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3.Area defect
Grain boundaries
1.Point defect
Vacancy atoms
Interstitial atoms
Substitutional atoms
Point defect
Vacancy atoms
Interstitial atoms
Substitutional
atoms
vacancy defect
The equilibrium number of vacancies ND depend
1.
2.
3.
on
Temperature T
Activation energy QD
Total number of atomic sites
Example
the effect of temperature on the
vacancy concentration
Calculate the concentration of vacancies in copper
at room temperature (25oC). What temperature will
be needed to heat treat copper such that the
concentration of vacancies produced will be 1000
times more than the equilibrium concentration of
vacancies at room temperature? Assume that 20,000
cal are required to produce a mole of vacancies in
copper.
Impurities
impurity : addition of an atom of a different species than the
host or matrix
Example:
Example Defect does not necessarily imply a bad
thing
addition of C to Fe to make steel
addition of Cr to Fe for corrosion resistance
Alloys other types of atoms are deliberately added to give
the material certain properties
Example:
Example alloy of silver and copper (silver is highly corrosion
resistant but very soft
Copper enhance the strength of the silver.
Solid solution
Solid solution is a particular type of alloy
Two types: substitutional and interstitial
solvent the host material, usually the element or
compound
present in the greatest amount.
solute the minor phase, added to the solvent. Usually the
element or compound present in minor concentrations.
phase is a region of uniform composition or crystal structure
What would a solid solution look like?
Solid solution:
(1) random placement of
solute atoms
(2) metallic bonding
Intermetallic compound:
(1)Specific stoichiometry,
(2) Crystal structure is such that this
stoichiometry is allowed
(3)bonding is partially metallic and
partially covalent (or ionic)
Types of dislocation
Edge dislocation
Misalignment of atomic planes due
to the extra half plane
screw dislocation
Crystal is "cut halfway through and then
slide sideways
helical path through structure hence
screw.
Significance of dislocation
Dislocation is the main reason for plastic
deformation in materials.
Plastic deformation is due to the motion of a
large number of dislocations
Slipping system
Slip plane :planes where dislocation move
Slip directions :Within the slip planes there are
preferred crystallographic directions for
dislocation movement
Slip system:
system The set of slip planes and directions
constitute
The slip planes and directions are those of highest
packing density
BCC and FCC crystals have more slip systems as
compared to HCP,
Polycrystalline Materials
Most materials are
polycrystalline and are
made of many single
crystals
during solidification the
crystal nucleate and grow
from the liquid in a random
orientation
the grains impinge on each
other when the solidification
is complete
junction of grains are grain
boundaries
3.Surface defect
grain boundaries
Grain boundaries:
are boundaries between crystals.
are produced by the solidification process, for example.
have a change in crystal orientation across them.
impede dislocation motion.
grain
boundaries
heat
flow
Plastic deformation
Plastic deformation
permeate deformation in
materials
Plastic deformation is due
to the motion of a large
number of dislocations.
Plastic Deformation of
Polycrystalline Materials
Plastic Deformation of
Polycrystalline Materials
Slip directions vary from crystal to crystal Some grains are
SUMMARY
Point, Line, and Area defects arise in solids.
The number and type of defects can be varied
and controlled.
Defects
affect material properties (e.g., grain
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