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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

Ceramic Resonators
(CERALOCKr)

Murata
Manufacturing Co., Ltd.
Cat.No.P16E-18
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for EU RoHS Compliant


• All the products in this catalog comply with EU RoHS.
• EU RoHS is "the European Directive 2002/95/EC on the Restriction of the Use
of Certain Hazardous Substances in Electrical and Electronic Equipment".
• For more details, please refer to our website 'Murata's Approach for EU RoHS'
(http://www.murata.com/info/rohs.html).
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CONTENTS CERALOCKr and "CERALOCK" in this catalog are


the trademarks of Murata Manufacturing Co., Ltd.
1

Selection Guide 2
2
Part Numbering 3

1 MHz Chip Type -Tight Frequency Tolerance for Automotive- 4

Application Circuits Utilization 6


3
2 MHz Chip Type -Standard Frequency Tolerance for Automotive- 7

Application Circuits Utilization 11

MHz Chip Type Notice (Soldering and Mounting) for Automotive 12


4
MHz Chip Type Notice for Automotive 13

MHz Chip Type Packaging for Automotive 14

3 MHz Chip Type -Tight Frequency Tolerance for General Usage- 16


5
Application Circuits Utilization 20

4 MHz Chip Type -Standard Frequency Tolerance for General Usage- 21

Application Circuits Utilization 26


6
5 MHz Lead Type -Standard Frequency Tolerance for General Usage- 28

6 kHz Chip Type -Standard Frequency Tolerance for General Usage- 30

7 kHz Lead Type -Standard Frequency Tolerance for General Usage- 32


7
MHz Chip Type Notice (Soldering and Mounting) for General Usage 34

MHz Chip Type Notice for General Usage 38

MHz Lead Type Notice for General Usage 39

kHz Type Notice for General Usage 40

MHz Chip Type Packaging for General Usage 43

MHz Lead Type Packaging for General Usage 46

kHz Type Packaging for General Usage 49

Recycled Paper
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Selection Guide

Start
Applications

Consumer Automotive

Functions Functions

High Speed USB Card General Usage Automotive


(high-precision) (small, low-profile) Network
(high-precision)

Full Speed USB Frequencies Other


(high-precision) Automotive Usage
kHz MHz

SMD SMD SMD SMD Leaded SMD Leaded SMD SMD

CSTCE_XTpppp CSTCR_G15Lpp CSTCE_G CSBFB_J CSBLA_E CSTCC_G CSTLS_G CSTCC_G_A CSTCR_G15Cpp


24.00–27.20 6.00MHz 8.00–13.99MHz 430–519kHz 375–429kHz 2.00–3.99MHz 3.40–10.00MHz 2.00–3.99MHz 4.00–7.99MHz
/30.00MHz

CSTCE_G15Lpp CSTCE_V CSBFB_J CSBLA_E CSTCR_G CSTLS_X CSTCR_G_B CSTCE_G15Cpp


12.00MHz 14.00–20.00MHz 700–1250kHz 430–509kHz 4.00–7.99MHz 16.00–70.00MHz 4.00–7.99MHz 8.00–13.99MHz

CSTCE_V13Lpp CSTCG_V CSBLA_E CSTCE_G CSALS_X CSTCE_G_A CSTCE_V13Cpp


16.00–70.00MHz
16.00MHz 20.00–33.86MHz 510–699kHz 8.00–13.99MHz 8.00–13.99MHz 14.00–20.00MHz
(Two Terminals)

CSTCW_X11ppp CSTCW_X_M CSBLA_J CSTCE_V CSTCE_V_C


24.00MHz 25.00–48.00MHz 700–1250kHz 14.00–20.00MHz 14.00–20.00MHz

The kHz resonators have


only two terminals.

CSTCZ_X12Rpp CSTCW_X CSTCV_X_Q


48.00MHz 20.01–70.00MHz 20.01–70.00MHz

CSACW_X CSACV_X_Q
20.01–70.00MHz 20.01–70.00MHz
(Two Terminals) (Two Terminals)

p: Alphanumerics express individual specification

Notice) "CERALOCKr for general usage" and "CERALOCKr for automotive" is different in the specification of Operating Temperature Range, Environmental Characteristics,
Physical Characteristics and so on. Please choose either "for general usage" or "for automotive" according to the required specification.

2
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

o Part Numbering

CERALOCKr (MHz)

(Part Number) CS T CE 16M0 V 5 3 *** -R0


q w e r t y u i o
qProduct ID yInitial Frequency Tolerance
Product ID Code Design
CS Ceramic Resonators 5 ±0.5%
3 ±0.3%
wFrequency/Capacitance 2 ±0.2%
Code Frequency/Capacitance 1 ±0.1%
A MHz No capacitance built-in H ±0.07%
T MHz Built-in Capacitance K -0.025/0.02%

eStructure/Size uLoad Capacity


Code Structure/Size Code Design
LS Round Lead Type 1 3/5/6pF
CC Cap Chip Type 2 10pF
CR/CE/CG Small-cap Chip Type 3 15pF
CV Monolithic Chip Type 4 22pF
CW/CZ Small Monolithic Chip Type 5 30/33/39pF
6 47pF
rNominal Center Frequency
Expressed by four-digit alphanumerics. The unit is in hertz (Hz). iIndividual Specification
Decimal point is expressed by capital letter "M".
Code Individual Specification

tDesign Three-digit alphanumerics express


***
"Individual Specification".
Code Design
With standard products, "iIndividual Specification" is omitted, and
Gpp Thickness Shear mode "oPackaging" is carried up.
T/Vpp Thickness Expander mode
Xpp Thickness Expander mode (3rd overtone) oPackaging
pp indicates initial frequency tolerance and load capacity. Code Packaging
-B0 Bulk
-A0 Radial Taping H0=18mm
-R0 Plastic Taping ø=180mm
-R1 Plastic Taping ø=330mm
Radial taping is applied to lead type and plastic taping to chip type.

CERALOCKr (kHz)

(Part Number) CS B FB 500K J58 *** -R1


q w e r t y u
qProduct ID tDesign
Product ID Code Design
CS Ceramic Resonators Epp Area Expansion mode
Jpp Area Expansion mode (Closed Type)
wFrequency/Capacitance pp indicates initial frequency tolerance and load capacitance.
Code Frequency/Capacitance
B kHz No capacitance built-in yIndividual Specification

Code Individual Specification


eStructure/Size Three-digit alphanumerics express
***
Code Structure/Size "Individual Specification".
LA Two-Terminal Lead Type With standard products, "yIndividual Specification" is omitted, and
"uPackaging" is carried up.
FB SMD Type

uPackaging
rNominal Center Frequency
Code Packaging
Expressed by four-digit alphanumerics. The unit is in hertz (Hz).
Capital letter "K" following three figures expresses the unit of -B0 Bulk
"kHz". In case of 1.0MHz (1000kHz) or above, expressed by -R1 Plastic Taping ø=330mm
three figures and capital letter "M" for decimal point.

3
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

1 Ceramic Resonators (CERALOCKr)


MHz Chip Type -Tight Frequency Tolerance for Automotive-

4.5±0.1

1.4 max.
2.0±0.1
Chip type "CERALOCK" with built-in load capacitors in

0.30±0.20

an extremely small package provides high accuracy.
0.2±0.2 0.6±0.05
MURATA's frequency adjustment and package technology 4.1 max.

1.1±0.1
expertise has enabled the development of the chip
"CERALOCK" with built-in load capacitors. 0.4 (ref.) 0.4 (ref.)

Chip "CERALOCK" for automotive has achieved importance 0.4 (ref.)


(3) (2) (1)
in the worldwide automotive market. This diverse 0.4±0.1
0.4±0.1 0.4±0.1
series owes its development to MURATA's original mass
∗: EIAJ Monthly
production techniques and high reliability. CSTCR_G15C Code
4.00-7.99MHz
0.75±0.1 1.5±0.1 1.5±0.1 (in mm)
■ Features
1. The series are high accuracy resonators whose total
3.2±0.15
tolerance is available for less than +-3,000ppm.

1.3±0.15

1.1 max.
0.10±0.10
2. The series has high reliability and is available

for wide temperature range.
0.4±0.1
0.1±0.1
3. Oscillation circuits do not require external load
3.0 max.
capacitors.

0.70±0.10
4. The series is available for a wide temperature range.
0.50 (ref.) 0.50 (ref.)
5. The resonators are extremely small and have a low 0.50 (ref.)
(3) (2) (1)
profile. 0.4±0.1 0.4±0.1 0.4±0.1
6. No adjustment is necessary for oscillation circuits.
CSTCE_G15C
8.00-13.99MHz
■ Applications (in mm)
0.4±0.1 1.2±0.1 1.2±0.1
1. Cluster panel and Control panel
2. Safety control
3.2±0.15
(Anti-lock Brake System, Electronic Stability
1.3±0.15

Control, Airbag, etc.) 1.1 max.


0.10±0.10


3. Engine ECU, Electronic Power Steering, Immobilizer,
0.1±0.1 0.4±0.1
etc.
3.0 max.
4. Car Air-conditioner, Power window, Remote Keyless
0.9±0.1

Entry system, etc.


0.5 (ref.) 0.5 (ref.) 0.5 (ref.)
5. Intelligent Transportation System
(Lane Keeping System, Millimeter wave radar, etc.) (3) (2) (1)
0.4±0.1 0.4±0.1 0.4±0.1
6. Battery control for hybrid car
∗: EIAJ Monthly
CSTCE_V13C Code
14.00-20.00MHz
0.4±0.1 1.2±0.1 1.2±0.1 (in mm)

Oscillating Initial Temp. Stability Temperature


Part Number Frequency Range
(MHz) Tolerance (%) (°C)

CSTCR_G15C 4.00 to 7.99 ±0.1% ±0.13 -40 to 125

CSTCE_G15C 8.00 to 13.99 ±0.1% ±0.13 -40 to 125

CSTCE_V13C 14.00 to 20.00 ±0.1% ±0.13 -40 to 125

Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.

4
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has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

■ Oscillation Frequency Measuring Circuit


1
VDD

5pF
To Frequency Counter
Rf
1MΩ

Rd

(1) (3)

C1 C2

(2)

■ Standard Land Pattern Dimensions


CSTCR_G15C CSTCE_G15C

0.4 1.1 0.4 1.1 0.4


0.4 0.8 0.4 0.8 0.4

1.90 ~ 2.10
2.6

1.2 1.2
Land Pattern
1.5 1.5 Land Pattern

(in mm) (in mm)

■ Oscillation Frequency Temperature Stability


CSTCE_V13C CSTCR_G15C

+0.2

0.4 0.8 0.4 0.8 0.4


Oscillating Frequency Shift (%)

+0.1
1.90 ~ 2.10

-0.1
1.2 1.2
Land Pattern

-0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C)
(in mm)

CSTCE_G15C CSTCE_V13C

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

5
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1 Application Circuits Utilization

■ TMP92CD54IF (Toshiba) ■ MB90F387 (Fujitsu)


16-bit Microcomputer 16-bit Microcomputer
Vcc3=3.3V Vcc5=5.0V Vcc=5.0V

0.1µF

H1 H2 H

IC : TMP92CD54IF IC : MB90F387

74 72 L 28 27 26 L

CERALOCKr H1: 36, 68, 86 CERALOCKr


H2: 2, 4, 15, 40, 50, 61, 75 0.1µF H: 1, 2, 21, 22, 24
L: 1, 3, 13, 38, 51, 63, 73, 88 L: 20, 23, 25, 48
V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCE10M0G15Cpp-R0 CERALOCKr: CSTCE8M00G15Cpp-R0
C1=33pF (Typ.) C1=33pF (Typ.)
C2=33pF (Typ.) C2=33pF (Typ.)

■ MC68HC908AZ60AVFU (Freescale) ■ ST72F561 (HS) (ST Microelectronics)


8-bit Microcomputer 8-bit Microcomputer
Vdd=5.0V Vdd=5.0V

H 60

EVALUATION BOARD
IC : ST72F561 (HS)
IC : MC68HC908AZ60AVFU

59 58 GND 1 2 L

1MΩ CERALOCKr
H: 9, 25, 41, 57, 58
CERALOCKr
L: 8, 24, 40, 55, 56
V1 V2 V1 V2
C1 C2
C1 C2 CERALOCKr: CSTCE16M0V13C-R0 CERALOCKr: CSTCE8M00G15App-R0
C1=15pF (Typ.) C1=33pF (Typ.)
C2=15pF (Typ.) C2=33pF (Typ.)

■ uPD70F3283YGC (NEC Electronics) ■ M30842MCT-XXXGP (Renesas)


32-bit Microcomputer 16-bit Microcomputer
Vdd=3.3V Vcc=5.0V

10kΩ

H 14 H 19

IC : µPD70F3283YGC IC : M30842MCT-XXXGP (High*)

H: 23, 24, 37, 39, 59, 74, 91, 118, 122,


12 13 10 L 22 20 L
132, 142, 143
4.7µF
L: 15, 16, 21, 36, 41, 57, 76, 93,
CERALOCKr CERALOCKr
110~113, 120, 121, 130, 140
H: 1, 5, 9, 34, 70
L: 2, 8, 11, 15, 33, 69 *High: XIN-XOUT Drive Capacity Select Bit
V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCE10M0G15Cpp-R0 CERALOCKr: CSTCE8M00G15Cpp-R0
C1=33pF (Typ.) C1=33pF (Typ.)
C2=33pF (Typ.) C2=33pF (Typ.)

6
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sales representatives or product
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has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

Ceramic Resonators (CERALOCKr)


MHz Chip Type -Standard Frequency Tolerance for Automotive-

7.2±0.2

Chip type "CERALOCK" with built-in load capacitors in 2

2.1 max.
3.0±0.2
0.45±0.3

an extremely small package provides high accuracy.
0.5±0.05
MURATA's frequency adjustment and package technology 0.3±0.3
6.6 max.
expertise has enabled the development of the chip
"CERALOCK" with built-in load capacitors. 0.45 0.45 0.45

t
(Ref.) (Ref.) (Ref.)
Chip "CERALOCK" for automotive has achieved importance (3) (2) (1)
in the worldwide automotive market. This diverse 1.2±0.2 1.4±0.2 1.2±0.2 t : 1.75±0.05
(2.00—2.99MHz)
series owes its development to MURATA's original mass t : 1.55±0.05
(3.00MHz—)
production techniques and high reliability. CSTCC_G_A
2.00-3.99MHz ∗ : EIAJ code
1.1±0.1 2.5±0.1 2.5±0.1 (in mm)
■ Features
1. The series has high reliability and is available
4.5±0.1
for wide temperature range.

1.4 max.
2. Oscillation circuits do not require external load

0.3±0.2

2.0±0.1

capacitors.
3. The series is available in a wide frequency range. (3)
0.2±0.2
(2) (1) 0.4±0.05

4.1 max.
4. The resonators are extremely small and have a low ∗ : EIAJ Monthly

1.15±0.05
Code
profile.
0.4 (ref.) 0.4 (ref.) 0.4 (ref.)
5. No adjustment is necessary for oscillation circuits. 0.8±0.1 0.8±0.1 0.8±0.1

■ Applications
1. Cluster panel and Control panel CSTCR_G_B
4.00-7.99MHz 0.4±0.1 0.4±0.1 0.4±0.1
2. Safety control (in mm)
0.75±0.1 1.5±0.1 1.5±0.1
(Anti-lock Brake System, Electronic Stability
Control, Airbag, etc.)
3.2±0.15
3. Engine ECU, Electronic Power Steering, Immobilizer, 1.3±0.15

1.1 max.
0.10±0.10

etc. ∗
4. Car Air-conditioner, Power Window, Remote Keyless
0.4±0.1
0.1±0.1
Entry system, etc. 3.0 max.
0.70±0.10

5. Electronic Toll Collection system, Car Navigation,


etc.
0.50 (ref.) 0.50 (ref.)
0.50 (ref.)
(3) (2) (1)
0.4±0.1 0.4±0.1 0.4±0.1

CSTCE_G_A
8.00-13.99MHz
(in mm)
0.4±0.1 1.2±0.1 1.2±0.1

3.2±0.15 3.7±0.2 1.3±0.1


1.3±0.15

1.1 max.
0.10±0.10

3.1±0.2


M ∗
0.1±0.1 0.4±0.1

3.0 max. (0.5) (0.5) (0.5)


Terminals (1) and (3) are
(3) (2) (1)
interchangeable.
0.9±0.1

Terminal (2) should be soldered


only to fix the resonator onto P.C.B.
Terminal (2) should be electrically
0.5 (ref.) 0.5 (ref.) 0.5 (ref.) 0.4±0.2 0.5±0.2 0.4±0.2 floating so it cannot be connected
0.5 0.5 0.5
anywhere.
(3) (2) (1)
0.4±0.1 0.4±0.1 0.4±0.1
Thickness varies
with frequency.
∗: EIAJ Monthly ∗ : EIAJ Monthly Code
CSTCE_V_C Code CSACV_X_Q
14.00-20.00MHz 20.01-70.00MHz 1.6±0.2 1.6±0.2
0.4±0.1 1.2±0.1 1.2±0.1 (in mm)
(in mm) 1.85±0.3

Continued on the following page.

7
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3
Continued from the preceding page.
3.7±0.2 1.3±0.1

3.1±0.2
M ∗

(0.7) (0.9) (0.7)


(3) (2) (1)

0.4±0.2 0.5±0.2 0.4±0.2


0.5 0.5 0.5

2 Thickness varies
with frequency and
built-in capacitance.
*: EIAJ code
CSTCV_X_Q
20.01-70.00MHz 1.6±0.2 1.6±0.2
(in mm)
1.85±0.3

Oscillating Initial Temp. Stability Temperature


Part Number Frequency Range
(MHz) Tolerance (%) (°C)
±0.4
CSTCC_G_A 2.00 to 3.99 ±0.5% -40 to 125
[-0.6% to +0.3%:Built-in Capacitance 47pF type within Freq.2.00 to 3.49MHz]

CSTCR_G_B 4.00 to 7.99 ±0.5% ±0.15 -40 to 125

CSTCE_G_A 8.00 to 13.99 ±0.5% ±0.2 -40 to 125

CSTCE_V_C 14.00 to 20.00 ±0.5% ±0.15 -40 to 125

CSACV_X_Q 20.01 to 70.00 ±0.5% ±0.3 -40 to 125

CSTCV_X_Q 20.01 to 70.00 ±0.5% ±0.3 -40 to 125

Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.

■ Oscillation Frequency Measuring Circuit


CSTCC_G_A CSTCE_G_A/CSTCE_V_C/CSTCR_G_B/CSTCV_X_Q
VDD
VDD

5pF
To Frequency counter To Frequency Counter
Rf Rf
1MΩ

Rd Rd

(1) (3) (1) (3)

C1 C2 C1 C2

(2) (2)

CSACV_X_Q

22µF VDD
+
0.01µF

Rf To Frequency Counter

CL1 CL2

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■ Standard Land Pattern Dimensions


CSTCC_G_A CSTCR_G_B

0.8 0.7 0.8 0.7 0.8

1.2 1.2 1.4 1.2 1.2

2.6
1.6
2
3.8~4.4

0.4 0.4 0.4


1.5 1.5
2.5 2.5

Land Pattern

Land Pattern (in mm)


(in mm)

CSTCE_G_A CSTCE_V_C

0.4 0.8 0.4 0.8 0.4 0.4 0.8 0.4 0.8 0.4
1.90 ~ 2.10

1.90 ~ 2.10
1.2 1.2 1.2 1.2
Land Pattern Land Pattern

(in mm) (in mm)

CSTCV_X_Q CSACV_X_Q

0.5 1.1 0.5 1.1 0.5 0.5 1.1 0.5 1.1 0.5
1.0
1.0

0.5
0.5

3.1±0.2
3.1±0.2

1.0
1.0

0.5
0.5

1.6 1.6 1.6 1.6


Land Pattern Land Pattern

(in mm) (in mm)

9
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■ Oscillation Frequency Temperature Stability


CSTCC_G_A CSTCR_G_B

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)


+0.1 +0.1

2 0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

CSTCE_G_A CSTCE_V_C

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

CSTCV_X_Q CSACV_X_Q

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

10
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Application Circuits Utilization

■ uPD78F9222MC-5A4 (NEC Electronics) ■ M30260F8AGP (Renesas)


8-bit Microcomputer 16-bit Microcomputer
Vdd=5.0V V'dd=7.0V Vcc=5.0V

10kΩ
2
H 6 H 7

IC : µPD78F9222MC-5A4 IC : M30260F8AGP (High*)

2 3 8 L 23 24 L
H: 11, 46, 47, 48
CERALOCKr CERALOCKr
L: 4, 9, 44
H: 5, 20
L: 1 *High: XIN-XOUT Drive Capacity Select Bit
V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCR6M00G55B-R0 CERALOCKr: CSTCE10M0G55A-R0
C1=39pF (Typ.) C1=33pF (Typ.)
C2=39pF (Typ.) C2=33pF (Typ.)

■ MB90F347D (Fujitsu) ■ MC68HC908AZ60AVFU (Freescale)


16-bit Microcomputer 8-bit Microcomputer
Vcc=5.0V Vdd=5.0V

EVALUATION BOARD
IC : MB90F347D
IC : MC68HC908AZ60AVFU

93 92 L 59 58 GND

CERALOCKr 1MΩ
H: 15, 32, 65, 90 CERALOCKr
L: 16, 35, 44, 66, 91
V1 V2 V1 V2
C1 C2
CERALOCKr: CSTCE8M00G55A-R0 C1 C2 CERALOCKr: CSTCE16M0V53C-R0
C1=33pF (Typ.) C1=15pF (Typ.)
C2=33pF (Typ.) C2=15pF (Typ.)

■ ST72F324J6T3 (MS) (ST Microelectronics) ■ PIC12F675-I/P (HS) (Microchip)


8-bit Microcomputer 8-bit Microcomputer
Vdd=5.0V Vdd=5.0V

H H

IC : ST72F324J6T3 (MS) IC : PIC12F675-I/P(HS)

42 41 L 2 3 L

CERALOCKr 1MΩ
H: 13, 21, 32, 43 CERALOCKr H: 1
L: 14, 22, 33, 39, 40 L: 4, 8
V1 V2 V1 V2
C1 C2
CERALOCKr: CSTCR4M00G55B-R0 C1 C2 CERALOCKr: CSTCE8M00G52A-R0
C1=39pF (Typ.) C1=10pF (Typ.)
C2=39pF (Typ.) C2=10pF (Typ.)

11
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MHz Chip Type Notice (Soldering and Mounting) for Automotive

■ CSTCC/CSTCR/CSTCE_V/CSTCE_G/CSTCV/CSACV Series
1. Soldering Conditions
(1) Reflow
One heat stress, shown in the profile at right, is applied to
2 resonator; then, after being placed in natural conditions
for 1 hour, the resonator is measured. Peak
(260˚C max.)
(a) Pre-heating conditions should be +150 to +180°C for

Temperature (˚C)
230
60 to 120 seconds. Ascending time up to +150°C Heating
180 (230˚C)
should be longer than 30 seconds. 150
Pre-heating
(b) Heating conditions should be within 40 seconds at (150-180˚C)
+230°C min., but peak temperature should be Iower Gradual
Cooling
than +260°C.

(2) Soldering Iron 30 sec. 60-120 sec. 40 sec. 120 sec.


min. max. min.
Components shall be measured after soldering on PCB
at +350±5°C for 3.0±0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.

2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW

(2) Temperature Difference : dT *1


dT<=60°C (dT=Component-solvent)
*1 ex. In case the component at +90°C immerses into
cleaning solvent at +60°C, then dT=30°C.

(3) Conditions
(a) Ultrasonic Wash (b) Immersion Wash
1 minute max. in above solvent at +60°C max. 5 minutes max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l) (c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.

(4) Drying
5 minutes max. by air blow at +80°C max.

(5) Others
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.

3. Notice for Mounting


(a) The component is recommended for use with (b) Please insure the component is thoroughly evaluated
placement machines which employ optical placement in your application circuit.
capabilities. The component might be damaged by (c) Please do not apply excess mechanical stress to the
excessive mechanical force. Please make sure to component and terminals during soldering.
evaluate by using placement machines before going
into mass production. Do not use placement
machines which utilize mechanical positioning. Please
contact Murata for details beforehand.

12
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MHz Chip Type Notice for Automotive

■ Notice (Storage and Operating Conditions)


1. Product Storage Condition (2) Please do not put the products directly on the
Please store the products in room where the floor without anything under them to avoid damp
temperature/humidity is stable. And avoid places and/or dusty places.
such places where there are large temperature (3) Please do not store the products in the places 2
changes. Please store the products under the such as: in a damp heated place, in a place where
following conditions: direct sunlight comes in, in place applying
Temperature: -10 to + 40 degrees C vibrations.
Humidity: 15 to 85% R.H. (4) Please use the products immediately after the
2. Expire Date on Storage package is opened, because the characteristics
Expire date (Shelf life) of the products is six may be reduced in quality, and/or be degraded in
months after delivery under the conditions of a the solderability due to storage under the poor
sealed and an unopened package. Please use the condition.
products within six months after delivery. If you (5) Please do not drop the products to avoid cracking
store the products for a long time (more than six of ceramic element.
months), use carefully because the products may 4. Others
be degraded in the solderability and/or rusty. Conformal coating of the component is acceptable.
Please confirm solderability and characteristics However, the resin material, curing temperature, and
for the products regularly. other process conditions should be evaluated to
3. Notice on Product Storage confirm that stable electrical characteristics are
(1) Please do not store the products in a chemical maintained.
atmosphere (Acids, Alkali, Bases, Organic gas, Please be sure to consult with our sales representative
Sulfides and so on), because the characteristics or engineer whenever and prior to using the products.
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.

■ Notice (Rating)
The component may be damaged if excess mechanical
stress is applied.

■ Notice (Handling)
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.

13
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MHz Chip Type Packaging for Automotive

■ Minimum Quantity
Part Number Plastic Tape ø180mm Plastic Tape ø330mm Bulk Dimensions
CSTCC_G_A 2,000 6,000 500 a
CSTCR_G_B 3,000 9,000 500 a
2 CSTCR_G15C 3,000 9,000 500 a
CSTCE_G_A 3,000 9,000 500 b
CSTCE_G15C 3,000 9,000 500 b
CSTCE_V_C 3,000 9,000 500 b
CSTCE_V13C 3,000 9,000 500 b
CSTCV_X_Q 2,000 6,000 500 a
CSACV_X_Q 2,000 6,000 500 a
The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.)

c Dimensions of Reel

a b
Trailer Leader
Trailer Leader
160-190 Cover Film 160-190 Cover Film

Empty Components Empty Empty Components Empty


160 min. 160 min.

400-560 400-560
(ø180 0–1.5 )

(ø180 0–1.5 )

ø13.0±0.2 ø13.0±0.2
2.0±0.5 2.0±0.5

+1.0
13.0 0 9.0
+1.0
0
17.0±1.0 13.0±1.0

(in mm)

■ Dimensions of Taping
CSTCR_G15C CSTCE_G15C
1.75±0.1

1.75±0.1
4.0±0.1 W0.1
ø1.5 Y0 4.0±0.1 ø1.5 +0.1
-0.0
2.0±0.05 2.0±0.05
3.5±0.05
5.5±0.05

12.0±0.2

8.0±0.2
(3) (2) (1)
(3) (2) (1)

3.40±0.1
4.7±0.1

(5.2)
(9.5)

W0.1 4.0±0.1 +0.2


4.0±0.1 ø1.5Y0 ø1.0 -0.0
1.50±0.1
(1.85 max.)

2.2±0.1 The cover film peel strength force 0.1 to 0.7N


(1.30 max.)
1.25±0.05

The cover film peel strength force 0.1 to 0.7N


0.25±0.05

0.90±0.10

3° max.
0.3±0.05

3˚ max. The cover film peel speed 300mm/min.


The cover film peel speed 300mm/min.
Cover Film Cover Film
10˚
10°

Direction of Feed (in mm) (in mm)


Direction of Feed

Continued on the following page.

14
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MHz Chip Type Packaging for Automotive


Continued from the preceding page.

■ Dimensions of Taping
CSTCE_V13C CSTCC_G_A

1.75±0.1
Dimensions of Carrier Tape

1.75±0.1
4.0±0.1 4.0±0.1
+0.1 ø1.55±0.05
ø1.5 -0.0 2.0±0.05
2.0±0.05

5.5±0.05
3.5±0.05

12.0±0.2
(3) (2) (1)
8.0±0.2

7.6±0.1
(3) (2) (1)

(9.5)
3.45±0.1
(5.2)

4.0±0.1 ø1.5+0.3
-0.0
+0.1
4.0±0.1 ø1.0 -0.0 3.3±0.1

(1.40 max.)
0.25±0.05

1.10±0.05

(2.45 max.)
0.3±0.05

1.85±0.05
The cover film peel strength force 0.1 to 0.7N 1.50±0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min. 3˚max.
3˚ max. The cover film peel speed 300mm/min.
Cover Film Cover film
10˚ 10˚

Direction of Feed (in mm) Direction of Feed (in mm)

CSTCR_G_B CSTCE_G_A
1.75±0.1

1.75±0.1
4.0±0.1 W0.1
ø1.5 Y0 4.0±0.1 ø1.5 +0.1
-0.0
2.0±0.05 2.0±0.05

3.5±0.05
5.5±0.05

12.0±0.2

8.0±0.2
(3) (2) (1)
(3) (2) (1)

3.40±0.1
4.7±0.1

(5.2)
(9.5)

W0.1 4.0±0.1 +0.2


4.0±0.1 ø1.5Y0 ø1.0 -0.0
1.50±0.1
(1.85 max.)

2.2±0.1 The cover film peel strength force 0.1 to 0.7N

(1.30 max.)
1.25±0.05

The cover film peel strength force 0.1 to 0.7N

0.25±0.05

0.90±0.10
3° max.
0.3±0.05

3˚ max. The cover film peel speed 300mm/min.


The cover film peel speed 300mm/min.
Cover Film Cover Film
10˚
10°

Direction of Feed (in mm) (in mm)


Direction of Feed

CSTCE_V_C CSTCV_X_Q 1.75±0.1


Dimensions of Carrier Tape
1.75±0.1

4.0±0.1 4.0±0.1 W0.1


+0.1
ø1.5 -0.0 2.0±0.1 ø1.5 Y0.0
2.0±0.05
5.5±0.1
3.5±0.05

12.0±0.2
(3)(2)(1)
8.0±0.2
(3) (2) (1)

(9.5)
3.45±0.1
(5.2)

4.1±0.1

The cover film peel strength force 0.1 to 0.7N 4.0±0.1 W0.3
W0.1 ø1.5 Y0.0
+0.1 The cover film peel speed 300mm/min. 3.35 Y0.05
0.3±0.1

4.0±0.1 ø1.0 -0.0


t2 ∗2
t1 ∗1

Cover Film
(1.40 max.)

3° max.
0.25±0.05

1.10±0.05

The cover film peel strength force 0.1 to 0.7N 1.50±0.1


10°
The cover film peel speed 300mm/min. 3˚ max.
Cover Film
10˚ (in mm)
Direction of Feed
∗1, ∗2 : Dimensions vary with product thickness of CERALOCKr
Thickness of CERALOCKr 1.50–1.40 1.30–1.20 1.10–1.00
t1 ∗1 1.65±0.1 1.45±0.1 1.2±0.1
Direction of Feed (in mm) t2 ∗2 2.0 max. 1.8 max. 1.5 max.

CSACV_X_Q
1.75±0.1

4.0±0.1 W0.1
2.0±0.1 ø1.5 Y0.0
5.5±0.1

12.0±0.2
(3)(2)(1)
(9.5)

4.1±0.1

The cover film peel strength force 0.1 to 0.7N 4.0±0.1 W0.3
W0.1 ø1.5 Y0.0
The cover film peel speed 300mm/min. 3.35 Y0.05
0.3±0.1

t2 ∗2
t1 ∗1

Cover Film 3° max.


10°

(in mm)
Direction of Feed
∗1, ∗2 : Dimensions vary with product thickness of CERALOCKr
Thickness of CERALOCKr 1.50–1.40 1.30–1.20 1.10–1.00
t1 ∗1 1.65±0.1 1.45±0.1 1.2±0.1
t2 ∗2 2.0 max. 1.8 max. 1.5 max.

15
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Ceramic Resonators (CERALOCKr)


MHz Chip Type -Tight Frequency Tolerance for General Usage-

4.5±0.1

Chip type "CERALOCK" with built-in load capacitors in

1.4 max.
0.3±0.2

2.0±0.1
an extremely small package provides high accuracy.

MURATA's frequency adjustment and package technology (3)
0.2±0.2
(2) (1) 0.4±0.05

expertise has enabled the development of the chip 4.1 max.


∗ : EIAJ Monthly

1.15±0.05
Code
"CERALOCK" with built-in load capacitors.
0.4 (ref.) 0.4 (ref.) 0.4 (ref.)
High-density mounting can be realized because of the 0.8±0.1 0.8±0.1 0.8±0.1

3 small package and the elimination of the need for an


external load capacitor.
CSTCR_G15L
4.00-7.99MHz 0.4±0.1 0.4±0.1 0.4±0.1
■ Features (in mm)
0.75±0.1 1.5±0.1 1.5±0.1
1. High accuracy resonator realizes initial tolerance
of +-250ppm.
3.2±0.15
2. Oscillation circuits do not require external load

1.3±0.15

1.1 max.
0.10±0.10
capacitors.

3. The series is available in a wide frequency range.
0.4±0.1
0.1±0.1
4. The resonators are extremely small and have a low
3.0 max.
profile.

0.70±0.10
5. No adjustment is necessary for oscillation circuits.
0.50 (ref.) 0.50 (ref.)
0.50 (ref.)

■ Applications (3) (2) (1)


0.4±0.1 0.4±0.1 0.4±0.1
1. Clock oscillators for USB (High-speed and Full-speed)
controller ICs CSTCE_G15L
8.00-13.99MHz
2. Storage devices with SATA interface (in mm)
0.4±0.1 1.2±0.1 1.2±0.1
(HDD, Optical storage device, etc.)
3. Audio equipment and musical instrument, etc.
3.2±0.15
4. Other applications for replacement from Crystal
1.3±0.15

Oscillators 1.1 max.


0.10±0.10

0.1±0.1 0.4±0.1

3.0 max.
0.9±0.1

0.5 (ref.) 0.5 (ref.) 0.5 (ref.)

(3) (2) (1)


0.4±0.1 0.4±0.1 0.4±0.1

∗: EIAJ Monthly
CSTCE_V13L Code
14.00-20.00MHz
0.4±0.1 1.2±0.1 1.2±0.1 (in mm)

3.2±0.15 2.5T0.2 1.4 max.


1.3±0.15

1.1 max.
0.10±0.10

2.0T0.2

∗ *

0.4±0.1
0.1±0.1
(0.5) (0.5) (0.5)
3.0 max. (3) (2) (1)
0.05 +0.10 0.05 +0.10
1.00±0.10

- 0.05 - 0.05

0.50 (ref.) 0.50 (ref.)


0.50 (ref.) 0.4 +0.3 +0.3 +0.3
- 0.2 0.4 - 0.2 0.4 - 0.2

(3) (2) (1) 0.5T0.2 0.5T0.2 0.5T0.2


0.4±0.1 0.4±0.1 0.4±0.1 Thickness varies
with frequency and
built-in capacitance.
*: EIAJ code
CSTCE_XK, CSTCE_XT CSTCW_X11
24.00-27.20/30.00MHz 20.01-29.99MHz 1.0T0.2 1.0T0.2
(in mm)
0.4±0.1 1.2±0.1 1.2±0.1 1.25T0.2 (in mm)

Continued on the following page.

16
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Continued from the preceding page.
2.00T0.05 0.75T0.10

1.60T0.05
*

(0.45) (0.60) (0.45)


(3) (2) (1)

0.3 +0.20
-0.15 0.3 +0.20
-0.15 0.3 +0.20
-0.15

0.43T0.10 0.55T0.10 0.43T0.10

Thickness varies
with frequency and
built-in capacitance.
*: EIAJ code
CSTCZ_X12R
30.00-48.00MHz 0.78T0.20 0.78T0.20
1.00T0.20 (in mm)

Oscillating Temperature
Part Number Frequency
Initial
Tolerance
Temp. Stability
(%)
Range 3
(MHz) (°C)

CSTCR_G15L 4.00 to 7.99 ±0.1% ±0.08 0 to 70

CSTCE_G15L 8.00 to 13.99 ±0.1% ±0.08 0 to 70

CSTCE_V13L 14.00 to 20.00 ±0.1% ±0.08 0 to 70

CSTCW_X11 20.01 to 29.99 ±0.1% ±0.1 0 to 70

24.00 to 27.20 +0.02


CSTCE_XK ±0.015 0 to 70
/30.00 /-0.025%

24.00 to 27.20
CSTCE_XT ±0.027% ±0.015 0 to 70
/30.00

±0.05
CSTCZ_X12R 30.00 to 48.00 ±0.15% -30 to 85
[0 to 70°C:±0.03%]

CSTCE_XK: Available Frequency is 24.00 to 27.20MHz and 30.00MHz.


CSTCE_XT: Initial tol. Includes freq. aging. Please contact us in case temp. range exceeds 0 to 70 degrees C.
Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.

■ Oscillation Frequency Measuring Circuit


CSTCR_G15/CSTCE_G15L/CSTCE_V13L CSTCE_XK, CSTCE_XT

VDD VDD

5pF
To Frequency Counter
Rf Rf To Frequency Counter
1MΩ

Rd

(1) (3)
(1) (3)

C1 C2
C1 C2
(2)
(2)

Continued on the following page.

17
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3
Continued from the preceding page.

■ Oscillation Frequency Measuring Circuit


CSTCW_X11 CSTCZ_X12R
VDD
VDD

To Frequency counter
Rf Rf To Frequency Counter

Rd

(1) (3) (1) (3)

C1 C2
C1 C2
(2)
(2)

3
■ Standard Land Pattern Dimensions
CSTCR_G15L CSTCE_G15L

0.4 1.1 0.4 1.1 0.4


0.4 0.8 0.4 0.8 0.4

1.90 ~ 2.10
2.6

1.2 1.2
Land Pattern
1.5 1.5 Land Pattern

(in mm) (in mm)

CSTCE_V13L CSTCE_XK, CSTCE_XT

0.4 0.8 0.4 0.8 0.4 0.4 0.8 0.4 0.8 0.4
1.90 ~ 2.10

1.90 ~ 2.10

1.2 1.2 1.2 1.2


Land Pattern Land Pattern

(in mm) (in mm)

CSTCW_X11 CSTCZ_X12R

0.5 0.5 0.5 0.5 0.5 0.3 0.65 0.3 0.65 0.3
0.3
0.8

2.0T0.2

2.0

1.6
0.8
0.3

0.95 0.95 Land Pattern


1.0 1.0

Land Pattern

(in mm)
(in mm)

18
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■ Oscillation Frequency Temperature Stability


CSTCR_G15L CSTCE_G15L

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)


+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

CSTCE_V13L CSTCE_XK, CSTCE_XT

+0.2 +1000
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +500

0 0

-0.1 -500

-0.2 -1000
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

CSTCW_X11 CSTCZ_X12R

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-40 -20 0 +20 +40 +60 +80 +100 -40 -20 0 +20 +40 +60 +80 +100
Temperature (°C) Temperature (°C)

19
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Application Circuits Utilization

■ M66291GP (Renesas) ■ MN102HF74GHL (Panasonic)


USB Transceiver 16-bit Microcontroller
Vset=3.3V Vdd=3.3V

Fout

H 82 18

EVALUATION BOARD IC : MN102HF74GHL


IC : M66291GP

14 13 GND 23 24 L

1MΩ CERALOCKr
CERALOCKr 220Ω

3 V1 V2 V1 V2
H: 1~17, 22, 25, 26~42, 54, 58~60, 66~81, 83~91
L: 19, 20, 43~53, 55~57, 61~65, 82, 92~100

C1 C2
C1 C2 CERALOCKr: CSTCR6M00G15ppp-R0 CERALOCKr: CSTCE12M0G15Lpp-R0
C1=39pF (Typ.) C1=33pF (Typ.)
C2=39pF (Typ.) C2=33pF (Typ.)

■ LC87F1964A (Sanyo) ■ TUSB2046B (Texas Insturuments)


8-bit Microcontroller USB 4-port HUB
Vdd=5.0V Vcc=3.3V

10kΩ

H H1 H

IC : LC87F1964A IC : TUSB2046B

6 7 L1 L 30 29 GND
H: 8, 19, 39
10kΩ L: 5, 20, 40
470Ω 1MΩ
H1: 31, 33
CERALOCKr L1: 29, 30, 32, 34~36 CERALOCKr
H: 3, 25
V1 V2 V1 V2 L: 7, 28

C1 C2 CERALOCKr: CSTCE12M0G15Lpp-R0 C1 C2 CERALOCKr: CSTCR6M00G15ppp-R0


C1=33pF (Typ.) C1=39pF (Typ.)
C2=33pF (Typ.) C2=39pF (Typ.)

■ ISP1181BDGG (Philips) ■ uPD720114 (NEC Electronics)


USB Controller USB2.0 (Hi-speed) HUB Controller
Vset=3.3V Vdd=3.3V

H VDD

EVALUATION BOARD IC : µPD720114


IC : ISP1181BDGG

48 47 GND 10 11 GND

CERALOCKr CERALOCKr

V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCR6M00G15ppp-R0 CERALOCKr: CSTCE30M0XK1ppp-R0
C1=39pF (Typ.) C1=5pF (Typ.)
C2=39pF (Typ.) C2=5pF (Typ.)

20
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Ceramic Resonators (CERALOCKr)


MHz Chip Type -Standard Frequency Tolerance for General Usage-

7.2±0.2

Chip type "CERALOCK" with built-in load capacitors

2.1 max.
3.0±0.2
0.45±0.3

provides extremely small package.
0.5±0.05
MURATA's package technology expertise has enabled the 0.3±0.3
6.6 max.
development of the Chip "CERALOCK" with built-in load
capacitors. 0.45 0.45 0.45

t
(Ref.) (Ref.) (Ref.)
High-density mounting can be realized because of the (3) (2) (1)
small package and the elimination of the need for an 1.2±0.2 1.4±0.2 1.2±0.2 t : 1.75±0.05
(2.00—2.99MHz)
external load capacitor. t : 1.55±0.05
(3.00MHz—)

CSTCC_G
■ Features 2.00-3.99MHz ∗ : EIAJ code
1.1±0.1 2.5±0.1 2.5±0.1 (in mm)
1. Oscillation circuits do not require external load
capacitors.
4.5±0.1
2. The series is available in a wide frequency range.
4

1.4 max.
3. The resonators are extremely small and have a low

0.3±0.2

2.0±0.1

profile.
4. No adjustment is necessary for oscillation circuits. (3)
0.2±0.2
(2) (1) 0.4±0.05

4.1 max.
∗ : EIAJ Monthly

1.15±0.05
Code
■ Applications
0.4 (ref.) 0.4 (ref.) 0.4 (ref.)
1. Clock oscillators for microprocessors 0.8±0.1 0.8±0.1 0.8±0.1
2. Small electronic equipment such as hand held phone,
digital video camcorder (DVC), digital still camera
(DSC), portable audio player, etc. CSTCR_G
4.00-7.99MHz 0.4±0.1 0.4±0.1 0.4±0.1
3. Storage media and memory (in mm)
0.75±0.1 1.5±0.1 1.5±0.1
(HDD, Optical storage device, FDD, Flash memory
card, etc.)
3.2±0.15
4. Office automation equipment 1.3±0.15

1.1 max.
0.10±0.10

(Mobile PC, Mouse, Keyboard, etc.) ∗


5. Audio-visual applications
0.4±0.1
0.1±0.1
(TV, DVD-HDD recorder, Audio equipment, Remote 3.0 max.
0.70±0.10

controller, etc.)
6. Home appliances
0.50 (ref.) 0.50 (ref.)
(Air conditioner, Microwave oven, Refrigerator, 0.50 (ref.)
(3) (2) (1)
Washing machine, etc.) 0.4±0.1 0.4±0.1 0.4±0.1

CSTCE_G
8.00-13.99MHz
(in mm)
0.4±0.1 1.2±0.1 1.2±0.1

3.2±0.15 2.0±0.15
1.1 max.
0.10±0.10

1.3±0.15
1.3±0.15

1.1 max.
0.10±0.10

0.4±0.1 0.075±0.075 0.4±0.1


0.1±0.1
3.0 max.
1.85 max.
0.9±0.1

0.85±0.1

0.62 (ref.) 0.62 (ref.)


0.45 (ref.) 0.52 (ref.) 0.41 (ref.) 0.52 (ref.)
(3) (2) (1) (3) (2) (1)
0.6±0.10.4±0.1 0.6±0.1 0.5±0.1 0.3±0.1 0.5±0.1

CSTCE_V CSTCG_V
14.00-20.00MHz 20.00-33.86MHz
0.65±0.1 0.95±0.1 0.95±0.1 (in mm) (Ultra Small) 0.3±0.1 0.7±0.1 0.7±0.1 (in mm)

Continued on the following page.

21
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Continued from the preceding page.

2.5T0.2 1.2 max. 2.5T0.2 1.4 max.

2.0T0.2
2.0T0.2
*
*

(0.5) (0.5) (0.5)


+0.10
(0.5) (0.5) +0.10 (3) (2) (1)
0.05 - 0.05 0.05 - 0.05 0.05 +0.10
- 0.05 0.05 +0.10
- 0.05

+0.3 +0.3
0.4 - 0.2 0.4 - 0.2
0.4 +0.3 +0.3 +0.3
- 0.2 0.4 - 0.2 0.4 - 0.2
0.5T0.2 0.5T0.2
0.5T0.2 0.5T0.2 0.5T0.2
Thickness varies
with frequency and
Thickness varies built-in capacitance.
with frequency. *: EIAJ code
CSACW_X *: EIAJ code CSTCW_X
20.01-70.00MHz 1.0T0.2 1.0T0.2
20.01-70.00MHz 1.0T0.2 1.0T0.2
1.25T0.2 (in mm) (in mm)
1.25T0.2

2.5T0.2 0.65 max.


2.0T0.2

(0.5) (0.5) (0.5)


+0.10 (3) (2) (1) +0.10
0.05-0.05 0.05 -0.05

0.4 +0.3 +0.3 +0.3


-0.2 0.4 -0.2 0.4 -0.2

4 0.5T0.2 0.5T0.2 0.5T0.2


Thickness varies
with frequency and
built-in capacitance.
ex.) 48.00MHz: 0.44±0.03mm
CSTCW_X_M *: EIAJ code
25.00-48.00MHz 1.0T0.2 1.0T0.2
(Urtra Thin) 1.25T0.2 (in mm)

Oscillating Initial Temp. Stability Temperature


Part Number Frequency Range
(MHz) Tolerance (%) (°C)
±0.3
CSTCC_G 2.00 to 3.99 ±0.5% -20 to 80
[±0.4%:Built-in Capacitance 47pF type within Freq.2.00 to 3.49MHz]

CSTCR_G 4.00 to 7.99 ±0.5% ±0.2 -20 to 80

CSTCE_G 8.00 to 13.99 ±0.5% ±0.2 -20 to 80

CSTCE_G_Z 8.00 to 13.99 ±0.5% ±0.2 -40 to 125

CSTCE_V 14.00 to 20.00 ±0.5% ±0.3 -20 to 80

CSTCG_V 20.00 to 33.86 ±0.5% ±0.3 -20 to 80

CSACW_X 20.01 to 70.00 ±0.5% ±0.2 -20 to 80

CSTCW_X 20.01 to 70.00 ±0.5% ±0.2 -20 to 80

CSTCW_X_M 25.00 to 48.00 ±0.5% ±0.2 -20 to 80

Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.

22
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■ Oscillation Frequency Measuring Circuit


CSTCR_G/CSTCE_G/CSTCE_V/CSTCG_V CSTCC_G/CSTCW_X
VDD
VDD

5pF
To Frequency Counter To Frequency counter
Rf Rf
1MΩ

Rd Rd

(1) (3) (1) (3)

C1 C2 C1 C2

(2) (2)

CSACW_X CSTCW_X_M
VDD
VDD

4
To Frequency counter To Frequency Counter
Rf Rf

Rd

(1) (3)

CL1 CL2 C1 C2
(2)

23
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■ Standard Land Pattern Dimensions


CSTCC_G CSTCR_G

0.8 0.7 0.8 0.7 0.8

1.2 1.2 1.4 1.2 1.2

2.6
1.6
3.8~4.4

0.4 0.4 0.4


1.5 1.5
2.5 2.5

Land Pattern

Land Pattern (in mm)


(in mm)

CSTCE_G CSTCE_V

0.3 0.65 0.3 0.65 0.3


0.4 0.8 0.4 0.8 0.4
4
1.90 ~ 2.10

1.6
1.2 1.2 0.95 0.95
Land Pattern
Land Pattem

(in mm) (in mm)

CSTCG_V CSACW_X

0.3 0.5 0.3 0.5 0.3


0.5 0.5
0.3
0.8
1.6

2.0T0.2
0.8

0.8 0.8
0.3

2.0
Land Pattem
Land Pattern

(in mm)
(in mm)

CSTCW_X CSTCW_X_M

0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
0.3
0.3

0.8
0.8

2.0T0.2

2.0
0.8

0.8
0.3

0.3

1.0 1.0 1.0 1.0


Land Pattern
Land Pattern

(in mm) (in mm)

24
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■ Oscillation Frequency Temperature Stability


CSTCC_G CSTCR_G

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)


+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-40 -20 0 +20 +40 +60 +80 +100 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

CSTCE_G CSTCE_V

+0.2 +0.2

4
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140
Temperature (°C) Temperature (°C)

CSTCG_V CSACW_X

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-60 -40 -20 0 +20 +40 +60 +80 +100 +120 +140 -40 -20 0 +20 +40 +60 +80 +100
Temperature (°C) Temperature (°C)

CSTCW_X CSTCW_X_M

+0.2 +0.2
Oscillating Frequency Shift (%)

Oscillating Frequency Shift (%)

+0.1 +0.1

0 0

-0.1 -0.1

-0.2 -0.2
-40 -20 0 +20 +40 +60 +80 +100 -40 -20 0 +20 +40 +60 +80 +100
Temperature (°C) Temperature (°C)

25
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Application Circuits Utilization

■ uPD78F0533GB (NEC Electronics) ■ M38235G6HP (Renesas)


8-bit Microcomputer 8-bit Microcomputer
Vdd=5.0V Vcc=5.0V

10kΩ

H 6 H 25

IC : µPD78F0533GB M38235G6HP

11 10 12 L 28 29 L
0.1µF
CERALOCKr CERALOCKr
H: 15, 16, 47 H: 71
L: 9, 13, 14, 48 L: 30, 73
V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCR4M00G55-R0 CERALOCKr: CSTLS8M00G53-B0
C1=39pF (Typ.) C1=15pF (Typ.)
C2=39pF (Typ.) C2=15pF (Typ.)

■ TMP19A43FDXBG (Toshiba) ■ MN103SFC2D (Panasonic)


32-bit Microcomputer 32-bit Microcomputer
4 Vcc=1.5V Vcc'=2.5V Vcc''=3.3V Vdd=5.0V

EVALUATION BOARD
IC : MN103SFC2D
IC : TMP19A43FDXBG

A14 A15 GND 14 13 Vdd2 L


10µF
CERALOCKr CERALOCKr H: 9, 17, 34
Xin: A14 L: 7, 15, 36
Xout: A15 Vdd2: 16, 38
V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCE10M0G52-R0 CERALOCKr: CSTCR5M00G55Z-R0
C1=10pF (Typ.) C1=39pF (Typ.)
C2=10pF (Typ.) C2=39pF (Typ.)

■ MB95F128H (Fujitsu) ■ PIC16F716-I/SO (Microchip)


8-bit Microcomputer 8-bit Microcomputer
Vcc=5.0V Vdd=5.0V

H H

EVALUATION BOARD
IC : MB95F128H
IC : PIC16F716-I/SO(HS)

56 55 L 16 15 GND

CERALOCKr 1MΩ
H: 3, 28, 51, 79 CERALOCKr
L: 4, 29, 54, 57
V1 V2 V1 V2
C1 C2
CERALOCKr: CSTCE8M00G52-R0 C1 C2 CERALOCKr: CSTCE12M0G52A-R0
C1=10pF (Typ.) C1=10pF (Typ.)
C2=10pF (Typ.) C2=10pF (Typ.)

Continued on the following page.

26
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

Application Circuits Utilization


Continued from the preceding page.

■ HD64F36077GH (Renesas) ■ LC87F5G32A (Sanyo)


16-bit Microcomputer 8-bit Microcomputer
Vcc=5.0V Vdd=5.0V
510Ω 47000pF

10kΩ 10kΩ 100pF

H 26 H' H 2

IC : HD64F36077GH IC : LC87F5G32A

11 10 6 L 6 7 L' L
0.1µF
2.2kF H: 8, 19, 39
CERALOCKr 10kF L: 5, 20, 40
CERALOCKr H': 29, 31, 35
H: 3, 7, 12
L: 8, 9 L': 30, 32~34, 36
V1 V2 V1 V2
C1 C2
CERALOCKr: CSTCE8M00G52-R0 C1 C2 CERALOCKr: CSTLS5M00G53-B0
C1=10pF (Typ.) C1=15pF (Typ.)
C2=10pF (Typ.) C2=15pF (Typ.)

■ uPD70F3215HYGC (NEC Electronics) ■ ATmega128 (Atmel)


32-bit Microcomputer 8-bit Microcomputer
Vdd=5.0V Vcc=5.0V
4

H 14 H

IC : µPD70F3215HYGC IC : ATmega128

12 13 10 L 24 23 L
10µF
CERALOCKr CERALOCKr
H: 1, 5, 9, 34, 70 H: 21, 52, 64
L: 2, 8, 11, 33, 69 L: 22, 53, 63
V1 V2 V1 V2
C1 C2 C1 C2
CERALOCKr: CSTCR5M00G55-R0 CERALOCKr: CSTCE8M00G52-R0
C1=39pF (Typ.) C1=10pF (Typ.)
C2=39pF (Typ.) C2=10pF (Typ.)

■ ST7FLITE29F2B6 (ST Microelectronics) ■ TMS320F2810PBKA (Texas Insturumets)


8-bit Microcomputer 32-bit Microcomputer
Vdd=5.0V Vdd1=1.8V Vdd2=3.3V

H 18 H1 H2

IC : ST7FLITE29F2B6 IC : TMS320F2810PBKA

15 14 L 58 57 L
H1: 20, 29, 42, 56, 63, 74, 82, 94, 99,
100Ω 100, 102, 110, 114
CERALOCKr H2: 1, 13, 14, 25, 49, 52, 83, 104, 118
H: 17 CERALOCKr L: 12, 15, 17, 26, 30, 39, 53, 59, 62, 73,
L: 16 88, 95, 103, 109, 115, 117, 128
V1 V2 V1 V2
C1 C2
CERALOCKr: CSTCE16M0V53-R0 C1 C2 CERALOCKr: CSTCE15M0V53-R0
C1=15pF (Typ.) C1=15pF (Typ.)
C2=15pF (Typ.) C2=15pF (Typ.)

27
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

Ceramic Resonators (CERALOCKr)


MHz Lead Type -Standard Frequency Tolerance for General Usage-

8.0±1.0 3.0±1.0

MURATA's ceramic resonator, "CERALOCK" with built-in

0.7 (Ref.)
5.5±0.5
load capacitors, has been widely applied as the most ∗∗∗

suitable component for clock oscillators in a broad


range of microprocessors.

3.5±0.3
The CSTLS series can be used in the design of
oscillation circuits not requiring external load 0.7 (Ref.)
7.0

ø0.48±0.05
(3) (2) (1)
capacitors, enabling both high-density mounting and
cost reduction.
CSTLS_G
■ Features 3.40-10.00MHz 2.5±0.2 2.5±0.2 ∗∗∗ : Weekly Date Code
(in mm)
1. Oscillation circuits do not require external load
capacitors.
There is some variation in built-in capacitance 5.5±1.0 T ∗1

values applicable to various IC (except for CSALS


series). ∗

6.5±0.5
2. The series is stable over a wide temperature range.
3. The resonators are compact, lightweight and exhibit

3.5±0.3
superior shock resistance performance.
4. They enable the design of oscillator circuits (3) (2) (1)
5 requiring no adjustment. T ∗1 : 3.5±1.0 (16.00—32.99MHz)
3.0±1.0 (33.00—70.00MHz)
5. The series is inexpensive and available in stable ∗ : EIAJ Monthly Code

φ0.48±0.05
supply. CSTLS_X
2.5±0.2 2.5±0.2
16.00-70.00MHz
(in mm)

■ Applications
1. DTMF generators
2. Clock oscillators for microcomputers 5.5±1.0 T ∗1

3. Remote control units


4. Automated office equipment ∗
6.5±0.5
3.5±0.3

5.0±0.3
T ∗1 : 3.5±1.0 (16.00—32.99MHz)
3.0±1.0 (33.00—70.00MHz)

φ0.48±0.05

: EIAJ Monthly Code


CSALS_X
16.00-70.00MHz
(in mm)

Oscillating Initial Temp. Stability Temperature


Part Number Frequency Range
(MHz) Tolerance (%) (°C)
±0.2
CSTLS_G 3.40 to 10.00 ±0.5% -20 to 80
[-0.4% to +0.2%:Built-in Capacitance 47pF type]

CSALS_X 16.00 to 70.00 ±0.5% ±0.2 -20 to 80

CSTLS_X 16.00 to 70.00 ±0.5% ±0.2 -20 to 80

Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page.

28
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

■ Oscillation Frequency Measuring Circuit


CSTLS_G/CSTLS_X CSALS_X
VDD VDD

To Frequency counter To Frequency counter


Rf Rf

Rd Rd

(1) (3)

CL1 CL2
C1 C2
(2)

■ Oscillation Frequency Temperature Stability


CSTLS_G CSTLS_X
W0.50
0.3

0.2
W0.25
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)

0.1

0 0.0
−50 −30 −10 10 30 50 70 90 110 130
Y40 0 40 80 120
Temperature (˚C)
Temperature (°C) −0.1

Y0.25
−0.2

−0.3
5
Y0.50

CSALS_X

0.3

0.2
Oscillating Frequency Shift (%)

0.1

0.0
−50 −30 −10 10 30 50 70 90 110 130
Temperature (˚C)
−0.1

−0.2

−0.3

29
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

Ceramic Resonators (CERALOCKr)


kHz Chip Type -Standard Frequency Tolerance for General Usage-

7.5±0.3 3.3±0.3

MURATA's original package technologies have enabled


the development of the kHz band "CERALOCK".

8.5±0.3
1.0 max.
The series is perfect in miniature remote control

2.0±0.5

1.0±0.5
units and AV modules. +0.1
0 -0.4

"CERALOCK" can be reflow soldered and mounted by


automatic placers. 1.1±0.1 0.15±0.05

0.9±0.1
■ Features

0.15 max.
∗ : EIAJ code

1. The series withstands reflow soldering. CSBFB_J (in mm)

2. The series is mountable by automatic placers. 430-519kHz


5.0±0.2

3. No adjustment is necessary for oscillation circuits.

■ Applications 5.0±0.3 2.3±0.2

1. Clock oscillators for microprocessors


2. OA equipment

6.0±0.3
+0.1
0 −0.4

3. AV modules

1.0 max.

2.0±0.5

1.0±0.3
0.8±0.2
0.7±0.2 0.15±0.05

0.15 max.
0.10±0.03

CSBFB_J
700-1250kHz ∗ : EIAJ code

2.5±0.2 (in mm)

6 Part Number
Oscillating Frequency
Initial Tolerance
Temp. Stability Temperature Range
(kHz) (%) (°C)
CSBFB_J 430 to 519, 700 to 1250 ±0.5% ±0.3 -20 to 80
Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.

■ Oscillation Frequency Measuring Circuit ■ Oscillation Frequency Temperature Stability

VDD

W0.5
Oscillating Frequency Shift (%)

To Frequency counter
Rf

0
Rd Y40 0 40 80 120
Temperature (˚C)

CL1 CL2
Y0.5

Continued on the following page.

30
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Continued from the preceding page.

■ Standard Land Pattern Dimensions


CSBFB_J (430-519kHz) CSBFB_J (700-1250kHz)

0.5
0.5
2.0

3.0
1.7 1.7 1.5 1.5
3.3 1.0

(in mm) (in mm)

31
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Ceramic Resonators (CERALOCKr)


kHz Lead Type -Standard Frequency Tolerance for General Usage-

7.9±0.3 3.6±0.3

The CSBLA series ceramic resonators owe their

9.3±0.3
development to MURATA's innovative expert technologies

1.5 max.
and the application of mass production techniques
typically utilized in the manufacture of piezoelectric
ceramic components. Because of their high mechanical Q

4.3±0.5
and consistent high quality, the CSBLA series are
ideally suited to microprocessor and remote control 0.8±0.1
1.1±0.1

0.25±0.1
0.1±0.03
unit applications.
CSBLA_E
∗ : EIAJ code

1.8±0.3
■ Features 375-429kHz
(in mm)
5.0±0.2
1. The series is stable over a wide temperature range
and with respect to long-term aging.
2. The series comprises fixed, tuned, solid-state 7.0±0.3 3.5±0.3

devices.
3. The resonators are miniature and lightweight.

9.0±0.3
1.5 max.
4. They exhibit excellent shock resistance performance.
5. Oscillating circuits requiring no adjustment can be
designed by utilizing these resonators in

3.5±0.5
conjunction with transistors or appropriate ICs.
0.8±0.1
1.1±0.1
0.25±0.1
0.1±0.03

■ Applications
1. Square-wave and sine-wave oscillators CSBLA_E

1.75±0.5
430-509kHz ∗ : EIAJ code
2. Clock generator for microprocessors 5.0±0.2 (in mm)

3. Remote control systems

7.0±0.3 3.5±0.3 5.0±0.3 2.2±0.2


6.0±0.3
9.0±0.3

1.5 max.
1.5 max.

3.5±.0.5
3.5±0.5

7 0.8±0.1
0.8±0.2
0.15±0.05
1.1±0.1
0.25±0.1
0.1±0.03

0.1±0.03
0.6±0.2

CSBLA_E CSBLA_J ∗ : EIAJ code


∗ : EIAJ code
510-699kHz
1.1±0.2
1.75±0.5

700-1250kHz
(in mm) in mm
5.0±0.2 2.5±0.2

Oscillating Frequency Temp. Stability Temperature Range


Part Number Initial Tolerance
(kHz) (%) (°C)
CSBLA_E 375 to 699 - ±0.3 -20 to +80
CSBLA_J 700 to 1250 ±0.5% ±0.3 -20 to 80
Irregular or stop oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page.

32
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

■ Oscillation Frequency Measuring Circuit ■ Oscillation Frequency Temperature Stability

VDD

W0.5

Oscillating Frequency Shift (%)


To Frequency counter
Rf

0
Rd Y40 0 40 80 120
Temperature (˚C)

CL1 CL2
Y0.5

33
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Notice (Soldering and Mounting) for General Usage

■ CSTCC Series
1. Soldering Conditions
(1) Reflow
One heat stress, shown in the profile at right, is applied to
resonator; then, after being placed in natural conditions
for 1 hour, the resonator is measured. Peak
(260˚C max.)
(a) Pre-heating conditions should be +150 to +180°C for

Temperature (˚C)
230
60 to 120 seconds. Ascending time up to +150°C Heating
180 (230˚C)
should be longer than 30 seconds. 150
Pre-heating
(b) Heating conditions should be within 40 seconds at (150-180˚C)
+230°C min., but peak temperature should be Iower Gradual
Cooling
than +260°C.

(2) Soldering Iron 30 sec. 60-120 sec. 40 sec. 120 sec.


min. max. min.
Components shall be measured after soldering on PCB
at +350±5°C for 3.0±0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.

2. Wash
Some series do not withstand washing. Series Wash
Please check the list at right before use. CSTCC (Except 2.00 - 3.49MHz) Available
CSTCC (Only 2.00 - 3.49MHz) Not Available
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW

(2) Temperature Difference : dT *1


dT<=60°C (dT=Component-solvent)
*1 ex. In case the component at +90°C immerses into
cleaning solvent at +60°C, then dT=30°C.

(3) Conditions
(a) Ultrasonic Wash (b) Immersion Wash
1 minute max. in above solvent at +60°C max. 5 minutes max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l) (c) Shower or Rinse Wash
7 5 minutes max. in above solvent at +60°C max.

(4) Drying
5 minutes max. by air blow at +80°C max.

(5) Others
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.

3. Notice for Mounting


(a) The component is recommended for use with (b) Please insure the component is thoroughly evaluated
placement machines which employ optical placement in your application circuit.
capabilities. The component might be damaged by (c) Please do not apply excess mechanical stress to the
excessive mechanical force. Please make sure to component and terminals during soldering.
evaluate by using placement machines before going
into mass production. Do not use placement
machines which utilize mechanical positioning. Please
contact Murata for details beforehand.

34
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Notice (Soldering and Mounting) for General Usage

■ CSTCR/CSTCE_V/CSTCG/CSTCE_G/CSTCE_XK Series
1. Soldering Conditions
(1) Reflow
One heat stress, shown in the profile at right, is applied to
resonator; then, after being placed in natural conditions
for 1 hour, the resonator is measured. Peak
(260˚C max.)
(a) Pre-heating conditions should be +150 to +180°C for

Temperature (˚C)
230
60 to 120 seconds. Ascending time up to +150°C Heating
180 (230˚C)
should be longer than 30 seconds. 150
Pre-heating
(b) Heating conditions should be within 40 seconds at (150-180˚C)
+230°C min., but peak temperature should be Iower Gradual
Cooling
than +260°C.

(2) Soldering Iron 30 sec. 60-120 sec. 40 sec. 120 sec.


min. max. min.
Components shall be measured after soldering on PCB
at +350±5°C for 3.0±0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.

2. Wash
Please contact us in case you need washable component.

3. Notice for Mounting


(a) The component is recommended for use with (b) Please insure the component is thoroughly evaluated
placement machines which employ optical placement in your application circuit.
capabilities. The component might be damaged by (c) Please do not apply excess mechanical stress to the
excessive mechanical force. Please make sure to component and terminals during soldering.
evaluate by using placement machines before going
into mass production. Do not use placement machines
which utilize mechanical positioning. Please contact
Murata for details beforehand.

35
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Notice (Soldering and Mounting) for General Usage

■ CSTCV/CSACV Series
1. Soldering Conditions
(1) Reflow
One heat stress, shown in the profile at right, is applied to
resonator; then, after being placed in natural conditions
for 1 hour, the resonator is measured. Peak
(260˚C max.)
(a) Pre-heating conditions should be +150 to +180°C for

Temperature (˚C)
230
60 to 120 seconds. Ascending time up to +150°C Heating
180 (230˚C)
should be longer than 30 seconds. 150
Pre-heating
(b) Heating conditions should be within 40 seconds at (150-180˚C)
+230°C min., but peak temperature should be Iower Gradual
Cooling
than +260°C.

(2) Soldering Iron 30 sec. 60-120 sec. 40 sec. 120 sec.


min. max. min.
Components shall be measured after soldering on PCB
at +350±5°C for 3.0±0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.

2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW

(2) Temperature Difference : dT *1


dT<=60°C (dT=Component-solvent)
*1 ex. In case the component at +90°C immerses into
cleaning solvent at +60°C, then dT=30°C.

(3) Conditions
(a) Ultrasonic Wash (b) Immersion Wash
1 minute max. in above solvent at +60°C max. 5 minutes max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l) (c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.

(4) Drying
7 5 minutes max. by air blow at +80°C max.

(5) Others
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.

3. Notice for Mounting


(a) The component is recommended for use with (b) Please insure the component is thoroughly evaluated
placement machines which employ optical placement in your application circuit.
capabilities. In some cases, placement machines (c) Please do not apply excess mechanical stress to the
which utilize mechanical positioning may apply component and terminals during soldering.
excessive mechanical force which might result in
damage to the ceramic resonator. Please contact
Murata before mounting this product using placement
machines which use mechanical positioning.

36
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of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Notice (Soldering and Mounting) for General Usage

■ CSACW/CSTCW/CSTCZ Series
1. Soldering Conditions
(1) Reflow
One heat stress, shown in the profile at right, is applied to
resonator; then, after being placed in natural conditions
for 1 hour, the resonator is measured. Peak
(260˚C max.)
(a) Pre-heating conditions should be +150 to +180°C for

Temperature (˚C)
230
60 to 120 seconds. Ascending time up to +150°C Heating
180 (230˚C)
should be longer than 30 seconds. 150
Pre-heating
(b) Heating conditions should be within 40 seconds at (150-180˚C)
+230°C min., but peak temperature should be Iower Gradual
Cooling
than +260°C.

(2) Soldering Iron 30 sec. 60-120 sec. 40 sec. 120 sec.


min. max. min.
Components shall be measured after soldering on PCB
at +350±5°C for 3.0±0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.

2. Wash
Please contact us in case you need washable component.

3. Notice for Mounting


(a) Please insure the component is thoroughly evaluated
in your application circuit.
(b) Please do not apply excess mechanical stress to the
component and terminals during soldering.

37
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
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storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Notice for General Usage

■ Notice (Storage and Operating Conditions)


1. Product Storage Condition (2) Please do not put the products directly on the
Please store the products in room where the floor without anything under them to avoid damp
temperature/humidity is stable. And avoid places and/or dusty places.
such places where there are large temperature (3) Please do not store the products in the places
changes. Please store the products under the such as: in a damp heated place, in a place where
following conditions: direct sunlight comes in, in place applying
Temperature: -10 to + 40 degrees C vibrations.
Humidity: 15 to 85% R.H. (4) Please use the products immediately after the
2. Expire Date on Storage package is opened, because the characteristics
Expire date (Shelf life) of the products is six may be reduced in quality, and/or be degraded in
months after delivery under the conditions of a the solderability due to storage under the poor
sealed and an unopened package. Please use the condition.
products within six months after delivery. If you (5) Please do not drop the products to avoid cracking
store the products for a long time (more than six of ceramic element.
months), use carefully because the products may 4. Others
be degraded in the solderability and/or rusty. Conformal coating or washing of the component is not
Please confirm solderability and characteristics acceptable because it is not hermetically sealed.
for the products regularly. Please be sure to consult with our sales representative
3. Notice on Product Storage or engineer whenever and prior to using the products.
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.

■ Notice (Rating)
The component may be damaged if excess mechanical
stress is applied.

■ Notice (Handling)
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
7

38
!Note • This PDF catalog
!Note is downloaded
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read rating and the website (for
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storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Lead Type Notice for General Usage

■ Notice (Soldering and Mounting)


1. Soldering Conditions (b) Lead terminal is directly contacted with the tip
(1) Reflow of soldering iron of +350+-5 degrees C
The component cannot withstand reflow soldering. for 3.0+-0.5 seconds, and then components shall
(2) Soldering Iron be left in natural condition for 1 hour.
(a) Lead terminals are immersed up to 1.5 mm from (3) Please do not apply excessive mechanical stress to
components body in soldering bath of +260+-5 the component and lead terminals during soldering.
degrees C for 10+-1.0 seconds, and then 2. Wash
components shall be left in natural condition The component cannot withstand washing.
for 1 hour.

■ Notice (Storage and Operating Conditions)


1. Product Storage Condition (2) Please do not put the products directly on the
Please store the products in room where the floor without anything under them to avoid damp
temperature/humidity is stable. And avoid places and/or dusty places.
such places where there are large temperature (3) Please do not store the products in the places
changes. Please store the products under the such as: in a damp heated place, in a place where
following conditions: direct sunlight comes in, in place applying
Temperature: -10 to + 40 degrees C vibrations.
Humidity: 15 to 85% R.H. (4) Please use the products immediately after the
2. Expire Date on Storage package is opened, because the characteristics
Expire date (Shelf life) of the products is six may be reduced in quality, and/or be degraded in
months after delivery under the conditions of a the solderability due to storage under the poor
sealed and an unopened package. Please use the condition.
products within six months after delivery. If you (5) Please do not drop the products to avoid cracking
store the products for a long time (more than six of ceramic element.
months), use carefully because the products may 4. Others
be degraded in the solderability and/or rusty. Conformal coating or washing of the component is not
Please confirm solderability and characteristics acceptable because it is not hermetically sealed.
for the products regularly. Please be sure to consult with our sales representative
3. Notice on Product Storage or engineer whenever and prior to using the products.
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
7
chemical atmosphere.

■ Notice (Rating)
The component may be damaged if excess mechanical
stress is applied.

■ Notice (Handling)
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.

39
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

kHz Type Notice for General Usage

■ Notice (Soldering and Mounting)


CSBFB_J (430-519kHz/700-1250kHz)
1. Soldering Conditions
(1) Reflow
One heat stress, shown in the profile at right, is applied to
resonator; then, after being placed in natural conditions
for 1 hour, the resonator is measured. Peak
(260˚C max.)
(a) Pre-heating conditions should be +150 to +180°C for

Temperature (˚C)
230
60 to 120 seconds. Ascending time up +150°C should Heating
180 (230˚C)
be longer than 30 seconds. 150
Pre-heating
(b) Heating conditions should be within 40 seconds at (150-180˚C)
+230°C min., but peak temperature should be lower Gradual
Cooling
than +260°C.

(2) Soldering Iron 30 sec. 60-120 sec. 40 sec. 120 sec.


min. max. min.
Components shall be measured after soldering on PCB
at +350±5°C for 3.0±0.5 seconds and leaving in natural
condition for 24 hours. The soldering iron shall not touch
the components while soldering.

2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW

(2) Temperature Difference : dT *1


dT<=60°C (dT=Component-solvent)
*1 ex. In case the component at +90°C immerses into
cleaning solvent at +60°C, then dT=30°C.

(3) Conditions
(a) Ultrasonic Wash (b) Immersion Wash
1 minute max. in above solvent at +60°C max. 5 minutes max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l) (c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.

7 (4) Drying
5 minutes max. by air blow at +80°C max.

(5) Others
(a) Total washing time should be within 10 minutes. (c) Ultrasonic cleaning of the component is acceptable.
(b) The component may be damaged if it is washed with However, the size of bath, size and thickness of PCB
chlorine, petroleum, or alkali cleaning solvent. should be evaluated to confirm stable electrical
characteristics are maintained.

3. Notice for Mounting


(a) Please insure the component is thoroughly evaluated (c) In the case of the bulk component, dry heating
in your application circuit. treatment (130°C. for 5 hours min.) is required before
(b) Please do not apply excess mechanical stress to the reflow soldering. Then, the component should be
component and lead terminals during soldering. soldered within 48 hours after dry heating treatment.

40
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

kHz Type Notice for General Usage

■ Notice (Soldering and Mounting)


CSBLA_E
1. Soldering Conditions (b) Lead terminal is directly contacted with the tip
(1) Reflow of soldering iron of +350+-5 degrees C
The component cannot withstand reflow soldering. for 3.0+-0.5 seconds, and then components shall
(2) Soldering Iron be left in natural condition for 1 hour.
(a) Lead terminals are immersed up to 1.5 mm from (3) Please do not apply excessive mechanical stress to
components body in soldering bath of +260+-5 the component and lead terminals during soldering.
degrees C for 10+-1.0 seconds, and then 2. Wash
components shall be left in natural condition The component cannot withstand washing.
for 1 hour.

■ Notice (Soldering and Mounting)


CSBLA_J
(1) Cleaning Solvents 3. Shower or Rinse Wash
HCFC, Isopropanol, Tap water, Demineralized water, 5 minutes max. in above solvent at +60 degrees C. max.
Cleanthrough750H, Pine alpha 100S, Techno care (4) Drying
FRW. 5 minutes max. by air blow at +80 degrees C. max.
(2) Temperature Difference: dT *1 (5) Others
dT<=30 C. (dT=Component-solvent) 1. Total washing time should be within 10 minutes.
*1 ex. In case the component at +90 degrees C. immerses 2. Please insure the component is thoroughly
into cleaning solvent at +60 degrees C., then evaluated in your application circuit.
dT=30 degrees C. 3. The component may be damaged if it is washed
(3) Conditions with alkali cleaning solvent.
1. Ultrasonic Wash 4. Please do not apply excess mechanical stress to
1 minute max. in above solvent at +60 degrees C. max. the component and lead terminals during soldering.
(Frequency: 28kHz, Output: 20W/L) 5. Ultrasonic cleaning of the component is acceptable.
2. Immersion Wash However, the size of bath, size and thickness of
5 minutes max. in above solvent at +60 degrees C. max. PBC should be evaluated to confirm stable electrical
characteristics are maintained.

■ Notice (Storage and Operating Condition)


CSBFB_J/CSBLA_J
1. Product Storage Condition 3. Notice on Product Storage
Please store the products in room where the (1) Please do not store the products in a chemical
7
temperature/humidity is stable. And avoid atmosphere (Acids, Alkali, Bases, Organic gas,
such places where there are large temperature Sulfides and so on), because the characteristics
changes. Please store the products under the may be reduced in quality, and/or be degraded in
following conditions: the solderability due to the storage in a
Temperature: -10 to + 40 degrees C chemical atmosphere.
Humidity: 15 to 85% R.H. (2) Please do not put the products directly on the
2. Expire Date on Storage floor without anything under them to avoid damp
Expire date (Shelf life) of the products is six places and/or dusty places.
months after delivery under the conditions of a (3) Please do not store the products in the places
sealed and an unopened package. Please use the such as: in a damp heated place, in a place where
products within six months after delivery. If you direct sunlight comes in, in place applying
store the products for a long time (more than six vibrations.
months), use carefully because the products may (4) Please use the products immediately after the
be degraded in the solderability and/or rusty. package is opened, because the characteristics
Please confirm solderability and characteristics may be reduced in quality, and/or be degraded in
for the products regularly. the solderability due to storage under the poor
condition.
(5) Please do not drop the products to avoid cracking
of ceramic element.
Continued on the following page.

41
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

kHz Type Notice for General Usage


Continued from the preceding page.

4. Others Please be sure to consult with our sales representative


Conformal coating of the component is acceptable. or engineer whenever and prior to using the products.
However, the resin material, curing temperature, and
other process conditions should be evaluated to
confirm that stable electrical characteristics are
maintained.

■ Notice (Storage and Operating Condition)


CSBLA_E
1. Product Storage Condition (2) Please do not put the products directly on the
Please store the products in room where the floor without anything under them to avoid damp
temperature/humidity is stable. And avoid places and/or dusty places.
such places where there are large temperature (3) Please do not store the products in the places
changes. Please store the products under the such as: in a damp heated place, in a place where
following conditions: direct sunlight comes in, in place applying
Temperature: -10 to + 40 degrees C vibrations.
Humidity: 15 to 85% R.H. (4) Please use the products immediately after the
2. Expire Date on Storage package is opened, because the characteristics
Expire date (Shelf life) of the products is six may be reduced in quality, and/or be degraded in
months after delivery under the conditions of a the solderability due to storage under the poor
sealed and an unopened package. Please use the condition.
products within six months after delivery. If you (5) Please do not drop the products to avoid cracking
store the products for a long time (more than six of ceramic element.
months), use carefully because the products may 4. Others
be degraded in the solderability and/or rusty. Conformal coating or washing of the component is not
Please confirm solderability and characteristics acceptable because it is not hermetically sealed.
for the products regularly. Please be sure to consult with our sales representative
3. Notice on Product Storage or engineer whenever and prior to using the products.
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.

7
■ Notice (Rating)
The component may be damaged if excess mechanical
stress is applied.

■ Notice (Handling)
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.

42
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Packaging for General Usage

■ Minimum Quantity
Part Number Plastic Tape ø180mm Plastic Tape ø330mm Bulk Dimensions
CSTCC_G 2,000 6,000 500 a
CSTCR_G 3,000 9,000 500 a
CSTCR_G15L 3,000 9,000 500 a
CSTCE_G 3,000 9,000 500 b
CSTCE_G15L 3,000 9,000 500 b
CSTCE_V 3,000 9,000 500 b
CSTCE_V13L 3,000 9,000 500 b
CSTCE_XK 3,000 9,000 500 b
CSTCE_XT 3,000 9,000 500 b
CSTCG_V 3,000 9,000 500 b
CSTCZ_X12R 3,000 9,000 500 b
CSTCW_X 3,000 9,000 500 b
CSTCW_X11 3,000 9,000 500 b
CSTCW_X_M 3,000 9,000 500 b
CSACW_X 3,000 9,000 500 b
The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.)

c Dimensions of Reel

a b
Trailer Leader Leader
Trailer
160-190 Cover Film 160-190 Cover Film

Empty Components Empty Empty Components Empty


160 min. 160 min.

400-560 400-560
(ø180 0–1.5 )

(ø180 0–1.5 )

ø13.0±0.2 ø13.0±0.2
2.0±0.5 2.0±0.5

+1.0 +1.0
13.0 0 9.0 –0
17.0±1.0 13.0±1.0

(in mm)

■ Dimensions of Taping
7
CSTCR_G15 CSTCE_G15L
1.75±0.1

1.75±0.1

4.0±0.1 W0.1
ø1.5 Y0 4.0±0.1 ø1.5 +0.1
-0.0
2.0±0.05 2.0±0.05
3.5±0.05
5.5±0.05

12.0±0.2

8.0±0.2
(3) (2) (1)
(3) (2) (1)

3.40±0.1
4.7±0.1

(5.2)
(9.5)

W0.1 4.0±0.1 +0.2


4.0±0.1 ø1.5Y0 ø1.0 -0.0
1.50±0.1
(1.85 max.)

2.2±0.1 The cover film peel strength force 0.1 to 0.7N


(1.30 max.)
1.25±0.05

The cover film peel strength force 0.1 to 0.7N


0.25±0.05

0.90±0.10

3° max.
0.3±0.05

3˚ max. The cover film peel speed 300mm/min.


The cover film peel speed 300mm/min.
Cover Film Cover Film
10˚
10°

Direction of Feed (in mm) (in mm)


Direction of Feed

Continued on the following page.

43
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Packaging for General Usage


Continued from the preceding page.

■ Dimensions of Taping
CSTCE_V13L CSTCE_XK, CSTCE_XT

1.75±0.1
Dimensions of Carrier Tape

1.75±0.1
4.0±0.1 +0.1 4.0±0.1 ø1.5 +0.1
-0.0
ø1.5 -0.0 2.0±0.05
2.0±0.05

3.5±0.05
3.5±0.05

8.0±0.2
8.0±0.2

(3) (2) (1)


(3) (2) (1)

3.40±0.1
3.45±0.1

(5.2)
(5.2)

+0.1 4.0±0.1 +0.2


4.0±0.1 ø1.0 -0.0 ø1.0 -0.0
1.50±0.1

(1.40 max.)
The cover film peel strength force 0.1 to 0.7N
0.25±0.05

1.10±0.05
1.50±0.1

0.25±0.05

1.15±0.1

(1.50 max.)
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min. 3° max.
The cover film peel speed 300mm/min. 3˚ max.
Cover Film Cover Film
10˚
10°

Direction of Feed (in mm)


Direction of Feed (in mm)

CSTCW_X11 CSTCZ-X12R
1.75±0.1

1.75±0.1
4.0±0.1 +0.1
2.0±0.1 ø1.5-0.0
4.0±0.1 +0.1
2.0±0.1 ø1.5 -0.0
3.5±0.1
8.0±0.2

3.5±0.1
(3) (2) (1)

2.8±0.1
(5.5)

8.0±0.2
(3) (2) (1)

2.2±0.1
(5.5)

4.0±0.1 +0.2
ø1.0-0.0
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min. +0.1 +0.2
0.2±0.1

2.3-0.05 The cover film peel strength force 0.1 to 0.7N 4.0±0.1 ø1.0 -0.0
Cover Film
t1 ∗1

t2 ∗2

3° max.

0.2±0.1

1.10±0.1

1.6 max.
The cover film peel speed 300mm/min.
10° 1.8±0.1
Cover Film 3° max.
10°
Direction of Feed (in mm)
∗1, ∗2 : Dimensions vary with product thickness of CERALOCKr
Thickness of CERALOCKr 1.40–1.20 1.15–1.00 0.95–0.90 Direction of Feed (in mm)
t1 ∗1 1.48±0.1 1.30±0.1 1.12±0.1
t2 ∗2 2.1 max. 1.9 max. 1.7 max.

CSTCC_G less than 3.00MHz CSTCC_G more than 3.00MHz


1.75±0.1

1.75±0.1

4.0±0.1 4.0±0.1
2.0±0.05 ø1.55±0.05 2.0±0.05 φ1.55±0.05
5.5±0.05

5.5±0.05
12.0±0.2

12.0±0.2
(3) (2) (1)

(3) (2) (1)

7
7.6±0.1

7.6±0.1
(9.5)

(9.5)

+0.3
4.0±0.1 ø1.5+0.3
-0.0 4.0±0.1 φ1.5 -0.0
3.3±0.1 3.3±0.1
(2.45 max.)

(2.25 max.)
0.3±0.05

1.85±0.05

0.3±0.05

1.65±0.05

The cover film peel strength force 0.1 to 0.7N The cover film peel strength force 0.1 to 0.7N
3˚max. 3˚max.
The cover film peel speed 300mm/min. The cover film peel speed 300mm/min.
Cover film Cover film
10˚
10˚

Direction of Feed (in mm) Direction of Feed (in mm)

Continued on the following page.

44
!Note • This PDF catalog
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• Please from!CAUTION
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storage, co., ltd.
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soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Chip Type Packaging for General Usage


Continued from the preceding page.

■ Dimensions of Taping
CSTCR_G CSTCE_G

1.75±0.1

1.75±0.1
4.0±0.1 W0.1
ø1.5 Y0 4.0±0.1 ø1.5 +0.1
-0.0
2.0±0.05 2.0±0.05

3.5±0.05
5.5±0.05

12.0±0.2

8.0±0.2
(3) (2) (1)
(3) (2) (1)

3.40±0.1
4.7±0.1

(5.2)
(9.5)

W0.1 4.0±0.1 +0.2


4.0±0.1 ø1.5Y0 ø1.0 -0.0
1.50±0.1

(1.85 max.)
2.2±0.1 The cover film peel strength force 0.1 to 0.7N

(1.30 max.)
1.25±0.05
The cover film peel strength force 0.1 to 0.7N

0.25±0.05

0.90±0.10
3° max.
0.3±0.05

3˚ max. The cover film peel speed 300mm/min.


The cover film peel speed 300mm/min.
Cover Film Cover Film
10˚
10°

Direction of Feed (in mm) (in mm)


Direction of Feed

CSTCE_V CSTCG_V
Dimensions of Carrier Tape Dimensions of Carrier Tape
1.75±0.1

1.75±0.1
4.0±0.1 +0.1
4.0±0.1 +0.1
ø1.5 -0.0 ø1.5 -0.0
2.0±0.05 2.0±0.05
3.5±0.05

3.5±0.05
8.0±0.2

8.0±0.2
(3) (2) (1)

(3) (2) (1)


3.45±0.1

2.2±0.05
(5.2)

(5.2)

+0.1 +0.1
4.0±0.1 ø1.0 -0.0 4.0±0.1 ø1.0 -0.0
(1.40 max.)

(1.30 max.)
0.25±0.05

1.10±0.05

0.25±0.05

1.00±0.05
The cover film peel strength force 0.1 to 0.7N 1.50±0.1 The cover film peel strength force 0.1 to 0.7N 1.50±0.1
The cover film peel speed 300mm/min. 3˚ max. The cover film peel speed 300mm/min. 3˚ max.
Cover Film Cover Film
10˚ 10˚

Direction of Feed (in mm) Direction of Feed (in mm)

CSACW_X CSTCW_X
1.75±0.1
1.75±0.1

4.0±0.1 +0.1 4.0±0.1 +0.1


2.0±0.1 ø1.5 -0.0 2.0±0.1 ø1.5-0.0
3.5±0.1
3.5±0.1

8.0±0.2
8.0±0.2

(3) (2) (1)

2.8±0.1
2.8±0.1

(5.5)
(5.5)

+0.2
The cover film peel strength force 0.1 to 0.7N 4.0±0.1
+0.1
+0.2
ø1.0-0.0 The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
4.0±0.1
+0.1
ø1.0-0.0
7
0.2±0.1

The cover film peel speed 300mm/min. 2.3-0.05


0.3±0.1

2.3 -0.05
t1 ∗1

t2 ∗2

Cover Film
t1 ∗1

t2 ∗2

Cover Film 3° max. 3° max.


10° 10°

(in mm) Direction of Feed (in mm)


Direction of Feed
∗1, ∗2 : Dimensions vary with product thickness of CERALOCKr ∗1, ∗2 : Dimensions vary with product thickness of CERALOCKr
Thickness of CERALOCKr 1.40–1.20 1.15–1.00 0.95–0.90
Thickness of CERALOCKr 1.40–1.20 1.15–1.00 0.95–0.90
t1 ∗1 1.48±0.1 1.30±0.1 1.12±0.1 t1 ∗1 1.48±0.1 1.30±0.1 1.12±0.1
t2 ∗2 2.1 max. 1.9 max. 1.7 max. t2 ∗2 2.1 max. 1.9 max. 1.7 max.

CSTCW_X_M
1.75±0.1

4.0±0.1 +0.1
2.0±0.1 ø1.5 -0.0
3.5±0.1
8.0±0.2
(3) (2) (1)

2.8±0.1
(5.5)

+0.2
The cover film peel strength force 0.1 to 0.7N 4.0±0.1 ø1.0 -0.0
The cover film peel speed 300mm/min.
0.2±0.1

2.3±0.1
Cover Film
t1 ∗1

t2 ∗2

3° max.
10°

Direction of Feed (in mm)


∗1, ∗2 : Dimensions vary with product thickness of CERALOCKr
Thickness of CERALOCKr 1.40–1.20 1.15–1.00 0.95–0.70
t1 ∗1 1.48±0.1 1.30±0.1 1.12±0.1
t2 ∗2 2.1 max. 1.9 max. 1.7 max.

45
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Lead Type Packaging for General Usage

■ Minimum Quantity
Part Number Ammo Pack Bulk
CSTLS_G (3.40 to 10.0MHz) 2,000 500
CSTLS_X (16.00 to 70.00MHz) 2,000 500
The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.)

■ Tape Dimensions of CSTLS_G

P2 P
dh dh
D dS

M∗∗∗ M∗∗∗
A

W2

H1
H0
W0
L1

W1
W

D0

P1 F1 F2

P0 t
Direction of Feed

Item Code Dimensions Tolerance Remarks


Width of diameter D 8.0 ±1.0
Height of resonator A 5.5 ±0.5
Dimensions of terminal d ø0.48 ±0.05
Lead length under the hold down tape L1 5.0 min. –
Pitch of component P 12.7 ±0.5 Tolerance for Pitches 10xP0=127±1
Pitch of sprocket hole P0 12.7 ±0.2
Length from sprocket hole center to lead P1 3.85 ±0.5
Length from sprocket hole center to
P2 6.35 ±0.5
component center
7 Lead spacing (I) F1 2.5 ±0.2
Lead spacing (II) F2 2.5 ±0.2
Slant forward or backward dh 0 ±1.0 1mm max.
Width of carrier tape W 18.0 ±0.5
Width of hold down tape W0 6.0 min. – Hold down tape does not exceed the carrier tape.
Position of sprocket hole W1 9.0 ±0.5
Gap of hold down tape and carrier tape W2 0 W0.5
Y0
Distance between the center of
H0 18.0 ±0.5
sprocket hole and lead stopper
Total height of resonator H1 23.5 ±1.0
Diameter of sprocket hole D0 ø4.0 ±0.2
Total tape thickness t 0.6 ±0.2
Body tilt dS 0 ±1.0

(in mm)

Continued on the following page.

46
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Lead Type Packaging for General Usage


Continued from the preceding page.

■ Tape Dimensions of CSTLS_X

P2 P dh dh

D dS

W2
d

H1
H0
W0
L1

W1
W

D0

P1 F1 F2
Direction of Feed
P0 t

Item Code Dimensions Tolerance Remarks


Width of diameter D 5.5 ±1.0
Height of resonator A 6.5 ±0.5
Dimensions of terminal d ø0.48 ±0.05
Lead length under the hold down tape L1 5.0 min. –
Pitch of component P 12.7 ±0.5 Tolerance for Pitches 10xP0=127±1
Pitch of sprocket hole P0 12.7 ±0.2
Length from sprocket hole center to lead P1 3.85 ±0.5
Length from sprocket hole center to
P2 6.35 ±0.5
component center
Lead spacing (I) F1 2.5 ±0.2
Lead spacing (II) F2 2.5 ±0.2
Slant forward or backward dh 0 ±1.0 1mm max.
Width of carrier tape W 18.0 ±0.5
Width of hold down tape W0 6.0 min. – Hold down tape does not exceed the carrier tape.
Position of sprocket hole W1 9.0 ±0.5
Gap of hold down tape and carrier tape W2 0 W0.5 7
Y0.0
Distance between the center of
H0 18.0 ±0.5
sprocket hole and lead stopper
Total height of resonator H1 24.5 ±1.0
Diameter of sprocket hole D0 ø4.0 ±0.2
Total tape thickness t 0.6 ±0.2
Body tilt dS 0 ±1.0

(in mm)

47
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

MHz Lead Type Packaging for General Usage

■ Minimum Quantity
Part Number Ammo Pack Bulk
CSALS_X (16.00 to 70.00MHz) 2,000 500
The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.)

■ Tape Dimensions of CSALS

P2 P dh dh

D dS

W2
d

H1
H0
W0
L1

W1
W

D0

P1 F
P0 Direction of Feed t

Item Code Dimensions Tolerance Remarks


Width of diameter D 5.5 ±1.0
Height of resonator A 6.5 ±0.5
Dimensions of terminal d ø0.48 ±0.05
Lead length under the hold down tape L1 5.0 min. ———
Pitch of component P 12.7 ±0.5 Tolerance for Pitches 10xP0=127±1
Pitch of sprocket hole P0 12.7 ±0.2
Length from sprocket hole center to lead P1 3.85 ±0.5
Length from sprocket hole center to
P2 6.35 ±0.5
component center
Lead spacing F 5.0 ±0.3
Slant forward or backward dh 0 ±1.0 1mm max.
7 Width of carrier tape W 18.0 ±0.5
Width of hold down tape W0 6.0 min. ——— Hold down tape does not exceed the carrier tape.
Position of sprocket hole W1 9.0 ±0.5
Gap of hold down tape and carrier tape W2 0 +0.5
-0
Distance between the center of
H0 18.0 ±0.5
sprocket hole and lead stopper
Total height of resonator H1 24.5 ±1.0
Diameter of sprocket hole D0 ø4.0 ±0.2
Total tape thickness t 0.6 ±0.2
Body tilt dS 0 ±1.0

(in mm)

48
!Note • This PDF catalog
!Note is downloaded
• Please from!CAUTION
read rating and the website (for
of Murata Manufacturing
storage, co., ltd.
operating, rating, Therefore,
soldering, it’s specifications
mounting and handling)areinsubject to change
this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
P16E.pdf
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

kHz Type Packaging for General Usage

■ CSBFB Series Minimum Quantity


Part Number Plastic Tape ø330mm Bulk
CSBFB_J (430 to 519kHz) 1,500 500
CSBFB_J (700 to 1250kHz) 3,000 1,000
The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.)

c Dimensions of Reel

2.0±0.5

(ø330±2.0)
(ø80±1.0)
ø13.0±0.2
17.5±0.5
21.5±1.0

(in mm)

■ Dimensions of Taping
CSBFB_J 430-519kHz CSBFB_J 700-1250kHz
4.0±0.1
1.75±0.1

1.75±0.15
4.0±0.1
2.0±0.1 ø1.5±0.1
2.0±0.1 ø1.5±0.1
7.5±0.1

7.5±0.1
16.0±0.3

16.0±0.15
13.3±0.1

11.4±0.1

13.3±0.1

8.8±0.1
12.0±0.1
The cover film peel strength force 0.1 to 0.7N 8.0±0.1
(4.6max.)

8.05±0.1 3˚ max. The cover film peel strength force 0.1 to 0.7N

(3.07max.)
The cover film peel speed 300mm/min.
3.5±0.1

The cover film peel speed 300mm/min. 5.45±0.1 3˚ max.


t0.3

2.7±0.1
Cover Film
10˚ Cover Film t0.3
10˚

Direction of Feed
Direction of Feed (in mm)
(in mm)

■ CSBLA Series Minimum Quantity


7
Part Number Magazine Bulk
CSBLA_E 50 500
CSBLA_J 100 1,000
The order quantity should be an integral multiple of the "Minimum Quantity" shown above. (pcs.)

49
!Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our P16E.pdf
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 08.3.3

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