Professional Documents
Culture Documents
DOI 10.1007/s00170-003-1721-z
O R I GI N A L A R T IC L E
Received: 27 November 2002 / Accepted: 5 March 2003 / Published online: 10 January 2004
Springer-Verlag London Limited 2004
settings of the signicant factors. By using these optimal in any of the solder joints can lead to failure of the
settings, the printing performance can be improved and circuit, the screening process is regarded as the most
therefore the sigma level of the screening process can critical process in PCB manufacturing.
also be enhanced. Finally, some control strategies were The screening process is a manufacturing process that
recommended in reference to the experimental ndings transfers solder paste onto the solder pad of a PCB. The
in order to sustain the improvement of the sigma level. application method of solder paste is printing and the
The remainder of the paper is organised as follows: printing technique used is o-contact printing in which
Section 2 oers the background information about there is a snap-o distance between a stencil and a PCB.
the company and the screening process, and denes the The type of screening machine used to manufacture
problem of initiating DMAIC. Section 3 presents PSSD products is semi-automatic. As the squeegee sys-
the DMAIC approach in this study. Section 4 describes tem consists of the front and back blades, there are two
the details of the initial experiments and the further types of printing, front printing and back printing, as
experiments. Section 5 presents the recommended con- shown in Fig. 1. In current practice, both front and back
trol strategy and the predicted performance after using printing are used alternatively during printing.
the optimal settings. Finally, Section 6 concludes by During a printing process, two PCBs are placed side-
summarising the contribution of this study and oering by-side on the holder of a screening machine as shown in
suggestions for future research. Fig. 1. The solder paste is then manually placed onto a
stencil before printing. The front/back blade makes line
contact with the stencil and close contact with the given
2 Company and process background amount of solder paste. The solder paste is then rolled in
front of the front / back blade. In this way, solder paste
This case study was conducted in an electronic company is pressed against the stencil and transferred onto the
located at an industrial park in southern China. The solder pad through the stencil openings. The operation
company manufactures multi-layer PCBs using surface of a screening machine is shown in Fig. 2.
mount technology (SMT), which is a technique of
placing surface mount devices (SMDs) on the surface of
a PCB. SMDs are micro-miniature leaded or leadless 3 Five phases of the Six-Sigma approach
electronic components that are soldered directly to the
pads on the surface of the PCB. The major manufac- The ve core phases of the six-sigma approach are de-
turing processes in the company are solder screen, ne, measure, analyse, improve, and control. Therefore,
component placement, and solder reow. As any defect the six-sigma approach is also referred to as the DMAIC
approach. The details of these phases are as follows [2]: the U1 location, two points in the U2 location and one
In the dene phase, the specic problem is identied, point in the J1 location. The solder paste height on ve
and the project goals and deliverables are dened. In the PCBs is measured using the Cyberoptics Cybersentry
measure phase, a review of the types of measurement system every four hours. The gage repeatability and
systems and their key features is included. The nature reproducibility (R&R) of the measurement system was
and properties of data collection must be thoroughly veried before the study on the solder paste height was
understood by companies. In the analyse phase, specic conducted. The operators then recorded the solder paste
statistical methods and tools are used to isolate the key height in the SPC data record sheet, which is currently
pieces of information that are important to explaining being used by the company. Afterwards, the Xbar-R
the number of defects. In the improve phase, the key control chart is plotted. The sample of the SPC data
factors that cause the problem are discovered. In the record sheet currently being used by the company is
control phase, the processes that create the product or shown in Fig. 4.
service are controlled and monitored continuously in
order to ensure that the problem will not occur again.
The details of the DMAIC approach of this case study 3.3 Analyse phase
are as follows:
Currently, six semi-automatic screening machines are
used to manufacture the PSSD product. Therefore, the
3.1 Dene phase data on solder paste height of these six machines was
collected from the company, and a process capability
This project specically focuses on improvement of the analysis was conducted for these screening machines in
sigma level of the PCB screening process. In the order to analyse the current printing performance.
screening process, the solder paste volume (height) According to the analytical results, the process capa-
transferred onto the PCB is the most important bility in machine no. 12 was not satisfactory because the
factor that needs to be controlled carefully. This capability index Cp was only 1.021, which was less than
is because too little solder paste can cause open 1.33 (the four-sigma level). Moreover, another capability
circuits and too much solder paste can cause bridging index Cpk was 0.387. This showed that the screening
between solder pads in the subsequent processes. As a process was o-centre. As shown in the capability plot in
result, the solder paste height on the solder pads is Fig. 5, there was a high variance in the solder paste
identied as a critical-to-quality (CTQ) characteristic height and there was a mean shift in the height distri-
that needs to be controlled in a very precise way by bution.
the company.
Fig. 4 SPC data record sheet that might have inuence on the printing performance
and the further experiments were used to determine
the optimal settings of the signicant factors. The
details of the initial and the further experiments are as
follows:
Table 2 The levels of each factor in the further experiments speed of squeegee, blade type, and side of stencil were
signicant factors for the height variation. From the
Level 1 Level 2 Level 3
interaction plots for the height average shown in Fig. 9,
Solder paste viscosity <150 mPa.s >190 mPa.s / the interaction between solder paste viscosity and blade
Speed of squeegee 0.4 inch/sec 0.7 inch/sec 1 inch/sec type showed signicant inuence on the solder paste
Pressure of squeegee 18 bar 28 bar / printing performance. At high viscosity, the height dif-
Side of stencil Left Right / ference between the front and back blades was relatively
Blade type Front Back /
large, i.e. 0.36 mil. At low viscosity, however, the height
dierence between the front and back blades was rela-
A full factorial experiment was carried out, and the tively small, i.e. 0.05 mil. The interaction between the
whole experiment was completed in about two hours. speed of squeegee and blade type was also signicant. At
There were 48 types of printing, and two PCBs were high or medium squeegee speed, the height dierence
measured for each type of printing. In total, 96 PCBs between the front and back blades was large, i.e.
were measured, and 480 solder paste height data were 0.36 mil for high squeegee speed and 0.22 mil for med-
collected for analysis. The factors and their levels in the ium squeegee speed. At low squeegee speed, the front
further experiments are given in Table 2. The experi- and back printings gave similar printing performance.
mental conditions are as follows: (1) Room temperature: The height dierence was only 0.01 mil.
25C, (2) Room humidity: 58%, (3) Machine number: The higher order interactions were not considered for
12, (4) Stencil number: 25 (new), (5) Number of opera- further analysis because the eects of these interactions
tors: 1, (6) Model: Neptune, (7) Snap-o distance: nearly were not signicant. As the data on solder paste height
zero, (8) Point locations: J1, U1, U1, U2, U2, and (9) was subjected to analysis of variance (ANOVA), the
Specication: (4.57) mil. signicant eects can also be conrmed by ANOVA.
The ANOVA table is shown in Table 3.
From the analytical results, the solder paste viscosity,
4.3 DOE results speed of squeegee, blade type, and side of stencil were
signicant factors for the height variation. Therefore, low
To study the inuence of these factors on the solder solder paste viscosity (<150 mPa.s), low speed of squee-
paste height and to draw conclusions, the main eect gee (0.4 inch/sec), front blade, and right side of stencil
plots and the interaction plots were used. A main eect could result in small height variation. By using these
is dened as the change in response produced by a optimal settings, the variation of the solder paste height
change in the level of the factor, and an interaction be- can be reduced. After reducing the height variation, the
tween the factors occurs when the dierence in response sigma level of the screening process can be improved.
between the levels of one factor is not the same at all
levels of the other factors [6, 7]. The responses for the
plots were the average of ve data points (height aver- 5 Recommended control strategy and predicted
age) and the natural logarithm of the variance of ve performance
data points (height variation).
From the main eect plots shown in Fig. 7, the After conducting the designed experiments, some con-
pressure of squeegee, blade type, and side of stencil were trol strategies for the critical-to-quality factors in the
signicant factors for the height average. From the main further experiments were recommended. The brief con-
eect plots shown in Fig. 8, the solder paste viscosity, clusions for each factor are as follows:
Solder paste viscosity According to the experimental pressure should be increased progressively as the
results, low solder paste viscosity (<150 mPa.s) can duration of using the stencil increases. By doing this,
reduce height variation within the board and hence the squeegee pressure can compensate the deforma-
can achieve better printing performance in the tion of stencil as the duration increases.
screening process. It is recommended solder paste Side of stencil It is suggested that the company record
viscosity be maintained at a low level (150 mPa.s) and the duration of using the squeegee so that the corre-
that it be monitored it by the control chart over time. lation between the side of the stencil and the age of
Speed of squeegee The relatively low squeegee speed the squeegee on the inuence of the solder paste
(0.4 inch/sec) is recommended as far as this low speed height can be studied.
can optimise the printing performance of the screen- Blade type As machine settings such as squeegee speed
ing process. The low printing speed can adversely af- and squeegee pressure can be adjusted individually
fect the production yield. Therefore, the production for the front blade and the back blade, the two blades
yield should be kept above an acceptable level as the can act as two independent printing machines.
printing speed decreases. Therefore, it is recommended that the company study
Pressure of squeegee A low squeegee pressure (18 bar) and optimise the front and back blades indepen-
should be set for a new stencil and the squeegee dently.
Table 4 Comparison of printing performance before & after using so that the impact of the DMAIC approach can be
optimal settings maximised.
Mean S.D. Cp Cpk Sigma ppm COQ In the screening process, many factors can aect the
level solder paste printing performance; however, due to time
and nancial constraints, only ve factors were included
Before 4.974 0.408 1.021 0.387 1.162 122,173 >40% in the designed experiments: solder paste viscosity, speed
of sales of squeegee, pressure of squeegee, side of stencil, and
After 5.750 0.211 1.975 1.975 5.924 3.4 <1%
of sales blade type. According to Marcoux [3], the force, speed,
stiness, angle, and length of the squeegee are critical in
the solder paste printing. It is therefore recommended
To conclude, the optimal settings are low solder paste that the company consider these factors in the designed
viscosity (<150 mPa.s), low speed of squeegee (0.4 inch/ experiments as well in order to identify the eect of these
sec), right side of stencil, and front blade type. By using factors on the printing performance. It is also suggested
these optimal settings, the variation of the solder paste that the company extend the designed experiments to
height can be reduced, and therefore the sigma level of dierent machine and stencil combinations, so that the
the screening process on machine no. 12 can be im- optimal settings can be applied to all machine and stencil
proved. combinations. For recent advances in statistical quality
The comparison of the printing performance before techniques, the readers are recommended to refer to
and after using the optimal settings is shown in Table 4. Tsung and Shi [8], Tsung et al. [9], Tsung [10], and Tsung
After using the optimal settings, the sigma level of the and Apley [11].
screening process can be improved from 1.162 to 5.924.
Acknowledgement The authors would like to thank the company
This shows that a nearly six-sigma level performance can for the opportunity to conduct this case study and also the tech-
be achieved. According to Harry and Schroeder [2], the nical sta for their assistance, ideas and experience throughout the
defect level in parts per million (ppm) would become 3.4 study. The support of Florent Nasse, Karen Chan, and Joe Wong is
and the cost of quality (COQ) would be less than one acknowledged. The authors would like to thank the editor, the
anonymous referees, and Dr. Richard Linn for their valuable
percent of the sales. As a result, after using the optimal comments. This paper is derived from the winning project of 2000
settings, the cost of quality for the company is signi- Quality Management Student Project Competition supervised by
cantly reduced. Dr. Fugee Tsung. His research was supported by RGC Competi-
tive Earmarked Research Grants HKUST6073/00E and
HKUST6011/01E.
6 Conclusion
References
In the improve phase of the DMAIC approach, DOE
was used to identify the optimal settings of the criti- 1. Woodgate RW (1996) The handbook of machine soldering:
cal-to-quality factors. By using the optimal settings, SMT and TH. Wiley, New York
2. Harry M, Schroeder R (2000) Six Sigma: the breakthrough
the sigma level of the screening process could be im- management strategy revolutionizing the worlds top corpora-
proved, and hence a nearly six-sigma performance can tions. Doubleday, New York
be achieved. Undoubtedly, DOE is the core statistical 3. Marcoux PP (1992) Fine pitch surface mount technology:
tools for six-sigma improvement. It is recommended quality, design, and manufacturing techniques. Van Nostrand
Reinhold, New York
that successful implementation of the DMAIC ap- 4. Hinch SW (1988) Handbook of surface mount technology.
proach in the screening process should be translated to Longman Scientic and Technical, New York and Wiley, New
similar manufacturing processes in the PCB industry, York
531
5. Hwang JS (1989) Solder paste in electronic packaging: tech- 9. Tsung F, Shi J, Wu CFJ (1999) Joint monitoring of PID-con-
nology and applications in surface mount, hybrid circuits, and trolled processes. J Qual Tech 31:275285
component assembly. Van Nostrand Reinhold, New York 10. Tsung F (2000) Statistical monitoring and diagnosis of auto-
6. Wu CFJ, Hamada M (2000) Experiments: planning, analysis, matic controlled processes using dynamic PCA. Int J Prod Res
and parameter design optimization. Wiley, New York 38:625637
7. Montgomery DC (2001) Introduction to statistical quality 11. Tsung F, Apley DW (2002) The dynamic T-squared chart for
control. Wiley, New York monitoring feedback-controlled processes. IIE Trans 34:1043
8. Tsung F, Shi J (1999) Integrated design of run-to-run PID 1054
controller and SPC monitoring for process disturbance rejec-
tion. IIE Trans 31:517527