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RAID Subsystem DVA-08E

DVA-08E SCSI Lite Series

en Installation Manual
RAID Subsystem DVA-08E | Installation Manual Table of Contents | en 3

Table of Contents
1 Warnings and Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Management Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.1 RS-232C Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.2 Ethernet Port: Telnet Access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.3 Ethernet Port: Using RAIDWatch Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2.4 Possible RAIDWatch Connection: DAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3 Enclosure Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.1 Chassis Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.2 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.3 Front Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.4 Hard Drive Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.5 Rear Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.6 Backplane Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4 Subsystem Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1 Chassis Ears . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.2 LED Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.3 Drive Trays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.4 The RAID Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.5 Power Supply Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4.6 Cooling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5 Subsystem Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.1 I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.2 LED Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.3 Firmware and Bosch RAIDWatch GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.4 Audible Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.6 Hot-Swappable Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.6.1 Hot-Swap Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.6.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3 Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 21
3.1 Installation Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 21
3.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 22
3.2.1 Precautions and Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 22
3.2.2 Static-Free Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 23
3.3 General Installation Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 24
3.4 Unpacking the Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 24
3.5 Rackmounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 25
3.6 Drive Tray Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 25
4 Subsystem Operation and Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 27
4.1 Subsystem Monitoring Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 27
4.2 Status-indicating LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 28
4.2.1 Brief Overview of the LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 28
4.2.2 LED Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 28
4.2.3 Drive Tray LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 29
4.2.4 Controller Module LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 30
4.2.5 LAN Port LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 30
4.2.6 PSU LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 31
4.2.7 Cooling Module LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 32
4.3 Audible Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 33
4.4 I2C Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 33
5 Subsystem Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1 SCSI Connection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1.1 SCSI Port on the Controller Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

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5.1.2 SCSI Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 34


5.2 Host Connection Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 35
5.2.1 Basic Configuration Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 35
5.2.2 Single Host Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 35
5.3 Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 36
5.3.1 Power On Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 36
5.3.2 Power On Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 36
5.3.3 Power On Status Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 37
5.4 Power Off Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...... . . . 38
6 Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.1.1 About Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.1.2 General Notes on Component Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.2 Replacing Controller Module Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.2.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.2.2 Notes on Controller Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.2.3 Removing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.2.4 Replacing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.3 DIMM Module Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.1 DIMM Module Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.2 DIMM Module Replacement Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.4 Replacing a Faulty PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.4.1 Notes on PSU Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.4.2 Replacing the PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.5 Replacing a Failed Cooling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6.5.1 Notes on Cooling Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6.5.2 Replacing a Cooling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6.6 Drive Tray Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.6.1 Notes on Hard Drive Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.6.2 Replacing a Failed Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7 Appendix: Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.1 Controller Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.2 Drive Tray Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.3 Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.4 Cooling Module Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.5 RAID Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.6 Fault Tolerance Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8 Appendix: Spare Parts and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
8.1 Spare Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
8.2 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
9 Appendix: Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.1 SCSI Port: VHDCI Connector Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.2 COM1 Cable: DB9 and Audio Jack Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
9.3 Null Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
9.4 Ethernet Port Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
9.5 Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

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RAID Subsystem DVA-08E | Installation Manual Warnings and Certifications | en 5

1 Warnings and Certifications

1.1 Warning
A shielded power cord is required in order to meet FCC emission limits and also to prevent
interference to nearby radio and television reception.
Use only shielded cables to connect I/O devices to this equipment. You are cautioned that
changes or modifications not expressly approved by the party responsible for compliance
could void your authority to operate the equipment.

1.2 Safety Precautions


Precautions and Instructions
• Prior to powering on the subsystem, ensure that the correct power range is being used.
• The RAID subsystems come with drive bays. Leaving any of these drive bays empty will
seriously affect the efficiency of the airflow within the enclosure, and will consequently
lead to the system overheating, which can cause irreparable damage.
• If a module fails, leave it in place until you have a replacement unit and you are ready to
replace it.
• Airflow Consideration: The subsystem requires an airflow clearance, especially at the
front and the rear side.
• Handle subsystem modules using the retention screws, extraction levers, and the metal
frames/faceplates. Avoid touching PCB boards and connector pins.
• To comply with safety, emission, or thermal requirements, none of the covers or replace-
able modules should be removed. Make sure that during operation, all enclosure modules
and covers are securely in place.
• Be sure that the rack cabinet that the subsystem chassis is to be installed provides suffi-
cient ventilation channels and airflow circulation around the subsystem.
• Provide a soft, clean surface to place your subsystem on before working on it. Servicing
on a rough surface may damage the exterior of the chassis.
• If it is necessary to transport the subsystem, repackage all disk drives separately. If using
the original package material, other replaceable modules can stay within the enclosure.

ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use of a
grounded wrist strap and an anti-static work pad are recommended. Avoid dust or debris in
your work area.

1.3 Certification
FCC Class B Radio Frequency Interference Statement
FCC (applies in the U.S. and Canada)
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22
Class B). These limits are designed to provide reasonable protection against harmful interfer-
ence when the equipment is operated in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
this user’s guide, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turn-

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ing the equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
This device complies with Part 15 of FCC Rules. Operation is subjected to the following two
conditions: 1) this device may not cause harmful interference, and 2) this device must accept
any interference received, including interference that may cause undesired operation.

This device is in conformity with the EMC.

CB (Certified Worldwide)
This device meets the requirements of the CB standard for electrical equipment with regard to
establishing a satisfactory level of safety for persons using the device and for the area sur-
rounding the apparatus. This standard covers only safety aspects of the above apparatus; it
does not cover other matters, such as style or performance.

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2 Introduction
The flexible, high performance RAID subsystem combines SCSI-320’s high-speed data transfer
rate with low-cost SATA-II hard disk solution, the subsystem offers the best storage return on
investment (ROI.)
The subsystem is easy to use. All modules including the drive trays, controller module, cooling
modules and PSUs can be access from either subsystem front or rear. Most of these modules
are hot-swappable and can be served while the subsystem is still running.
The subsystem’s embedded firmware offers the same protection and maintenance functional-
ities as those designed for an enterprise-level RAID solution. The subsystems provide unprece-
dented configuration flexibility and allow for the customization of storage subsystems to meet
specific demands. It is a rigorous and durable subsystem that can be easily configured and
operated.
Fully featured RAID redundancy (which provides advanced data protection) ensures that the
complete range of RAID levels (RAID 0, 1(0+1), 3, 5, 10, 30, and 50) is supported by the sub-
system. Bosch implements Smart Technologies (IOSmart, DrvSmart and SysSmart) into the
intelligent firmware further guarantees the overall availability of valuable data.
IT managers using the RAID subsystems will be able to save the totally investment cost and
rapidly develop a comprehensive storage array.

2.1 Product Overview


The RAID subsystem comes in a 2U-high rack-mountable chassis. The SATA-based RAID sub-
system has one (1) 320MB/second SCSI (SCSI-320) host channel and provides RAID protec-
tion to the data stored in the eight (8) hot-swappable, SATA-II hard drives. The 2U-profile
subsystem is equipped with redundant and hot-swappable cooling modules and a single
power supply module. The modular nature of the subsystem and the easy accessibility to all
major components ensure the ease of subsystem maintenance.
All controller functionality is managed by robust and easily upgraded firmware. Arrays created
using different versions of firmware are compatible and data stored in all Bosch-based sub-
systems can be managed or shared within a storage network. The subsystem is ideal for
direct-attached data storage, backup, and retrieval.
When you are configuring your storage subsystem, the followings should also be considered.
• Host ID mapping is flexible, in the sense that the same array can be associated with dif-
ferent host ID/LUNs, allowing the host clustering configurations. Drives on different chan-
nels can then be grouped into an array, and the array has its unique volume size, stripe
size, and optimization mode. Arrays of different RAID levels can be striped together into
logical volumes, making management of huge volume size an easier task.
• Using a mix of LVD and legacy devices, such as devices using single-ended signaling, is
not recommended. Use LVD terminators if all your devices support LVD signaling. Please
refer to the documentation provided with your SCSI devices to avoid possible conflicts.
• When selecting the number of hard drives to be included in a logical configuration that
should be presented through the host channels, the transfer rates and the mechanical
performance of the hard disks should be considered. The combined bandwidth of the
two SCSI host channels is 640MB/s, sufficient for most applications. If properly config-
ured, combining subsystems or drive enclosures may increase the number of drives and
helps to bring out the most of IOPs performance.
If you consider cascading multiple enclosures, considerations may include the characteristics
of your I/O load. Select the correct combination of optimization mode and a specific RAID
level. Please refer to the Administration Manual for more details on the preferences, and ana-

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lyze them with reference to the preferences of your host applications, such as the scatter/
gather elements.
An optimal configuration is always a compromise among different factors. For instance, a
large array with many drive members may be more efficient, but the chance of failing a mem-
ber is also increased.

Fig. 2.1 Front view

NOTICE!

i On receiving and unpacking your subsystem, please check the package contents against the
included unpacking checklist. If any modules appear to be missing, please contact your sub-
system vendor immediately.

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2.2 Management Connection


2.2.1 RS-232C Terminal
To access the configuration utility embedded in the controller firmware, do the following:
1. Use a serial cable, to connect the audio jack connectors (COM1) (see Figure 2.2) on the
back of the RAID controllers to the serial port of a management computer.

Fig. 2.2 Management Interfaces

2. The null modem should be attached to either the DB-9 end of the serial cable or directly
to the serial port of the computer running a terminal emulation program as a manage-
ment station.
3. The configuration utility is accessed by VT-100-compatible software running on a PC. The
connection requirements are listed below:

Baud rate 38400

Data bits 8

Stop bits 1

Parity None
Terminal connection should work properly using the above setting.

2.2.2 Ethernet Port: Telnet Access


1. Use a reliable Ethernet cable with RJ-45 phone jacks to connect the Ethernet port on the
controller module installed in the upper module slot.
2. Connect the other end of the Ethernet cable to your local area network. An IP address
should be acquired for the subsystem’s Ethernet port. The subsystem firmware also sup-
ports automatic client configuration such as DHCP.
3. Consult your network administrator for an IP address that will be manually assigned to
the controller Ethernet port.
4. Assign the IP address to the controller Ethernet port and specify the NetMask and Gate-
way values. Power off your system and then power on again for the configuration to take
effect.
5. Select "View and Edit Configuration Parameters" from the main menu on terminal screen.
Select "Communication Parameters" -> "Internet Protocol (TCP/IP)" -> press [ENTER] on
the chip hardware address -> and then select "Set IP Address."
6. Provide the IP address, NetMask, and Gateway values accordingly.
7. PING the IP address from your management computer to make sure the link is up and
running.
8. Open a command prompt and key in “telnet <IP address>” to access the embedded firm-
ware utility.

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2.2.3 Ethernet Port: Using RAIDWatch Manager


To prepare the controller for using the RAIDWatch manager, do the following: (For RAIDWatch
versions 2.1 and above)
1. Prepare the Ethernet port connection; see the description in the previous section.
2. Download or access the RAIDWatch installation program in the Product Utility CD that
came with your subsystem.
3. Assign an IP address to the controller Ethernet port and specify the Net Mask and Gate-
way values.
4. Execute the install shield program (there are specific installers for different OSes) to
begin the installation process. Select an appropriate installation batch for your installa-
tion scheme. The available options are listed below:
– Centralized Management allows you to install the RAIDWatch GUI, a Root agent,
RAID agents, Configuration Client utility, and necessary drivers on the computer cho-
sen as a management center.
– Stand-alone (on Host) - Selecting this option installs the In-Band driver (RAID
agents) for servers directly attached to a RAID subsystem, and the RAIDWatch GUI
on the local computer.
– Stand-alone (on Subsystem) - This will install the GUI onto the subsystem itself. The
RAID subsystem comes with the necessary RAID agents embedded in the firmware.
A RAID subsystem uses a small section of formatted disk space (called the reserved
space) to store GUI files. Installed in this mode, RAIDWatch can be started by a
remote browser accessing the IP address assigned to the subsystem’s Ethernet port.
For more details, please refer to the connection view diagrams below.
Use a Java-compatible browser and key in the controller IP address as your URL. NOTE: If
you are using the third installation scheme (Stand- alone on Subsystem mode), at least
one drive slot should be populated. The controller firmware distributes the necessary
RAIDWatch modules to a small portion of disk capacity that is automatically formatted
once the configuration is done.

2.2.4 Possible RAIDWatch Connection: DAS

Fig. 2.3 RAIDWatch in a DAS Environment: Multiple Arrays Monitored on a Direct-Attached Server

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2.3 Enclosure Chassis


2.3.1 Chassis Overview
The subsystem comes in a 2U metal chassis. A backplane board divides the enclosure inter-
nally into front and rear sections. The front section accommodates eight (8) drive trays (with
their associated hard drives) and the rear section accommodates one (1) or two (2) PSU mod-
ule(s), two (2) single-fan cooling modules, and a single RAID controller module. The sub-
system comes with two (2) forearm handles or two (2) chassis ears with finger grip on either
side of the subsystem front enable you to easily insert/extract the chassis into/from a rack or
cabinet. Pre-drilled mounting holes on the sides of the chassis allow you to attach separately
purchased slide rails.
NOTICE!

i Components accessed through the front panel are referred to as “Front Panel Components”
and Components accessed through the rear panel are referred to as “Rear Panel Components.”

All active components on the RAID subsystems are accessed through the front or rear panel.
The modular nature of the active components facilitates their ease of maintenance. Almost
every major component is hot-swappable and can be easily replaced while the system is run-
ning.
• RAID controller module: RAID controller comes with a main board and a DDR RAM DIMM
module mounted on it to provide the system I/O transaction power and RAID functional-
ity.
• PSUs: Connect the hot-swappable PSUs to the main power source will provide sufficient
power to the subsystem. A power switch is located on each PSU to turn the subsystem
on and off.
• Cooling modules: The redundant cooling modules ventilate the subsystem to reduce the
operating temperature within the subsystem.

2.3.2 Physical Dimensions


The subsystems come in a standard 2U, 19" chassis with the following dimensions:
• Measured with forearm handles: 482mm x 88mm x 505mm (width x height x depth)
• Measured without forearm handles: 446mm x 88mm x 490mm (width x height x depth)

2.3.3 Front Panel Overview


The front section of the subsystem features a 4 x 2 layout for eight (8) 3.5-inch disk drives and
LED panel. A description of the front panel component is given below:

Fig. 2.4 Front View

The front panels are designed to accommodate the following components:


• Chassis ear and LED panel: Two (2) chassis ears are located on either side of the sub-
system front. An LED panel that shows subsystem operating status by indicating LEDs
covers the left chassis ear. (Please refer to Section 2.4.1 Chassis Ears and
Section 2.4.2 LED Panel.)

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• Drive bays with drive tray canisters: The drive bays are used to house the subsystem
hard drives. The subsystem contains eight (8) drive bays with a blank plate covering the
upper part of the front panel.

2.3.4 Hard Drive Numbering


A blank plate covers the upper chassis. When viewing from the front, drive bays (slots) are
numbered from Slot 1 to Slot 8 (see Figure 2.5), from left to right, and then from middle to
bottom.

Fig. 2.5 Drive Bay Numbering Sequence

2.3.5 Rear Panel Overview


The rear section of the subsystems are accessed through the rear panel and is reserved for a
single RAID controller module and two (2) cooling modules. (See Figure 2.6).

Fig. 2.6 Rear View

The rear panels shown above are designed to accommodate the following components:
• RAID controller module: Each controller module contains a RAID controller board and a
pre-installed DDR RAM DIMM module, which provide the system RAID functionalities.
• PSU: The subsystem contains one (1) PSU. The hot-swappable PSU provides power to
the subsystem. A power switch is located on the right of each PSU to turn the system on
and off.
• Cooling module: The redundant cooling module is used to ventilate the subsystem and to
reduce the temperature within the subsystem.

2.3.6 Backplane Board


An integrated backplane board separates the front and rear sections of the subsystem. This
PCB board provides logic level signals and low voltage power paths. Thermal sensors and I2C
devices are on-board to detect system temperature and cooling module running status. This
board contains no user-serviceable components.
CAUTION!
Accessing the backplane board may lead to fatal damage of the RAID subsystem. Any interfer-
ence with this board may lead to critical and irreversible damage.

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2.4 Subsystem Components


All the active components on the subsystems can be accessed through either the front or rear
panel. The modular design of the active components facilitates their easy installation and
removal. Hot-swap mechanisms are incorporated to eliminate power surges and signal
glitches that might occur while removing or installing these modules.

2.4.1 Chassis Ears


Each subsystem enclosure has two (2) chassis ears on either side of the subsystem. Each
chassis ear contains a finger grip, and two (2) screw holes. The left chassis ear, when face the
subsystem front, is covered by the LED panel. A plastic cap conceals the right chassis ear. To
access the finger grips, pressing the LED panel and the plastic cap toward to the center of the
subsystem. (See Figure 2.7 and Figure 2.8) This mechanical design allows more finger room
for holding the subsystem into or out of the server rack. However, it is not recommended to
use these finger grips to lift up subsystem.
The screw holes on the chassis ear can be used to secure the subsystem to a rack using the
screws provided by your slide rail kit.

Fig. 2.7 Accessing the Left Finger Grips

Fig. 2.8 Accessing the Right Finger Grips

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2.4.2 LED Panel


The subsystem comes with an LED panel in each front chassis for system status display (see
Figure 2.9). This module contains a Power Status LED, Host Busy LED, System Fault LED, and
a Mute button. The status LEDs indicate major component as well as subsystem statuses.
These LEDs deliver important messages from the subsystem to users and their definitions are
further explained in Section 4.2 Status-indicating LEDs.
The MUTE button stops the alarm until the next controller event occurs.

Fig. 2.9 LED Panel

2.4.3 Drive Trays


The subsystem comes with eight (8) drive trays (see Figure 2.10) designed to accommodate
separately purchased standard 1-inch pitch, 3.5-inch SATA disk drives. The drive bays are eas-
ily accessible from the front of the enclosure. Two (2) LEDs on the front of the tray indicate
the drive status. A key-lock on each drive tray secures the hard drive in place, while a conve-
nient release button ensures fast and efficient drive hot-swapping. Retention screw holes are
located on the sides of the drive tray and are reserved for securing hard drives to the tray.

Fig. 2.10 Drive Tray Front View

CAUTION!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or resting
heavy objects on it). The drive tray has been customized to fit into the drive bays in the sub-
system. If the drive bay superstructure is deformed or altered, the drive trays may not fit into
the drive bay.

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2.4.4 The RAID Controller Module


The RAID controller module contains a main circuit board, a preinstalled 256MB DDR RAM
DIMM module, and the necessary support interfaces. The controller module contains no user-
serviceable components. Except when replacing a faulty unit or installing the cache memory
inside, the controller module should never be removed or opened.

Fig. 2.11 RAID Controller Model

CAUTION!
Although the RAID controller can be removed, the only time you should touch the controller
itself is to replace the memory module or to install the memory module. The RAID controller is
built of sensitive components and unnecessary tampering can damage the controller.

NOTICE!

i If the pre-installed DIMM module is not damaged, it can be reused when the controller module
is being replaced. Controller modules both come without DIMM module installed.

• Cooling module speed detection: If the controller board temperature breaches the high
temperature threshold, the cooling modules in the subsystem will automatically turn to
the high fan speed to cool the system down.
• Docking connectors: The FCI docking connectors at the rear of the controller boards are
used to connect the controller module to the backplane board.
• Hand Screws: Two (2) hand screws located on the sides of the controller rear panel pro-
vide easy controller module installation and secure the controller module in place.

Controller Module Interfaces


The controller module rear panel is accessed through the controller module rear panel shown
in Figure 2.12.

Fig. 2.12 RAID Controller Rear Panel

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• Host Ports: One (1) SCSI-320 host channels connect the subsystem to the host comput-
ers equipped with SCSI-320 compatible adapters through the single VHDCI connector on
the subsystem’s controller module rear panel.
NOTICE!

i The subsystem comes with preset configurations for channel mode and channel ID settings,
and should be sufficient for most applications.

• COM Port: Each controller module comes with one (1) COM ports. The COM port is used
for accessing the controller-embedded configuration utility through the network that
allows you to configure and monitor your array and upgrade firmware over a VT-100 ter-
minal emulation program running on a management computer. An audio-jack to DB9
cable is shipped with your subsystem to facilitate the connection. Use the cable to con-
nect the COM serial port to a PC hyper-terminal for terminal emulation management.
• Ethernet port: The controller module on the subsystem comes with a 10/100M Ethernet
port used for remote management through the network. Shielded cables must be used to
protect against emissions. Connect the other end of the Ethernet cable to a LAN hub port
of the local network.
• LED indicators: Each controller board rear panel comes with four (4) LED indicators.
Please refer to Section 4 Subsystem Operation and Monitoring for information on how to
monitor your subsystem using these LED indicators.

DIMM Module
Each controller module comes with a 184-pin DDR RAM DIMM socket that is pre-installed a
256MB DDR RAM DIMM. The DIMM socket and module can be found on the controller board.
When the DIMM module is being changed, the controller module must be removed from the
subsystem chassis. Please see Section 6 Subsystem Maintenance for upgrading/replacing DIMM
modules.

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2.4.5 Power Supply Unit


The subsystem is equipped with one (1) PSU on the left side of subsystem rear. The 2U, 350W
PSU is permanently mounted into a 2U bracket especially designed to house both the PSU and
a cooling module.
As shown in Figure 2.13, the PSU comes with a single power socket for power cord plug-in and
a single power switch to turn the PSU on and off. The PSU also comes with one (1) embedded
cooling fan to provide sufficient airflow to keep the PSU a consistent temperature. A single
LED is used to indicate the PSU status. A handle at the back of the PSU has been especially
designed to enable you to remove the PSU from the subsystem. This should only be done if
the PSU has failed and needs to be replaced.
A retention screw at the upper right corner of the PSU module is used to secure the PSU to
the enclosure. If the PSU needs to be removed, the retention screw must be removed first.
When installing a new PSU module, make sure that the retention screw has been firmly
secured.
For the PSU specifications, please refer to Section 7 Appendix: Technical Specifications.

Fig. 2.13 PSU Module

NOTICE!

i Cooling modules can be independently removed from the chassis without affecting PSU opera-
tion.

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2.4.6 Cooling Modules


The SATA-based RAID subsystems are equipped with two (2), 1U single-fan, redundant, hot-
swappable cooling modules shown in Cooling Module. One 9.7cm blower is housed in each
cooling module. These modules have been designed to generate a cooling flow from the front
to the rear of the subsystem to extract the heat generated by the SATA hard drives.

Fig. 2.14 Cooling Module

Intelligent Dual Speed Operation


The cooling fans in the cooling module operate with two rotation speeds. Under normal oper-
ating conditions, the cooling fans run at the low speed, which is sufficient for maintaining effi-
cient airflow across the components. Under the following conditions, cooling fans raise their
rotation speed to increase the airflow:
1. Component failure: if one cooling fan in a cooling module, a PSU, or a temperature sensor
fails, the remaining cooling fan(s) automatically raises its rotation speed.
2. Elevated temperature: if the temperature breaches the upper threshold set for any of the
interior temperature sensors, the cooling fans automatically raise their rotation speed.
3. During the subsystem initialization stage, the cooling fans operate at the high speed and
return to low speed once the initialization process is completed and no erroneous condi-
tion is detected.
NOTICE!
There are two values set for the upper temperature thresholds. One is set for event notification

i and the other triggering higher fan rotation speed. The preset value for event notification can
be changed using the firmware-embedded configuration utility, while the fan speed trigger is
not a user’s option. Please refer to the Administration Manual for the options with event notifi-
cation values.

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2.5 Subsystem Monitoring


The subsystem comes with a number of different monitoring methods that provide you with
continual updates on the status of the system and individual components. The following mon-
itoring features are included in the subsystem.

2.5.1 I2C Bus


The following subsystem elements are interfaced to the RAID controller over a non-user-ser-
viceable I2C bus:
• Cooling modules
• Temperature sensors

2.5.2 LED Indicators


The following active components come with LEDs to indicate the status of the individual com-
ponents:
• RAID controller
– 4 controller status LEDs
– 2 Ethernet port status LEDs
• LED panel (3 LEDs)
• Cooling module (1 LED on each module)
• PSU module (1 LED on each module)
• Drive tray (2 LEDs on each module)

2.5.3 Firmware and Bosch RAIDWatch GUI


Firmware: The firmware is pre-installed software that is used to configure the subsystem. The
firmware can be accessed through a terminal emulation program running on a management
computer that is connected to the subsystem’s serial port.
Bosch RAIDWatch: Bosch RAIDWatch is a premier web-based graphical user interface (GUI)
that can be installed on a remote computer and is used to access the array through LAN or the
Internet. The manager communicates with the array via the connection of the existing host
interface or Ethernet link to the RJ-45 LAN port.

2.5.4 Audible Alarms


The subsystems come with audible alarms that are triggered when certain active components
fail or when certain (controller or subsystem) thresholds are exceeded. If you hear hastily
repeated beep tones from the subsystems it is imperative that you immediately determine and
rectify the problem.
Event notification messages indicate the completion of or the condition when proceeding with
array configuration tasks and are always accompanied by two (2) or three (3) successive and
prolonged beeps.
CAUTION!
Failing to respond when a critical alarm is heard can lead to permanent damage of the sub-
system. When an audible alarm is heard, rectify the problem as soon as possible.

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2.6 Hot-Swappable Components


Proper subsystem cooling is referred to as “normalized” airflow. Normalized airflow ensures
the sufficient cooling of the subsystem and is only attained when all components are properly
installed. Therefore, a failed component should only be hot-swapped when a replacement is
available. If a failed component is removed but not replaced, permanent damage to the sub-
system can result.

2.6.1 Hot-Swap Capabilities


The RAID subsystems come with a number of hot-swappable components. A hot-swap compo-
nent is one that can be exchanged while the subsystem is still online without affecting the
operational integrity of the subsystem. These components should only be removed from the
subsystem when they are being replaced. At no other time should these components be
removed from the subsystem.

2.6.2 Components
The following components are all hot-swappable:
• Cooling module
• Hard drive
NOTICE!

i Instructions on how to replace these hot-swappable components are given in


Section 6 Subsystem Maintenance.

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3 Hardware Installation
This chapter gives detailed instructions on how to install the controller module, hard drives,
and drive trays into the subsystem. Installation into a rack or cabinet should occur before the
hard drives or drive trays are installed into the subsystem. Please confirm that you received all
of the components listed on the Unpacking List that came with the subsystem before pro-
ceeding with the installation process.
CAUTION!
Carefully follow the installation instructions described in this manual to prevent any difficulties
and damages to your system.

3.1 Installation Prerequisites


• Static free installation environment: The subsystems must be installed in a static-free
environment to minimize the possibility of electrostatic discharge (ESD) damage. (See
Section 1 Warnings and Certifications).
• Component check: Before installing the subsystems, you should first check to see that
you have received all the required components. (See Section 3.3 General Installation Pro-
cedure) If any items appear damaged, contact your vendor for a replacement.
• Cabling:
– One (1) audio-jack-to-DB9 cable is provided to facilitate the connection of the COM1
port for local terminal emulation access to the array.
– For the power connections to the power sources, one (1) power cord is provided for
the subsystem.
– The RJ-45 Ethernet cable for network management connection is a user-supplied
item.
• Memory module: If you wish to change the pre-installed DDR RAM DIMM module, the sep-
arately purchased module(s) must be installed. (See Section 6 Subsystem Maintenance)
• Rack installation: The enclosure chassis can be installed into a rack cabinet using sepa-
rately purchased mounting rails, rear-attached brackets, or Bosch Slide rails. (See
Section 3.5 Rackmounting) A printed copy of installation guide is provided with the slide
rails package.

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3.2 Safety Precautions


3.2.1 Precautions and Instructions
• Please read these safety instructions carefully.
• Please keep this Installation Manual for later reference.
• Please disconnect the power cord from AC outlets before servicing or cleaning. Don‘t use
liquid or sprayed detergent for cleaning. Use moisture sheet or clothe for cleaning.
• Rack-mounted RAID subsystem – The subsystem is intended to be rack-mounted, follow-
ing concerns should be paid special attentions when the unit is mounted in a rack sys-
tem.
– “The RAID subsystem is to be installed in an environment with maximum ambient
temperature must not exceed 50°C.”
– “The openings on the enclosure are for air convection hence protected the equip-
ment from overheating. DO NOT COVER THE OPENINGS.”
– “Mounting of the RAID subsystem in the rack should be such that a hazardous con-
dition is not achieved due to uneven mechanical loading.”
– “Consideration should be given to the connection of the RAID subsystem to the sup-
ply circuit and the effect that overloading of circuits might have on over current
equipment nameplate ratings should be used when addressing this concern.”
– “This equipment must be connected to the reliable earthing before using. Particular
attention should be given to supply connections other than direct connections to the
branch circuit (e.g. use of power strips.)”
• CAUTION: RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE. DIS-
POSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
• The RAID subsystems are pluggable equipments; the socket-outlet shall be installed near
the equipment and shall be easily accessible.
• Please keep the RAID subsystem from humidity.
• Lay RAID subsystem on a reliable surface when install. A drop or fall could cause injury.
• Make sure the voltage of the power source (100-120 or 200-230VAC) when connect the
RAID subsystem to the power outlet.
• Place the power cord such a way that people cannot step on it. Do not place anything
over the power cord. The power cord must be rated for the product and for the voltage
and current marked on the product’s electrical ratings label. The voltage and current rat-
ing of the cord should be greater than the voltage and current rating marked on the prod-
uct.
• All cautions and warnings on the RAID subsystem should be noted.
• If RAID subsystem is not use for long time, disconnect the equipment from mains to avoid
being damaged by transient over-voltage.
• Never pour any liquid into ventilation openings; this could cause fire or electrical shock.
• Never open the RAID subsystem. For safety reason, qualified service personnel should
only open the equipment.
• If one of the following situations arises, get the equipment checked by service personnel:
– The power cord or plug is damaged.
– Liquid has penetrated into the RAID subsystem.
– The equipment has been exposed to moisture.
– The RAID subsystem has not worked well or you cannot get it work according to this
manual.
– The RAID subsystem has dropped and damaged.
– If the RAID subsystem has obvious sign of breakage

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• Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed
into the enclosure. Leaving a drive bay or module slot open will greatly affect the airflow
efficiency within the enclosure, and consequently lead to system overheating. Keep a
faulty module in place until you have a replacement unit and are ready to replace it.
• An enclosure without disk drives can weigh up to 19 kilograms. (42 lbs.) Two people will
be required to install or relocate the subsystem. Drives should be removed from the
enclosure before moving the subsystem.
• Airflow considerations: The subsystem requires an airflow clearance especially at the
front and rear. For proper ventilation, a minimum of 2.5cm (1 inch) is required between
the front of the enclosure and rack cover; a minimum of 5cm (2 inches) is required
between the enclosure and end of the cabinet.
• Handle the system modules by the retention screws, eject levers, or the module’s metal
frame/face plate only. Avoid touching the PCB boards or connector pins.
• Always secure every enclosure module with its retaining screws or make sure it is held in
place by its latches.
• Be sure that the rack cabinet in which the subsystem chassis is to be installed provides
sufficient ventilation channels and airflow circulation around the subsystem.
• Provide a soft, clean surface to place your enclosure on before working on it. Servicing
the enclosure on a rough surface may damage the finish of the chassis.
• When working with the subsystem, it is important to use tools with extreme care. Do not
place tools or other items on top of the enclosure to avoid damaging the outward appear-
ance of the chassis.
• If it is necessary to transport the subsystem, remove and repackage all drives and
replaceable modules separately.

3.2.2 Static-Free Installation


Static electricity can damage the system’s electronic components. To prevent ESD damage to
any of the components, follow these precautions before touching or handling them:
• Discharge the static electricity accumulated in your body by wearing an anti-static wrist-
band.
• Avoid carpets, plastic, vinyl, and Styrofoam in your work area.
• Handle all components by holding their edges or metal frames. Avoid touching the
exposed circuitry on PCB boards and connector pins.

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3.3 General Installation Procedure


Following all the instructions provided below can save installation time. Detailed, illustrated
instructions for each component are given in the following sections.
CAUTION!
To ensure that your system is correctly installed, please follow the steps outlined below. If you
follow these steps, installation will be fast and efficient. If you do not follow these steps, you
may accidentally install the hardware incorrectly.

1. Unpack: Unpack the subsystem and confirm that all the components on the list were
included. (See Section 3.4 Unpacking the Subsystem)
2. Rack/Cabinet installation: If the subsystem is going to be installed in a rack or cabinet, it
should be installed prior to installing the hard drives. Installing the subsystem into a rack
or cabinet requires at least two (2) people. (See Section 3.5 Rackmounting)
3. Install drive trays: After the hard drives have been installed into the drive trays, the drive
trays must be installed into the enclosure itself. (See Section 3.6 Drive Tray Installation)
4. Cable connection: Use the supplied power cords to connect the subsystem to main
power. It is recommended to connect power cords to separate and independent power
sources for higher redundancy. Make sure your subsystem is electrically grounded. It is
also recommended to use the included cable clamps to prevent accidental disconnection
of the power cords.
5. Power up: Once the components have been properly installed and all cables are properly
connected, you can power up the subsystem and configure the RAID array. (See
Section 5.3 Power On)

Installation Procedure Flowchart


Table 3.1 shows a flowchart of the installation procedure. As you complete each step, check
off the “Done” box on the right. Please use this flowchart in conjunction with the instructions
that follow.

Step Installation Procedure Done


1 Unpack See Section 3.4 Unpacking the Subsystem

3 Rack/Cabinet Installation See Section 3.5 Rackmounting

5 Drive Tray Installation See Section 3.6 Drive Tray Installation

6 Cable Connection

7 Power On See Section 5.3 Power On

Table 3.1 Upgrade Procedure Flowchart

3.4 Unpacking the Subsystem


Compare the Unpacking List against the actual package contents to confirm that all required
materials have been received. Carefully check the items contained in each box before pro-
ceeding with installation.
CAUTION!
Do not rely on the non-definitive, summarized unpacking list shown below--it is for reference
only. A detailed packing list can be found in your product shipping package or product CD.

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3.5 Rackmounting
The subsystem is designed to fit into a variety of 19-inch rack cabinets or racks. Make sure you
have an appropriate site location and cables prepared with adequate lengths to connect to
main power and other devices.
Two (2) slide rails are available from Bosch for installing the subsystem into a rack or cabinet.
The available models are listed in the beginning of this section. To install the subsystem into a
rack or cabinet, please refer to the installation instructions that came with the slide rails.
The subsystem should be installed in the rack or cabinet before the hard drives and the drive
trays are installed. If the drive trays with the associated hard drives are installed first, the sub-
system will be too heavy to lift.
Use two (2) front finger grips on the chassis ear to push or pull the subsystem into/out of a
rack. Secure the subsystem chassis to the rack using the two (2) screw holes on each chassis
ear. To access the finger grip and screw holes, open the LED panel and the plastic cap. Please
see Section 2.4.2 LED Panel for detail description.

3.6 Drive Tray Installation


Once the hard drives have been installed in the drive trays, the drive trays are ready to be
installed into the subsystem.
WARNING!
All drive trays must be installed into the enclosure even if they do not contain a hard drive. If
the trays are not installed into the enclosure, the ventilation required for cooling will not be
normalized and the subsystem will overheat.

1. Make sure the key-lock is in the unlocked position, i.e., the groove on its face is in a hori-
zontal orientation as shown in Figure 3.1. If the groove is in a vertical position, then the
key-lock is locked and the front flap on the drive tray cannot be opened.

Fig. 3.1 Front View of an Individual Drive Tray

2. Open the front flap on the drive tray (see Figure 3.2) by pushing the release button on the
front of the drive tray. The front flap will open in an upward direction.

Fig. 3.2 Opening the Drive Tray Front Flap

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3. Align the drive tray with the slot in which you wish to insert it. Make sure that it is resting
on the rails inside the enclosure, and then gently slide it in. This should be done smoothly
and gently. (See Figure 3.3)

Fig. 3.3 Installing a Drive Tray

4. Close the front flap on the drive tray. Make sure the front flap is closed properly to
ensure that the connector at the back of the hard drive is firmly connected to the corre-
sponding connector on the back-plane board. If the front flap is not closed properly, the
connection between the hard drive and the subsystem will not be secure. (See
Figure 3.4)

Fig. 3.4 Closing the Drive Tray Front Flap

5. Lock the flap into place by turning the key-lock until the groove on its face is pointing
down (vertical orientation). (See Figure 3.5)

Fig. 3.5 Drive Tray Key-Lock Rotation

6. Once the drive tray is inserted, the RAID controller will recognize the drive and scan it in
automatically.

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4 Subsystem Operation and Monitoring


This chapter provides information on how to monitor the subsystem.

4.1 Subsystem Monitoring Overview


The subsystem is equipped with a variety of self-monitoring features that help to keep sub-
system managers informed of the subsystem operational status. These monitoring features
provide vital feedback to help you maintain the operational integrity of the subsystem. Prompt
response to warnings and subsystem component failure notifications will ensure safe opera-
tion of the subsystem and help ensure the longevity of the subsystems.
Self-monitoring features include:
• Firmware (FW): The RAID controllers in the subsystems come with pre-installed FW. The
FW can be accessed using a PC running terminal software through the RS-232C (audio
jack) serial port. Device status information can be obtained from the FW. The FW capabil-
ities have been fully described in the Administration Manual that came with your sub-
systems. Please refer to this manual for further information.
• Bosch RAIDWatch: Bosch RAIDWatch is a fully integrated, Java-based, Graphical User
Interface (GUI) that came with the subsystem and can be used to monitor and maintain
the subsystem and the RAID controllers using your web browser. The LAN port at the
back of each controller module enables you to use an Ethernet cable to connect to the
subsystem.
• The Bosch RAIDWatch Panel View can be customized to show a direct representation of
the subsystem in the content panel of the Bosch RAIDWatch screen. Panel View allows
you to quickly determine the operational status of critical subsystem components. Please
refer to the Bosch RAIDWatch User’s Manual for further details.
• Detailed installation instructions for Bosch RAIDWatch Manager are given in the Bosch
RAIDWatch User’s Manual located on the product CD that came with the EV system.
• Configuration Client: Configuration Client is a powerful module that runs as an indepen-
dent program from Bosch RAIDWatch and can be installed on different hosts. It is used
for event notification via email, fax, LAN broadcast, SNMP traps, MSN Messenger, ICQ,
SMS (Short Message Service), and the configuration utility screen. Configuration Client
helps prevent blind time and keeps you constantly informed as to the status of the stor-
age management subsystem. Instructions on activating Configuration Client functionality
are given in the Bosch RAIDWatch User’s Manual.
• LEDs: Device-status-indicating LEDs are placed on all of the subsystems’ active compo-
nents. These LEDs inform you of the integrity of a given component or a given link. You
should become familiar with the different LEDs on the subsystem and be aware of their
functions. (See Section 4.2 Status-indicating LEDs)
• Audible Alarm: An audible alarm is present on the subsystem controller board and will be
triggered if any of a number of threatening events occurs. These events usually jeopardize
the functional and operational integrity of the controller board and must be heeded at all
times. Events such as a breaching of the temperature threshold will trigger the alarm. If a
subsystem manager is present, the manager should use either the LED panel, or the PC
hyper-terminal to determine the cause of the alarm and take the appropriate corrective
measures. (See Section 4.3 Audible Alarm)
• Inter-Integrated Circuit (I2C): The I2C bus monitors the operational integrity of the cool-
ing modules, voltage readings, and RAID controller board temperature.
Subsystem monitoring is a necessary part of subsystem management. If failure events or other
disruptive events are detected and reported, the subsystem manager must take the appropri-

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ate action to rectify the problem. Failure to act in a properly specified manner to a system
event (like overheating) can cause severe and permanent damage to the subsystem.

4.2 Status-indicating LEDs


4.2.1 Brief Overview of the LEDs
The following devices come with LEDs that inform subsystem managers about the operational
status of the component on which they are mounted. The RAID subsystems feature status-
indicating LEDs distributed over the active components in the following ways:

Component LEDs per Module Total LEDs Definition


LED Panel 3 3 See Section 4.2.2 LED Panel
Drive Tray 2 16 See Section 4.2.3 Drive Tray
LEDs
Controller Module 4 4 See Section 4.2.4 Controller
Module LEDs
LAN Port 2 2 See Section 4.2.5 LAN Port
LEDs
PSU Module 1 1 See Section 4.2.6 PSU LED
Cooling Module 1 2 See Section 4.2.7 Cooling
Module LED
Table 4.1 LED Distribution

4.2.2 LED Panel

Fig. 4.1 LED Panel

An LED panel is provided on the subsystem. Each LED panel consists of three (3) status LEDs.
The Mute/Service button located directly below the status LEDs is used to turn on and off the
services LED as well as stop the alarm until the next controller event occurs.
The LED panel houses three (3) status LEDs (see Figure 4.1) that indicate the status of sub-
system. The definitions of these LEDs are given in Table 4.2 below.

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Name Icon Color Status

PWR Blue ON indicates that power is being supplied to the sub-


(Power) system.
OFF indicates that no power is being supplied to the sub-
system.

BUSY White FLASHING indicates that there is activity on the host/drive


channels.
OFF indicates that there is no activity on the host/drive
channels.

ATTEN Red ON indicates that a component failure/status event has


(Attention) occurred.
OFF indicates that the subsystem and all its components
are operating correctly.

Table 4.2 LED Panel’s Status LED Definitions

4.2.3 Drive Tray LEDs


Two (2) LED indicators are located on the right side of each drive tray. (See Figure 4.2) Refer
to Table 4.3 for the LED definitions. When notified by a drive failure message, you should
check the drive tray indicators to find the correct location of the failed drive. Replacing the
wrong drive can fatally fail a logical array.

Fig. 4.2 Drive Tray LEDs

LED Name Color Status

Drive Busy Blue ON indicates read/write activity on the drive.


OFF indicates there is no read/write activity on the drive.

Power Sta- Red/ GREEN indicates that power is being supplied to the drive.
tus Green OFF indicates no power is being supplied to the drive or the drive
tray is not properly installed.
RED indicates drive failure or faults have occurred.

Table 4.3 Drive Tray LED Definitions

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4.2.4 Controller Module LEDs


The rear-facing faceplate of the RAID controller module is shown in Figure 4.3. The LEDs are
numbered from 1 to 4. The definitions are shown in Table 4.4 below. There are two (2) more
LEDs on the LAN port. They are described in the section follows.

Fig. 4.3 Controller Rear Panel

LED Name Color Status

1 Ready (Controller Green ON: Indicates controller is active and operat-


Ready) ing normally.
OFF: Controller is not ready for operation.

2 Hst Bsy Green FLASHING: Activities on the host ports.


(Host Ports Busy) OFF: No activities on the host ports.

3 Drv Bsy Green FLASHING: Activities on the drive side.


(Drive Busy) OFF: No activities on the drive side.

4 C_Dirty Amber ON: Indicates that data is currently being


(Cache Dirty) cached in memory or is being held up by the
BBU during a system power loss.

Table 4.4 Controller Module LED Definitions

4.2.5 LAN Port LEDs


A shielded Ethernet cable must be used to connect the RJ-45 Ethernet port to a hub on a net-
work after you assign a permanent IP to the subsystem. This enables you to manage your sub-
system via the web. Two (2) LEDs located on the Ethernet port indicate the Ethernet
connection status. See Figure 4.4 for the locations of the two (2) LED indicators. Refer to
Table 4.5 for the LED definitions.

Link
LinkStatus
Status Activity
Activity

Fig. 4.4 LAN Port Indicators

Name Color Status

Online Status Green ON indicates currently connected to a LAN

LAN Activity Green BLINKING indicates active transmission

Table 4.5 Ethernet Port LED Definitions

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4.2.6 PSU LED


The PSU comes with a single LED located just above the power switch and just below the
retention screw (see Figure 4.5). The LED is used to indicate the operational status of the PSU
module. Please refer to the PSU LED definitions shown in Table 4.6.

Fig. 4.5 PSU LED

Color Status

Flashing Green The power supply has not been turned on. The PSU module LED will blink
when the subsystem is connected to a power source but has not been
turned on.

Static Green The PSU is operating normally and experiencing no problems

Static Red The PSU has failed and is unable to continue providing power to the sub-
system.

OFF The power cord is unplugged or the power cord is plugged but no power is
being supplied from the power source.

Table 4.6 PSU Module LED Definitions

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4.2.7 Cooling Module LED


The cooling module comes with a single status-indicating red LED shown in Figure 4.6. LED
definitions are given in Table 4.7.

Fig. 4.6 Cooling Module LED

LED Status

OFF The cooling module is operating normally.

ON The cooling module has failed and must be replaced.

Table 4.7 Cooling Module LED Definitions

The subsystem has a novel approach to stabilizing the temperature within the subsystem:
When the sensors within the enclosure detect critical working conditions, such as high ambi-
ent temperature or the failure of any cooling, the system will turn the cooling fans to high
speed to extract more heat. Once the ambient temperature cools down to normal or the faulty
module has been replaced, the cooling fans return to normal speed.

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4.3 Audible Alarm


Different subsystem environmental and operational parameters (i.e., temperature, etc.) have
been assigned a range of values between which they can fluctuate. If either the upper or lower
thresholds are exceeded, an audible alarm will automatically be triggered. The alarm will also
be triggered when an active component of the subsystem fails. If the subsystem manager is
onsite and hears the alarm, the manager will have to read the error message on the PC termi-
nal in order to determine what has triggered the alarm. After determining what has occurred,
the subsystem manager must take appropriate actions to rectify the problem.
CAUTION!
When an alarm is triggered, it is necessary for you to determine the problem. If the audible
alarm is ignored and the problem is not rectified, unexpected damages may occur.

Failed Devices
The audible alarm will be triggered if any of the following devices fail:
• RAID controller module
• Cooling module
• PSU
• Hard drive
NOTICE!

i When the temperature exceeds a preset threshold, the controller’s charger circuits will stop
charging. You will then receive a message that says “Thermal Shutdown/Enter Sleep Mode.”
When the temperature falls back within normal range, the battery will resume charging.

4.4 I2C Monitoring


Presence detection and the general working status of the cooling modules and other modules
are monitored through an I2C serial bus. If any of these modules fail, you will be notified via
the various methods described above.

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5 Subsystem Connection
This chapter introduces sample topologies, configuration options and server connections for
the RAID subsystems and discusses both the power on and power off procedures.
The RAID subsystem supports one (1) SCSI host channels featuring SCSI-320 protocol (also
known as Ultra-320), the latest iteration of the SCSI drive interface standard. The SCSI-320
enables maximum data transfer rates up to 320MB/second per channel from host computers
to the subsystems or expansion systems. This is twice the bandwidth as the Ultra160 stan-
dard, allowing you optimal performance and flexibility with configuring storage applications.

5.1 SCSI Connection Overview


SCSI cables are not supplied with the subsystem. Refer to Section 8 Appendix: Spare Parts and
Accessories for information.

5.1.1 SCSI Port on the Controller Rear Panel


The subsystem is equipped with one (1) VHDCI SCSI connector on the back of the enclosure.
(See Figure 5.1)

Fig. 5.1 SCSI Connector on the Rear Panel

5.1.2 SCSI Termination


Correct SCSI termination procedures require that the last device on the SCSI bus be termi-
nated. If the last device is not terminated or if devices other than the last are terminated,
erratic SCSI bus behavior may occur.
An auto-detection, on-board terminator is built into the subsystem. You do not need to install
an external terminator when a subsystem acts as the last device in the daisy chain configura-
tion. The on-board terminator default is enabled. If the subsystem is not the last device in the
daisy chain configuration, the terminator will be automatically disabled. Although it is not rec-
ommended, if you prefer to disable the firmware setting for the on-board terminator using a
RS232C terminal session or Bosch RAIDWatch management software, the auto-detection
function is also disabled.
Typically, the host computer or host adapter (SCSI card inside the PC) is the first device and
some are already terminated. When installing the subsystem on a SCSI bus with other devices,
be sure to observe the above rules regarding all devices on the SCSI bus. Consult your host
computer and/or host adapter manual for additional information on correct termination pro-
cedures.

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5.2 Host Connection Topology


There is no direct association between host ports and drive channels. Drives are associated
with host port IDs as the logical configuration of drives, e.g., a logical drive. A logical drive can
be composed of drives on different drive channels, and a logical drive can be associated with
target IDs on different host ports.
Drive access contention (that may happen when two (2) host computers can access the same
array) and data-path failover activities should be handled by a third-party software running on
host computer(s).

5.2.1 Basic Configuration Rules


When you are configuring your subsystem, the following are some basic rules that should be
followed.
NOTICE!

i Please adhere to these basic configuration rules. They are provided for your convenience to
ensure that your storage system will run smoothly and effectively.

• When selecting the number of hard drives that will be connected through the drive chan-
nels, the transfer rates and the mechanical performance of the hard disks should be con-
sidered.
• When cabling, follow all SCSI channel specifications. Pay attention to signal quality and
avoid electronic noise from adjacent interfaces.
• The drives in the same logical array should have the same capacity, but it is preferred that
all the drives within the subsystem have the same capacity.
• A spare drive should have a minimum capacity equal to the largest drive that it is
expected to replace. If the capacity of the spare is less than the capacity of the drive it is
expected to replace, then the controller will not proceed with the failed drive rebuild.

5.2.2 Single Host Connection

Fig. 5.2 Single Host Connection

In the example shown in Figure 5.2, the SCSI port is connected to a host adapter on a host
computer. This topology does not provide path redundancy. If one of the host channels
becomes disconnected, or if the cable connecting one of the host ports to the host computer
is damaged, data flow will be interrupted.

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5.3 Power On
After installing all the components in the subsystem, connecting the host channels to the
host, and connecting the expansion cables to the expansion enclosures, the subsystem is
ready to be powered on.

5.3.1 Power On Checklist


BEFORE powering on the subsystem, please check the following:
• Memory module: Memory modules have been correctly installed on the controller boards.
• Hard drives: Hard drives have been correctly installed in the drive trays.
• Drive trays: All the drive trays, whether or not they contain a hard drive, have been
installed into the subsystem.
• Cable connections: The subsystem has been correctly connected to host computer(s),
and external devices.
• Power cords: The power cord has been connected to the PSU on the subsystem and
plugged into the main power source.
• Ambient temperature: All the subsystem components have been acclimated to the sur-
rounding temperature.

5.3.2 Power On Procedure


When powering on the subsystem, please follow these steps:
1. Power on any expansion enclosures if applied.
If you have daisy chain additional subsystem or any external devices, power on those
devices before powering on the subsystem that is connected directly to the host com-
puter(s).

CAUTION!
All necessary cables connections must be made between subsystems before turning on the
subsystem. If you power on the subsystem before correctly connecting the cables, unexpected
damages may occur.

2. Power on the subsystem.


To power on the subsystem, please follow the procedures below.
– Using the power cords provided in the package, connect the power socket(s) on the
subsystem rear panel to the main power source.
– Turn the power switch on. (See Figure 5.3)

Fig. 5.3 Power Sockets and Power Switches

3. Power on the host computers.


The host computers should be the last devices that are turned on. Please refer to the
manual that came with your host computers to see their own power on procedures.

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5.3.3 Power On Status Check


Once the subsystem has been powered on, the status of the entire subsystem should be
checked to ensure that everything is running smoothly and that there are no complications or
malfunctions.
1. LEDs on LED panel: The power status LED on the LED panel should illuminate, indicating
that power is being supplied to the system.
2. Controller module LEDs: The Controller Ready, Host Busy, and Drive Busy LEDs should all
flash green.
3. Drive tray LEDs: The green LEDs for all the drive trays that contain a hard drive should
light up showing that there is power. Drive tray LEDs should also start flashing, indicating
that the RAID control units are attempting to access the hard drives.
4. PSU LEDs: If the PSU is operating normally and experiencing no problem after being pow-
ered on, the LEDs on the PSU should light green constantly.
5. Firmware and Bosch RAIDWatch: The overall status of the system may be checked using
the pre-installed firmware or the Bosch RAIDWatch GUI.
6. Audible alarm: If any errors occur during the initialization process, the onboard alarm will
sound in a hastily repeated manner.
System firmware can be configured to support a delayed sequence for starting drives. Please
consult your Administration Manual for more details.
NOTICE!

i The subsystem has been designed to run continuously. If a component fails, the fault can be
corrected online.

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5.4 Power Off Procedure


If you wish to power down the subsystem, please follow these steps:
NOTICE!

i If you wish to power down the subsystem, please ensure that no time-consuming processes,
like “Regenerate Logical Drive Parity” or a “Media Scan,” are taking place.

1. Stop I/O access to the system.


Use the software provided on the host computer to stop all IO accesses to the sub-
system. Please refer to the user’s manual that came with your host computer.
2. Flush the cache.
Locate the C_Dirty LED on the back of controller module to check if there is still cached
data in memory. Use the Shutdown Controller function to flush all cached data. This pre-
pares the RAID subsystem to be safely powered down.
3. Turn off the power.
Turn off the power switches at the top of the rear panel of the subsystem. Once the sub-
system has been powered down, other devices that are connected to the subsystem may
be powered down.

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6 Subsystem Maintenance

6.1 Overview
Constant monitoring and maintenance of your subsystem minimizes system downtime and
preserves the working integrity of the system for a longer period of time. If any of the sub-
system components fail, they must be replaced as soon as possible.

6.1.1 About Subsystem Maintenance


All of the following components can be replaced in case of failure:
1. Controller module – Section 6.2 Replacing Controller Module Components
2. Memory module – Section 6.3 DIMM Module Replacement
3. PSU modules – Section 6.4 Replacing a Faulty PSU Module
4. Cooling modules – Section 6.5 Replacing a Failed Cooling Module
5. Hard drives – Section 6.6.2 Replacing a Failed Hard Drive
CAUTION!
Do not remove a failed component from the subsystem until you have a replacement on hand.
If you remove a failed component without replacing it, the internal airflow will be disrupted
and the system will overheat, causing damage to the subsystem.

6.1.2 General Notes on Component Replacement


• Most of the components on the subsystems, including the cooling modules and drive
trays are hot-swappable and can be changed while the subsystem is still in operation.
• Qualified engineers who are familiar with the subsystem should be the only ones who
make component replacements. If you are not familiar with the subsystems and not famil-
iar with RAID subsystem maintenance in general, it is strongly advised that you refer sub-
system maintenance to a suitably qualified maintenance engineer.
• Normalized airflow is directly dependent upon the presence of all subsystem compo-
nents. Even if a subsystem component fails, it should not be removed from the sub-
system until a replacement is readily at hand and can be quickly installed. Removing a
subsystem component without a replacement can lead to permanent subsystem damage.
• When replacing any hot-swappable component, caution should be taken to ensure that
the components are handled in an appropriate manner. Rough or improper handling of
components can lead to irreparable damage.
• When removing a controller module from the subsystem, ensure that the power has been
turned off and that all precautionary measures, without exception, are adhered to. The
controller board contains very sensitive components and can be easily damaged.
CAUTION!
When inserting a removable module, take heed that DO NOT USE EXCESSIVE FORCE! Forcing
or slamming a module can damage the pins on the module connectors either on the module
itself or on the backplane. Gently push the module until it reaches the end of module slot.
Feel the contact resistance and use slightly more force to ensure the module connectors are
correctly mated. If the module comes with extraction levers or retention screws, use them to
secure the module.

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6.2 Replacing Controller Module Components


6.2.1 Overview
The controller module in the subsystem consists of the following replaceable components:
• DDR RAM DIMM module
• Controller module itself
If any of these components fails, it needs to be replaced. To replace any of these components,
the controller module must be removed.
CAUTION!
The docking connector on the rear of the controller module is very delicate and the connector
pins can be broken easily. Do not touch the connector pins. Visually examine each connector
pin before inserting the controller module into the subsystem. A broken pin may damage the
subsystem backplane board and cause a subsequent system crash.

CAUTION!
Unnecessary tampering with the controller module can cause severe and permanent damage.
Only move the controller module if it is absolutely necessary. If you have no reason to remove
the controller module from the subsystem, leave it in place.
When removing a controller module from the subsystem, all anti-static preventative techniques
should be strictly adhered to. Failure to adhere to specified cautionary measures could result
in severe damage to the controller board.

6.2.2 Notes on Controller Module Maintenance


• The controller module contains a DIMM module. It is not recommended to re-use the
DIMM module extracted from a failed controller unless you have a similar RAID subsystem
that can be used to test the module. You can contact your vendor for sending the failed
controller in for repair.
• When replacing the controller module, it must be remembered that the controller board
is one of the most sensitive components in the subsystem. All previously stipulated safety
precautions (see Section 3 Hardware Installation ) must be strictly adhered to. Failure to
adhere to these precautions can result in permanent damage to the controller board,
resulting in lengthy delays.
• Prior to replacing the controller module, it is imperative for your own safety to be sure no
power is being supplied to the system.

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6.2.3 Removing the Controller Module


To remove the controller module:
1. Stop host I/Os or host applications to avoid losing data or causing data inconsistency.
2. Power off the subsystem in the way described in Section 5.4 Power Off Procedure.
3. Disconnect all cables from the controller module. These include the SCSI cables for host
connection, an RS-232C (audio jack) cable for COM port connection, and an Ethernet
cable for network connection.
4. Loosen the retention hand screws that are located on both sides of the RAID controller’s
rear panel. Use a Phillips screwdriver to loosen them so that the controller can be
removed from chassis. (See Figure 6.1)

Hand screw

Fig. 6.1 Loosening Controller Module Retention Screws

5. Gently pull the controller module out of the subsystem. Place the controller module on a
clean surface. (See Figure 6.2)

Fig. 6.2 Removing the Controller Module

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6.2.4 Replacing the Controller Module


If the controller module itself has failed, it must be replaced. To replace a failed controller
module:
1. Remove the controller module from the subsystem (see Section 6.2.3 Removing the Con-
troller Module.) If the DIMM modules are undamaged they can be removed and reinstalled
on the new controller module. For instructions on removing and installing a DIMM mod-
ule, please see Section 6.3 DIMM Module Replacement.
2. Install the DIMM module onto the new controller module; making sure that DDR RAM
DIMM module is securely in place. (Refer to Section 6.3 DIMM Module Replacement.)
3. Install the replacement controller module. Align the controller module with the controller
module bay at the rear of the subsystem. Gently slide the controller module in. (See
Figure 6.3.)

Fig. 6.3 Inserting the Controller Module

4. Secure the controller module to the subsystem by tightening the hand screws at the
sides of the controller rear panel. (See Figure 6.4.)

Hand screw

Fig. 6.4 Fastening Controller Module Retention Screws

5. Re-attach all the cables that were removed. These include the cables that connect to the
host and the expansion chassis, any Ethernet cable that was previously attached to the
LAN port, and any cables that were attached to the COM ports.
6. Power on: Once the new controller module has been properly installed and the cables
have been correctly connected, turn the subsystem power on.

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6.3 DIMM Module Replacement


The subsystem comes with a preinstalled 256MB DDR RAM DIMM module on each controller.
If the memory module has failed, the preinstalled module must be removed and a new, sepa-
rately purchased DIMM installed.
The DIMM module is located on the controller board. The controller board is a sensitive com-
ponent and must be treated with care to avoid being damaged. Replacement and installation
instructions are described fully below.
CAUTION!
The controller board in the module contains sensitive components. Please ensure that all anti-
static precautions stipulated above are strictly adhered to. Only qualified engineers can
replace a DIMM module.

6.3.1 DIMM Module Considerations


If the memory module on the controller module is going to be replaced, the following issues
must be considered when purchasing a replacement DIMM module:
• Purchasing considerations: Contact your subsystem vendor for an updated list of compat-
ible DIMM modules.
• Installation considerations: When installing the DIMM module, it is necessary to remove
the controller module from the chassis and then remove the module from the controller.
The controller board is more susceptible to damage than the other components and must
be handled with extreme care.
• Secure installation: When replacing the DIMM module, make sure that the new DIMM
module is firmly in place prior to installing the controller module. If the DIMM module is
not firmly in place, the subsystem will not run and the controller will need to be removed
and the DIMM module correctly installed.

6.3.2 DIMM Module Replacement Procedure


If any of the DIMM modules fails, the onboard DIMM modules must be replaced. The DDR RAM
DIMM module is installed on the back of the controller board. Therefore, to replace any of the
memory modules, the controller module must be removed from the subsystem and the con-
troller board must be removed from the controller module.
To replace the DIMM module:
1. Remove the controller module from the subsystem, and place it on a clean surface. (See
Section 6.2.3 Removing the Controller Module)
2. Remove the previously installed DDR RAM DIMM module. To do this, press both DDR
RAM DIMM socket latches outward; the DDR RAM DIMM module will be ejected by the
mechanism (see Figure 6.5).

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Fig. 6.5 Removing the DIMM Module

3. Insert the new DDR RAM DIMM module into the DIMM socket. Align the new module to
the DDR RAM DIMM socket, and then gently push the DIMM module into the socket. The
latches on the sides of the socket will close automatically and secure the DDR RAM DIMM
module into the socket. (See Figure 6.6)

Fig. 6.6 Inserting the DIMM Module

4. Install the controller module back in its original location. (See Section 6.2.4 Replacing the
Controller Module)
NOTICE!

i When replacing a DIMM, the whole subsystem needs to be powered down. Therefore, when
replacing a DIMM, you should carefully select the time when the replacement will be made in
order to minimize the overall disruption to service.

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6.4 Replacing a Faulty PSU Module


6.4.1 Notes on PSU Module Maintenance
• Number of PSU module: The subsystem comes with one 1 PSU module.
If you like to maintain the PSU, flash the cache and turn off the subsystem before pro-
cessing. To turn off the subsystem, please refer to Section 5.3 Power Onof this manual.
• Immediate replacement: When a PSU fails, it should ideally be replaced immediately. Do
not remove the PSU module unless a replacement is readily available. Removing a PSU
without a replacement will cause severe disruptions to the internal airflow and the sub-
system will overheat, possibly causing irreparable damage to some of the subsystem
components.
• PSU bracket: The PSU module is permanently mounted in a two-level steel bracket, creat-
ing a single unit. The PSU is located in the upper level and a removable cooling module is
mounted in the lower level. When removing the PSU from the subsystem, the cooling
module is also being removed.

6.4.2 Replacing the PSU Module


To replace a PSU, please follow these steps:
1. Turn off the PSU using the power switch found on the center of each PSU. (See
Figure 6.7)
2. Remove the power cord connecting the failed module to the main power. The power cord
socket is found on the left side of each PSU. (See Figure 6.7)
Power Switch

Power Socket
Fig. 6.7 Power Sockets and Power Switches

3. Remove the PSU retention screw at the top right-hand side of the PSU. (See Figure 6.8)
Subsystem

Fig. 6.8 Power Sockets and Power Switches

4. Remove the PSU by pressing down the PSU handle found on the top of the PSU. (See
Figure 6.9) to dislodge the PSU from the subsystem.
Subsystem

PSU handle
Fig. 6.9 Pressing Down the PSU Handle

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5. Use the handle to gently pull the PSU out of the enclosure. (See Figure 6.10).
Subsystem

PSU handle
Fig. 6.10 Dislodging the PSU

6. Remove the cooling module from the lower level of the PSU. Please refer to
Section 6.5 Replacing a Failed Cooling Module.
7. Insert the previously removed cooling module into the new PSU. (See
Section 6.5 Replacing a Failed Cooling Module)
8. Insert the new PSU into the subsystem. Make sure the PSU handle is in its down position
so that the saddle notches on the lower edges of the handle can lock on to the edge
metal brackets along the chassis inner walls. Push the PSU into the slot and pull the han-
dle upward to secure the module. (See Figure 6.11)
Subsystem

PSU handle
Fig. 6.11 Installing the PSU

9. Secure the PSU to the subsystem by inserting the retention screw into the PSU. (See
Figure 6.12)

Subsystem

Fig. 6.12 Installing the PSU

10. Reconnect the power cord that connects the PSU to the main power source.
11. Turn on the PSU.

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6.5 Replacing a Failed Cooling Module


6.5.1 Notes on Cooling Module Maintenance
• Redundant cooling modules: The subsystems are equipped with two (2) redundant, hot-
swappable, single-blower cooling modules located on either side of the lower subsystem
rear. These cooling modules control the internal operational temperature of the sub-
system and therefore their working integrity should be maintained at all times.
• Detecting a failed cooling module: If a cooling module fails, you can be notified of the fail-
ure by the LED located at the back of the module, an audible alarm, the terminal event
prompts, the Bosch RAIDWatch, or through the various methods by the Configuration Cli-
ent utility.
• Replacing a cooling module: Once you are notified that a cooling module has failed, it
should be replaced as soon as possible. A failed cooling module should only be removed
from the subsystem when you have an immediately available replacement module that
can be installed as soon as the failed cooling module has been removed.
CAUTION!
• The latches at the back of the cooling module secure the cooling module into the enclo-
sure. If these latches are broken, the warranty on the cooling module will be void.
• Although the cooling modules are fully redundant, it is not advisable to run the subsystem
with any of the cooling modules missing. Whenever a cooling module fails, the system is at
risk of sustaining irreparable damage.
• Keep a failed module in its enclosure bay until a replacement unit is in hand.

6.5.2 Replacing a Cooling Module


The cooling modules are secured to the chassis with two latches located on the rear of the
module. To replace the cooling module, please follow these steps:
1. To remove the cooling module, pull both side latches toward the center of the cooling
module. Withdraw the cooling module from the PSU bracket by gently pulling on the han-
dle at the bottom of the module.

Fig. 6.13 Removing the Cooling Module

2. Install the new cooling module by aligning the module with the cooling module slot on
the bottom of the PSU bracket and gently sliding it in. The latches will hold the module in
place.

Fig. 6.14 Installing the Cooling Module

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CAUTION!
Forcing or slamming a module into place can damage the connector pin on the module itself or
that on the subsystem backplane.

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6.6 Drive Tray Maintenance


6.6.1 Notes on Hard Drive Maintenance
• Hot-swappable drive trays: The drive trays are all hot-swappable. If a hard drive fails, it
can be replaced while the subsystem is still running.
• Handles: If the failed hard drive is behind either the left or right front handle, unfold the
handles to access to the drive trays.
• Front flap mechanism: Do not leave a drive tray’s front flap open. The front flap and its
key-lock secure a drive tray to chassis slot. A disk drive operating with the half-open front
bezel may result in signal glitches and Data Compare Errors might ensue.
• Remove drives slowly: Although drive trays are designed to be hot-swappable, slowly
withdraw the drive tray when removing it from the subsystem. Removing the drive tray
too quickly may cause a drive I/O timeout.
• Replacement on hand: If a hard drive has failed, make sure you have a replacement hard
drive readily available before removing the failed drive. Do not leave the drive tray slot
open for an extended period of time. The airflow will be disrupted and subsystem compo-
nents will overheat and may be permanently damaged.

6.6.2 Replacing a Failed Hard Drive


When a hard drives fails, it needs to be replaced. To replace a hard drive, please follow these
steps:
CAUTION!
The hard drive is fragile therefore always handle with extreme care. Do not drop the hard drive;
always be slow, gentle, and careful when setting down a hard drive. Only handle the hard drive
by the edges, and avoid touching any components or connectors.

1. Identify the drive tray that contains the hard drive that needs to be replaced.
CAUTION!
Replacing the wrong drive in an array may cause fatal errors in a RAID configuration. You
should identify a failed drive from the Bosch RAIDWatch GUI screen, by checking the drive slot
ID in the terminal screen, by checking the LEDs on the drive tray panel, and/or use the identify/
flash drive function in firmware. Please refer to Administration Manual for details on this func-
tion.

2. Identify the drive tray that contains the hard drive that needs to be replaced.
3. Open the key-lock (See Figure 6.15) by turning the key-lock on the front of the drive tray
until the groove on its face is in a horizontal orientation.

Fig. 6.15 Drive Tray Key-lock Rotation

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4. Open the front flap by pushing the button at the front of the drive tray. (See Figure 6.16)
The drive tray front flap will automatically be lifted and the drive tray will be dislodged
from the chassis.

Fig. 6.16 Opening the Front Flap

5. Gently and carefully remove the drive tray with the hard drive from the chassis. (See
Figure 6.17)

Fig. 6.17 Removing a Drive Tray

6. Re-install the new drive tray back to the subsystem. Refer to Section 3.6 Drive Tray Instal-
lation.

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7 Appendix: Technical Specifications


Environmental Specifications

Humidity Operating: 5% to 90% (non-condensing)


Non-operating: 5% to 95% (non-condensing)
Temperature Operating: 0º to 40ºC (32º F to 104º F)
Non-operating: -40º to 60ºC (-40º F to 149º F)
Altitude Operating: 3,658m (12,000 ft.)
Non-operating: 12,192m (40,000 ft.)
Shock (Half-sine) Operating: 5G, half-sine, 11ms duration
Non-operating: 15G, half-sine, 11ms duration
Vibration Operating: 5 - 500Hz, 0.2G, X/Y/Z Sine
Non-operating: 5 - 500Hz, 1.0G, X/Y/Z Sine
Acoustic Noise 65dB max.

Power Requirements
Input Voltage 115VAC / 6A
240VAC / 3A with PFC (auto-switching)
Frequency 47-63Hz
Power Consumption 350W

Dimensions
With Chassis Ears 88.0mm (3.5 inches) (H) x 446.0mm (17.6 inches) (W) x
498.0mm (19.6 inches) (L)
With Front Handles 88.0mm (3.5 inches) (H) x 446.0mm (17.6 inches) (W) x
490.0mm (19.4 inches) (L)
Without Chassis Ears and Han- 88.0mm (3.5 inches) (H) x 481.6mm (19 inches) (W) x
dles 498.0mm (19.6 inches) (L)

System Weight
Net weight: 19.37 Kg (42.7 pounds); Gross weight: 27.5 Kg (60.63 pounds)

Certifications
• UL
• FCC Class-B
• CE
• CB
• BSMI

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Warning Alarms
• Audible alarms
• System LEDs
• Bosch RAIDWatch Manager
• RS-232C terminal
• Event notifications sent over email, fax, LAN broadcast, SNMP traps, MSN messenger,
ICQ, SMS short messages

7.1 Controller Specifications


Configuration Specifications

RAID Levels 0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk spanning
Host OS Compatibility Host OS independent; supports all major platforms
Host Interface 1 SCSI-320 channels via one (1) VHDCI connector
Host Channels 1 pre-configured SCSI-320 host channels
Drive Interface Supports 8 channel connection to 3Gbps SATA-II disk drives,
SATA-I backward compatible
Drive Channels All drive channels are pre-configured, routed through a back-
end PCB and cannot be changed
Caching Mode Write-through or Write-back
Cache Memory Pre-installed 256MB (or above) DDR RAM DIMM with/without
ECC, in one DIMM socket
Number of LUN’s Up to 32 per host ID
Multiple Target IDs/Host Yes
Channel
Firmware on Flash Memory Yes

7.2 Drive Tray Specifications


Specifications

Height 28mm (1.1 inches)


Width 110mm (4.33 inches)
Depth 218.92mm (8.62 inches)
Key-lock Yes

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7.3 Power Supply Specifications


Specification

Nominal Power 350W


DC Output 12.0V: 25A
5.0V: 25A
3.3V: 20A
Input Frequency 47 to 63Hz
AC Input 115VAC / 6A or 240VAC / 3A with PFC
Power Factor Correction Yes
Hold-up Time At least 16ms at 115/230VAC full load after a loss of AC input
Over-temperature Protec- Auto shutdown when cooling is lost or elevated temperature is
tion detected; over-voltage protection is also available.
Cooling Fans Two fans (inside PSU)

7.4 Cooling Module Specifications


Specification

Speed High or low rotation speed controlled by firmware


Max. Air Flow (each module) High speed: 31.8 CFM
Low speed: 20.1 CFM
Input Power 9/3.12W max.
Rated Voltage DC 12V
Temperature Operating: -10 to +60ºC
Storage: -20 to +70ºC

7.5 RAID Management


Specification

Configuration Text-based firmware-embedded utility over RS-232C connection


through the included audio jack-to-DB-9 serial cable
The Bosch RAIDWatch Manager program using Ethernet connec-
tion
Performance Monitoring Yes
Remote Control and Moni- Yes
toring
Event Notification Yes (via Bosch RAIDWatch’s sub-modules, Configuration Client
or NPC)
Management Connection In-band over Ethernet, or RS-232C
Configuration on Disk Configuration data stored on disk drives for logical drive assem-
blies to exist after controller replacement; basic settings, e.g.,
channel mode settings, are stored on NVRAM
Failure Indicator Via audible alarm, LED panel, Bosch RAIDWatch Manager ses-
sion, event notifications, or event prompts on terminal emulation

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7.6 Fault Tolerance Management


Specification

SATA drive SMART support Yes


Battery Back-up Option Yes
Automatic Drive Failure Detection Yes
Regenerate Logical Drive Parity Yes
Bad Block Reassignment Yes
Automatic Rebuild upon Failed Drive Replacement Yes
Automatic Rebuild on Spare Drives Yes
Manual Clone of Suspected Failed Drive Yes
Concurrent rebuild on Multiple Drives in a RAID (0 + 1) Logical Yes
Drive
Salvage the 2nd Temporarily Failed Drive in a RAID 1, 3 or 5 Logi- Yes
cal Drive
Salvage the 1st Temporarily Failed Drive in a RAID 0 Logical Drive Yes

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8 Appendix: Spare Parts and Accessories

8.1 Spare Parts


The active components and their model names are listed in Table 8.1:

Model Name Description


DVA-ADTK-000A Drive tray, Type-III bezel and Type-II LED lightpipe
DVA-ADTK-050A Drive tray including 500GB Hitachi SATA drive
DVA-SPEK-08A Power supply module, for lite subsystem, 350W capacity
DVA-SFAK-08A Cooling fan module, for ES/EV 2U DDR-interface subsystems

DVA-SCSK-08A SCSI to SATA RAID controller module, 1 x SCSI-320 VHDCI host con-
nector
Table 8.1 Controller Module List

8.2 Accessories
Accessories that must be purchased separately are listed in Table 8.2.

Model Name Description


DVA-ACON-HD50A SCSI external round cable, HD50 to VHDCI
DVA-ACON-HD68A SCSI external round cable, DB68 to VHDCI
DVA-ACON-VD68A SCSI external round cable, VHDCI to VHDCI
DVA-ASRK-28A Enhanced Slide rail assembly, for ES/EV 2U series subsystem,
21"~28.5" rack depth
DVA-ASRK-36A Enhanced Slide rail assembly, for ES/EV 2U series subsystem,
25.5"~36" rack depth
Table 8.2 Accessories List

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9 Appendix: Pinouts

9.1 SCSI Port: VHDCI Connector Pinouts


The SCSI port connector pinouts comply with specifications in T10 Working Draft, Project
1365D, SCSI Parallel Interface-4.
* NC = No Connection, * GND = Ground,
* TPWR = Terminator Power

Pin Name Pin Name


1 SD12+ 35 SD12-
2 SD13+ 36 SD13-
3 SD14+ 37 SD14-
4 SD15+ 38 SD15-
5 SDP1+ 39 SDP1-
6 SD0+ 40 SD0-
7 SD1+ 41 SD1-
8 SD2+ 42 SD2-
9 SD3+ 43 SD3-
10 SD4+ 44 SD4-
11 SD5+ 45 SD5-
12 SD6+ 46 SD6-
13 SD7+ 47 SD7-
14 SDP0+ 48 SDP0-
15 GND 49 GND
16 DIFSENS 50 GND
17 TPWR 51 TPWR
18 TPWR 52 TPWR
19 NC 53 NC
20 GND 54 GND
21 SATN+ 55 SATN-
22 GND 56 GND
23 SBSY+ 57 SBSY-
24 SACK+ 58 SACK-
25 SRST+ 59 SRST-
26 SMSG+ 60 SMSG-
27 SSEL+ 61 SSEL-
28 SC_D+ 62 SC_D-
29 SREQ+ 63 SREQ-
30 SI_O+ 64 SI_O-
31 SD8+ 65 SD8-
32 SD9+ 66 SD9-
33 SD10+ 67 SD10-
34 SD11+ 68 SD11-

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9.2 COM1 Cable: DB9 and Audio Jack Pinouts


COM1 cable is used to connect a PC running terminal emulation program.

Fig. 9.1 Figure C-1: COM1 Cable CN1 and CN2 Connectors

CN1 Pin Number Pin Name

1 Ground
2 TXD
3 RXD

CN2 Pin Number Pin Name

1 NC
2 RXD
3 TXD
4 DTR (Shorted)
5 GND
6 DSR (Shorted)
7 RTS (Shorted)
8 CTS (Shorted)
9 NC

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9.3 Null Modem


A null modem is used for wire-swap and is necessary for connecting COM1 CN2 to a PC serial
port.

Fig. 9.2 Figure C-2: Null Modem Pinouts

Swap pin 2 and pin 3


Swap pin 4 and pin 6
Swap pin 7 and pin 8

9.4 Ethernet Port Pinouts

Fig. 9.3 Figure C-3: LAN Port Pinouts

Pin Pin Name Pin Pin Name


1 LAN_TXP 5 N2

2 LAN_TXN 6 LAN_RXN
3 LAN_RXP 7 N1
4 N2 8 N1

9.5 Main Power


IEC-type receptacle.

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Index
Numerics Ethernet port 16
2U 11 event notification 27
A F
Administration Manual 27, 37 faulty module 23
airflow 23, 53 finger grip 13
airflow clearance 23 firmware 19, 27
alarm trigger 33 flush cache 38
ambient temperature 36 front flap 25, 50
audible alarm 19, 27, 33 front panel 13
audio jack 57 G
audio-jack to DB9 cable 16 Gateway 9
B Graphics User Interface 27
backplane board 12 groove 25
blower 18 GUI 19, 27
Bosch RAIDWatch 19, 27 H
C hand screw 15
cable connection 36 handles 49
Cabling 21 hard drive 49
chassis ear 13 hard drives 36
COM port 16 host computer 35
Communication Parameters 9 hot-swap mechanism 13
component check 21 hot-swappable 39
Configuration Client 27 hot-swappable components 20
controller board 12 hyper-terminal 16
controller module 12, 15, 40, 41 I
controller module LED 30 I2C 27, 33
Controller Specifications 52 I2C bus 19
cooling module 11, 12, 18 initialization stage 18
cooling module latches 47 Internet Protocol 9
cooling module LED 32 IO access 38
Cooling Module Specifications 53 IP address 10
cooling module speed detection 15 K
cooling modules 47 key-lock 14, 25
D L
data flow 35 LAN port 27
DB9 57 LAN Port LED 30
DDR 11 LAN port LED 30
DDR RAM 12 LED indicators 16
DDR RAM DIMM module 15 LED panel 11, 13, 14, 28
DDR RAM DIMM socket 16 LEDs 19, 27
DIMM 40 logic level signal 12
DIMM module 11, 43
M
DIMM socket latches 43
main power 45
docking connector 15
memory module 36
drive bay 12
minimum capacity 35
drive bays 14
MUTE button 14
drive IO timeout 49
drive tray 14, 25, 36, 49 N
drive tray LED 29 NetMask 9
drive trays 49 normalized airflow 20, 39
E P
electronic noise 35 Panel View 27
electrostatic discharge 21 path redundancy 35
elevated temperature 18 permanent IP 30
ESD damage 23 Phillips screwdriver 41
Ethernet cable 41 plastic cap 13
Ethernet link 19 power cord 17, 36
Ethernet Port 58 power down 38

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power on 36
power path 12
power socket 17, 36
Power Supply Specifications 53
power switch 11, 12, 17, 36
PSU 11, 12, 45
PSU Bracket 45
PSU LED 31
R
rack installation 21
Rackmounting 25
RAID functionalities 12
RAIDWatch User’s Manual 27
rear panel 11, 12, 13
release button 14
reserved space 10
retention screws 23
RJ-45 30
RS-232C cable 41
S
sample topologies 34
SCSI cables 41
SCSI-320 protocol 34
sensors 32
services LED 28
Shutdown Controller 38
signal quality 35
single-blower 47
slide rail kit 13
slide rails 25
spare drive 35
static electricity 23
static free 21
status check 37
T
temperature sensor 18
terminal emulation program 19
thermal notice 23
U
Ultra-320 34
Unpacking List 24
unpacking list 21
upper threshold 18
URL 10
V
ventilation 23
VHDCI connector 16
VHDCI SCSI connector 34
VT-100 terminal 16

F.01U.027.096 | V1 | 2006.11 Bosch Security Systems


Bosch Security Systems
Robert-Koch-Straße 100
D-85521 Ottobrunn
Germany
Telefon (089) 6290-0
Fax (089) 6290-1020
www.bosch-securitysystems.com
© Bosch Security Systems, 2006

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