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DT questions

1.A device that converts a continuous physical quantity (usually voltage) to a digital number
that represents the quantity's amplitude is named as
1. ADC 2.DAC 3.both 4.None
2. AD converter is often referred to as an since it is used to encode signals for entry
in to a digital system 1.Encoding device 2.Decoding device 3.Both
4.None

3.ADC can be used in


1. digital voltmeters 2. cell phone 3. Thermocouples 4.All

4. Analog to Digital Conversion is a 2-Step Process, that is


1. Sampling and Holding 2. Quantizing and Encoding 3.Both
4.None

5. MTCS
1. Quantizing:- breaking down analog value in to a set of finite states
2. Encoding:- assigning a digital word or number to each state and matching it to the input
signal
3.Both are correct. 4.Both are incorrect

6.MTCS regarding improve the accuracy of A/D conversion


1. Increasing the resolution which improves the accuracy in measuring the amplitude of the
analog signal
2. Increasing the sampling rate which increases the maximum frequency that can be
measured.
3. Both are correct
4. Only 1 is correct.

7. Type of A/D Converters is


1. Binary Weighted Resistor 2. R-2R Ladder 3. Flash A/D Converter
4.All of the above

8.Advantages of Binary Weighted Resistor is/are


1.Simple Construction/Analysis 2.As in 1 and Fast
Conversion
3.As in 1Requires low switch resistances in transistors 4.All

9. Advantages of R-2R Ladder is/are


1. Only two resistor values (R and 2R) 2.As in 1 & Does not
require high precision resistors

3.As in 1 & Higher conversion speed than binary weighted DAC 4. All

10.MTCS
1. ESD is avoided by preventing the buildup of static electricity
2. As in (1)An ESDS and bodies within proximity of about one meter of the ESDS
should be grounded so that electrostatic charge is bled off.
3. As in (1)If it is possible for the ESDS and surrounding bodies to be grounded, then the ESDS
should be shielded within conductive package, thus preventing the buildup of electrical charge
around the ESDS, and any ESD is absorbed by the packaging
4.All

11.MTCS
1. To prevent ESD during shipment and storage, the power modules are placed in boxes with a
layer of conductive foam in contact with the pins,
2. As in (1) In order to protect the power modules against ESD.
3. As in (1) A label is placed on the box to inform that inside products are sensitive to ESD
4.All of the above are correct.

12.MTCS
1.Before open the boxes, place the boxes on an ESD protected workstation
2.As in (1)Unprotected employees may generate thousand of volts and can reduce the
performance or destroy the power module.
3. As in (1)The work surface of the table and the floor area are covered by a static dissipative
work surface
4.All of the above are correct.

13.MTCS
1.The wrist strap is the primary mean of controlling static charge on personnel.
2.As in (1)When the wrist strap is connected to ground, it keeps the employee near
ground potential.
3.As in (1)Because the employee and other grounded objects in the workstation are at the
different potential, there can be no hazardous discharge between them
4.All of the above are correct.

14.MTCS
1. The wrist strap must be worn against the skin.
2. The employee must not be connected directly to the ground, but must be connected through
a 1M resistor.
3. Each employee should test the wrist strap before use
4.All of the above are correct.

15.MTCS
1.Power modules devices may be pile up.
2.Humidity is an important factor for the generation of static charges
3.As in (2)A humid environment generates higher static charges than a dry environment which
generates low static charges
4.All the above are correct

16.Humidity between .is the best choice for an assembly area and for a storage area for
power module devices?
1. 40 and 60% 2. 50 and 60% 3. 50 and 70% 4. 30 and 60%

17.EIDS stands for


1.Electronic Instrument Digital Systems 2.Electrical Instrument Display Systems
3.Electronic Instrument Display Systems 4.Electrical Instrument Digital
Systems
18. Plasma panels (gas-discharge display) is example of
1.Emissive display 2.Non-Emissive display 3.Both are correct
4.Only 2 is correct.

19. Thin film electroluminescent (EL) display


1.Emissive display 2.Non-Emissive display 3.Both are correct
4.Only 2 is correct.

20. Liquid crystal device (LCD) flat panel


1. Emissive display 2.Non-Emissive display 3.Both are correct
4.Only 1 is correct.

21. The intensity of the beam is controlled by variation of the negative potential of the
cylindrical control grid surrounding the cathode. This electrode is called the
1. Modulator 2. De-modulator 3.Accelerometer 4.All

22.MTCS
1. When electrons strike the fluorescent screen, light is emitted
2.As in (1)The electron beam is deflected and modulated in a way which causes it to display an
image on the screen
3.As in (1)The image may represent electrical waveforms, pictures, echoes of aircraft detected
by radar, etc
4. All of the above are correct.
23.MTCS
1. An electron gun consists of a series of electrodes producing a narrow beam of high-velocity
electrons
2.As in(1) Electrons are released from the indirectly heated cathode
3.As in(1) The control grid has a hole in the front to allow passage of the electron beam

4.All of the above

24.MTCS.
1.Two or more electrodes at different potentials are used to focus the electron beam
2. The electrostatic field set up between the electrodes causes the beam to converge
3. The focusing effect is controlled by varying the potential of the focusing electrode
4.All of the above are correct.

25.MTCS
1. A light-emitting diode (LED) is a two-lead semiconductor light source
2. As in(1)It is a PN junction diode, which emits light when activated
3. As in(1)When a suitable voltage is applied to the leads, electrons are able to recombine
with electron holes within the device, releasing energy in the form of photons
4.All

26. ..is an optical phenomenon and electrical phenomenon in which a material emits light in
response to the passage of an electric current or to a strong electrical field.
1. Electroluminescence (EL) 2. Electric luminescence (EL) 3. Electro and eclectic
luminescence (EL) 4.none
27. .. is an example for Emissive display
(1) OLED (2) CRT (3) LCD (4) TFT

28. . .. is an example for Emissive display


(1) OLED (2) LED (3) LCD (4) TFT

29 . . . . .. is an example for Non-Emissive display


(1) OLED (2) LED (3) LCD (4) TFT

30. .. is a analog display device


(1) OLED (2) CRT (3) LCD (4) TFT

31is a digital display devices


(1) OLED (2) LED (3) CRT (4) TFT

32is a digital display devices


(1) OLED (2) LCD (3) CRT (4) TFT

33. The cathode ray tube is a..


(1) glass envelope (2) glass tube (3) evacuated glass envelope (4) none

34. In CRT, when .. Strike the fluorescent screen, light is emitted


(1) neutron (2) proton (3) electron (4) none

35. In CRT, when electrons strike the .. screen, light is emitted


(1) Fluorescent (2) display (3) anode (4) none

36. In CRT, when electrons strike the fluorescent screen, is emitted


(1) energy (2) photon (3) light (4) none

37. A consists of a series of electrodes producing a narrow beam of high-velocity


electrons.
(1) electron gun (2) picture tube (3) CRT (4) none

38. An electron gun consists of a series of producing a narrow beam of high-velocity


electrons.
(1) plates (2) conductors (3) electrodes (4) none

39. In electron gun, electrons are released from the .. heated cathode.
(1) directly (2) indirectley (3)BOTH (4) none

40. In electron gun, the intensity of the beam is controlled by variation of the negative potential
of the ..
(1) control grid (2) focusing plate (3) first anode (4) second anode

41. The screen of the CRT may be coated with aluminium on the inside and this coating is held
at potential
(1) earthing (2) cathode (3) anode (4) none
42. 89. CRTs are used as display unit in many aircrafts.
(1) radar (2) weather (3) weather radar (4) none

43. is a PN junction diode, which emits light when activated


(1) CRT (2) LED (3) LCD (4) TFT

44. LED is a which emits light when activated


(1) transistor(2) diode (3) PN junction diode (4) none

45. 95. An ESD event can occur when any charged conductor (including the human body)
discharges to .
(1) any device (2) electrical device
(3) Electrostatic Discharge Sensitive device (4) electronic device

46. ESD is avoided by . ESDS and bodies within proximity of about one meter.
(1) none (2) grounding (3) discharging (4) neutralizing

47. If it is not possible for the ESDS and surrounding bodies to be grounded, then the ESDS
should be within conductive package
(1) covered (2) enclosed (3) shielded (4) none

48. In ESD protective workstation, work surface of the table and the floor area are covered by a
static .. work surface.
(1) resistive (2) insulated (3) none (4) dissipative

49. All the static dissipative surfaces and the workstation must be connected to a point.
(1) common ground (2) ground (3) none (4) common

50. The is the primary means of controlling static charge on personnel.


(1) wrist strap (2) gloves (3) clothing (4) none

51. The personnel must not be connected directly to the ground, but must be connected
through
(1) insulator (2) resistor (3) capacitor (4) none

52. A . environment generates lower static charges.


(1) arid (2) dry (3) humid (4) none

53. The symbol means


(1) electrostatic sensitive device (2) ESD protected
(3) sensitive device(4) none

54. The symbol means


(1) electrostatic sensitive device (2) ESD protected
(3) sensitive device(4) none

55. Analog circuits uses ..signals in linear fashion


(1) small (2) larger (3) medium (4) very small

56. Analog circuits use small signals in. fashion


(1) linear (2) non linear (3) distinct 4) NOTA

57. Digital circuits uses .. signals in nonlinear fashion.


(1) small (2) larger (3) medium (4) very small

58. Digital circuits uses large signals in . fashion.


(1) linear (2) non linear (3) distinct 4) NOTA

59. Analog signals are..in nature.


(1) digital (2) discrete (3) continuous (4) non continuous

60. Digital signals represent only a finite number of values.


(1) continuous (2) analog (3) non continuous (4) discrete

61. Temperature, pressure, velocity and sound are example for .signals.
(1) digital (2) analog (3) continuous (4) non continuous

62. circuits and system can be used to process both analog and digital signal.
(1) digital (2) analog (3) continuous (4) non continuous

63. Record player is an . device, while a CD player is ..device.


(1) analog, digital (2) digital, analog (3) audio, video (4) None

64. An .. is a device that converts a continuous physical quantity to a digital number


that represents the quantity's amplitude.
(1) DAC (2) ADC (3) none

65.Analog to Digital Conversion is a ..Process


(1) two step (2) single (3) three step (4) four step

66. Faithful reproduction is only possible if the sampling rate is .higher than the highest
frequency of the signal.
(1) thrice (2) four times (3) five times (4) twice

67. Since a practical ADC cannot make an instantaneous conversion, an input circuit called
..is used to perform conversion task.
(1) Hold and sample (2) sample and hold
(3) Quantizing and Encoding (4) Encoding and Quantizing
68. The .was the world's first microprocessor introduced in 1971.
(1) 4004 (2) Intel 4004 (3) 4040 4) Intel 4040

69 are the parts of a microprocessor.


(1) arithmetic&logic unit,register (2) arithmetic&logic unit, control unit
(3) contol unit&register (4) arithmetic&logic unit, contol unit&register

70. ALU is a digital circuit that performs ..operations.


(1) control (2) arithmetic (3) arithmetic and logical 4) logical

71 is a group of memory elements that store a binary word.


(1) C.U (2) Register (3) ALU (4) RAM

72. An input circuit called a sample and hold in ADC uses a .. to store the analog voltage
at the input.
(1) transistor (2) resister (3) capacitor (4) inductor

73. Minimum .. rate should be at least twice the highest data frequency of the analog
signal.
(1) holding (2) sampling (3) encoding (4) quantizing

74. Partitioning the reference signal range into a number of discrete quanta, then matching the
input signal to the correct quantum is the process known as
(1) holding (2) sampling (3) encoding (4) quantizing
75. Assigning a unique digital code to each quantum, then allocating the digital code to the
input signal is the process known as
(1) holding (2) sampling (3) encoding (4) quantizing

76. A signal that can have only two discrete values is called a .signal.
(1) digital (2) analog (3) continuous (4) non continuous

77. data is a discrete representation, breaking the information up into separate


elements.
(1) digital (2) analog (3) continuous (4) non continuous

78. A microprocessor is a .. constructed on a single silicon chip.


(1) control unit (2) processing unit (3) logic unit (4) central processing unit
30. RAM is a ..memory
(1) non volatile (2) permanent (3) temperory (4) volatile

79. RAM is a ..memory


(1) primary (2) temperory (3) permanent (4) secondary

80. Microprocessor performs memory read/write and I/O read/write functions using
(1) Data bus (2) Address bus
(3) Control bus (4) Data bus, Address bus, Control bus

81. In microprocessor 8085 the data bus uses


(1) 4 lines (2) 8 lines (3) 16 lines (4) 32 lines

82. In microprocessor 8085 the data bus is


(1) bidirectional (2) unidirectional (3) multidirectional (4) none

83. In microprocessor 8085 the address bus is .


(1) bidirectional (2) unidirectional (3) multidirectional (4) none
84. In microprocessor 8085 the address bus is unidirectional and information flows from
..
(1) peripheral to microprocessor (2) ALU to peripheral
(3) peripheral to ALU (4) microprocessor to peripheral

85.The speed is the speed at which a microprocessor executes instructions.


(1) ALU (2) clock (3) CU (4) memory

86. Integrated circuit has increased due to lesser number of connections.


(1) reliailty (2) weight (3) volume (4) size

87. Integrated circuit has extremely small . due to the fabrication of various circuit
elements in a single chip of semi-conductor material.
(1) weight (2) size (3) reliability 4) power

88. Integrated circuit has weight and space requirement due to miniaturized circuit
(1) more (2) reliable (3) moderate (4) lesser

89. If any component in an IC goes out of order, ..


(1) it can be repaired (2) faulty component can be replaced
(3) whole IC to be replaced (4) none

90. In an IC, it is neither convenient nor economical to fabricate capacitances exceeding


(1) 35 pF (2) 300 pF (3) 30 pF (4) 33 pF

91. It is not possible to fabricate inductors and transformers on the surface of semi-conductor
chip.
(1) transistor (2) inductor (3) transformer (4) inductors and transformers

92. It is not possible to produce greater than ..power ICs.


(1) 10 W (2) 100 W (3) 20 W (4) 1000 W

93. In an IC, the SSI means .components.


(1) 1-20 (2) 20-40 (3) 1-10 (4) 30-40

94. In an IC, the MSI means .components.


(1) 10-200 (2) 20-100 (3) 30-100 (4) 30-400

95. In an IC, the LSI means .components.


(1) 100-2000 (2) 200-1000 (3) 100-1000 (4) 303-4000

96. In an IC, the VLSI means .components.


(1) 100-20000 (2) 2000-10000 (3) 3000-10000 (4) 1000-10000

97. In an IC, the SLSI means .components.


(1) 10000-100000 (2) 1000-100000 (3) 2000-100000 (4)1000-10000

98. A standard 7-segment LED display generally has .. input connections,


(1) seven (2) eight (3) nine (4) six
99. An IC has................. size.
(1) very large (2) large (3) extremely small(4) none

100. The multiplexer, is a circuit designed to switch one of several input lines through
to a single common output line by the application of a control signal.
(1) digital (2) analog (3) combinational logic (4) logic

101. Analog display devices are

1. Oscilloscope tubes 2.TV CRTs 3.LED 4.Only 1 & 2

102. Digital display devices is/are


1. Oscilloscope tubes 2.TV CRTs 3.LED 4.Only 1 & 2

103. A cathode ray tube (CRT) contains basic parts like


1. Electron gun 2.Focusing and accelerating systems 3.Deflecting systems 4.All

104. In CRT, Electrons are released from the


1. Indirectly heated anode 2. Indirectly heated
cathode
3.Directly heated anode 4.Directly heated
anode

105.MTCS
1. ESD is defined as the transfer of charge, called static electricity, between bodies at
different electrical potentials.
2.ESD is avoided by preventing the buildup of static electricity
3.If it is not possible for the ESDS and surrounding bodies to be grounded, then the ESDS
should be shielded within conductive package
4.All of the above

106.MTCS
1.Before open the boxes(Power module devices), place the boxes on an ESD protected
workstation.
2.Dont forget, unprotected employees may generate thousand of volts and can reduce the
performance or destroy the power module
3. The work surface of the table and the floor area are covered by a static dissipative work
surface
4.All of the above are correct.

107.MTCS
1. Before handling a power module employees must wear Wrist strap
2. Each employee should have their own wrist strap.
3. The wrist strap is the primary means of controlling static charge on personnel
4. All of the above are correct.

108.MTCS
1. The wrist strap must be worn against the skin
2. AS in 1The employee must be connected directly to the ground.
3. As in 1 each employee should test the wrist strap before use
4. All of the above are correct

109.MTCS
1.The employees must wear appropriate smocks (dissipative material) and the smocks must be
opened.
2. It is preferable to handle a power module with dissipative gloves.
3. Both are correct
4. Both are incorrect.

110.MTCS
1. Never pile up the power modules.
2. Power modules may pile up.
3. Humidity is not an important factor for the generation of static charges
4. All of the above are correct.

111.MTCS
1. A humid environment generates higher static charges than a dry environment which
generates low static charges
2. Humidity between 40 and 60% is the best choice for an assembly area and for a storage
area.
3. As in 2 Too high humid environment is uncomfortable for human.
4. All of the above are correct.

112. A circuit with many inputs and only one output is termed as
(a) Logic circuit
(b) TTL group
(c) Multiplexer
(d) Demultiplexer

113. A circuit with only one input and many output is termed as
(a) Logic circuit
(b) TTL group
(c) Multiplexer
(d)Demultiplexer

114. Decoders are also termed as


(a) Logic circuit
(b) TTL group
(c) Multiplexer
(d)Demultiplexer

115. The intregrated logic circuit which converts BCD into decimals called as
(a)Decoder (b) Encoder
(c) Multiplexer (d) none of the above

116. 8085 microprocessor is called


(a)4 bits microprocessor (b) 12 bits microprocessor
(c) 8 bits microprocessor (d) 16 bits microprocessor

117. The method used to make two a/c parts to the same potential by providing a low resistance is called
(a)Screening (b) Shielding (c) Bonding (d) Potting

118. NOR gate is equal to Bubbled AND gate


(a)False (b) False and true both
(c) True (d) None of the above

119. In a two input exclusive NOR gate , when connected both inputs high then output will be
(a)Low (b)High & Low (c) High (d) Low & high
120. A microprocessor performs the duty of
(a)Arithmetic operation (b) Arithmetic logic operation
(c) Adding binary (d) Subtracting binary

Subjective questions
1.What is ESD? How to prevent ESD?

2.What is Analog and digital data? Writes Examples?


3.What is ADC? Explain with Block diagram?
4.What is Microprocessor? Explain Parts of Microprocessor?
5.What is ICs? Writes Advantages & Disadvantages?
6.What is scale of Integration? Explain all types?
7.What is Encoder & Decoder?
8.What is Multiplexing and De multiplexing? Explain?
9.What is CRT? Explain in details ?
10.What is LED displays? Explain?
11.how to prevent ESD? Writes Packaging Precautions?
12. Give Advantages and disadvantages of ICs over Discrete Circuits?

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