SG175/D

REV 16

Networking
and Computing
Systems Group

Selector Guide
NCSG
Quarter 3, 2001
www.motorola.com/smartnetworks
DTThin Small Shrink Outline Package DWSmall Outline Integrated Circuit EMPlastic Quad (Gull Wing)
(TSSOP) (SOIC)

FCPlastic Quad (Gull Wing) FECeramic Quad (Gull Wing) FGPlastic Quad Flat Pack (PQFP)

SCALE 1:1
FTPlastic Flat Pack FUPlastic Quad Flat Pack PBLQFP Plastic

PUThin Quad Flat Pack (Plastic) PVTQFP (Plastic) RCPin Grid Array, Gold Lead Finish

RPPlastic Pin Grid Array RXCBGA Without Lid TQLQFP

2
 MPC2605 MPC2605
MPC2605

ZP PACKAGE ZP PACKAGE
PBGA ZP PACKAGE PBGA
CASE 1138-01 PBGA CASE 1138-01
CASE 1138-01
ZCGTPAC ZPPlastic Ball Grid Array ZTPlastic Ball Grid Array

ZUTape Ball Grid Array

3
PowerPC Host Processors
Voltage
Apps Voltage
Device No. Package Speeds Rev Process IO/tol SOG MPG POG Description
Modr Core
(V)

107 60x to PCI Bridge, memory

XPC107A 503-Lead PX 66,100 L B=1.2 Hip3.0 2.5 5% 2.5/3.3 24 120 controller with support for SDRAM,
(PBGA) ROM. I20, I2C support.

603R 32-bit PowerPC superscaler MPU

MPC603R 255-Lead RX 200,266,300 L C=1.2 Hip3.0 2.5 5% 3.3/5 1 1 60 with dual 16K instruction and data
(CBGA) caches, single/double precision
XPC603R 255-Lead ZT 200 L C=1.2 Hip3.0 2.5 5% 3.3/5 60 300 IEEE FPU 2.5 V core and 3.3 V I/O.
(PBGA)
MPC603R 255-Lead RX 200,266 T C=1.2 Hip3.0 2.5 5% 3.3/5 1 1 60
(CBGA)

740A 32-bit PowerPC superscalar MPU

MPC740A 255-Lead RX 200,233,266 L H=3.1 Hip3 2.6 0.1 V 3.3 1 60 300 with dual 32K instruction and data
(CBGA) caches, single/double precision
MPC740A 255-Lead RX 200,266 T H=3.1 Hip3 2.6 0.1 V 3.3 60 300 IEEE FPU, and 64-bit external data
(CBGA) bus.

745B 32-bit PowerPC superscalar MPU

XPC745B 255-Lead PX 300,350 L E=2.8 Hip4 2.0 0.1 V 3.3 1 1 60 with dual 32K instruction and data
(PBGA) caches, single/double precision
IEEE FPU, 32-/64-bit external data
bus. Features enhanced for
embedded applications.

755B 32-bit PowerPC superscalar MPU

XPC755B 360-Lead PX 300,350,400 L E=2.8 Hip4 2.0 0.1 V 3.3 2 44 220 with dual 32K instruction and data
(PBGA) caches, single/double precision
XPC755B 360-Lead RX 300,350,400 L E=2.8 Hip4 2.0 0.1 V 3.3 1 1 44 IEEE FPU, 32-/64-bit external data
(CBGA) bus, external L2 cache interface
(up to 1MByte) with integrated
controller and cache tags. Direct
Mapped SRAM capability, cache
locking. Features enhanced for
embedded applications.

7400 32-bit PowerPC superscalar MPU

XPC7400 360-Lead RX 350,400 L K=2.9 Hip5 1.8 0.1 V 2.5/3.3 1 1 44 combined with 128-bit AltiVec
(CBGA) technology vector processing
XPC7400 360-Lead RX 400,450,500 P K=2.9 Hip5 2.15 0.05 V 2.5/3.3 2 44 220 implementation, dual 32K
(CBGA) instruction and data caches, single/
XPC7400 360-Lead RX 350,400 T K=2.9 Hip5 2.15 0.05 V 2.5/3.3 2 44 132 double precision IEEE FPU, and
(CBGA) 64-bit external data bus and 32-bit
address bus. The MPC7400 also
has external L2 cache interface (up
to 2 MB) with integrated controller
and cache tags.

7410 Features similar to the MPC7400

XPC7410 360-Lead RX 400,450,500 L E=1.4 Hip6 1.5 0.05 V 2.5/3.3 1 1 44 with 32-/64-bit L2 bus support and
(CBGA) direct-mapped SRAM capability.
XPC7410 360-Lead RX 450,500,533 P E=1.4 Hip6 2.0 0.05 V 2.5/3.3 1 1 44 High bandwidth 133 MHz 64-bit
(CBGA) MPX/60x bus interface.

7441 7450 derivative with no external L3

XPC7441 360-Lead RX 600,700 L E=2.1 Hip6 1.5 0.05 V 1.8 1 1 44 cache.
(CBGA)

7450 32-bit PowerPC superscalar MPU

PPC7450 484-Lead RX 533,600 L E=2.1 Hip6 1.8 0.05 V 1.8 1 1 44 combined with 128-bit AltiVec
(CBGA) technology vector processing
PPC7450 484-Lead RX 600,667,733 P E=2.1 Hip6 1.9 0.05 V 1.8 1 1 44 implementation, dual 32K
(CBGA) instruction and data caches, single/
double precision IEEE FPU. High
bandwidth 133 MHz 64-bit MPX/
60x bus interface, integrated
256KB on-chip L2 cache. External
L3 cache interface (up to 2 MB).
Full symmetric multi-processing
capability.

4
PowerPC Host Processors (continued)
Voltage
Apps Voltage
Device No. Package Speeds Rev Process IO/tol SOG MPG POG Description
Modr Core
(V)

8240 32-bit superscalar PowerPC

XPC8240 352-Lead ZU 200 L E=1.3 Hip3 2.5 5% 3.3/5 24 120 processor core with integrated
(TBGA) peripheral logic. Supports up to
XPC8240 352-Lead ZU 250 R E=1.3 Hip3 2.625 0.125 V 3.3/5 1 24 24 100 MHz 64-bit memory interface
(TBGA) and up to 66 MHz 32-bit PCI
interface.

8245 32-bit superscalar PowerPC

XPC8245 352-Lead ZU 266 L A=1.1 Hip4 1.8 0.05 V 3.3/5 processor core with integrated
(TBGA) peripheral logic. Supports up to
XPC8245 352-Lead ZU 300 L A=1.1 Hip4 2.0 0.05 V 3.3/5 24 24 133 MHz 64-bit memory interface
(TBGA) and up to 66 MHz 32-bit PCI
interface, MPC8245 has the
on-chip DUART and is
pin-compatible with the MPC8240.

Networking and Communications Processors

Security Processors
Voltage Voltage IO/tol
Device No. Package Speeds Rev Status Description
Core (V)

XPC180 100-Lead LM 50, 66 A 1.8 10% 3.3 V 10% Now Security co-processor which interfaces gluelessly to
(QFP) 8xx system bus and 8260 local bus. Ideal for DSL type
applications.

MPC190VP 252-Pin 33, 66 0 1.8 10% 3.3 V 10% Sampling High performance security co-processor that interfaces
MAPBGA Q3 2001 to 32- or 64-bit PCI.

MPC823 Integrated PowerPC Microprocessors for Portable Systems Standard Temperature: 0 to 95C Tj (Junction Temperature)

Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)

XPC823 256-Lead ZT 66, 75, 81 B2T Portable System CZT66 0 60 300 PowerPC MPU for mobile computing.
MPU 256-lead ZT is the preferred package. 823E
XPC823 256-Lead ZC 66, 75, 81 B2 CZC66 0 90 420
has 16 KI cache and 8 KD cadre.
XPC832 256-Lead VF 66, 75, 81 B2 CVF66 0 60 300

XPC823E 256-Lead ZT 66, 75 B2 CZT66 0 60 300

For samples order: KXPC823ZT81B2T, KXPC823VF81B2, KXPC823EZT75B2

MPC850 Integrated PowerPC Communications Processors Standard Temperature: 0 to 95C Tj

Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)
XPC850 256-Lead ZT 50, 66, 80 BU Low-Cost CZT50 0 60 300 Low cost, integrated PowerPC MPU with
XPC850DE 256-Lead ZT 50, 66, 80 BU Integrated CZT50 0 60 300 tailored Communication Processing Module
PowerPC MPU (CPM) including Universal Serial Bus (USB).
XPC850SR 256-Lead ZT 50, 66, 80 BU CZT50 0 60 300
XPC850DSL 256-Lead ZT 50 BU CZT50 0 60 300
For samples order: KXPC850SRZT80BT, KXPC850SRZT80BU, KXPC850DSLZT60BU
NOTE: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.

MPC855T and MPC857T Integrated PowerPC Communications Processors Standard Temperature: 0 to 95C Tj

Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)
XPC855T 357-Lead ZP 50, 66, 80 D4 Low-Cost CZP50,66 0 44 220 Low cost, integrated PowerPC MPU with
Integrated tailored CPM including Fast Ethernet.
PowerPC MPU
For samples order: KXPC855TZP50D4, KXPC855TZP66D4, KXPC855TZP80D4
XPC857T 357-Lead ZP 50, 66, 80 0 Low-Cost CZP50,66 0 44 220 Low cost, integrated PowerPC MPU with
Integrated tailored CPM simultaneous operation of Fast
PowerPC MPU Ethernet (MII) and Parallel ATM (Utopia).
For samples order: KXPC857TZP50, KXPC8857TZP66, KXPC857TZP80

5
MPC860 and MPC862 Integrated PowerPC Communications Processors Standard Temperature: 0 to 95C Tj

Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 85C)

XPC860DE 357-Lead ZP 50,66,80 D4 PowerQUICC CZP50,66 0 44 220 PowerQUICC family with embedded
PowerPC MPU PowerPC superscalar MPUwith 4KB
XPC860DP 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220
I-cache, 4KB D-cache, and MMUs integrated
XPC860DT 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220 with CPM of earlier generation 68360
QUICC. 860P and 860DP has 16K I-cache
XPC860EN 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220 and 8K D-cache.
XPC860P 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220

XPC860SR 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220

XPC860T 357-Lead ZP 50,66,80 D4 CZP50,66 0 44 220

For samples order: KXPC860DEZPxxD4, KXPC860DPZPxxD4,

KXPC860DTZPxxD4,KXPC860ENZPxxD4, KXPC860PZPxxD4, KXPC860SRZPxxD4,
KXPC860TZPxxD4

XPC862DP 357-Lead ZP 50,66,80 0 PowerQUICC CZP50,66 0 44 220 Rev 0 of the 862 PowerQUICC family
PowerPC MPU including simultaneous operations of Fast
XPC862DT 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220
Ethernet (MII) and Parallel ATM (UTOPIA).
XPC862P 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220

XPC862SR 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220

XPC862T 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220

For samples order: KXPC862DPZPxx, KXPC862DTZPxx, KXPC862PZPxx,

KXPC862SRZPxx, KXPC862TZPxx

Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.

MPC860 and MPC855 Integrated PowerPC Communications ProcessorsExcess Inventory Listing

Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Comments
(40 to 85C)

XPC860 357-Lead ZP 50,66,80 C1 Low-Cost CZP50,66 0 44 220 These devices should be ordered for
Integrated INVENTORY DEPLETION ONLY.
XPC860DC 357-Lead ZP 50,66,80 C1 CZP50,66 0 44 220
PowerQUICC If you can use these revisions, please order
XPC860DE 357-Lead ZP 50,66,80 C1, D3 CZP50,66 0 44 220 for quick turns.

XPC860DH 357-Lead ZP 50,66,80 C1 CZP50,66 0 44 220 For new designs, please order the current
XPC860DP 357-Lead ZP 50,66,80 D3 CZP50,66 0 44 220 D4 revision listed above.

XPC860DT 357-Lead ZP 50,66,80 D3 CZP50,66 0 44 220

XPC860EN 357-Lead ZP 50,66,80 C1, D3 CZP33,50 0 44 220

XPC860MH 357-Lead ZP 33,50,66 C1 CZP50,66 0 44 220

XPC860P 357-Lead ZP 50,66,80 D3 CZP50,66 0 44 220

XPC860SR 357-Lead ZP 50,66,80 C1, D3 CZP50,66 0 44 220

XPC860T 357-Lead ZP 50,66,80 D3 CZP50,66 0 44 220

XPC855T 357-Lead ZP 50,66,80 D3 CZP50,66 0 44 220

MPC823/MPC850/MPC855/MPC857/MPC860/MPC862 Processor Derivatives and Features

I-Cache D-Cache (No. of Channels) USB
Device 10T 10/100 ATM FCC MCC #T1/E1 #T3/E3 PCI
(Kbyte) (Kbyte) HDLC SCC (v.1.1)
MPC823 2 1 Up to 2 Up to 64 2 0 Y
MPC823E 16 8 Up to 2 Up to 64 2 0 0 Y
MPC850 2 2 1 1 1 0 0 Y
MPC850DE 2 1 Up to 2 2 0 0 Y
MPC850SR 2 1 Up to 2 Y Up to 64 2 0 0 2 Y
MPC850DSL 2 1 1 Y 2 0 0 Y
MPC855T 4 4 1 1 Y Up to 32 1 0 0 1
MPC857T 4 4 1 1 Y Up to 32 1 0 0 1
MPC860DE 4 4 Up to 2 2 0 0
MPC860DP 16 8 Up to 2 1 Y Up to 64 2 0 0 2

6
MPC823/MPC850/MPC855/MPC857/MPC860/MPC862 Processor Derivatives and Features
MPC860DT 4 4 Up to 2 1 Y Up to 64 2 0 0 2
MPC860EN 4 4 Up to 4 4 0 0
MPC860P 16 8 Up to 4 1 Y Up to 64 4 0 0 2
MPC860SR 4 4 Up to 4 Y Up to 64 4 0 0 2
MPC860T 4 4 Up to 4 1 Y Up to 64 4 0 0 2
MPC862DT 4 4 Up to 2 1 Y Up to 64 2 0 0 2
MPC862P 16 8 Up to 4 1 Y Up to 64 4 0 0 2
MPC862SR 4 4 Up to 4 Y Up to 64 4 0 0 2
MPC862T 4 4 Up to 4 1 Y Up to 64 4 0 0 2

MPC8255/MPC8260/MPC8264/MPC8265/MPC8266 PowerQUICC II
Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ Description
(40 to 105C)
XPC8255 480-Lead ZU IEA A1 PowerQUICC II CZUIEA 0 21 105 Next Generation of PowerQUICC product
family. 603e CPU, Fast Ethernet, OC-3 ATM,
256 HDLC Channels.
For samples order: KXPC8255ZUIEAA1
XPC8260 480-Lead ZU 133,166,200 A CZU133,166 0 21 105 Next Generation of PowerQUICC product
XPC8260 480-Lead ZU FFB,HFB,IFB,I B3 CZUFFB family. 603e CPU, Fast Ethernet, OC-3
GA ATM, 256 HDLC Channels.

For samples order: KXPC8260ZuxxxA, KXPC8260ZuxxxB3

XPC8260A 480-Lead ZU IFB,IHB,IIB 0 PowerQUICC II N/A 0 21 105 Next Generation of PowerQUICC product
(HIP4) (HIP4) family.
XPC8264A 480-Lead ZU IFB,IHB,IJB A N/A 0 21 105
(HIP4)
ZPC8265A 480-Lead ZU IFB,IHB,IJB A N/A 0 21 105
(HIP4)
ZPC8266A 480-Lead ZU IFB,IHB,IJB A N/A 0 21 105
(HIP4)
CPU/CPM/BUS SPEED A = 50 B = 66 C = 75 D = 83 E = 100 F = 133 G = 150
FOR POWER QUICC II H = 166 I = 200 J = 223 K = 266 L = 300 M = 333
Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.

MPC8255/MPC8260/MPC8264/MPC8265/MPC8266 PowerQUICC II Derivatives and Features

I-Cache D-Cache Utopia ATM (No. of Channels) USB
Device 10T 10/100 FCC MCC #T1/E1 #T3/E3 PCI
(Kbyte) (Kbyte) Support HDLC SCC (v.1.1)
MPC8255 16 16 Up to 4 Up to 2 1 Ch. Up to 128 4 2 1 4 2
(155 Mbps)
MPC8260 16 16 Up to 4 Up to 2 2 Ch. Up to 256 4 3 2 8 2
(155 Mbps ea)
MPC8264 16 16 Up to 4 Up to 2 2 Ch. Up to 256 4 3 2 8 2
(155 Mbps ea)
MPC8265 16 16 Up to 4 Up to 2 2 Ch. Up to 256 4 3 2 8 2 Y
(155 Mbps ea)
MPC8266 16 16 Up to 4 Up to 2 2 Ch. Up to 256 4 3 2 8 2 Y
(155 Mbps ea)

68K Integrated Communication Processors

Temp.**
Device No. Package Speeds Rev Device Name SOQ MPQ POQ BRICK Description
(40 to 85C)
MC68302 132-Lead FC 16,20,25 C Intergrated CFC16,20 0 36 144 180 68000 core with three
Multiprotocol high-performance multiprotocol
144 Lead PV 16,20,25,33 C N/A 0 60 300 300
Processor (IMP) serial channels also on-chip DMA,
132-Lead RC 16,20,25 C CRC16,20 0 14 70 N/A RAM, timers, I/O, chip select, and
wait state interrupt controller.
MC68302V 144-Lead PV 16 @ 3.3 V C CPV16V 0 60 300 300
For samples order: SPAK302FXxxC
MC68EN302 144-Lead PV 20,25 BT Intergrated CPV20 0 60 300 300 Full 68302, plus separate IEEC
Multiprotocol 802.2 ethernet MAC channel and
Processor with full DRAM controller.
Ethernet
Controller

7
68K Integrated Communication Processors
For samples order: KMC68EN302PV25B
MC68LC302 100-Lead PU 16,20,25 @ 5 V CT Low-Cost CPU16,20 0 84 420 420 Static EC000 Core Processor with
Intergrated two high-performance multiprotocol
16,20 @ 3.3 V CT CPU16V
Multiprotocol serial channels; also on-chip DMA,
Processor RAM, timers, I/O, chip selects, and
wait state interrupt controller.
For PU samples order: KMC68LC302PU16CT,
KMC68LC302PU20CT, KMC68LC302PU25CT,
KMC68LC302PU16VCT, KMC68LC301PU20VCT
MC68360 240-Lead EM 25,33 @ 5.0 V L QUICC Quad CEM25 0 24 120 CPU32 + core with System
Intergrated Intergration Module (SIM) and four
357-Lead ZP L CZP25 0 44 220
Communications high-performance SCCs support
241-Lead RC K Controller CRC25 0 10 50 numerous protocols. Two SCCs
support Ethernet on "EN" version.
MC68360V 240-Lead EM 25 @ 3.3 V L 0 24 120
357-Lead ZP L 0 44 220
MC68EN360 240-Lead EM 25, 33 @ 5.0 V L CEM25 0 24 120
357-Lead ZP L CZP25 0 44 220
241-Lead RC K CRC25 0 10 50
MC68EN360V 240-Lead EM 25 @ 3.3 V L 0 24 120
357-Lead ZP L 0 44 220
For EM sample order: KMC68360EM25L, KMC68360EM33L, KMC68360EM25VL,
KMC68360CEM25L, KMC68EN360EM25L, KMC68EN360EM33L,
KMC68360EN360EM25VL, KMC68EN360CEM25L.
For ZP sample order: KMC68360ZP25L, KMC68360ZP25VL, KMC68360ZP33L,
KMC68360CZP25L, KMC68EN360ZP25L, KMC68EN360ZP33L,
KMC68EN360ZP25VL, KMC68EN360CZP25L
MC68MH360 240-Lead EM 25, 33 @ 5.0 V L CEM25 0 24 120 One-chip intergrated
microprocessor and peripheral
357-Lead ZP L CZP25 0 44 220
combination with four SCCs, two
241-Lead RC K CRC25 0 10 50 serial management controllers
(SMCs), and one serial peripheral
MC68MH360V 240-Lead EM 25 @ 3.3 V L 0 24 120
interface (SPI).
357-Lead ZP L 0 44 220
For EM sample order: KMC68MH360EM25L, KMC68MH360EM33L,
KMC68MH360EM25VL, KMC68MH360CEM25L
For ZP sample order: KMC68MH360ZP25L, KMC68MH360ZP25VL,
KMC68MH360ZP33L, KMC68MH360CZP25L
MC68606 84-Lead FN 12, 16 C CFN12, 16 1 1 15 Implements CCITT Q.920/Q.921
link access procedure (LAPB)
specified at ISO level 2 for both
signaling and data applications in
an ISDN.
Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be validconsult factory to verify.

Advanced Clock Drivers

Clock Generator
Output Max Max
Extended
VCC Frequency Output Period No. of
Device Processor and Application Temp. Package Input Status
(V) Range Skew Jitter Outputs
(C)
(MHz) (ps) (ps)
MPC930FA Pentium or PowerPC 603/740/750 3.3 32 LQFP 16 to 140 400 100 LVCMOS 6 P
Class Processor Designs (On-Board
Crystal Oscillator)
MPC931FA Pentium or PowerPC 603/740/750 3.3 32 LQFP 16 to 140 400 100 LVCMOS 6 P
Class Processor Designs (Faster VCO
than 930)
MPC9315FA Telecom/Networking Applications 40 to 85 3.3/ 32 LQFP 18 to 200 200 8 Two 8 S
2.5 (rms) Selectable LVCMOS
LVCMOS

8
Clock Generator (continued)
Output Max Max
Extended
VCC Frequency Output Period No. of
Device Processor and Application Temp. Package Input Status
(V) Range Skew Jitter Outputs
(C)
(MHz) (ps) (ps)
MPC932FA Zero Delay Applications, Six Input 3.3 32 TQFP 33 to 120 600 100 LVCMOS 7 P
Clock Multipliers (Independent Output LVCMOS
Enable/ Disable for Lo-Power
Scheme)
MPC9350FA Networking and Telecommunications 40 to 85 3.3/ 32 LQFP 25 to 240 200 XTAL or 9 S
Ideal for PowerQUICC II and PowerPC 2.5 LVCMOS LVCMOS
MPC74XX Applications
MPC9351FA Networking and Telecommunications 40 to 85 3.3/ 32 LQFP 25 to 240 200 LVCMOS or 9 S
Ideal for PowerQUICC II and PowerPC 2.5 LVPECL LVCMOS
MPC74XX Applications
MPC950FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 375 100 XTAL or 9 P
Processor Designs (Scan Chain Clock LVCMOS
Distribution)
MPC951FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 375 100 LVCMOS 9 P
Processor Designs (Zero Delay, Low
Skew Fanout Buffer)
MPC952FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 450 100 LVCMOS 11 P
Processor Designs (Terminated
Transmission Line Driver)
MPC9600FA General Purpose 2.5 V, High Fanout 3.3/ 48 LQFP 50 to 200 150 50 LVCMOS or 21 S
Zero Delay Buffer 2.5 LVPECL LVCMOS
MPC972FA General Purpose or RISC/CSIC Class 3.3 52 LQFP 25 to 125 550 100 LVCMOS or 12 P
Designs (Independent Output Enable/ LVPECL
Disable Lo-Power Scheme)
MPC973FA Pentium or PowerPC603/740/750 3.3 52 LQFP 125 550 100 LVCMOS 12 P
Class Designs (Output Enable/Disable
Lo-Power Scheme)
MPC974FA Fault Tolerant (Redundant Clock 3.3 52 LQFP 16 to 125 350 100 LVCMOS 15 P
Source Needed) Pentium/PowerPC
603/740/ 750/RISC Class Processor
Designs
MPC980FA Processor and System Clock for 3.3 52 LQFP 66 350 150 XTAL 10 P
Pentium and PowerPC603
PCDesigns, PCI Clock, SCSI Clock,
Dual PLL
MPC991FA Telecom Applications, Work Station, 40 to 85 3.3 52 LQFP 400 250 50 LVPECL 14 Different P
Mainframe (Differential Input Locks Pairs
onto External Clock Reference)
MPC992FA Telecom, Work Station, Mainframe, 3.3 32 LQFP 375 300 25 LVPECL 7 Different P
Instrumentation (On-Board XTL Pairs
Oscillator, or Lock onto External Clock)
MPC993FA Systems with cLock Redundancy 40 to 85 3.3 32 LQFP 50 to 180 150 50 LVPECL 5 Different P
Needs (High-End Computing and Pairs
Telecomm) Differential LVPECL 50
MHz to 90 MHz Input Frequency
MPC9857FA Clock Driver for 184-pin DDR SDRAM 3.3/ 48 167 100 SSTL2 11 Q2/01
Modules 2.5 TSSOP
MPC9952FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 180 450 100 LVCMOS 11 P
Processor Designs9952 is based on
the MPC952; removing the power-on
reset function
MPC9990FA IA64, HSTL Clock Generator 3.3/ 75 to 300 50 75 LVPECL 10 HSTL+ IN
2.5 LVPECL
Feedback
MC88915TFN55 PC, Work Station, Servers, Memory 40 to 85 5.0 28 PLCC 55 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88915TFN70 PC, Work Station, Servers, Memory 40 to 85 5.0 28 PLCC 70 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88915TFN100 PC, Work Station, Servers, Memory 40 to 85 5.0 28 PLCC 100 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom

9
Clock Generator (continued)
Output Max Max
Extended
VCC Frequency Output Period No. of
Device Processor and Application Temp. Package Input Status
(V) Range Skew Jitter Outputs
(C)
(MHz) (ps) (ps)
MC88915TFN133 PC, Work Station, Servers, Memory 5.0 28 PLCC 133 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88915TFN160 PC, Work Station, Servers, Memory 5.0 28 PLCC 160 500 CMOS 8 P
Modules, Graphics Cards, High End
Printers, Networking, and Telecom
MC88LV915TFN MC88LV915TFN is the 3.3 V version of 3.3 28 PLCC 100 500 CMOS 8 P
MC88915TFN100
MC88916DW70 MC68030/EC030/LC030, 5.0 20 SOIC 70 500 CMOS 6 P
MC68040/EC040/LC040 (33 MHz)
MC88916DW80 MC68030/EC030/LC030, 5.0 20 SOIC 80 500 CMOS 6 P
MC68040/EC040/LC040 (40 MHz)
MC88920DW MC68020/EC020/030/EC030/LC030/0 5.0 20 SOIC 50 500 CMOS 6 P
40/EC040/LC040 (20 and 25 MHz),
i960 (16,25,33 MHz)
MC88921DW MC68040/EC040/LC040 (20, 25, 33 5.0 20 SOIC 80 500 CMOS 3 P
MHz), Pentium (Input Clock and Bus
Logic Clock), i960 (16, 25, 33 MHz)
MC88LV926DW MC68030/EC030/LC030, 3.3 20 SOIC 66 500 CMOS 5 P
MC68040/EC040/LC040,
MC68060/EC060/LC060, CISC
Processors

Clock Synthesizer
Max
Extended Frequency
VCC Frequency Period
Device Processor and Application Temp. Package Range Input Outputs Status
(V) Steps Jitter
(C) (MHz)
(ps)
MC12429FN Clock Source for 25 MHz to 400 MHz 3.3 28 PLCC 25 to 400 1 MHz 25 XTAL LVPECL P
Processor Designs (Serial and/or
Parallel) 1 MHz Steps
MC12430FN Clock Source for 50 MHz to 800 MHz 3.3 28 PLCC 50 to 800 1 MHz 25 to XTAL or LVPECL P
Processor Designs (Serial and/or 65 External
Parallel) 1 MHz Steps
MC12439FN Clock Source for 50 MHz to 800 MHz 3.3 28 PLCC 50 to 800 16 MHz 25 to XTAL or LVPECL P
Processor Designs (Serial and/or 65 External
Parallel) 16.66 MHz Steps
MPC998FA HP PA and Intel 64-Bit Architectures 3.3 Core/ 32 LQFP 520 to 840 50 ps 5% of HSTL or 2+ P
(Itanium): 520 MHz to 840 MHz 1.8 Output Clock LVPECL Feedback
High-End Computing/Telecomm HSTL Period HSTL
Clock Trees/Clock Synthesis
MPC9994FA HP PA and Intel 64-Bit Architectures 3.3 Core/ 32 LQFP 340 to 640 50 ps 5% of HSTL or 2+ P
(Itanium): 340 MHz to 640 MHz 1.8 Output Clock LVPECL Feedback
High-End Computing/Telecomm HSTL Period HSTL
Clock Trees/Clock Synthesis
Legend: IN = In Development P = Production S = Sampling

10
Zero-Delay Buffer
Output Max Max
Extended
VCC Frequency Output Period
Device Processor/Application Temp. Package Input Outputs Status
(V) Range Skew Jitter
(C)
(MHz) (ps) (ps)
MPC953FA High Performance Clock Tree Design, 3.3 32 LQFP 25 to 110 150 100 LVPECL Ref 8+ P
PC100 LVCMOS Fdbk Feedback
LVCMOS
MPC954DT High Performance Clock Tree Design 3.3 24 TSSOP 50 to 100 200 50 LVCMOS Ref 10 + P
(Clock Signal Retiming Without Insertion LVCMOS Fdbk Feedback
Delay) in the 50 MHz to 100 MHz Range LVCMOS
MPC958FA Very High Performance Clock Tree 3.3 32 LQFP 50 to 200 200 100 LVPECL Ref 10 + P
Design up to 200 MHz LVCMOS Fdbk Feedback
LVCMOS
MPC961CFA General Purpose also PowerQUICC: 3.3/ 32 LQFP 50 to 200 150 10 LVCMOS Ref 17 + P
Zero-Delay Applications (CMOS Clock 2.5 LVCMOS Fdbk Feedback
Signal Retiming Without Insertion Delay) LVCMOS
DRAM Driver
MPC961PFA Zero-Delay Applications (PECL Clock 3.3/ 32 LQFP 50 to 200 150 10 LVCMOS Ref 17 + P
Signal Retiming Without Insertion Delay) 2.5 LVCMOS Fdbk Feedback
LVCMOS

LVCMOS Fanout Buffer

Max Max Max
Extended
VCC Output Output Part-Part
Device Processor and Application Temp. Package Input Outputs Status
(V) Frequency Skew Skew
(C)
(MHz) (ps) (ns)
MPC905D Pentium PCI Processor Bus Clock or PCI 3.3 16 SOIC 100 500 XTAL or 6 P
Bus Hi-Speed Transmission Line Driver External
LVCMOS
MPC940LFA General Purpose or RISC/CSIC PCI 3.3/ 32 250 150 1.7 LVPECL or 18 P
Clock Distribution to Synchronous 2.5 QFP/LQFP LVCMOS
Memory (Better Performance Than
MPC9109)
MPC941FA General Purpose or RISC/CSIC PCI 40 to 85 3.3 48 QFP 250 250 1.2 LVPECL or 27 P
Clock Distribution to Synchronous LVCMOS
Memory (More Outputs Than MPC940)
MPC942CFA Pentium II and Other High-Performance 3.3/ 32 LQFP 250 250 1 LVTTL or 18 P
Synchronous Designs (CMOS Inputs) 2.5 LVCMOS
MPC942PFA Pentium II and Other High-Performance 40 to 85 3.3/ 32 LQFP 250 250 1 LVPECL 18 P
Synchronous Designs (PECL Inputs) 2.5
MPC9443FA Low Voltage High-Performance Telecom, 40 to 85 3.3/ 48 LQFP 250 200 LVPECL or 16 IN
Networking and Computing Applications 2.5 LVCMOS
MPC9446FA Low Voltage Mid-Range and High- 40 to 85 3.3/ 32 LQFP 250 200 LVCMOS 10 IN
Performance Telecom, Networking and 2.5
Computing Applications
MPC9456FA Low Voltage Mid-Range and High- 3.3/ 32 LQFP 250 250 LVPECL 10 IN
Performance Telecom, Networking and 2.5
Computing Applications
MPC946FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 150 350 4.5 LVTTL or 10 P
Processor PCI Clock Distribution to LVCMOS
Synchronous Memory
MPC947FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 110 500 2 LVTTL or 9 P
Processor Clock Fanout for L2 Cache LVCMOS
MPC948FA General Purpose or RISC/CSIC Class 3.3 32 LQFP 150 350 2 LVPECL or 12 P
Processor Clock Fanout for L2 Cache LVCMOS
(faster and more outputs than the
MPC947)
MPC949FA General Purpose or RISC/CSIC Class 3.3 52 LQFP 150 350 4 LVPECL 15 P
Processor PCI Clock Distribution to
Synchronous Memory (5 more outputs
than the MPC946)
Mixed mode power supply.
Legend: IN = In Development P = Production S = Sampling

11
Differential Fanout Buffer
Max Max
Extended Part-Part Output
Temp. VCC Skew Skew Output
Device Processor and Application (C) (V) Package (ps) (ps) Technology Input Outputs Status
MC100EP111FA Clock Distribution Schemes Requiring 40 to 70 3.3/ 32 LQFP 100 35 LVPECL ECL/PECL 1:10 P
Extremely Low Part-to-Part and 2.5 or HSTL
Output-to-Output Skews
MC100EP210FA Clock Distribution Schemes Requiring 40 to 70 3.3/ 32 LQFP 150 35 LVPECL ECL/PECL Dual 1:5 P
Very Low Part-to-Part and Output-to- 2.5
Output Skews
MC100EP220TB ECL/PECL Designs Needing Low Skew. 40 to 85 3.3/ 52 LQFP 150 50 DIFF LVPECL ECL/PECL Dual 1:10 S
Telecom Backbone Equipment, Semi 2.5 Exposed DIFF
Test Equipment Pad
MC100EP221TB ECL/PECL Designs Needing Low Skew. 40 to 85 3.3/ 52 LQFP 150 50 LVPECL ECL/PECL 1:20 DIFF S
Telecom Backbone Equipment, Semi 2.5 Exposed
Test Equipment Pad
MC100EP222TB ECL/PECL Designs Needing Low Skew. 40 to 85 3.3/ 52 LQFP 150 50 DIFF LVPECL ECL/PECL 1:15 DIFF S
Telecom Backbone Equipment, Semi 2.5 Exposed
Test Equipment Pad
MC100EP223TC ECL/PECL Designs Needing Low Skew. 0 to 85 3.3/ 64 LQFP 150 50 DIFF ECL/PECL 1:22 DIFF P
Telecom Backbone Equipment, Semi 2.5 Exposed PECL/HTSL or HSTL
Test Equipment Pad
Legend: IN = In Development P = Production S = Sampling

RF LDMOS High Power Transistors

MobileTo 520 MHz
Gain
Frequency Pout VDD JC
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) (V) (C/W)
(dB/MHz) (%)

VHF and UHF, Land Mobile Radio, Class ABLDMOS Die

MRF1511T1 2f U 136175 8 7.5 11.5/175 55 2.0 466/1
2f
MRF1517T1 U 430520 8 7.5 11/520 55 2.0 466/1
2f
MRF1513T1 U 400520 3 7.5/12.5 11/520 55 4.0 466/1
2f
MRF1518T1 U 400520 8 12.5 11/520 55 2.0 466/1
MRF1535T1 2j U 400520 35 12.5 10 (Min)/520 50 (Min) 0.90 1264/1
MRF1550T1 2j U 136175 50 12.5 10 (Min)/175 50 (Min) 0.75 1264/1

BroadcastTo 1.0 GHzLateral MOSFETs

Gain
Frequency Pout VDD JC IMD
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) (V) (C/W) (dBc)
(dB/MHz) (%)

4701000 MHz, Class ABLDMOS Die

MRF373A U 470860 75 CW 32 18/860 60 0.89 360B/1
MRF373AS U 470860 75 CW 32 18/860 60 0.63 360C/1
MRF374A U 470860 130 PEP 32 17.3/860 41 0.38 31 375F/2
MRF372 M 470860 180 PEP 32 17/860 36 0.5 35 375G/2
3
MRF377 M 470860 240 PEP 32 14/860 40 0.5 30 375G/2
3
MRF376 M 470860 400 Pulsed 50 16/860 50 0.4 375G/2

12
CellularTo 1.0 GHzLateral MOSFETs
Gain
Frequency Pout Test VDD JC
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) Signal (V) (C/W)
(dB/MHz) (%)

8001.0 GHz, Class ABLDMOS Die

MRF9002R2 2e U 960 2 PEP 2-Tone 26 16/960 50 12 978/
MRF9030MR1 2a, 4b U 945 30 PEP 2-Tone 26 19/945 41 1265/1
MRF9030 U 945 30 PEP 2-Tone 26 19/945 41.3 1.9 360B/1
MRF9030S 2a U 945 30 PEP 2-Tone 26 19/945 41.3 1.5 360C/1
MRF9045MR1 2a U 945 45 PEP 2-Tone 28 18.5/945 41 0.8 5 1265/1
MRF9045 U 945 45 PEP 2-Tone 28 18.8/945 42 1.4 360B/1
MRF9045S 2a U 945 45 PEP 2-Tone 28 18.8/945 42 1.0 360C/1
MRF9060MR1 2a, 4b U 945 60 PEP 2-Tone 26 17.7/945 39 1265/1
MRF9060 U 945 60 PEP 2-Tone 26 17/945 40 1.1 360B/1
MRF9060S 2a U 945 60 PEP 2-Tone 26 17/945 40 0.8 360C/1
MRF652270 2i M 921960 70 CW 1-Tone 26 16/921,960 58 1.1 465D/1
MRF9080 M 921960 75 CW 1-Tone 26 18.5/921,960 55 0.7 465/1
MRF9080S M 921960 75 CW 1-Tone 26 18.5/921,960 55 0.7 465A/1
MRF9085 M 880 90 PEP 2-Tone 26 17.9/880 40 0.7 465/1
MRF9085S M 880 90 PEP 2-Tone 26 17.9/880 40 0.7 465A/1
MRF9120 M 880 120 PEP 2-Tone 26 16.5/880 39 0.45 375B/2
MRF9120S M 880 120 PEP 2-Tone 26 16.5/880 39 0.45 375H/2
MRF9180 M 880 170 PEP 2-Tone 26 17.5/880 39 0.45 375D/2
MRF9180S M 880 170 PEP 2-Tone 26 17.5/880 39 0.45 375E/2

PCS and 3GTo 2.1 GHzLateral MOSFETs

Gain
Frequency Pout Test VDD JC
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) Signal (V) (C/W)
(dB/MHz) (%)

18051990 MHz, Class ABLDMOS Die (GSM1800, GSM1900, GSM EDGE, and PCS TDMA)
MRF18060A M 18051880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465/1
MRF18060AS M 18051880 60 CW 1-Tone 26 13/1805,1880 45 0.97 465A/1
MRF18060B M 19301990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465/1
MRF18060BS M 19301990 60 CW 1-Tone 26 13/1930,1990 45 0.97 465A/1
MRF18085A 4a M 18051880 85 CW 1-Tone 26 13/1805,1880 53 0.64 465/1
4a
MRF18085AS M 18051880 85 CW 1-Tone 26 13/1805,1880 53 0.64 465A/1
MRF18085B 4a M 19301990 85 CW 1-Tone 26 13/1930,1990 52 0.64 465/1
4a
MRF18085BS M 19301990 85 CW 1-Tone 26 13/1930,1990 52 0.64 465A/1
MRF18090A M 18051880 90 CW 1-Tone 26 13.5/1805,1880 52 0.7 465B/1
MRF18090AS M 18051880 90 CW 1-Tone 26 13.5/1805,1880 52 0.7 465C/1
MRF18090B M 19301990 90 CW 1-Tone 26 13.5/1930,1990 45 0.7 465B/1
MRF18090BS M 19301990 90 CW 1-Tone 26 13.5/1930,1990 45 0.7 465C/1

13
PCS and 3GTo 2.1 GHzLateral MOSFETs (continued)
Gain
Frequency Pout Test VDD JC
Device (Typ)/Freq. Eff. (Typ) Package/Style
Band 1 (W) Signal (V) (C/W)
(dB/MHz) (%)

1.9 GHz, Class ABLDMOS Die (2-CH N-CDMA)

MRF19030 M 19301990 30 PEP 2-Tone 26 13/1990 36 2.1 465E/1
MRF19030S M 19301990 30 PEP 2-Tone 26 13/1990 36 2.1 465F/1
MRF19045 M 19301990 9.5 AVG N-CDMA 26 14.5/1990 23.5 0.65 465E/1
MRF19045S M 19301990 9.5 AVG N-CDMA 26 14.5/1990 23.5 0.65 465F/1
MRF19060 M 19301990 60 PEP 2-Tone 26 12.5/1990 36 0.97 465/1
MRF19060S M 19301990 60 PEP 2-Tone 26 12.5/1990 36 0.97 465A/1
MRF19090 M 19301990 90 PEP 2-Tone 26 11.5/1990 35 0.65 465B/1
MRF19090S M 19301990 90 PEP 2-Tone 26 11.5/1990 35 0.65 465C/1
MRF19085 M 19301990 18 AVG N-CDMA 26 13/1990 23 0.64 465/1
MRF19085S M 19301990 18 AVG N-CDMA 26 13/1990 23 0.64 465A/1
MRF19120 6 M 19301990 120 PEP 2-Tone 26 11.7/1990 34 0.45 375D/2
MRF19120S 6 M 19301990 120 PEP 2-Tone 26 11.7/1990 34 0.45 375E/2
MRF19125 M 19301990 24 AVG N-CDMA 26 13.5/1990 22 0.53 465B/1
MRF19125S M 19301990 24 AVG N-CDMA 26 13.5/1990 22 0.53 465C/1
2.0 GHz, Class A, ABLDMOS Die
MRF281SR1 2a U 19302000 4 PEP 2-Tone 26 12.5/2000 33 5.74 458B/1
2a
MRF281ZR1 U 19302000 4 PEP 2-Tone 26 12.5/2000 33 5.74 458C/1
MRF282SR1 2a U 19302000 10 PEP 2-Tone 26 11.5/2000 28 (min) 4.2 458B/1
MRF282ZR1 2a U 19302000 10 PEP 2-Tone 26 11.5/2000 28 (min) 4.2 458C/1
MRF284 U 19302000 30 PEP 2-Tone 26 10.5/2000 35 2.0 360B/1
2a
MRF284SR1 U 19302000 30 PEP 2-Tone 26 10.5/2000 35 2.0 360C/1
4a
MRF286 M 19302000 60 PEP 2-Tone 26 10.5/2000 32 0.73 465/1
MRF286S 4a M 19302000 60 PEP 2-Tone 26 10.5/2000 32 0.73 465A/1
2.1 GHz, Class ABLDMOS Die (2-CH W-CDMA, UMTS)
MRF21010 U 21102170 10 PEP 2-Tone 28 13.5/2170 35 5.5 360B/1
MRF21010S 4a U 21102170 10 PEP 2-Tone 28 13.5/2170 35 5.5 360C/1
MRF21030 M 21102170 30 PEP 2-Tone 28 13/2170 33 2.1 465E/1
MRF21030S M 21102170 30 PEP 2-Tone 28 13/2170 33 2.1 465F/1
MRF21045 M 21102170 10 AVG W-CDMA 28 15/2170 23.5 1.65 465E/1
MRF21045S M 21102170 10 AVG W-CDMA 28 15/2170 23.5 1.65 465F/1
MRF21060 M 21102170 60 PEP 2-Tone 28 12.5/2170 34 1.02 465/1
MRF21060S M 21102170 60 PEP 2-Tone 28 12.5/2170 34 1.02 465A/1
MRF21085 M 21102170 19 AVG W-CDMA 28 13.6/2170 23 0.78 465/1
MRF21085S M 21102170 19 AVG W-CDMA 28 13.6/2170 23 0.78 465A/1
MRF21090 M 21102170 90 PEP 2-Tone 28 11.7/2170 33 0.65 465B/1
MRF21090S M 21102170 90 PEP 2-Tone 28 11.7/2170 33 0.65 465C/1
MRF21120 6 M 21102170 120 PEP 2-Tone 28 11.4/2170 34.5 0.45 375D/2
MRF21120S 6 M 21102170 120 PEP 2-Tone 28 11.2/2170 34.5 0.45 375E/2
MRF21125 M 21102170 20 AVG W-CDMA 28 13/2170 18 0.53 465B/1
MRF21125S M 21102170 20 AVG W-CDMA 28 13/2170 18 0.53 465C/1
MRF21180 6 M 21102170 38 AVG W-CDMA 28 12.1/2170 22 0.46 375D/2
MRF21180S 6
M 21102170 38 AVG W-CDMA 28 12.1/2170 22 0.46 375E/2

14
RF LDMOS Amplifier Modules/ICs
Base Stations
Supply
Frequency P1dB Gain (Min) System Die
Device Voltage Class Package/Style
(MHz) (W) (dB) Application Technology
(V)
MHVIC910HR2 2e 921960 10 38 26 AB GSM900 LDMOS-IC 978/
MHW18101 18051880 10 24 26 AB GSM1800 LDMOS 301AW/1
MHW18102 18051880 10 32 26 AB GSM1800 LDMOS 301AW/1
MHW19101 19301990 10 24 26 AB GSM1900 LDMOS 301AW/1
MHPA19030 4a 19002000 30 25 26 AB PCS1900 LDMOS 301AP/1
MHPA21030 4a 21002200 30 25 28 AB W-CDMA LDMOS 301AP/1

Base Station Drivers

Gain 3rd Order
Frequency VDD IDD Gain P1dB NF
Flatness Intercept
Device Band (Nom.) (Nom.) (Nom.) (Typ) (Typ) Case/Style
(Typ) (Typ)
(MHz) (V) (mA) (dB) (dBm) (dB)
(dB) (dBm)

Ultra-Linear (for CDMA, W-CDMA, TDMA, Analog)Class A (LDMOS Die)Lateral MOSFETs

MHL9838 800925 28 770 31 0.1 39 50 3.7 301AP/1

MHL9236 800960 26 550 30.5 0.1 34 47 3.5 301AP/1

MHL9236M 800960 26 550 30.5 0.1 34 47 3.5 301AP/2

MHL9318 860900 28 500 17.5 0.1 35.5 49 3.0 301AS/1

MHL18336 18001900 26 500 30 0.2 36 46 4.2 301AP/1

4a
MHL18926 18001900 26 1000 30 0.2 40 50 4.2 301AY/1

MHL19338 19002000 28 500 30 0.1 36 46 4.2 301AP/1

MHL19936 19002000 26 1400 29 0.2 41 49.5 4.2 301AY/1

MHL21336 21102170 26 500 31 0.15 35 45 4.5 301AP/1

New Product
NOTES:
1. M = Matched Frequency Band; U = Unmatched Frequency Band.
2. Tape and Reel Packaging Option Available by adding suffix: a) R1 = 500 units; b) R2 = 2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e)
R2 = 1,500 units; f) T1 = 1,000 units; g) R2 = 4,000 units; h) R1 = 1,000 units; i) R3 = 250 units; j) T1 = 500 units; k) R2 = 450 units.
3. In development.
4. To be introduced: (a) 2Q01; (b) 3Q01; (c) 4Q01.
5. Simulated.
6. Internal Impedance Matched Push-Pull Transistors.

15
Networking DSPs
DSP Products
Sample Part Number Voltage
Device MOQ Package Performance (2-Unit Core, Internal Memory Peripherals Applications
Sample Pack) I/O
DSP56301VF80 126 252-pin 80 MHz SPAKDSP301VF100 3.3, 24K Bytes 32-bit Host, High-bandwidth 32-bit PCI
MAP-BGA 80 MIPS 3.3 V 4K words program ESSI, SCI, interface is particularly
4K words data Triple Timer useful in multimedia and
DSP56301VF100 126 252-pin 100 MHz
telecommunication
MAP-BGA 100 MIPS
applications such as video
DSP56301PW80 84 208-pin 80 MHz SPAKDSP301PW100 conferencing and base
TQFP 80 MIPS transceiver stations.
DSP56301PW100 84 208-pin 100 MHz
TQFP 100 MIPS
DSP56303VF100 126 196-pin 100 MHz SPAKDSP303VF100 3.3, 24K Bytes 8-bit Host, Networking applications
MAP-BGA 100 MIPS 3.3 V 4K words program ESSI, SCI, requiring low-cost, high-
4K words data Triple Timer performance digital signal
DSP56303PV100 60 144-pin 100 MHz SPAKDSP303PV100
processing such as voice/
TQFP 100 MIPS
data/fax processing, video-
XC56309VF100A 126 196-pin 100 MHz SPAKXC309VF100A 3.3, 102K Bytes conferencing, audio
MAP-BGA 100 MIPS 3.3 V 20K words program applications, and control.
5 V I/O 14K words data
XC56309PV100A 60 144-pin 100 MHz SPAKXC309PV100A
Tolerant
TQFP 100 MIPS
XC56L307VF160 126 196-pin 160 MHz SPAKXCL307VF160 1.8, 192K Bytes 8-bit Host, Networking applications
MAP-BGA 290 MIPS 3.3 V 1648K words program ESSI, SCI, requiring high-performance
4816K words data Triple Timer, and large internal memory
5 memory switch ESSI, EFCOP such as wireline and
options wireless communications
infrastructure equipment,
XC56311VF150A 126 196-pin 150 MHz SPAKXC311VF150A 1.8, 384K Bytes
packet telephony, and
MAP-BGA 270 MIPS 3.3 V 3296K words program
modem banks.
9632K words data
EFCOP provides hardware
5 memory switch
acceleration for filtering
options
operations.
XC56321FC200 126 196-pin 200 MHz SPAKXC321FC200 1.5, 576K Bytes
Available 4Q2001 FC-BGA 360 MIPS Available 4Q2001 3.3 V 32160K words
program
16032K words data
8 memory switch
options
XC8101M1375B 90 332-pin 275 MHz SPAKXC8101M1375B 1.5, 512K Bytes 4 ALUs, Networking infrastructure
Available 4Q2001 FC-BGA 1375 MIPS Available 4Q2001 3.3 V Unified program and 137 MHz CPM, applications such as 2.5G
1375 MMACS data memory 16-channel DMA and 3G wireless
configurable by the 68 MHz, 64-bit infrastructure, IP telephony
application PowerPC bus (voice, fax, modem, and
interface, video IP gateways), ATM
275 MHz Edge/Carrier switches,
EFCOP modem banks, WAN
switching and transmission,
and centralized DSP
services (compression and
echo cancellation).

16
Applications Software
Partner
Signals and Software Limited
VoicePump
(Formerly Analogical Systems)
Lake Communications
Surf Communication Solution, Ltd.
http://www1.motorola-dsp.com/3rd/3rdparty.html
Description Contact
Embedded communications software including speech coders, www.sasl.com
modems, and echo cancellers for applications such as cellular and
PCS telephones, pagers, and wireless basestations.
Off-the-shelf licensable software modules suitable for use in the http://www.voicepump.com/index.html
wireless communications, satellite communications, networking,
and computer industries.
Lake Genus suite of DSP algorithms provide many common http://www.lakecommunications.com
modem and vocoder combinations using a common API, enabling
easy integration into products.
Advanced universal port solution for converged packet voice, http://www.surf-com.com
packet fax, V.9x modems, and high-speed data services.

Motorola Development Tools

Part Number Description
DSPTOOLSCD DSP56300 Family Simulator/Assembler/Librarian/C Compiler for IBM PC, SUN-4, and Hewlett-Packard Series 700
CDDSP56300/D DSP56300 Training CD
DSP56301ADM DSP56301 Applications Development Module
DSP56303EVM DSP56303 Evaluation Module
DSP56L307EVM DSP56L307 Evaluation Module
DSP56309EVM DSP56309 Evaluation Module
DSP56311EVM DSP56311 Evaluation Module
DSP56321EVM DSP56321 Evaluation Moduleavailable 4Q2001
MSC8101ADS MSC8101 Application Development Systemavailable 3Q2001
DSPCOMMAND 16-, 24-, 32-bit Command Converter Board which allows the host to talk with DSP target system via OnCE/JTAG port
DSPCOMMPCI Command Converter with PCI Host Interface
DSPCOMMANDUSB Command Converter with SBUS Host Interface
DSPCOMMETHERNET Command Converter with Ethernet Host Interface
DSPCOMMPARALLEL Command Converter with Parallel Port Host Interface
DSPPCHOST PC-Compatible Host Interface Board
DSP2UN4HOST Sun-4 Host Interface Board

17
Third Party Tools http://www1.motorola-dsp.com/3rd/3rdparty.html
Tools Description Partner
Real-Time Operating System Eonic Systems
Embedded Power Corporation
Precise Software Technologies
Wind River Systems
Integrated Development Environment Green Hills
MetroWerks
Signalogic
Tasking
Optimizing Compilers / Assembler / Linker Green Hills
Tasking
Wind River Systems
Debugger Domain Technologies
Green Hills
Precise Software Technologies
Tasking
Wind River Systems
Simulator Precise Software Technologies
Tasking
Wind River Systems
DSP Algorithm Development Mathworks
Hyperception
System Simulation and Verification Cadence
Mentor Graphics
Synopsys
Hardware Debug Connections/ Analyzers Corelis/HP
Macraigor Systems
Signalogic
Wind River Systems
Hardware Development Tools CDA Systems
P&E Microcomputer Systems
United Electronic Industries
White Electronic Designs
18
Contact
www.eonics.com
http://www.embeddedpower.com/
www.psti.com
www.windriver.com
www.greenhills.com
www.metrowerks.com
http://www.signalogic.com
http://www.tasking.com
www.greenhills.com
http://www.tasking.com
www.windriver.com
http://www.domaintec.com
www.greenhills.com
www.psti.com
http://www.tasking.com
www.windriver.com
www.psti.com
http://www.tasking.com
www.windriver.com
http://www.mathworks.com
http://www.hyperception.com
http://www.cadence.com/alta
www.mentorgraphics.com
www.synopsys.com
http://www.corelis.com/
www.macraigor.com
http://www.signalogic.com
www.windriver.com
www.cdasys.com
www.pemicro.com
www.ueidaq.com
www.whiteedc.com
Network Memory Products
CAMs (Content Addressable Memory)
Pin Prod
Device No. Organization VDD Package Speeds Description
Count Status
MCM69C432 16K x 64 3.3 V 100 TQ (TQFP) 20 ns Now Content addressable memory for communication
applications. 16K connections, 180 ns match time.
MCM69C433 100 TQ (TQFP) 15 ns Now 66 MHz for PowerQUICC II applications. 240 ns
match time.
MCM69C232 32K x 36 3.3 V 100 TQ (TQFP) 20 ns Now Content addressable memory for communication
applications. 16K connections, 160 ns match time.
MCM69C233 100 TQ (TQFP) 15 ns Now 66 MHz for PowerQUICC II applications. 210 ns
match time.

Integrated Cache Solutions

Pin Prod
Device No. Organization VDD Package Speeds Description
Count Status
MPC2605 32K x 72 3.3 V 241 ZP (PBGA) 83 / 66 MHz Now Integrated L2 cache for PowerPC processors. One
component for 256KB, two for 512KB, and four for
1MB L2 cache solution.

Communications Application-Specific Standard Products

Calling Line I.D.
Device Description Leads-Package Samples Production Document No.
MC14LC5447A Calling Line I.D. Receiver with Ring Detector 16-Lead PDIP, Now Now MC14LC5447/D
16-Lead SOG

ISDN
Device Description Leads-Package Samples Production Document No.
MC145572 ISDN U-Interface Transceiver II 44-Lead PLCC, Now Now MC145572/D
44-Lead TQFP
MC145572A ISDN U-Interface Transceiver II with Micro Interruptions 44-Lead PLCC, Now Now Note 1
Feature 44-Lead TQFP
MC145574A ISDN S/T-Interface Transceiver II 28-Lead SOG, Now Now MC145574/D
32-Lead TQFP
MC145576 ISDN Single-Chip NT1 44-Lead TQFP Now Now MC145576/D

Universal Digital Loop Transceivers

Device Description Leads-Package Samples Production Document No.
XC145423 UDLT1 Mode: Provides synchronous full-duplex 80 Kbps 28-Lead SOIC, Now Now MC145423/D
voice and data communication in a 1B+1D format on a 28-Lead TSSOP
single twisted pair up to 2 km. Single 5 V power supply,
protocol independent.
UDLT2 Mode: Provides synchronous full-duplex
160 Kbps voice and data communication in a 2B+2D
format for ISDN compatibility on a single protocol
independent.

19
Voice and Data Coding
Device Description Leads-Package Samples Production Document No.
MC14LC5480 5.V PCM Codec-Filter 20-Lead PDIP, 20-Lead SOG, Now Now MC14LC5480/D
20-Lead SSOP,
20-Lead TSSOP
MC145481 3 V PCM Codec-Filter 20-Lead SOG, Now Now MC14LC5481/D
20-Lead SSOP,
MC145482 5 V Linear Codec-Filter Now Now MC145482/D
20-Lead TSSOP
MC145483 3 V Linear Codec-Filter Now Now MC145483/D
MC145484 5 V PCM Codec-Filter Now Now MC145484/D
MS140131KT Short Loop Dual PCM Codec-Filter/SLIC N/A Now Now MS140131KT/D
Chipset with GCI
MS140132KT Short Loop Dual PCM Codec-Filter/SLIC N/A Now Now MS140132KT/D
Chipset with SPI

Development Tools
Device Description Key Device Production Document No.
MC14LC5480EVK PCM Codec-Filter Evaluation Kit MC14LC5480, MC145481, Now MC14LC5480EVK/D
MC145482, MC145483,
MC145484
MC145537EVK ADPCM Codec Evaluation Kit MC14LC5540 Now MC145537EVK/D
MC145572EVK ISDN U-Interface Transceiver Evaluation Kit MC145572 Now Note 1
MC145574EVK ISDN S/T-Interface Transceiver Evaluation Kit MC145574 Now Note 1
MC145576EVK ISDN Single-Chip NT1 Evaluation Kit MC145576 Now Note 1
MC145572DRV Driving Board for the MC145576EVK for Smart NT1 MC145576 Now Note 1
Evaluation
Hipster Hipster Reference Design for SOHO Router MC145572, MC145574, Now Note 1
MPC850DH
Note 1: For details or preliminary document, contact your NCSG regional marketing representative.

End-Of-Life Devices
PowerPC End of Life
Device Last Buy Date Last Ship Date Replacement
MPC603EFE133LN 1/24/01 6/30/01 MPC603RRXLC/XPC603RZTLC
MPC603ERX133LN 1/24/01 6/30/01 MPC603RRXLC/XPC603RZTLC
XPC740P 3/14/02 9/14/02 XPC745B
XPC750P 3/14/02 9/14/02 XPC755B

Networking and Communications

Device Last Buy Date Last Ship Date Replacement
XPC821 12/30/01 6/29/02 N/A
MC68824 2/28/02 8/31/02 N/A
MC68QH302 2/21/01 8/21/01 N/A
XPC801 2/9/01 8/9/01 N/A

20
Network Memory
Device Last Buy Date Last Ship Date Replacement
MCM67A618BFN 12/21/01 6/21/02 N/A
MCM67B618BFN 12/21/01 6/21/02 N/A
MCM67H618BFN 12/21/01 6/21/02 N/A
MCM67M618BFN 12/21/01 6/21/02 N/A
MCM63Z736TQ 3/24/01 9/24/01 N/A
MCM63Z737TQ 3/24/01 9/24/01 N/A
MCM63Z818TQ 3/24/01 9/24/01 N/A
MCM63Z819TQ 3/24/01 9/24/01 N/A
MCM69F536CTQ10 3/11/01 9/11/01 N/A
MCM69F618CTQ10 3/11/01 9/11/01 N/A
MCM69P536CTQ 3/11/01 9/11/01 N/A
MCM69P618CTQ 3/11/01 9/11/01 N/A
MCM69T618TQ 1/15/02 7/16/02 N/A
MCM63R736FC 1/23/02 7/24/02 N/A
MCM63R818FC 1/23/02 7/24/02 N/A
MCM63R836FC 1/23/02 7/24/02 N/A
MCM63R918FC 1/23/02 7/24/02 N/A
MCM67Q909ZP 1/10/02 7/11/02 N/A
MCM67Q709AZP 1/10/02 7/11/02 N/A
MCM69R818CZP 3/1/01 9/1/01 N/A
MCM69R736CZP 3/1/01 9/1/01 N/A
MCM63D736ATQ 1/27/02 7/27/02 N/A
MCM6343 12/7/00 6/7/01 N/A
MCM63F733ATQ 3/24/01 9/24/01 N/A
MCM63P733ATQ 3/24/01 9/24/01 N/A
MCM64E836FC 1/23/02 7/24/02 N/A
MCM64E918FC 1/23/02 7/24/02 N/A

Codecs, Transceivers, and Modems

Device Last Buy Date Last Ship Date Replacement
MC145406DWR2 3/1/05 9/1/05 N/A
MC145407DW 3/1/05 12/31/05 N/A
MC145505DWR2 3/1/05 12/31/05 N/A
MC145554DWR2 3/1/05 12/31/05 N/A
MC145557DW 3/1/05 12/31/05 N/A
MC145564DWR2 10/18/05 4/18/06 N/A
MC145406P 3/1/05 12/31/05 N/A
MC145407P 3/1/05 9/1/05 N/A
MC145506P 3/1/05 12/31/05 N/A
MC14LC5540P 10/18/05 4/18/06 N/A
MC145583VF 3/1/05 9/1/05 N/A
MC145443BDWR2 3/1/05 12/31/05 N/A
MC145442BDW 3/1/05 12/31/05 N/A
MC143416PB 1/31/05 1/31/06 N/A
MC14LC5472FE 10/18/05 4/18/06 N/A
MC145740FEL 10/18/05 4/18/06 N/A
MC145740F 10/18/05 4/18/06 N/A
MC145444DW 10/18/05 4/18/06 N/A

21
Microprocessor Part Number Schemes
PowerPC 1xx, 6xx, and 7xx Processor Part Numbering Scheme
MPC 603 R RX 300 L C
Product Code 100, 600, or 700 Series Device Package Frequency Application Modifier Revision
PPC Sample (106, 107, 603, 740, 750, 7400) (see page 4) 23 Digits Bus Ratio
XPC XC Qualified C 2:1 (106 Only)
Part/Module Modifier
MPC Qualified D 5:2 (106 Only)
A 106/107/740/750 Alpha (Original)
PPE EC-Sample L Full Spec all Modes
E 603 Enhanced Performance
XPE XC Qualified EC CPU Temp./Spec.
P 740/750 Enhanced and Lower Voltage
MPE Qualified EC CPU N 65C, 2.1 V
R 603e in HIP3 Process
P 65C, 2.05 V (750); 2.15 V (7400)
(not used for 7400)
R 105C, 2.05 V
T Ext. Temp. (40 to 105C Tj)

MPC8xx PowerPC Processor Part Numbering Scheme

XPC 860 EN C ZP 66 D4
Product Code 800 Series Device Temp. Range Frequency Die Mask Revision
PPC Prototype Sample 823 0 to 95C Tj 50/66/80 MHz 823 B2T
KXPC Sample Pack (210) 850 C 40 to 95C Tj 850 BT/BU
Part/Module Modifier Package
XPC Engineering Production 855T 855T D4
DE Dual Channel (w/Enet) 823 256-Lead ZT
MPC Qualified 857T 857T 0
DP Dual Channel (10/100, Multi-HDLC, ATM) 823 256-Lead ZC
860 860 D4
DT Dual Channel (10/100, Multi-HDLC, ATM) 823 256-Lead VF
862 862 0
EN Four Channel (w/Enet) 850 256-Lead ZT
P Four Channel (10/100, Multi-HDLC, ATM) 855T 357-Lead ZP
SR Four Channel (w/Enet, Multi-HDLC, ATM) 857T 357-Lead ZP
T Four Channel (10/100, Multi-HDLC, ATM) 860 357-Lead ZP
862 357-Lead ZP

MPC8xxx PowerPC Processor Part Numbering Scheme

XPC 8240 L ZU 200 C
Product Code 8240 Series Device Core Volt/Temp. Spec. (Optional) Package Frequency Die Mask Revision
PPC Prototype Sample 8240 0 to 95C Tj (see page 4) 23 Digits
KXPC Sample Pack (210) C 40 to 95C Tj
KMPC Sample Pack (210) L 0 to 105C Tj
XPC Engineering Production T Ext. Temp. (40 to 105C Tj)
MPC Qualified R 2.52.75 V, 105C

MPC8xxx PowerQUICC II Processor Part Numbering Scheme

XPC 8260 C ZU IFB B3
Product Code 8xxx Series Device Package CPU/CPM/Bus Speed Core Voltage Die Mask Revision
PPC Prototype Sample 8260 Base 480-Lead ZU A 50 B 66 2.5 V +0.2, 0.1 0
KXPC Sample Pack (210) 8264 IMA Enabled C 75 D 83 V 1.8 0.1 V A
Temp. Range Junction
XPC Engineering Production 8265 PCI Option E 100 F 133 A1
0C TA to 105C Tj
MPC Qualified 8266 PCI+IMA G 150 H 166 B3
C 40C TA to 105C Tj
I 200 J 233
K 266 L 300
M 333

MC3xx Processor Part Numbering Scheme

MC68 EN 302 C PV 25 L
Product Code Part/Module Modifier 683xx Series Device Temp. Range Package Frequency Die Mask Revision
MC68 Full Spec. Product EN Ethernet 302 0 to 70C PV EN302 2 Digits 302 CT
XC68 Engineering Product LC Low Cost 360 C 40 to 85C PU LC302 360 L
XC68 Engineering Sample EM 360
KXC Sample Pack (210) RC 360
KMC Sample Pack (210) ZP 360

Networking DSP56300 Part Numbering Scheme

DSP 56303 VF 100 A
Product Code 56300 Series Device Package Frequency Die Mask Revision
XC XC Qualified 301, 303, L307, 309, (If applicable)
DSP MC Qualified 311, 321

Networking MSC8000 Part Numbering Scheme

MSC 8101 M 1375 B
Product Code 8000 Series Device Package MMACS Die Mask Revision
XC XC Qualified (If applicable)
MSC MC Qualified

22
World Wide Web and Documentation

Motorola SPS Product Design Center

http://www.motorola.com/semiconductors/webapp/DesignCenter

For Documentation Library, and links to our Product Catalog,

Product/Technology Sites, and Design Tools
Solutions
http://www.motorola.com/semiconductors/solutions/index.html

Support
http://www.motorola.com/semiconductors/support/index.html

News
http://www.motorola.com/semiconductors/news_center

Smart Networks from Motorola SPS

http://www.motorola.com/smartnetworks

23
DigitalDNA, Hipster, PowerQUICC, and PowerQUICC II are trademarks of Motorola, Inc.
The PowerPC name, the PowerPC logotype, and PowerPC 603e are trademarks of International Business Machines Corporation used by Motorola
under license from International Business Machines Corporation.
All brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders.

Motorola, Inc., 2001. All rights reserved.

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee
regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters
which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as
components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application
in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
HOW TO REACH US:
USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or
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