters).
44
Two I/O Extender Modules Linked by I/O Bus Cables
Interconnect Assemblies
Tri-GP baseplates within a single I/O
column are connected by Interconnect
Assemblies that carry I/O messages and
logic power across the baseplates. The
MP Interconnect is connected to an I/O
Baseplate, and the I/O Interconnects are
connected to other I/O Baseplates.
I/O Interconnect
Assembly
MP Interconnect
Assembly
Top End Cap
Bottom End Cap
End Caps for I/O Baseplate/I/O Extender Module
Physically, an MP Interconnect
Assembly consists of a small passive
PCB in a molded plastic housing with
two DIN-C 96-pin male connectors. The
assembly is attached to the top or bottom
of an MP Baseplate in order to connect
adjacent I/O Baseplates. The MP Interconnect Assembly also is used on AI and
AO HART Baseplates because they are
the same size as MP Baseplates.
Physically, an I/O Interconnect
Assembly consists of a small passive
PCB in a molded plastic housing with
two DIN-C 96-pin male connectors. The
assembly is attached to the top or bottom
of an I/O Baseplate in order to connect
other I/O Baseplates.
Bottom End Cap
Top End Cap
End Caps for MP Baseplate
The following accessories are required to

protect Tri-GP components from dust,
liquids and corrosive atmospheres:
End caps
Terminal covers
Slot covers
End caps protect the top and bottom of
each end-of-column baseplate and serve
as a card guide. They are available for
both MP Baseplates and I/O Baseplates.
Slot
Cover
Terminal
Cover
Terminal covers protect any terminals on

a baseplate that are not connected to field
wiring.
Slot covers protect unused baseplate
slots.
45
Notes
The Tri-GPs Main Processor and Communication Modules support

Modbus, Ethernet, Peer-to-Peer, and TriStation 1131 protocols.
Communication Capabilities
The Tri-GP controller provides stateof-the-art communication capabilities
through communication ports on the
CIM, CM, and MP. Ports on the MP
support TriStation 1131 and Modbus
slave protocol. Ports on the CIM and
CM support TriStation 1131, TSAA
client/server (DDE Server and OPC
UA Server or OPC Server), Peer-toPeer, Time Synchronization, JetDirect
printing, and Modbus master/slave
protocols.
Depending on application requirements, the Tri-GP controller can
communicate with the following:
OPC UA clients (using a CIM) or
OPC Server for Triconex (using a
CM)
Any Modbus master, including DCS
from Foxboro, Honeywell, ABB,
Bailey, Fisher-Rosemount and
Yokogawa
A PC running TriStation 1131
software through the TriStation 1131
(Ethernet) protocol
Other Triconex controllers through
the Triconex Peer-to-Peer protocol
External devices using TSAA which
is a Triconex master/slave protocol
used by devices on an Ethernet
network
TSAA Client/Server Protocol
Triconex System Access Application is
a master/slave protocol that allows an
external device acting as a master to
communicate with one or more Tri-GP
controllers. Typically, a client/server
workstation connects to a DCS client
using TSAA protocol to access point
data in the Tri-GP controller. DDE
Tri-GP Communication Capabilities

Type of Connection
MP Only
One CIM/CM
Two CIM/CMs
Tri-GP as Modbus Slave
3 serial ports
3 serial ports
6 serial ports
Tri-GP as Modbus Master
not available
3 serial ports
6 serial ports
Tri-GP as Modbus Master/Slave
not available
3 serial ports
6 serial ports
Tri-GP as Modbus Master or

Slave using TCPa
not available
2 Ethernet ports
4 Ethernet ports
TriStation 1131 communication

using serial connection
not available
1 serial portb
2 serial portsb
TriStation 1131 communication

using TCP/IP protocol
3 Ethernet
ports
2 Ethernet ports
4 Ethernet ports
TSAA Client/Server or TSAA

Client/Server with IP Multicast
communication
not available
2 Ethernet ports
4 Ethernet ports
OPC UA (CIM) or OPC (CM)
not available
2 Ethernet ports
4 Ethernet ports
Peer-to-Peer communication
for one network of Triconex
controllers onlyusing
UDP/IPc or DLCd
not available
2 Ethernet ports
4 Ethernet ports

via DLCe
not available
1 Ethernet portf
2 Ethernet portsf

using UDP/IP or SNTP Triconex
Time Synchronization
not available
2 Ethernet ports
4 Ethernet ports
HP JetDirect Printing
not available
2 Ethernet ports
4 Ethernet ports
a.Maximum of 16 Modbus TCP ports on CIM; maximum of 4 on CM.

b.Serial 3 only.
c.NET1 or NET2 can be configured for Peer-to-Peer using UDP/IP, but not both at the same time.
d.CM only.
e.CM only.
f.NET1 only.
Server, OPC UA Server, and OPC

Server for Triconex use TSAA.
OPC UA Server
Object Linking and Embedding (OLE)
for Process Control Unified Architecture (OPC UA) is a standard set of nonproprietary interfaces used to develop
client/server programs. CIMs have an
embedded OPC UA Server, which
allows read and write access to Tri-GP

input, output, and memory variables,
and system attributes. OPC UA clients
that conform to the Data Access (DA)
version 1.0.1 standard and the Alarms
and Events (A&E) version 1.10 standard can communicate with a Tri-GP
controller through the embedded OPC
UA Server on the CIM.
47
Communication Capabilities
OPC Server for Triconex
OPC Server for Triconex is an OPCcompliant product, available from
Matrikon that runs on a PC. OPC
Server for Triconex allows read and
write access to Tri-GP input, output,
and memory variables, and system
attributes through the CM. OPC clients
that conform to OPC version 2.0 for
Data Access and version 1.0 for Alarms
and Events Handler can communicate
with a Tri-GP through the OPC Server
for Triconex.
For more information on OPC Server
for Triconex and OPC client applications, see the Matrikon website at
www.matrikon.com.
DDE Server for Triconex
Triconex DDE Server is a Windowsbased application that enables DDEcompliant clients to read and, if
allowed, to write data to a Triconex
control program. A client can read
input, output, and memory variables,
and system attributes.
Client applications use DDE (Dynamic
Data Exchange) protocol to communicate with a DDE Server. Any Windows
application that supports DDE
protocolsuch as Microsoft Excel
can use Triconex DDE Server. Triconex
DDE Server communicates with one or
more Triconex controllers through
TSAA protocol. To return data to
clients, the DDE server uses DDE
protocol. For detailed Windows version
compatibility information, see the
Product Release Notice for Triconex
DDE Server v4.1-v4.3.0, available on
the Global Customer Support (GCS)
website.
Modbus Communication
Modbus is an industry-standard
master/slave protocol that is traditionally used for energy management,
transfer line control, pipeline monitoring, and other industrial processes.
A Tri-GP controller can operate as a
Modbus master, slave, or both. A DCS
48
Serial Port Specifications

Mode
RTU
MP
CIM/CM
ASCII
RS-232
RS-485
Master
Slave
Point-to-Point
Multi-drop
software must be installed on a PC that

is running Windows and is connected to
a CIM, CM, or MP port on the Tri-GP
controller. For detailed Windows
version compatibility information, see
the Product Release Notice for TriStation v4.x, available on the Global
Customer Support (GCS) website.
TriStation 1131 software is compliant
with the IEC 61131 International Standard for Programmable Controllers.
Peer-to-Peer
typically acts as the master while the

Tri-GP controller acts as the slave. The
master can also be an operator workstation or any general-purpose computer
programmed to support Modbus
devices. Serial ports on the MP, and
serial ports and network ports on the
CIM and CM, support Modbus communication.
Triconex Peer-to-Peer protocol allows

Triconex General Purpose, Trident, and
Tricon controllers in a closed network
to exchange a limited amount of
process control data. The controllers in
a Peer-to-Peer network can be timesynchronized with the master node (the
controller with the lowest node
number). Peer-to-Peer protocol
supports a maximum of 31 Triconex
controllers.
TriStation 1131 Communication
Upgrades to Flash ROM
TriStation 1131 protocol uses TCP/IP

for CIM and CM ports, and DLC for
MP ports on Tri-GP systems earlier
than version 3.0, to enable communication between a PC running TriStation
1131 software and a Tri-GP controller.
TriStation 1131 Developers Workbench is used to develop, download,
operate, and monitor projects for the
Tri-GP controller. The TriStation 1131
The CIM and CM firmware stored in

the Flash ROM can be upgraded by
connecting an Ethernet port to a PC that
is running the Triconex Firmware
Manager.
Communication Interfaces
Interface
MP
CIM
CM
Modbus Serial Port (RS-232/RS-485)
Ethernet Port (10BaseT IEEE 802.3)
Ethernet Port (100BaseT IEEE 802.3)
Ethernet Port (10BaseT/100BaseTX Auto-negotiable IEEE

802.3)
Attachment unit interface (AUI) for MAU
Media independent interface (MII) for MAU
Reduced Gigabit Media Independent Interface (RGMII)

Copper or Serial Gigabit Media Independent Interface
(SGMII) Fiber for Media Adapter
Debug port
Easy-to-use developer's workbench allow you to develop, test and

document process-control applications for the Tri-GP Controller
TriStation 1131 Developers Workbench

TriStation 1131 Developer's Workbench is an integrated tool for developing, testing, and documenting safety
and critical-process control applications for the Tri-GP controller. The
programming methodology, user interface and self-documentation capabilities make the system superior to
traditional and competing engineering
tools.
This table identifies the compatibility
of Tri-GP and TriStation 1131 software
versions.
Functional Overview
TriStation 1131 software provides three
editors which support these IEC 611313 languages:
Function Block Diagram
Ladder Diagram
Structured Text
An optional Triconex programming
language, CEMPLE (Cause and Effect
Matrix Programming Language Editor)
supports the widely used Cause and
Effect Matrix (CEM) methodology.
TriStation 1131 software allows you to:
TriStation 1131
Software
Tri-GP
System
4.8.0
2.1.x
Create programs, functions, and

function blocks
4.9.0
2.1.x
Define the controller configuration
4.10.0
3.0.x
Declare tagnames
Test applications in an emulator
TriStation 1131 software is compliant

with Part 3 of the IEC 61131 International Standard for Programmable
Controllers, which defines programming languages.
Features in TriStation 1131

v4.11.0
TriStation 1131 version 4.11.0 is a significant release that includes the following
new features:
Integration with Wonderware
ArchestrA System Platform 2014
and Foxboro Evo Control Software
(FCS), which allows you to launch
TriStation 1131 from both these
platforms via the command-line
interface.
Introduction of the Triconex Single
Logon service, which allows you to
log back on to a TriStation 1131
project without re-entering your user
name and password, if your logon
attempt is within 10 minutes of
closing the project.
Download and monitor applications
The TriStation 1131 v4.11.0 and later

software supports the following
Windows operating systems:
Windows 7 Professional/Enterprise
(32-bit and 64-bit)
Windows Server 2008 R2 (64-bit)
For detailed version compatibility
information, see the Product Release
Notice for TriStation 1131 v4.x, available on the Global Customer Support
(GCS) website.
Example of TriStation 1131 v4.x Software Interface
49

Several other minor fixes and
enhancements.
Enhanced Diagnostic
Monitor
The Enhanced Diagnostic Monitor is
an application which monitors the
hardware health of Triconex
controllers and allows users to
effectively troubleshoot the safety
system during maintenance.
For more information on the
Enhanced Diagnostic Monitor, see the
online Help or printed guide included
with the Enhanced Diagnostic
Monitor.
Elements of a TriStation 1131

Project
A TriStation 1131 project contains all
of the elements required to implement
a safety or control application in a
Triconex controller. Some of these
elements are automatically included in
every project by TriStation 1131, while
others are user-created.
Programs
A program is the highest-level executable logic element in a TriStation 1131
project. It is an assembly of programming language elements (functions,
function blocks, and data variables) that
work together to allow a programmable
control system to achieve control of a
machine or a process. Each program is
uniquely identified by a user-defined
type name. A TriStation 1131 project
can include hundreds of programs.
Functions
A function is a logic element which
yields exactly one result. Unlike a function block, the data associated with a
function is not retained from one evaluation of the function to the next. Functions do not have to be instanced.
50
Sample Logic in FBD, ST and LD Languages
Function Blocks
A function block is a logic element
which yields one or more results. To
use a function block in a program, an
instance of the function block type must
first be declared. Each instance is identified by a user-defined instance name.
All of the data associated with a
specific instance of a function block is
retained from one evaluation of the
function block to the next.
Data Types
A data type defines the size and characteristics of variables declared in a
program, function or function block.
Data types used by TriStation 1131
software include discrete (BOOL),
analog (DINT), and real (REAL).
Libraries
TriStation 1131 software includes
libraries of pre-defined functions, function blocks, and data types that can be
used in a project.
TriStation 1131 software includes these

libraries:
IEC 61131-3 Standard Library a
set of functions and function blocks
defined by the IEC 61131-3 Standard
Triconex Library a set of Triconex
functions and function blocks that
can be used with any Triconex
programmable controller
Tricon Library a set of functions
and function blocks that are specifically for use with the Tricon
controller
In addition to the pre-defined libraries,
you can also develop your own libraries
of project elements. These libraries can
include programs, functions, function
blocks, and data types which can be
imported to other TriStation 1131 projects.
Programming Languages
these programming languages: Function Block Diagram, Structured Text,
and Ladder Diagram. An optional
language, CEMPLE, can be
purchased separately.
Function Block Diagram (FBD)
Function Block Diagram is a graphical language that corresponds to
circuit diagrams. FBD elements
appear as blocks that are wired
together to form circuits. The wires
transfer binary and other types of data
between elements.
Structured Text (ST)
Structure Text is a high-level, textual
programming language that is similar
to PASCAL. Structured Text allows
Boolean and arithmetic expressions,
and programming structures such as
conditional (IFTHENELSE) statements. Functions and function blocks
can be invoked in Structured Text.
In TriStation 1131 v4.0 software, these
structures were added: arrays, structures, For Loop and Exit statements,
CASE statement, enumerated data
types, var-external, and var-temp variables.
Sample CEM from a TriStation 1131 Project
Ladder Diagram (LD)

Ladder Diagram is a graphical
language that uses a standard set of
symbols for representing relay logic.
The basic elements are coils and
contacts which are connected by links.
Links are different from the wires in
FBD in that they transfer only binary
data between the elements.
Cause and Effect Matrix

Programming Language Editor
(CEMPLE)
CEMPLE is a high-level graphical
language that provides a two-dimensional matrix in which you can associate a problem in a process with one or
more corrective actions. The problem is
referred to as the cause and the action as
the effect. The matrix associates a cause
with an effect in the intersection of the
cause row and the effect column.
CEMPLE is the first automated implementation of CEM, a methodology that
is commonly used throughout the
process-control industry and readily
understood by a broad range of plant
personnel. CEM diagrams are automatically translated into IEC 61131-3
compliant Function Block Diagrams,
thereby eliminating the risks associated
with manual translation from handdrawn CEMs.
Controller Configuration
Declaring Tagnames in a Program
In TriStation 1131 software, the

controller configuration identifies the
modules in the system, communication
settings, memory allocation for
tagnames, and operating parameters.
51

Password Security
TriStation 1131 software provides a
security system that defines users and
their privileges with regard to editing,
library changes, state changes and
other operations.
Project History
An audit trail function is provided to
document the history of a project and
its program version changes. This
detailed log keeps track of user actions
and comments by automatically timestamping critical events within a
session and manually logging user
comments on demand.
Annotations
Emulator Panel
These configuration settings are

included in the application that is
downloaded to the controller.
Emulator Panel
The Emulator Panel allows you to
connect to an emulator, download the
control program, and test and debug the
control program. The panel lists the
programs, variables, and tagnames in
the control program. Testing can be
done by dragging variables and
tagnames from the list to the monitor
panel and changing the values as
desired. You can specify commands to
run the control program without intervention, to run in single-step, or to halt
the execution.
Controller Panel
The Controller Panel allows connection
to the controller for real-time execution
of the application.
52
TriStation 1131 Interface

Options
TriStation 1131 software allows you to
specify options to be used in the interface. For example, you can specify the
drawing colors used in the programming editors, and editor options such as
double-spacing between function block
terminals. You can also specify the
directory location for files.
Annotations can be added to constants,

tagnames, and variables An annotation
can be used to display descriptive text,
including information specified in
system and user-modifiable macros.
You can also display the value of a variable during program execution.
Comments
Comments can be added to programs,
functions, and function blocks to add
information about the operations.
Reports and Documentation
Help Documentation

multiple methods of sorting data and
documenting project elements, both
during and after project development.
Printouts of user-developed function
blocks and programs can be obtained
on a variety of user-selected engineering drawing templates.
TriStation 1131 software features an

online Help system which provides
detailed information about the software.
Standard reports are available to document the project configuration data.

You can also create customized reports
with Crystal Reports.
CEMPLE is the Triconex automated implementation of the

traditional CEM methodology that has been used by process
control engineers for decades.
CEM Programming Language Editor

Cause and Effect Matrix (CEM) is a
methodology that is commonly used in
the process control industry to define
alarms, emergency shutdown strategies, and mitigation actions. For
decades, process control engineers
have used manual methods such as
graph paper and spreadsheet programs
to identify problem conditions and
corrective actions.
Automated CEM
Called CEMPLE
The traditional CEM method is timeconsuming and subject to errors caused
by misinterpretation of the matrix or
inaccurate coding. Invensys has automated the CEM process with the Cause
and Effect Matrix Programming
Language Editor, referred to as
CEMPLE.
Customized view monitoring of

active causes, intersections, and
effects
Multiple levels of undo and redo
editing
CEM Editor
The CEM Editor includes the following
components as shown in the figure
below:
Matrix
FBD Network
Variable Detail Table
Matrix
As the major component of the CEM
Editor, the Matrix identifies the parts of
associated with causes, effects, and
intersections. The Matrix can also
include functions or function blocks
related to causes, effects, and intersections.
FBD Network
The FBD Network displays the Function Block Diagram (FBD) related to
the cause, intersection, or effect that is
selected in the matrix. It can also be
used to specify properties and to invert
values for variables.
The FBD network uses internal boolean
variables to save and move results to
Matrix rows and columns
CEMPLE enables a cause and

effect matrix to be used as the
basis for a TriStation 1131
program.
CEMPLE Features
CEMPLE includes the following
features:
Ability to specify up to 99
causes, 99 effects, and 1,000
intersections
Ability to invoke functions and
function blocks to evaluate
cause, intersection, and effect
states
Automatic conversion of
matrix to Function Block
Diagram language
FBD Network
CEM Editor Components
53
CEM Programming Language Editor

User-created functions and
function blocks, must be
created and enabled for use
before they can be included in a
matrix.
Testing and Monitoring

Like all TriStation 1131
programs, a matrix can be
tested and debugged offline
using the Emulator Control
Panel. After the project is
downloaded, the Control Panel
can be used to monitor the
values of variables during realtime execution.
In an instance view of a matrix,
active causes, intersections,
and effects can be viewed in a
choice of colors.
Instance View of a Matrix
associated cells so that causes and

effects can be evaluated. For each
cause, effect, and intersection, an
internal variable is automatically
created to store and move results
between cells.
The Variable Detail Table displays the
inputs and outputs of the FBD Network
that are generated when a cause, effect,
or intersection is selected.
The variable type and data type can also
be specified from the Variable Detail
Table.
Developing a Matrix
A matrix created in CEMPLE can be as
basic or complex as the situation
requires. In a basic matrix, causes are
identified as true or false inputs related
to one or more effects through the intersections between them. The state of a
cause (true or false) determines the
54
state of the related effect. If more than

one cause is related to an effect, the
state of the effect is based on how the
matrix is evaluated.
The effect state can be determined in
either of two ways: by a logical AND
operation or by a logical OR operation
on the intersection. A logical AND is
typically used for de-energize to trip
systems; a logical OR is typically used
for energize to trip systems.
Using Functions and

Function Blocks
For more complex processes, CEMPLE
enables functions and function blocks
to be added to causes, effects, and intersections. This feature can be used for
many purposes, such as; evaluation of
process input to determine the cause
state, calculating one or more process
variable values based on the state of an
effect, and using time delays.
As with other types of executable elements, values and variables can be set for use during
emulation and real-time execution.
CEMPLE Tools
A matrix can be developed and edited
using a variety of graphical interface
methods. Commands can be selected
from a main menu, toolbar, and pop-up
menu.
Variables can be added or renamed by
making changes in the Variable Detail
Table. Where appropriate, drop-down
lists provide variable names or function
and function block names to be
selected.
For more information, see the TriStation 1131 Developers Guide.
During each scan of the TriStation 1131 project, the Main Processors
examine selected discrete variables for state changes known as events.
Sequence of Events (SOE) Capability

Triconex systems support the ability to
report, by exception, events that are
significant in your application. This
capability, called Sequence of Events
(SOE), includes the following parts:
Defining the discrete data items to
be monitored through the TriStation
1131 application
Monitoring and collecting events by
the Triconex controller
Retrieving the events from the
Triconex controller using a host
system
The following host systems can be used
to retrieve event data:
Triconex SOE Recorder, a
Windows-based application
Preparing Your System for

Event Collection
The following tasks are completed in

the TriStation 1131 software:
To enable the controller to detect

events, event variables and SOE blocks
are identified in the TriStation 1131
project. In addition, the project must
include an SOE function block that
starts the event collection.
Defining SOE blocks
After an SOE-enabled project is downloaded to the controller, TriStation 1131

software creates an SOE definition file
that contains the SOE block definitions.
Types of Event Variables
When the SOE Recorder collects an

event from the controller, it obtains the
tagname, alias, state name, and other
information about the event variable
from the SOE definition file.
When using the OPC UA Server

embedded on the CIM, an OPC UA
client application
Triconex Controller
Adding SOE function blocks to the

program logic
The types of discrete variables that can

be designated as event variables
include BOOL input and BOOL aliased
memory variables.
Configuring SOE Blocks

An SOE block is a data structure that
resides in the memory of a controllers
CIM
CIM
NET1
NET1
NET2
Triconex Controller
Triconex Controller
CIM
When using an external OPC Server

with a CM, an OPC client
application
Assigning event variables to the

SOE blocks
With SOE Recorder you can:

Collect and analyze event data
Export event data to dBASE IV files
MP
MP
MP
Print reports with event data

The SOE data file, which is output from
TriStation 1131 software, is only for
use with the Triconex SOE Recorder
program. This file is read by the SOE
Recorder program and adds descriptive
information which is associated with
the tagname in the Configuration file in
a TriStation 1131 project.
To DCS
PC Running TriStation 1131 Software
PC Running SOE Software
Tri-GP Network with SOE Recorder
55
Sequence of Events (SOE) Capability

MPs. When SOE blocks are configured, the event variables to be detected
by the controller are specified for each
block.
The maximum individual block size is
20,000 events, with 60,000 events for
all blocks. The block size is the amount
of memory that the MPs reserve for
recording of events.
When a block is collecting events, the
MPs write an event entry which
includes the values of event variables
that changed during the current scan
and a time stamp.
SOE Events File
SOE Function Blocks

SOE function blocks control and verify
event collection for SOE blocks. The
following function blocks are available:
SOESTRT starts event collection
SOESTOP stops event collection
SOESTAT checks status of SOE
blocks
events that cover specific periods of

time before or after trips have occurred
can also be saved. SOE Recorder
allows you to:
snapshot. This snapshot is a file of

events that occurred x minutes before a
trip and y minutes after a trip, based on
TriStation 1131 settings.
Find events and copy them to

Windows-based applications
and Time Stamps
Filter and sort saved event data
In a typical Peer-to-Peer network, the

controllers synchronize their time with
the master node (the controller with the
lowest node number) within 25 milliseconds. A controller recognizes
events on a scan basis and time-stamps
each event at the beginning of the scan.
SOECLR clears status of SOE

blocks
Specify the display of point

properties for event data
The SOESTRT function block must be

added to the TriStation 1131 program
to identify the SOE blocks from which
events are to be collected. The other
SOE function blocks are optional.
View the properties of individual

events
SOE Recorder
SOE Recorder can simultaneously
collect event data from as many as 31
networked controllers. It queries all the
controllers on the network to determine
which downloaded TriStation 1131
projects include SOE blocks. If a
project includes one or more SOE
blocks, then SOE Recorder opens the
appropriate SOE definition file and
begins collecting events from the associated controller.
While the TriStation 1131 project is
running, SOE Recorder can be used to
analyze events online as it collects them
from the controllers. Snapshots of
56
SOE Recorder also allows event data to

be exported to dBASEIV or ASCII text
files, either manually or automatically.
A report engine and standard report are
included.
Trip Processing
A trip is a shutdown of the controlled
process, or a portion of the controlled
process. A TriStation 1131 project used
for safety shutdown typically includes
one trip variable, whose state change
initiates the shutdown activities. If a
project requires several variables
related to trip conditions, these variables must be evaluated in combination
to determine the final state of the trip
variable.
When a trip event occurs, SOE
Recorder can automatically create a trip
Because the scans of the various

controllers on the network are not
synchronized, the same event can be
logged by two controllers with
different time stamps. The worst-case
difference is the longer scan time plus
25 milliseconds.
Each day, SOE Recorder compares its
clock with the clock of each controller
from which event data is being
collected. If a controllers clock is out
of sync by more than five minutes, a
message is displayed in the SOE
message bar.
For more information about SOE
Recorder, see the SOE Recorder Users
Guide.
Triconex Safety View ABM allows you to monitor and manage

safety alarms and bypasses.
Safety View ABM

Triconex Safety View Alarm and
Bypass Management (ABM) is part of
the Triconex Safety View suite of applications. Safety View ABM is used to
monitor and acknowledge safety
alarms, and bypass tagnames. The
safety alarms are generated from field
devices connected to the safety controllers, and represent conditions impacting
the safety of the equipment under
control. Safety View ABM also
displays the current alarm state and
process condition for all configured
tagnames, and displays bypassed
tagnames. The user interface, configurability, and bypass capabilities make
Safety View ABM superior to traditional safety monitoring tools.
Safety View ABM is TV-approved for
use with SIL3 safety systems per IEC
61508 and IEC 61511. Safety View
ABM can be used with the following
Triconex controllers:
Tricon 10.x and later systems
Trident 3.x and later systems
Triconex General Purpose (Tri-GP)
3.x and later systems
Safety View ABM 1.1.0 supports the
following Windows operating systems:
Windows 7 Professional SP1
(Standard 32-bit or 64-bit)
Windows Server 2008 R2 SP1
(Standard 64-bit)
Functional Overview
Safety View ABM depends on the
implementation of process alarms in the
safety controller using TriStation 1131.
Safety View ABM supports alarm
states and sequences as defined in the
ISA 18.1 - 2004 (R)-Annunciator
Sequences and Specifications standard.
Safety View ABM allows you to:
Configure tagnames for alarm
monitoring
Monitor alarms generated from
controllers
Retrieve alarm-related data from up
to 254 controllers simultaneously,
across multiple Safety View ABM
networks (a maximum of 62
controllers per network)
Safety View ABM is comprised of
several components, including the
following:
Configuration Component: The
Safety View Configuration
Component allows you to add,
delete, update, import, and export
configuration settings for
controllers, users, tagnames, alarms,
and monitoring workstations. Once
configuration is complete, you
deploy the Alarm Monitoring
Application to the monitoring
workstations.
Safety View Server: The Safety
View server manages
communication with the controller,
the Safety View database, and the
Alarm Monitoring Application. The
server sends commands from the
Alarm Monitoring Application to

the controller for processing and to
the database for storage. The server
also retrieves alarm and process
condition information continuously
from the configured controllers and
displays the collected information in
the Alarm Monitoring Application
even when no user is logged on.
Safety View Database: The Safety
View database stores configuration
information, alarm state data, and
security information from the
Configuration Component, the
Alarm Monitoring Application, and
the controllers.
Alarm Monitoring Application:
The Alarm Monitoring Application
is a managed InTouch application
that is deployed to monitoring
workstations via the Configuration
Component. It allows you to
perform a number of alarm
management functions.
HMI Designer: The Safety View
HMI Designer allows you to
customize the layout of the Alarm
Monitoring Application. You can
drag the objects you want in your
layout onto the canvas and then
define the object properties such as
position, size, and color.
The Safety View ABM components are
installed on designated PCs or servers
in the supervisory network. The
Invensys ArchestrA framework maintains the Safety View ABM components and serves as the underlying
infrastructure that supports Safety View
ABM.
57
Safety View ABM

Alarm Monitoring Application
Features
The Safety View ABM Alarm Monitoring Application allows a plant operator to view, manage, and bypass
tagnames and safety alarms. It continually updates alarm states and process
conditions even when an operator is not
logged in; user authentication is
required to perform most operations.
The Shift Change functionality re-activates all alarms acknowledged by an
operator during the previous work shift.
All user actions are maintained in an
audit trail log.
The Safety View ABM Alarm Monitoring Application allows you to:
Acknowledge active alarms
(individually, or all alarms at once)
Silence the audio for active and
ringback alarms
Clear first-out alarms
Reset ringback alarms
Disable and enable alarms (not
available when using the Modbus
protocol)
Example of the Alarm Monitoring Application Interface
View process value tagnames

associated with an alarm or LoE
Initiate or revoke an action command

using a General Purpose (GP) button
(not available when using the
Modbus protocol)
Acknowledge bypassed tagnames

(when using the Custom layout)
Bypass tagnames grouped under

lines of equipment (LoEs) and safety
instrumented functions (SIFs)
Re-activate alarms acknowledged

by an operator during the previous
work shift
Unbypass tagnames
Print audit trail records
Manage notes for bypassed tagnames
Configuration Component
Features
The Safety View ABM Configuration
Component is an ArchestrA object that
is accessed from the ArchestrA IDE. It
allows you to configure the following:
Safety controllers
Users, roles, and security
permissions
Monitoring workstations and their
corresponding displays
Areas, lines of equipment (LoEs),
safety instrumented functions
(SIFs), alarms, and general purpose
(GP) buttons
Alarm colors and sounds
Audit trail network printer
Example of the Configuration Component Interface
58
HMI Designer Features

The Safety View HMI Designer allows
you to customize the screen layout of
the Alarm Monitoring Application and
to perform some configuration tasks
that can also be performed using the
Safety View Configuration Component.
The HMI Designer can be used to
customize the following:
Screen layout
Colors and names of the alarm states
and process condition values
Appearance of the alarm and GP
button faceplates
The HMI Designer can be used to
configure the following:
Example of the HMI Designer Interface
Controllers
Areas, LoEs, SIFs, alarms, and GP
buttons
Monitoring workstations and
associated monitors
Assign sounds to the various alarm
conditions and add command
buttons to your interface
59
Notes
Glossary
The symbol which represents ohm.
The symbol which represents micro.
A
Abbreviation for amp.
alias
A five-digit number which identifies the data type and
hardware address of a point in the Triconex controller.
Alias is a convention of Modbus which is a communication protocol available with Triconex communication
modules.
ASIC
Stands for Application Specific Integrated Circuit.
availability
The probability that the control system is operational at
some instant of time.
ATEX
Stands for Atomsphres Explosibles and refers to the
European Union Directive 94/9/EC, which is one of a
number of approach directives developed by the
European Union and covers all equipment and protective
systems intended for use in potentially explosive atmospheres
bin
An address range of aliased variables in Triconex
controllers, based on Class and Type combinations.
board
See module.
card
See module.
cause
In CEM methodology, a cause is a problem to be solved
by the matrix.
CEM
Stands for Cause and Effect Matrix which is a twodimensional matrix for the development of safety applications. In this type of matrix, causes are represented by
rows and effects are represented by columns.
CE Mark
A type of certification by the European Union which
ensures the electro-magnetic compatibility of Triconex
controllers with other pieces of electrical and electronic
equipment.
CEMPLE
A language editor in the TriStation 1131 Developer's
Workbench that allows you to develop CEMs for safety
shutdown applications.
communication modules
Modules that enable the Triconex controllers to communicate with host computers. Invensys offers communication modules with Ethernet and serial protocol.
configuration
In TriStation 1131 software, the modules and settings
used in a Triconex controller, including MPs, communication and I/O modules, field termination panels, and
memory and module settings.
control program
In TriStation 1131 software, a control program is the
compiled code (built from program elements and configuration information) that is downloaded to and runs in a
Triconex controller.
control system
The system which governs the operation of plant,
machinery or other equipment by producing appropriate
instructions in response to input signals.
controller
A Triconex controller includes MPs, communication and
I/O modules, and field termination devices.
DCS
Stands for distributed control system, which is a system
that controls a process and provides status information to
an operator.
61
Glossary
DDE
Stands for Dynamic Data Exchange (DDE) which is an
interprocess communication mechanism provided by
Microsoft Windows. Applications running under
Windows can use DDE to send and receive data and
instructions to and from each other.
HART
Highway Addressable Remote Transducer protocol is a
bi-directional industrial field communication protocol
used to communicate between intelligent field instruments and host systems over 420 mA instrumentation
wiring.
debug
The act of locating and correcting faults: 1) one of the
normal operations in software development such as
editing, compiling, debugging, loading, and verifying; or
2) the identification and isolation of a faulty physical
component, including its replacement or repair to return
the PLC to operational status.
host
See external host.
effect
In CEM methodology, an effect is an action that must be
taken to solve a cause (problem).
IEEE
Stands for the Institute of Electrical and Electronics Engineers (IEEE) which is a professional society for engineers.
event
A state change of a discrete aliased variable which has
been designated for event logging. An event occurs when
a variable changes from the normal state to another state.
event logger
A utility that logs, displays and prints critical events in
real time, based on state changes of discrete variables in
the user-written application. Proper use of an event logger
warns users about dangerous conditions and printouts of
events can help identify the sequence of events that led to
a trip.
event variable
A discrete memory variable or discrete input point that
has been assigned to an SOE block.
fault tolerance
The ability to identify and compensate for failed control
system elements and allow repair while continuing an
assigned task without process interruption. Fault tolerance is achieved by incorporating redundancy and fault
masking.
FBD
Stands for Function Block Diagram which is a graphical
programming language that corresponds to circuit
diagrams. Used for connective programming, FBD
programs are structured by groups of interconnected
elements (networks), allowing the integration of function
and function blocks.
62
hot-spare
A unique feature of Triconex controllers which allows
spare I/O modules to be installed with automatic switch
to the spare in case the primary module fails.
IEC 61131-3
The part of the IEC 61131 standard for programmable
controllers that specifies the syntax and semantics of a
unified suite of programming languages for programmable controllers.
input poll time
The time required by the Triconex controller to collect
input data from the controlled process. Input polling is
asynchronous and overlaps execution of the user-written
application.
instance view
In TriStation 1131 software, the Emulator Control Panel
and Triconex Control Panel displays the values of annotated variables while a TriStation 1131 project is running.
In an instance view, you can change the values of variables during emulation or real-time execution.
intermittent fault
A fault or error that is only occasionally present due to
unstable hardware or varying software states.
intersection
In CEMPLE, a cell in a matrix where a cause row intersects an effect column.
intersection function
In CEMPLE, a function or function block that can be
selected from a list in the Intersection cell of a cause row
and an effect row.
Glossary
ISO
Stands for the International Organization for Standardization (ISO) which is a worldwide federation of national
standards bodies (ISO member bodies) that promulgates
standards affecting international commerce and communications.
LD
Stands for Ladder Diagram, which is a graphical
programming language that uses a set of symbols to
represent relay logic. Modules are defined by their
connection to a left and right power rail.
logical slot
A logical slot includes two physical slots, which can
house a primary module and a hot spare module.
m
MTTR
Stands for Mean Time To Repair which is the expected
time to repair a failed system or subsystem. Usually
expressed in hours.
node
Any of the machines on a network. In this document,
node usually means a Triconex controller.
node number
The physical address of a node.
OPC
Stands for OLE for Process Control which is a standard
set of non-proprietary interfaces used to develop
client/server programs. OPC supports interoperability
between field devices and applications for process
control, factory automation, and business.
Abbreviation for milli.

Markov model
A generalized modeling technique which can be used to
represent a system with an arbitrary number of modules,
failure events, and repair events. A Markov model can be
mathematically solved to produce a resultant probability.
matrix
1. A CEM program
2. A traditional methodology for ESD applications which
associates a problem (cause) in a process with one or
more actions (effects) that must be taken to correct the
problem.
OPC UA
Stands for OLE for Process Control Unified Architecture, which is the next generation OPC standard that
provides a cohesive, secure, and reliable cross-platform
framework for access to real time data and events.
open network
A network to which an external host can be connected.
output poll time
The time required by the Triconex controller to implement the outputs generated by the user-written application in response to inputs from the controlled process.
module
An active field-replaceable unit consisting of an electronic circuit assembly housed in a metal spine. Also
called board or card.
Peer-to-Peer
A protocol that allow multiple Triconex controllers on a
proprietary network to exchange limited amounts of
process and safety information.
MTBF
Stands for Mean Time Between Failure which is the
expected average time between failures of a system,
including the time taken to repair the system. Usually
expressed in hours.
program
1. The set of instructions, commands, and/or directions
that define the Triconex controllers output signals in
terms of input signals.
2. The act of creating such a set of instructions using the
relay ladder language of the TriStation 1131 programming system.
MTTF
Stands for Mean Time To Failure which is the expected
average time to a system failure in a population of identical systems. Usually expressed in hours.
protocol
A set of rules describing the format used for data
exchange between two entities.
63
Glossary
reliability
The probability that no failure of the system will have
occurred in a given period of time.
scan time
The period of the Triconex controllers cycle of required
control functions. Scan time is composed of three
elements:
Input poll time (asynchronous with execution of the
user-written application)
The time required to execute the user-written
application
Output poll time
ST
Stands for Structured Text, which is a high-level
programming language used for complex arithmetic
calculations and procedures that are not easily expressed
in graphical languages.
system
Consists of a set of components which interact under the
control of a design.
TCP/IP
Stands for Transmission Control Protocol/Internet
Protocol (TCP/IP) which are protocols for the Transport
and Network layers of the OSI network model. TCP/IP
provides reliable, sequenced data delivery.
A Triconex protocol used to establish and maintain a
synchronized, network-wide time basis. Time can be
synchronized with the master node in a network of
Tricon, Triconex General Purpose, or Trident controllers,
with a distributed control system (DCS), or with an OPC
client/server application.
transient fault
A fault or error resulting from a temporary environmental
condition.
64
TMR
Stands for Triple-Modular Redundant architecture, which
allows Triconex controllers to achieve fault tolerance.
The complete system is triplicated; each of the three identical systems is called a leg. Each leg independently
executes the user-written application in parallel with the
other legs.
trip
A safety-related shutdown of the controlled process or a
portion of the controlled process.
TriStation 1131
A Windows-based application for developing and downloading user-written applications and for performing
maintenance and diagnostics.
TriStation 1131 protocol
A master/slave protocol used by a TriStation 1131 application for communication with the Triconex controllers.
TV Rheinland
TV stands for Technischer berwachungs-Verein
which translates to Technical Supervisory Association. In
Germany, TV Rheinland is an authorized technical
inspection agency for a wide variety of products,
processes, installations, plants and equipment.
UDP/IP
Stands for User Datagram Protocol/Internet Protocol
(UDP/IP) which are protocols for the Transport and
Network layers of the OSI network model. UDP/IP
provides best-effort datagram delivery.
voting
A mechanism whereby each leg of a TMR system
compares and corrects the data in each leg using a twoout-of-three majority voting scheme.

Technical Product Guide For Tri-GP v3 Systems PDF

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Technical Product Guide For Tri-GP v3 Systems PDF

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Technical Product Guide

Triconex General Purpose v3 Systems

Part No. 9791040-004

The Tri-GP controller is state-of-the art and provides fault tolerance

Tri-GP System Mounted on a Panel

Setting up applications is simplified

tors at a single wiring terminal and

What are Typical UserCreated Applications?

What is TriStation 1131

Each day Tri-GP systems supply

Emergency Safety Shutdown

What about Communication

The Tri-GP controller is designed with a fully triplicated

Each I/O Baseplate supports two

Main Processor Module

The MPs switch control between the

A dedicated I/O control processor on

If a fault is detected on the active

Every Tri-GP system contains three

The I/O control processor polls the

Once per scan, the MPs

Main Processor Architecture

the voting process. The input table in

application in parallel with the neighboring MP and generates a table of

If a disagreement occurs, the signal

Using the table of output values, the I/O

The MPs send the corrected data to the

A failure of one power source does not

flash EPROM and loaded in DRAM for

Each MP provides 16 megabytes of

Bus and Power Distribution

The triplicated I/O bus and redundant

The TriBus, which is local to the MP

An important feature of the Tri-GP

Transfers input, diagnostic and

I/O Bus and Logic Power Distribution

A triplicated I/O bus between the I/O

Isolation is provided between field and

Each column is typically limited to

On an Analog Input (AI) Module, each

Analog Input Module Typical Point (1 of 32)

Analog Input Module Schematic

Analog Input/Digital Input Module Typical Point (1 of 32)

The Analog Input/Digital Input

For analog input points, each channel

Each AI Module is guaranteed to

The AI/DI Module has three isolated

AI Modules continuously execute

Analog Input/Digital Input

Analog Input Module

For digital input points, an ASIC on

*On DI points only

Analog Input/Digital Input Module Schematic

For all points, the MPs vote the data

Module is mechanically keyed to

AO Modules continuously execute

Field Circuitry Typical Point (4)

Analog Output Modules Schematic

Digital Input Module Schematic

output signals just before they are

point is momentarily reversed on one of

Loop-back circuitry on the module

During Output Voter Diagnostic (OVD)