Birla Institute of Technology & Science, Pilani

Hyderabad Campus
Instruction Division
Second Semester 2017-2018
Course Handout (Part-II)
08-01-2018

In addition to Part I (General Handout for all courses appended to the Time Table), this
portion gives further specific details regarding the course.

Course No. : CS/ECE/EEE/INSTR F241

Course Title : Microprocessor Programming & Interfacing
Instructor-in-charge : Soumya J
Team of Instructors : Runa Kumari, Syed Ershad Ahmed, Sandeep Kumar, Ramakant,
Anil Kumar U, Sravan kumar V, Poorna Lakshmi U

Course Description : 8086 - 80486 Programmers model of processor, processor architecture;

Instruction set, modular assembly programming using subroutines, macros etc.; Timing
diagrams ; Concept of interrupts: hardware & software interrupts, Interrupt handling
techniques, Interrupt controllers; Types of Memory & memory interfacing; Programmable
Peripheral devices and I/O Interfacing ; DMA controller and its interfacing: Design of
processor based system.

Text Book:
T1: Barry B Brey, The Intel Microprocessors .Pearson, Eight Ed. 2009.

Reference book:
R1: Douglas V Hall, Microprocessor and Interfacing, TMH, Second Edition.

Detailed Course Plan:

Lect. Learning Objectives Topics to be covered Reference to Text

No.
1. Introduction to Compute Architecture, Chapter 1 (T1), Chapter 1 (R1)
Microprocessor and Memory & I/O organization,
Microcomputers CISC/RISC processors

2-3 Microprocessor & its 8086 Microprocessor Chapter 2 (T1), Chapter 2

architecture (R1)
4-6 Assembly Addressing Modes Chapter 3 (T1)
Programming
7-12 Assembly Instruction Set & ALP Chapter 4-6, 8 (T1)
Programming
13-15 8086/8088 Hardware Pin Out, Modes of operation, Chapter 9 (T1)
 Specifications Clocking, Buses
16-19 Memory Interface Memory Devices, Address Chapter -10 (T1)
Decoding- Mmeory
Interface 8086- 80386
20-23 I/O Interfacing Basic I/O interfacing (I/O 11.1, 11.2 (T1)
mapped I/O and Memory
mapped I/O)
I/O port address decoding
24-26 Interrupts Types of interrupts, Vector 12.1, 12.2, (T1)
tables, Priority Schemes
27-29 Programmable 8255,8254,ADC,DAC, 8259 11.3-11.6 & 12.3 -12.6 (T1)
Peripheral Devices
30-31 DMA controller 8Basic Operation, 8237, Chapter -13 (T1)
Shared Bus, Disk Memory
Systems, Video Displays
32-33 Bus Interface ISA, PCI, Com, USB,AGP Chapter 15 (T1)
34-36 Advanced Processors 80186-80286 Chapter 16 (T1), Chapter 15
(R1)
37-39 Advanced Processors 80386-80486 Chapter 17 (T1), Chapter 15
(R1)

Evaluation Scheme:

E Evaluation Duration Weightage Marks Date & Time Nature of

C Component Component
No
1. Mid Exam 90 min 25% 75 9/3, 9.00-10.30AM Closed Book
2. Lab 2hrs/week 25%(20+5) 75 Will be announced Open+Closed
book
3. Quizzes - 10% 30 Will be announced Closed Book
4. Comprehensive 180 min 40% 120 10/05 FN Closed Book
examination
Totals 100% 300

Chamber Consultation Hour: Will be announced in the class.

Notices: Notices concerning to this course will be on CMS.

Soumya J
Instructor-in-Charge
 BIRLA INSTITUTE OF TECHNOLOGY AND SCIENCE, PILANI
INSTRUCTION DIVISION
SECOND SEMESTER 2017-18
Course Handout (Part II)
Date: 23/11/2017

In addition to Part I (General Handout for all courses appended to the time table) this portion gives further
specific details regarding the course.

Course No. : BITS F415

Course Title : Introduction to MEMS
Instructor-in-charge : Prof. Sanket Goel
Instructor : Prof. Sanket Goel and Dr. Satish Kumar Dubey

1. Scope and Objective of the Course:

The course introduces the basic concepts in MEMS (Micro Electromechanical Systems) with a view to address
a class of students from science and engineering disciplines. The discussion on topics like MEMS design,
Microfabrication, Microfluidics, Microrobotics and Microsensors have been structured in the course plan. The
objective of the course is to equip the students from various aspects and with basic knowledge of the area of
MEMS.

2. Text Book:
Tai-Ran Hsu, MEMS and Micro systems Design and Manufacture, Tata McGraw Hill, 2002
Reference Books:
i. G.K. Ananthsuresh et al ,’Micro and Smart Systems’, Wiley, India, 2010.
ii. Nitaigour P. Mahalik, MEMS, Tata McGraw Hill, 2007
iii. Marc Madou, Fundamentals of Microfabrication, CRC Press, 2002.
iv. Chang Liu, Foundation of MEMS, Pearson Education Inc., NJ, 2006
v. Nadim Maluf, Introduction to Microelectromechanical Systems Engineering, Artech House, 2000.
vi. Stephen D. Senturia, Microsystem Design , Kluwer Academic Publishers, 2001
vii. Gad- el-Hak, Introduction to MEMS, CRC Press, 2010.

3. Course Plan:

# Learning Objectives Topic Lectures Chap. Sec.

1 Introduction – history, fundamentals, components, landmark 2 Ch. 1(T), Ref
interventions, career opportunities, research areas in MEMS (b)
2 To understand MEMS Basic Concepts of MEMS Design and 1 Ch. 3 Ref (a)
fundamentals and Fabrication
components
3 To understand basic Scaling Laws – geometry, various forces, 2 Ch. 9(T)
MEMS governing laws fluid mechanics etc
4 To understand Microsensors & Microactuatars: working 4 Ch. 2, (T)
Microsensors & principles, design, applications
Microactuatars
5 To understand MEMS Microfabrication Processes I - - 3 Ch. 7 (T), Ch.7
fabrication processes lithography Ref. (a)
6 To understand MEMS Microfabrication Processes II - – soft- 4 Ch. 3(T), Ch 8
fabrication processes lithography, 3D printing 7Ref. (a)
7 To understand how MEMS Micromanufacturing – fundamental 3 C8h. 3 (T) Ch.
can be harnessed for design principles, MEMS integration, 9 Re9f. (a)
micromanufactering applications
 8 To understand COMSOL Modeling in MEMS – COMSOL 4 Ch. 4, 5, 6 (T)
based MEMS modelling fundamentals, design principles,
examples
9 To understand Meteorology in MEMS – fundamentals of 1 Class-notes
meteorological applications Meteorology, need for MEMS, recent
for MEMS applications
10 To understand electronics Electronics in MEMS – integration of IC, 2 Chapter 7 (T)
components in MEMS embedded systems with MEMS devices,
with few design principles and examples
11 To RF components in RF MEMS – Components, Biasing, 2 Ch.8 Ref (b),
MEMS Packaging, Microfabrication, Reliability, Class notes
Applications
12 To RF components in Optical MEMS – need for optical MEMS, 1 Ch.7 Ref (b),
MEMS Components, Biasing, Integrated optics, Class notes
Reliability, Applications
13 To understand Microfluidics – fundamentals, design 4 Ch. 5 Ref (a),
Microfluidics parameters, fabrication aspects, Class Notes
characterization, applications
14 To understand Microsystem design – integration 2 Ch.10 Ref. (a)
Microsystem design constraints, industrial applications,
considerations troubleshooting
15 To understand MEMS MEMS Packaging – function of Self study Ch. 11 Ref (a)
packaging packaging, requirements, integration
aspects, advantages, applications
16 Lab sessions 5
Total 40

4. Evaluation Scheme:

Weightage
Component Duration % Marks Date &Time Remarks
Midterm 1Hr30m 20 60 Closed Book
Comprehensive 3 Hr. 40 120 Closed Book
Exam
Quizzes 15 45 During Lecture / Closed Book
Tutorial
Lab 10 30
Project 15 45 To be announced
Total 100 300

5. Lab Experiments

i. Introduction to the software COMSOL and its application in MEMS

ii. Simulation of MEMS Actuators using COMSOL
iii. Simulation of MEMS Sensors using COMSOL
iv. Microfluidic simulations using COMSOL: Laminar Flow; Convection diffusion; Conjugate heat transfer
v. Development of Micro-device using FDM based 3D printer.
vi. Study the customized filament making for FDM 3D printer
vii. Development of Micro-device with the photolithography process using dry film photoresist
viii. Development of Micro-device using poly-di-methyl-siloxane (PDMS) based Soft-lithography
ix. Development of paper Micro-device using solid wax printer
x. Development of paper / polymer Micro-device using Xurography
6. Chamber Consultation Hour: To be announced in the class.
7. Make-up Policy: There will no make-ups unless for genuine reasons. Prior Permission of the Instructor-in-
Charge is required to take a make-up for any component.

8. Notices: EEE/MechE Notice Board and CMS

Instructor-In-Charge

BITS F415