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RAID Subsystem DVA-08E | Installation Manual Table of Contents | en 3
Table of Contents
1 Warnings and Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Management Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.1 RS-232C Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.2 Ethernet Port: Telnet Access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.3 Ethernet Port: Using RAIDWatch Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2.4 Possible RAIDWatch Connection: DAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3 Enclosure Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.1 Chassis Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.2 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.3 Front Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.4 Hard Drive Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.5 Rear Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.6 Backplane Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4 Subsystem Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1 Chassis Ears . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.2 LED Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.3 Drive Trays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.4 The RAID Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.5 Power Supply Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4.6 Cooling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5 Subsystem Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.1 I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.2 LED Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.3 Firmware and Bosch RAIDWatch GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.4 Audible Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.6 Hot-Swappable Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.6.1 Hot-Swap Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.6.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3 Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 21
3.1 Installation Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 21
3.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 22
3.2.1 Precautions and Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 22
3.2.2 Static-Free Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 23
3.3 General Installation Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 24
3.4 Unpacking the Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 24
3.5 Rackmounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 25
3.6 Drive Tray Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 25
4 Subsystem Operation and Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 27
4.1 Subsystem Monitoring Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 27
4.2 Status-indicating LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 28
4.2.1 Brief Overview of the LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 28
4.2.2 LED Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 28
4.2.3 Drive Tray LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 29
4.2.4 Controller Module LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 30
4.2.5 LAN Port LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 30
4.2.6 PSU LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 31
4.2.7 Cooling Module LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 32
4.3 Audible Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 33
4.4 I2C Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 33
5 Subsystem Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1 SCSI Connection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1.1 SCSI Port on the Controller Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.1 Warning
A shielded power cord is required in order to meet FCC emission limits and also to prevent
interference to nearby radio and television reception.
Use only shielded cables to connect I/O devices to this equipment. You are cautioned that
changes or modifications not expressly approved by the party responsible for compliance
could void your authority to operate the equipment.
ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use of a
grounded wrist strap and an anti-static work pad are recommended. Avoid dust or debris in
your work area.
1.3 Certification
FCC Class B Radio Frequency Interference Statement
FCC (applies in the U.S. and Canada)
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22
Class B). These limits are designed to provide reasonable protection against harmful interfer-
ence when the equipment is operated in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
this user’s guide, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turn-
ing the equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
This device complies with Part 15 of FCC Rules. Operation is subjected to the following two
conditions: 1) this device may not cause harmful interference, and 2) this device must accept
any interference received, including interference that may cause undesired operation.
CB (Certified Worldwide)
This device meets the requirements of the CB standard for electrical equipment with regard to
establishing a satisfactory level of safety for persons using the device and for the area sur-
rounding the apparatus. This standard covers only safety aspects of the above apparatus; it
does not cover other matters, such as style or performance.
2 Introduction
The flexible, high performance RAID subsystem combines SCSI-320’s high-speed data transfer
rate with low-cost SATA-II hard disk solution, the subsystem offers the best storage return on
investment (ROI.)
The subsystem is easy to use. All modules including the drive trays, controller module, cooling
modules and PSUs can be access from either subsystem front or rear. Most of these modules
are hot-swappable and can be served while the subsystem is still running.
The subsystem’s embedded firmware offers the same protection and maintenance functional-
ities as those designed for an enterprise-level RAID solution. The subsystems provide unprece-
dented configuration flexibility and allow for the customization of storage subsystems to meet
specific demands. It is a rigorous and durable subsystem that can be easily configured and
operated.
Fully featured RAID redundancy (which provides advanced data protection) ensures that the
complete range of RAID levels (RAID 0, 1(0+1), 3, 5, 10, 30, and 50) is supported by the sub-
system. Bosch implements Smart Technologies (IOSmart, DrvSmart and SysSmart) into the
intelligent firmware further guarantees the overall availability of valuable data.
IT managers using the RAID subsystems will be able to save the totally investment cost and
rapidly develop a comprehensive storage array.
lyze them with reference to the preferences of your host applications, such as the scatter/
gather elements.
An optimal configuration is always a compromise among different factors. For instance, a
large array with many drive members may be more efficient, but the chance of failing a mem-
ber is also increased.
NOTICE!
i On receiving and unpacking your subsystem, please check the package contents against the
included unpacking checklist. If any modules appear to be missing, please contact your sub-
system vendor immediately.
2. The null modem should be attached to either the DB-9 end of the serial cable or directly
to the serial port of the computer running a terminal emulation program as a manage-
ment station.
3. The configuration utility is accessed by VT-100-compatible software running on a PC. The
connection requirements are listed below:
Data bits 8
Stop bits 1
Parity None
Terminal connection should work properly using the above setting.
Fig. 2.3 RAIDWatch in a DAS Environment: Multiple Arrays Monitored on a Direct-Attached Server
i Components accessed through the front panel are referred to as “Front Panel Components”
and Components accessed through the rear panel are referred to as “Rear Panel Components.”
All active components on the RAID subsystems are accessed through the front or rear panel.
The modular nature of the active components facilitates their ease of maintenance. Almost
every major component is hot-swappable and can be easily replaced while the system is run-
ning.
• RAID controller module: RAID controller comes with a main board and a DDR RAM DIMM
module mounted on it to provide the system I/O transaction power and RAID functional-
ity.
• PSUs: Connect the hot-swappable PSUs to the main power source will provide sufficient
power to the subsystem. A power switch is located on each PSU to turn the subsystem
on and off.
• Cooling modules: The redundant cooling modules ventilate the subsystem to reduce the
operating temperature within the subsystem.
• Drive bays with drive tray canisters: The drive bays are used to house the subsystem
hard drives. The subsystem contains eight (8) drive bays with a blank plate covering the
upper part of the front panel.
The rear panels shown above are designed to accommodate the following components:
• RAID controller module: Each controller module contains a RAID controller board and a
pre-installed DDR RAM DIMM module, which provide the system RAID functionalities.
• PSU: The subsystem contains one (1) PSU. The hot-swappable PSU provides power to
the subsystem. A power switch is located on the right of each PSU to turn the system on
and off.
• Cooling module: The redundant cooling module is used to ventilate the subsystem and to
reduce the temperature within the subsystem.
CAUTION!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or resting
heavy objects on it). The drive tray has been customized to fit into the drive bays in the sub-
system. If the drive bay superstructure is deformed or altered, the drive trays may not fit into
the drive bay.
CAUTION!
Although the RAID controller can be removed, the only time you should touch the controller
itself is to replace the memory module or to install the memory module. The RAID controller is
built of sensitive components and unnecessary tampering can damage the controller.
NOTICE!
i If the pre-installed DIMM module is not damaged, it can be reused when the controller module
is being replaced. Controller modules both come without DIMM module installed.
• Cooling module speed detection: If the controller board temperature breaches the high
temperature threshold, the cooling modules in the subsystem will automatically turn to
the high fan speed to cool the system down.
• Docking connectors: The FCI docking connectors at the rear of the controller boards are
used to connect the controller module to the backplane board.
• Hand Screws: Two (2) hand screws located on the sides of the controller rear panel pro-
vide easy controller module installation and secure the controller module in place.
• Host Ports: One (1) SCSI-320 host channels connect the subsystem to the host comput-
ers equipped with SCSI-320 compatible adapters through the single VHDCI connector on
the subsystem’s controller module rear panel.
NOTICE!
i The subsystem comes with preset configurations for channel mode and channel ID settings,
and should be sufficient for most applications.
• COM Port: Each controller module comes with one (1) COM ports. The COM port is used
for accessing the controller-embedded configuration utility through the network that
allows you to configure and monitor your array and upgrade firmware over a VT-100 ter-
minal emulation program running on a management computer. An audio-jack to DB9
cable is shipped with your subsystem to facilitate the connection. Use the cable to con-
nect the COM serial port to a PC hyper-terminal for terminal emulation management.
• Ethernet port: The controller module on the subsystem comes with a 10/100M Ethernet
port used for remote management through the network. Shielded cables must be used to
protect against emissions. Connect the other end of the Ethernet cable to a LAN hub port
of the local network.
• LED indicators: Each controller board rear panel comes with four (4) LED indicators.
Please refer to Section 4 Subsystem Operation and Monitoring for information on how to
monitor your subsystem using these LED indicators.
DIMM Module
Each controller module comes with a 184-pin DDR RAM DIMM socket that is pre-installed a
256MB DDR RAM DIMM. The DIMM socket and module can be found on the controller board.
When the DIMM module is being changed, the controller module must be removed from the
subsystem chassis. Please see Section 6 Subsystem Maintenance for upgrading/replacing DIMM
modules.
NOTICE!
i Cooling modules can be independently removed from the chassis without affecting PSU opera-
tion.
i and the other triggering higher fan rotation speed. The preset value for event notification can
be changed using the firmware-embedded configuration utility, while the fan speed trigger is
not a user’s option. Please refer to the Administration Manual for the options with event notifi-
cation values.
2.6.2 Components
The following components are all hot-swappable:
• Cooling module
• Hard drive
NOTICE!
3 Hardware Installation
This chapter gives detailed instructions on how to install the controller module, hard drives,
and drive trays into the subsystem. Installation into a rack or cabinet should occur before the
hard drives or drive trays are installed into the subsystem. Please confirm that you received all
of the components listed on the Unpacking List that came with the subsystem before pro-
ceeding with the installation process.
CAUTION!
Carefully follow the installation instructions described in this manual to prevent any difficulties
and damages to your system.
• Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed
into the enclosure. Leaving a drive bay or module slot open will greatly affect the airflow
efficiency within the enclosure, and consequently lead to system overheating. Keep a
faulty module in place until you have a replacement unit and are ready to replace it.
• An enclosure without disk drives can weigh up to 19 kilograms. (42 lbs.) Two people will
be required to install or relocate the subsystem. Drives should be removed from the
enclosure before moving the subsystem.
• Airflow considerations: The subsystem requires an airflow clearance especially at the
front and rear. For proper ventilation, a minimum of 2.5cm (1 inch) is required between
the front of the enclosure and rack cover; a minimum of 5cm (2 inches) is required
between the enclosure and end of the cabinet.
• Handle the system modules by the retention screws, eject levers, or the module’s metal
frame/face plate only. Avoid touching the PCB boards or connector pins.
• Always secure every enclosure module with its retaining screws or make sure it is held in
place by its latches.
• Be sure that the rack cabinet in which the subsystem chassis is to be installed provides
sufficient ventilation channels and airflow circulation around the subsystem.
• Provide a soft, clean surface to place your enclosure on before working on it. Servicing
the enclosure on a rough surface may damage the finish of the chassis.
• When working with the subsystem, it is important to use tools with extreme care. Do not
place tools or other items on top of the enclosure to avoid damaging the outward appear-
ance of the chassis.
• If it is necessary to transport the subsystem, remove and repackage all drives and
replaceable modules separately.
1. Unpack: Unpack the subsystem and confirm that all the components on the list were
included. (See Section 3.4 Unpacking the Subsystem)
2. Rack/Cabinet installation: If the subsystem is going to be installed in a rack or cabinet, it
should be installed prior to installing the hard drives. Installing the subsystem into a rack
or cabinet requires at least two (2) people. (See Section 3.5 Rackmounting)
3. Install drive trays: After the hard drives have been installed into the drive trays, the drive
trays must be installed into the enclosure itself. (See Section 3.6 Drive Tray Installation)
4. Cable connection: Use the supplied power cords to connect the subsystem to main
power. It is recommended to connect power cords to separate and independent power
sources for higher redundancy. Make sure your subsystem is electrically grounded. It is
also recommended to use the included cable clamps to prevent accidental disconnection
of the power cords.
5. Power up: Once the components have been properly installed and all cables are properly
connected, you can power up the subsystem and configure the RAID array. (See
Section 5.3 Power On)
6 Cable Connection
3.5 Rackmounting
The subsystem is designed to fit into a variety of 19-inch rack cabinets or racks. Make sure you
have an appropriate site location and cables prepared with adequate lengths to connect to
main power and other devices.
Two (2) slide rails are available from Bosch for installing the subsystem into a rack or cabinet.
The available models are listed in the beginning of this section. To install the subsystem into a
rack or cabinet, please refer to the installation instructions that came with the slide rails.
The subsystem should be installed in the rack or cabinet before the hard drives and the drive
trays are installed. If the drive trays with the associated hard drives are installed first, the sub-
system will be too heavy to lift.
Use two (2) front finger grips on the chassis ear to push or pull the subsystem into/out of a
rack. Secure the subsystem chassis to the rack using the two (2) screw holes on each chassis
ear. To access the finger grip and screw holes, open the LED panel and the plastic cap. Please
see Section 2.4.2 LED Panel for detail description.
1. Make sure the key-lock is in the unlocked position, i.e., the groove on its face is in a hori-
zontal orientation as shown in Figure 3.1. If the groove is in a vertical position, then the
key-lock is locked and the front flap on the drive tray cannot be opened.
2. Open the front flap on the drive tray (see Figure 3.2) by pushing the release button on the
front of the drive tray. The front flap will open in an upward direction.
3. Align the drive tray with the slot in which you wish to insert it. Make sure that it is resting
on the rails inside the enclosure, and then gently slide it in. This should be done smoothly
and gently. (See Figure 3.3)
4. Close the front flap on the drive tray. Make sure the front flap is closed properly to
ensure that the connector at the back of the hard drive is firmly connected to the corre-
sponding connector on the back-plane board. If the front flap is not closed properly, the
connection between the hard drive and the subsystem will not be secure. (See
Figure 3.4)
5. Lock the flap into place by turning the key-lock until the groove on its face is pointing
down (vertical orientation). (See Figure 3.5)
6. Once the drive tray is inserted, the RAID controller will recognize the drive and scan it in
automatically.
ate action to rectify the problem. Failure to act in a properly specified manner to a system
event (like overheating) can cause severe and permanent damage to the subsystem.
An LED panel is provided on the subsystem. Each LED panel consists of three (3) status LEDs.
The Mute/Service button located directly below the status LEDs is used to turn on and off the
services LED as well as stop the alarm until the next controller event occurs.
The LED panel houses three (3) status LEDs (see Figure 4.1) that indicate the status of sub-
system. The definitions of these LEDs are given in Table 4.2 below.
Power Sta- Red/ GREEN indicates that power is being supplied to the drive.
tus Green OFF indicates no power is being supplied to the drive or the drive
tray is not properly installed.
RED indicates drive failure or faults have occurred.
Link
LinkStatus
Status Activity
Activity
Color Status
Flashing Green The power supply has not been turned on. The PSU module LED will blink
when the subsystem is connected to a power source but has not been
turned on.
Static Red The PSU has failed and is unable to continue providing power to the sub-
system.
OFF The power cord is unplugged or the power cord is plugged but no power is
being supplied from the power source.
LED Status
The subsystem has a novel approach to stabilizing the temperature within the subsystem:
When the sensors within the enclosure detect critical working conditions, such as high ambi-
ent temperature or the failure of any cooling, the system will turn the cooling fans to high
speed to extract more heat. Once the ambient temperature cools down to normal or the faulty
module has been replaced, the cooling fans return to normal speed.
Failed Devices
The audible alarm will be triggered if any of the following devices fail:
• RAID controller module
• Cooling module
• PSU
• Hard drive
NOTICE!
i When the temperature exceeds a preset threshold, the controller’s charger circuits will stop
charging. You will then receive a message that says “Thermal Shutdown/Enter Sleep Mode.”
When the temperature falls back within normal range, the battery will resume charging.
5 Subsystem Connection
This chapter introduces sample topologies, configuration options and server connections for
the RAID subsystems and discusses both the power on and power off procedures.
The RAID subsystem supports one (1) SCSI host channels featuring SCSI-320 protocol (also
known as Ultra-320), the latest iteration of the SCSI drive interface standard. The SCSI-320
enables maximum data transfer rates up to 320MB/second per channel from host computers
to the subsystems or expansion systems. This is twice the bandwidth as the Ultra160 stan-
dard, allowing you optimal performance and flexibility with configuring storage applications.
i Please adhere to these basic configuration rules. They are provided for your convenience to
ensure that your storage system will run smoothly and effectively.
• When selecting the number of hard drives that will be connected through the drive chan-
nels, the transfer rates and the mechanical performance of the hard disks should be con-
sidered.
• When cabling, follow all SCSI channel specifications. Pay attention to signal quality and
avoid electronic noise from adjacent interfaces.
• The drives in the same logical array should have the same capacity, but it is preferred that
all the drives within the subsystem have the same capacity.
• A spare drive should have a minimum capacity equal to the largest drive that it is
expected to replace. If the capacity of the spare is less than the capacity of the drive it is
expected to replace, then the controller will not proceed with the failed drive rebuild.
In the example shown in Figure 5.2, the SCSI port is connected to a host adapter on a host
computer. This topology does not provide path redundancy. If one of the host channels
becomes disconnected, or if the cable connecting one of the host ports to the host computer
is damaged, data flow will be interrupted.
5.3 Power On
After installing all the components in the subsystem, connecting the host channels to the
host, and connecting the expansion cables to the expansion enclosures, the subsystem is
ready to be powered on.
CAUTION!
All necessary cables connections must be made between subsystems before turning on the
subsystem. If you power on the subsystem before correctly connecting the cables, unexpected
damages may occur.
i The subsystem has been designed to run continuously. If a component fails, the fault can be
corrected online.
i If you wish to power down the subsystem, please ensure that no time-consuming processes,
like “Regenerate Logical Drive Parity” or a “Media Scan,” are taking place.
6 Subsystem Maintenance
6.1 Overview
Constant monitoring and maintenance of your subsystem minimizes system downtime and
preserves the working integrity of the system for a longer period of time. If any of the sub-
system components fail, they must be replaced as soon as possible.
CAUTION!
Unnecessary tampering with the controller module can cause severe and permanent damage.
Only move the controller module if it is absolutely necessary. If you have no reason to remove
the controller module from the subsystem, leave it in place.
When removing a controller module from the subsystem, all anti-static preventative techniques
should be strictly adhered to. Failure to adhere to specified cautionary measures could result
in severe damage to the controller board.
Hand screw
5. Gently pull the controller module out of the subsystem. Place the controller module on a
clean surface. (See Figure 6.2)
4. Secure the controller module to the subsystem by tightening the hand screws at the
sides of the controller rear panel. (See Figure 6.4.)
Hand screw
5. Re-attach all the cables that were removed. These include the cables that connect to the
host and the expansion chassis, any Ethernet cable that was previously attached to the
LAN port, and any cables that were attached to the COM ports.
6. Power on: Once the new controller module has been properly installed and the cables
have been correctly connected, turn the subsystem power on.
3. Insert the new DDR RAM DIMM module into the DIMM socket. Align the new module to
the DDR RAM DIMM socket, and then gently push the DIMM module into the socket. The
latches on the sides of the socket will close automatically and secure the DDR RAM DIMM
module into the socket. (See Figure 6.6)
4. Install the controller module back in its original location. (See Section 6.2.4 Replacing the
Controller Module)
NOTICE!
i When replacing a DIMM, the whole subsystem needs to be powered down. Therefore, when
replacing a DIMM, you should carefully select the time when the replacement will be made in
order to minimize the overall disruption to service.
Power Socket
Fig. 6.7 Power Sockets and Power Switches
3. Remove the PSU retention screw at the top right-hand side of the PSU. (See Figure 6.8)
Subsystem
4. Remove the PSU by pressing down the PSU handle found on the top of the PSU. (See
Figure 6.9) to dislodge the PSU from the subsystem.
Subsystem
PSU handle
Fig. 6.9 Pressing Down the PSU Handle
5. Use the handle to gently pull the PSU out of the enclosure. (See Figure 6.10).
Subsystem
PSU handle
Fig. 6.10 Dislodging the PSU
6. Remove the cooling module from the lower level of the PSU. Please refer to
Section 6.5 Replacing a Failed Cooling Module.
7. Insert the previously removed cooling module into the new PSU. (See
Section 6.5 Replacing a Failed Cooling Module)
8. Insert the new PSU into the subsystem. Make sure the PSU handle is in its down position
so that the saddle notches on the lower edges of the handle can lock on to the edge
metal brackets along the chassis inner walls. Push the PSU into the slot and pull the han-
dle upward to secure the module. (See Figure 6.11)
Subsystem
PSU handle
Fig. 6.11 Installing the PSU
9. Secure the PSU to the subsystem by inserting the retention screw into the PSU. (See
Figure 6.12)
Subsystem
10. Reconnect the power cord that connects the PSU to the main power source.
11. Turn on the PSU.
2. Install the new cooling module by aligning the module with the cooling module slot on
the bottom of the PSU bracket and gently sliding it in. The latches will hold the module in
place.
CAUTION!
Forcing or slamming a module into place can damage the connector pin on the module itself or
that on the subsystem backplane.
1. Identify the drive tray that contains the hard drive that needs to be replaced.
CAUTION!
Replacing the wrong drive in an array may cause fatal errors in a RAID configuration. You
should identify a failed drive from the Bosch RAIDWatch GUI screen, by checking the drive slot
ID in the terminal screen, by checking the LEDs on the drive tray panel, and/or use the identify/
flash drive function in firmware. Please refer to Administration Manual for details on this func-
tion.
2. Identify the drive tray that contains the hard drive that needs to be replaced.
3. Open the key-lock (See Figure 6.15) by turning the key-lock on the front of the drive tray
until the groove on its face is in a horizontal orientation.
4. Open the front flap by pushing the button at the front of the drive tray. (See Figure 6.16)
The drive tray front flap will automatically be lifted and the drive tray will be dislodged
from the chassis.
5. Gently and carefully remove the drive tray with the hard drive from the chassis. (See
Figure 6.17)
6. Re-install the new drive tray back to the subsystem. Refer to Section 3.6 Drive Tray Instal-
lation.
Power Requirements
Input Voltage 115VAC / 6A
240VAC / 3A with PFC (auto-switching)
Frequency 47-63Hz
Power Consumption 350W
Dimensions
With Chassis Ears 88.0mm (3.5 inches) (H) x 446.0mm (17.6 inches) (W) x
498.0mm (19.6 inches) (L)
With Front Handles 88.0mm (3.5 inches) (H) x 446.0mm (17.6 inches) (W) x
490.0mm (19.4 inches) (L)
Without Chassis Ears and Han- 88.0mm (3.5 inches) (H) x 481.6mm (19 inches) (W) x
dles 498.0mm (19.6 inches) (L)
System Weight
Net weight: 19.37 Kg (42.7 pounds); Gross weight: 27.5 Kg (60.63 pounds)
Certifications
• UL
• FCC Class-B
• CE
• CB
• BSMI
Warning Alarms
• Audible alarms
• System LEDs
• Bosch RAIDWatch Manager
• RS-232C terminal
• Event notifications sent over email, fax, LAN broadcast, SNMP traps, MSN messenger,
ICQ, SMS short messages
RAID Levels 0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk spanning
Host OS Compatibility Host OS independent; supports all major platforms
Host Interface 1 SCSI-320 channels via one (1) VHDCI connector
Host Channels 1 pre-configured SCSI-320 host channels
Drive Interface Supports 8 channel connection to 3Gbps SATA-II disk drives,
SATA-I backward compatible
Drive Channels All drive channels are pre-configured, routed through a back-
end PCB and cannot be changed
Caching Mode Write-through or Write-back
Cache Memory Pre-installed 256MB (or above) DDR RAM DIMM with/without
ECC, in one DIMM socket
Number of LUN’s Up to 32 per host ID
Multiple Target IDs/Host Yes
Channel
Firmware on Flash Memory Yes
DVA-SCSK-08A SCSI to SATA RAID controller module, 1 x SCSI-320 VHDCI host con-
nector
Table 8.1 Controller Module List
8.2 Accessories
Accessories that must be purchased separately are listed in Table 8.2.
9 Appendix: Pinouts
Fig. 9.1 Figure C-1: COM1 Cable CN1 and CN2 Connectors
1 Ground
2 TXD
3 RXD
1 NC
2 RXD
3 TXD
4 DTR (Shorted)
5 GND
6 DSR (Shorted)
7 RTS (Shorted)
8 CTS (Shorted)
9 NC
2 LAN_TXN 6 LAN_RXN
3 LAN_RXP 7 N1
4 N2 8 N1
Index
Numerics Ethernet port 16
2U 11 event notification 27
A F
Administration Manual 27, 37 faulty module 23
airflow 23, 53 finger grip 13
airflow clearance 23 firmware 19, 27
alarm trigger 33 flush cache 38
ambient temperature 36 front flap 25, 50
audible alarm 19, 27, 33 front panel 13
audio jack 57 G
audio-jack to DB9 cable 16 Gateway 9
B Graphics User Interface 27
backplane board 12 groove 25
blower 18 GUI 19, 27
Bosch RAIDWatch 19, 27 H
C hand screw 15
cable connection 36 handles 49
Cabling 21 hard drive 49
chassis ear 13 hard drives 36
COM port 16 host computer 35
Communication Parameters 9 hot-swap mechanism 13
component check 21 hot-swappable 39
Configuration Client 27 hot-swappable components 20
controller board 12 hyper-terminal 16
controller module 12, 15, 40, 41 I
controller module LED 30 I2C 27, 33
Controller Specifications 52 I2C bus 19
cooling module 11, 12, 18 initialization stage 18
cooling module latches 47 Internet Protocol 9
cooling module LED 32 IO access 38
Cooling Module Specifications 53 IP address 10
cooling module speed detection 15 K
cooling modules 47 key-lock 14, 25
D L
data flow 35 LAN port 27
DB9 57 LAN Port LED 30
DDR 11 LAN port LED 30
DDR RAM 12 LED indicators 16
DDR RAM DIMM module 15 LED panel 11, 13, 14, 28
DDR RAM DIMM socket 16 LEDs 19, 27
DIMM 40 logic level signal 12
DIMM module 11, 43
M
DIMM socket latches 43
main power 45
docking connector 15
memory module 36
drive bay 12
minimum capacity 35
drive bays 14
MUTE button 14
drive IO timeout 49
drive tray 14, 25, 36, 49 N
drive tray LED 29 NetMask 9
drive trays 49 normalized airflow 20, 39
E P
electronic noise 35 Panel View 27
electrostatic discharge 21 path redundancy 35
elevated temperature 18 permanent IP 30
ESD damage 23 Phillips screwdriver 41
Ethernet cable 41 plastic cap 13
Ethernet link 19 power cord 17, 36
Ethernet Port 58 power down 38
power on 36
power path 12
power socket 17, 36
Power Supply Specifications 53
power switch 11, 12, 17, 36
PSU 11, 12, 45
PSU Bracket 45
PSU LED 31
R
rack installation 21
Rackmounting 25
RAID functionalities 12
RAIDWatch User’s Manual 27
rear panel 11, 12, 13
release button 14
reserved space 10
retention screws 23
RJ-45 30
RS-232C cable 41
S
sample topologies 34
SCSI cables 41
SCSI-320 protocol 34
sensors 32
services LED 28
Shutdown Controller 38
signal quality 35
single-blower 47
slide rail kit 13
slide rails 25
spare drive 35
static electricity 23
static free 21
status check 37
T
temperature sensor 18
terminal emulation program 19
thermal notice 23
U
Ultra-320 34
Unpacking List 24
unpacking list 21
upper threshold 18
URL 10
V
ventilation 23
VHDCI connector 16
VHDCI SCSI connector 34
VT-100 terminal 16