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COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : CL-82
MODEL: L1719S (L1719S-*FS.A***EP)
L1919S (L1919S-*FS.A***EP)
( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SPECIFICATIONS
1. LCD CHARACTERISTICS 4. Max. Resolution
Type : TFT Color LCD Module D-sub Analog : 1280 x 1024@75Hz
Active Display Area : 17 inch - L1719S
: 19 inch - L1919S 5. POWER SUPPLY
Pixel Pitch : 0.264 (H) x 0.264 (V) - L1719S 5-1. Power : AC 100~240V, 50/60Hz , 0.6A
: 0.294 (H) x 0.294 (V) - L1919S
Color Depth : 8bits, 16.2M colors 5-2. Power Consumption
Size : 358.5 (H) x 296.5 (V) x 17.0(D) - L1719S
: 396 (H) x 324 (V) x 17.5(D) - L1919S MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
Electrical Interface : LVDS less than 34 W -L1719S
Surface Treatment : Hard-coating(3H), Anti-Glare POWER ON (NORMAL) ON/ON ACTIVE
Operating Mode : Normally White, Transmissive mode less than 38 W -L1919S or GREEN
Backlight Unit : 4-CCFL STAND-BY OFF/ON OFF less than 1 W AMBER
2-2. Luminance : 230(min), 300(Typ) (Full White pattern, 0.70V) -6500K 6. ENVIRONMENT
: 150(min) (Full White pattern, 0.70V) -9300K 6-1. Operating Temperature : 10°C~35°C (50°F~95°F)
75%(min) (Ambient)
6-2. Relative Humidity : 10%~80% (Non-condensing)
2-3. Contrast Ratio : 2000:1 (DFC) 6-3. MTBF : 50,000 HRS with 90% Confidence
Lamp Life : 50,000 Hours(Min)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal 7. DIMENSIONS (with TILT/SWIVEL)
• Type : Separate Sync, SOG L1719S
Width : 364.0 mm (14.33')
3-2. Video Input Signal Depth : 180 mm (7.09'')
1) Type : R, G, B Analog Height : 378.0 mm (14.88'')
2) Voltage Level : 0~0.71 V
a) Color 0, 0 : 0 Vp-p L1919S
b) Color 7, 0 : 0.467Vp-p Width : 418 mm (16.46'')
c) Color 15, 0 : 0.714Vp-p Depth : 180 mm (7.09'')
3) Input Impedance : 75Ω Height : 412.7 mm (16.25'')
L1919S
Net. Weight : 4.3 kg (9.26 lbs)
Gross Weight : 5.4 kg (11.91 lbs)
-2-
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING
• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are
• If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
replacement parts list. It is essential that these critical
because high voltage appears at inverter circuit about
parts should be replaced with the manufacturer’s
650Vrms.
specified parts to prevent electric shock, fire or other
hazard.
• Handle with care wires or connectors of the inverter
• Do not modify original design without obtaining written circuit. If the wires are pressed cause short and may
permission from manufacturer or you will void the burn or take fire.
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE Leakage Current Hot Check Circuit
WITH BACKLIGHT UNIT.
AC Volt-meter
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the Good Earth Ground
screen. such as WATER PIPE,
To Instrument’s CONDUIT etc.
• Do not scratch or press on the panel with any sharp exposed
objects, such as pencil or pen as this may result in METALLIC PARTS
damage to the panel.
• Protect the module from the ESD as it may damage the 1.5 Kohm/10W
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module or any other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain
c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.
3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
-4-
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500 F to 600 F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500 F to 600 F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500 F to 600 F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
-5-
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of a small gauge jumper edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
-6-
TIMING CHART
VIDEO
A
E
D
B
SYNC
C
-7-
DISASSEMBLY-Stand [TYPE A]
#1 #2
1. In assembly state, Twist Stand Body to 2. Pull Stand and Separate Stand from
Right side. Monitor set.
# 3-1 # 3-2
#4
-9-
DISASSEMBLY-Stand [TYPE B]
#1 #2
1. In assembly state, Twist Stand Body to 2. Pull Stand and Separate Stand from
Right side. Monitor set.
# 3-1 # 3-2
#4
-9-
D-Sub
NT68625/68665/68670
Analog(R/G/B)
A
AD C
DC S
Scca
alleerr
3.3V
P O LLV
VD S
DS LVDS
1.8V PLLLL OSSD
D
Tran sm i
Transmitttteerr
DVI-D
T
TM DS
MD S M
MCCU
U 5V
Digital(R/G/B) UP stream
FFlla
assh
hmmeem
moorryy
To Key Control
- 10 -
EEPROM
24C08
1EA
P ow e r
BLOCK DIAGRAM
3.3V
Adapter IIn
nvveerrtteerr 5V
12V R
Reeg
guullaattoorr 1.8V
(only ODC version)
POWER INVERTER
12V
Module Vcc High
5V
Main Board
Over
(Scaler & Inverter On/OFF (3.3V) Voltage
DC DC Dimming (Lamp Current Control) Protection
converter) 13V
- 11 -
IC
N-ch
Start
Drive Block
Feedback
BLOCK DIAGRAM-POWER
Lamp
Current Low
Line Filter Feedback
L N
DESCRIPTION OF BLOCK DIAGRAM
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 5V is provided for LCD panel.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 12 -
LIPS Board Block Diagram
12V
50 ~ 60Hz
SIGNAL
PWM CONTROL COLLENT-
PHOTO-COUPLER
CIRCUIT ION
ISOLATION
PRIMARY SECONDARY
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
- 13 -
ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
- 14 -
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C08)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) MODULE : To select applied module.
IBM 9 6
Video Signal 5 1
Compatible PC 15 11
Generator 10 6
5 1
C
PARALLEL PORT
d
13
se
1
tu
2C
25
No
14
23
RS
OFF ON
5V
L
Control Line
F
E
LL
C
RA
PA
VG ON
WE
S 5V
(110V/220V)
PO
E 74LS06
A
T
MO Power LED
CS
NI OFF 4.7K
YN
TO
V-S
R
74LS06
E ST Switch
B
B
F V-Sync On/Off Switch
(Switch must be ON.)
- 15 -
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
YES
YES NO PROBLEM
IS U201
NO
PIN75 (3.3V) CHECK 3.3V LINE
VOLTAGE ?
YES
YES
CHECK U201
Waveforms
1 U201-#96
- 16 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
YES
1. CONFIRM BRIGHTNESS
J703 PIN10 NO OSD CONTRL STATE.
5V? 2. CHECK MICOM DIM-ADJ
PORT
YES
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL. NO
(CONTACT PROBE TO LIPS
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
YES
- 17 -
3. NO RASTER (OSD IS NOT DISPLAYED) – MSTAR
NO RASTER
(OSD IS NOT DISPLAYED)
U201 NO
PIN 16, 75 CHECK U601
3.3V?
YES
YES
U201
PIN27 IS 48KHz H-SYNC? CHECK CONNECTION
NO
2 PIN28 IS 60Hz V-SYNC? LINE FROM D-SUB TO
IS PULSE APPEARED U201
AT SIGNAL PINS?
AT MODE 12?
YES
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
1 U201-#96, 97 2 U201-#27 H-SYNC 2 U201-#28 V-SYNC
- 18 -
4. TROUBLE IN DPM
TROUBLE IN DPM
NO CHECK PC
CHECK
3 PC IS NOT GOING
R730, R731
INTO DPM OFF MODE
YES
CHECK NO
U201 PIN 27,28 CHECK H/V SYNC LINE
SYNC PULSE ?
YES
TROUBLE IN U201
Waveforms
3 R442 H-Sync 3 R443 V-Sync
- 19 -
5. POWER
NO POWER
(POWER INDICATOR OFF)
CHECK NO
Trouble in Fuse (F101)
Fuse F101 OK?
YES
CHECK
C101 Voltage NO
(AC110V->160Vdc Check BD101
(AC220V->304Vdc
YES
CHECK
U101 Pin6 Waveform NO Check U101 Pin7 : 9~10V
(Square wave Check D102
Come out?)
YES
YES
YES
- 20 -
6. Raster
NO Raster
(Lamp Off)
YES
YES
YES
If waveform is no problem
YES
- 21 -
WIRING DIAGRAM
30P
EAD37414501 17"
11P
EAD37413101 19"
6P 6631T20023J
6631900011H
3P
6631T20010E
- 22 -
010
020
030
130
100
110
- 23 -
140
EXPLODED VIEW
170
050
060
070 150
160
080 040
180
190
EXPLODED VIEW PARTS LIST(L1719S)
* Note: Safety mark !
30919C0021D L1719 . 17" L1719 BRAND 30909C0009 CABINET ASSY ANALOG (BK)
010 !
30919C0021A L1719 BRAND 30909C0009 CABINET ASSY ANALOG SILVER
M170EG01-VD ZBD DRIVER 17.0INCH 1280X1024 300CD COLOR 72% 5/4 800:1 5MS,
EAJ32176801
160/160, 2CH-LVDS, 4LAMP AU OPTRONICS CORP
HT170E01-300 ZBD DRIVER 17.0INCH 1280X1024 300CD COLOR 72% 5/4 800:1 4MASK,
EAJ34858001
5ms, 160/160 BOE HYDIS TECHNOLOGY
LM170E03-TLL1 DRIVER 17.0INCH 1280X1024 300CD COLOR 72% 4/3 800:1 P5, 5ms,
EAJ36378001
160/160, TLI T-con, Lusem/Toshba(Source/Gate), Diffuser*2+Prism*1,lamp wir
020 !
LM170E03-TLL2 DRIVER 17.0INCH 1280X1024 300CD COLOR 72% 4/3 800:1 P6, 5ms,
EAJ36379501
160/160, TLI T-con, Lusem/Toshiba(Source/Gate), Diffuser x2+Prism x1, lamp
LM170E03-TLL3 DRIVER 17.0INCH 1280X1024 300CD COLOR 72% 4/3 800:1 P5, 5ms,
EAJ36380701
160/160, TLI T-con, Magna/Toshiba(Source/Gate), Diffuser x2+Prism x1, lamp
CLAA170EA07P ZBD DRIVER 17INCH 1280X1024 300CD COLOR 72% 4/3 700:1 5ms, 16.7M
EAJ36720101
color depth, 160/160, lamp wire length 150mm CHUNGHWA PICTURE TUBES, LT
ACQ33172001 BACK COVER ASSY (ANALOG) FOR LPL CI TLL1/2/3
ACQ33172002 BACK COVER ASSY (ANALOG) FOR AUO-5ms
030 !
ACQ33172003 BACK COVER ASSY (ANALOG) FOR HYDIS
ACQ33172005 BACK COVER ASSY (ANALOG) FOR CPT
040 ! 3043900045F BASE L1x19 MB03CD L1x19 STAND BASE ASSY / ND-LOCAL
050 ! 35509K0267A L1719 STAND BODY COVER
060 3520900044A LED LX19 PC NON LENS
49509K0266A SHIELD LX52 LAMP
070
MGJ37924303 PRESS SPTE 0.3 LAMP SPTE SHIELD L1753 FOR LPL/AUO CI MODULE ND LOCCAL
EBR37001401 CONTROL T.T LM72A BAIKAL II 17-INCH GREEN RD 19 SERIAL
080 !
EBR36269401 POWER T.T LM-57C BAIKAL II - -
baikal 2 FREE L1952/L1752 LCD LG INNOTEK, LIEN CHANG Baikal 2 lips ,4 lamp LG
100 EAY36304901
INNOTEK CO., LTD(Oversea)
110 EBU36999401 BAIKAL II MSTAR ANALOG BRAND LM72B
49509S0034A PRESS H-GI 0.8MM REAR HGI SHIELD LX52/ LX19 SERIES
130
MGJ37924107 PRESS SBHG 0.8 REAR SECC SHIELD LX53 FOR LPL/AUO CI MODULE Analog ND local
140 4940900023A MAIN/SMPS 5 KEY LX19 CONTROL KNOB
150 FAB30006308 332-102L TH + P 4MM 14MM MSWR10 FZB
160 49519K0137A ASSY STAND HINGE ASSY FOR LX53S/T & LX19
170 35509K0263A LX19 HINGE COVER R
180 35509K0264A LX19 HINGE COVER L
190 35509K0265A LX19 HINGE BODY
- 24 -
EXPLODED VIEW PARTS LIST(L1919S)
* Note: Safety mark
- 25 -
REPLACEMENT PARTS LIST
CAUTION : BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THESAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE :S SAFETY Mark !
AL ALTERNATIVE PARTS
- 1 -
DATE: 2007-4-2 DATE: 2007-4-2
*S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION
- 2 -
DATE: 2007-4-2 DATE: 2007-4-2
*S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION
- 3 -
DATE: 2007-4-2 DATE: 2007-4-2
*S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION
- 4 -
DATE: 2007-4-2 DATE: 2007-4-2
*S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION
C319 0CH2102K566 C2012X7R1H102KT 1nF 10% 50V CY102 0CZZ9ST024A DCF101K26Y5PG63L0E0 100pF
X7R -55TO+125C 2012 TP TDK 10% 250V Y5P -25TO+85C 6.5X5MM
C320 0CK473DK56A C2012X7R1H473KT 47nF 10% 50V 10MM TP
X7R -55TO+125C 2012 TP CY104 0CZZ9ST023A DCF472M46Y5VG63L0E0 4.7nF 20%
C321 0CH2102K566 C2012X7R1H102KT 1nF 10% 50V 250V Y5V -25TO+85C 11.5X5MM
X7R -55TO+125C 2012 TP TDK 10MM TP
C322 0CH3103K516 C2012Y5P1H103KT 10nF 10% 50V
DIODEs
Y5P -30TO+85C 2012 TP TDK
C323 0CH5151K416 0805N151J500LT 150pF 5% 50V D101 0DRDI00234A PR1007 1KV 1.3V 5UA 30A 500NSEC
C0G -55TO+125C 2012 TP PILKOR DO41 TA52 2P 1
ELECTRONICS D102 0DRDI00244A IN4007/L 1KV 1V 5UA 30A 500NSEC
C401 EAE36975601 DCG150J26SLV65L0A 15pF 5% 6KV DO41 TA52 2P 1
SL -25TO+85C 6.5X5MM 10MM BK D103 0DSGF00019A 1N4148 1V 100V 150MA 500MA
DONG GUAN HONG MING 4NSEC 500MW DO35 TP 2P 1
C402 EAE36975601 DCG150J26SLV65L0A 15pF 5% 6KV GULF SEMICONDUCTOR
SL -25TO+85C 6.5X5MM 10MM BK D104 0DRTW00274A 2A05 600V 1V 50UA 60A 1MSEC
DONG GUAN HONG MING DO34 TA52 2P 1 TAIWAN
C403 EAE36975601 DCG150J26SLV65L0A 15pF 5% 6KV SEMICONDUCTOR
SL -25TO+85C 6.5X5MM 10MM BK D105 0DRTW00274A 2A05 600V 1V 50UA 60A 1MSEC
DONG GUAN HONG MING DO34 TA52 2P 1 TAIWAN
C404 EAE36975601 DCG150J26SLV65L0A 15pF 5% 6KV SEMICONDUCTOR
SL -25TO+85C 6.5X5MM 10MM BK D106 0DRTW00274A 2A05 600V 1V 50UA 60A 1MSEC
DONG GUAN HONG MING DO34 TA52 2P 1 TAIWAN
C407 0CK22201510 DCH222K43Y5PN6DK0A 2.2nF 10% SEMICONDUCTOR
1000V Y5P -25TO+85C 10X5MM D107 0DRTW00274A 2A05 600V 1V 50UA 60A 1MSEC
11MM BK DO34 TA52 2P 1 TAIWAN
C408 0CK22201510 DCH222K43Y5PN6DK0A 2.2nF 10% SEMICONDUCTOR
1000V Y5P -25TO+85C 10X5MM D201 0DRTW00280A MBRF10200CT 200V 990MV 150UA
11MM BK 150A 1MSEC ITO220 BK 2P 1
C409 0CK22201510 DCH222K43Y5PN6DK0A 2.2nF 10% TAIWAN SEMICONDUCTOR
1000V Y5P -25TO+85C 10X5MM D202 EAH36977701 SR306 TSC 60V 700MV 500UA 80A
11MM BK 10NSEC DO201AD BK 2P 1
C410 0CK22201510 DCH222K43Y5PN6DK0A 2.2nF 10% SHANGHAI EVERWELL
1000V Y5P -25TO+85C 10X5MM ELECTRONICS TRADING CO,LTD
11MM BK D203 EAH36977701 SR306 TSC 60V 700MV 500UA 80A
C411 0CH6152K406 C2012S2L1H152JT 1.5nF 5% 50V 10NSEC DO201AD BK 2P 1
S2L -55TO+125C 2012 TP SHANGHAI EVERWELL
C412 0CH6152K406 C2012S2L1H152JT 1.5nF 5% 50V ELECTRONICS TRADING CO,LTD
S2L -55TO+125C 2012 TP D301 0DSGD00048A MM4148 1V 75V 150MA 500MA
C413 0CH6152K406 C2012S2L1H152JT 1.5nF 5% 50V 4NSEC 500MW LL34 R/TP 2P 1
S2L -55TO+125C 2012 TP SUZHOU GRANDE ELECTRONICS
C414 0CH6152K406 C2012S2L1H152JT 1.5nF 5% 50V D302 0DSDI00038A BAV99-(F) 1.25V 100V 300MA 2A
S2L -55TO+125C 2012 TP 4NSEC 350MW SOT23 R/TP 3P 2
C415 0CH2393K516 0805B393K500CT 39nF 10% 50V D303 0DSDI00038A BAV99-(F) 1.25V 100V 300MA 2A
Y5P -30TO+85C 2012 TP PILKOR 4NSEC 350MW SOT23 R/TP 3P 2
ELECTRONICS D304 0DSGD00048A MM4148 1V 75V 150MA 500MA
C416 0CH2393K516 0805B393K500CT 39nF 10% 50V 4NSEC 500MW LL34 R/TP 2P 1
Y5P -30TO+85C 2012 TP PILKOR SUZHOU GRANDE ELECTRONICS
ELECTRONICS D401 0DSDI00068A BAV70-(F) 1.25V 100V 300MA 2A
CX101 0CZZ9ST025A PCX233712474 470nF 10% 4NSEC 350MW SOT23 R/TP 3P 2
275V PE -40TO+100C NON-IND D402 0DSDI00068A BAV70-(F) 1.25V 100V 300MA 2A
11X18.5X18MM 15MM BK 4NSEC 350MW SOT23 R/TP 3P 2
CY101 0CZZ9ST024A DCF101K26Y5PG63L0E0 D403 0DSDI00038A BAV99-(F) 1.25V 100V 300MA 2A
100pF 10% 250V Y5P -25TO+85C 4NSEC 350MW SOT23 R/TP 3P 2
6.5X5MM 10MM TP D404 0DSDI00038A BAV99-(F) 1.25V 100V 300MA 2A
- 5 -
DATE: 2007-4-2 DATE: 2007-4-2
*S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION
- 6 -
DATE: 2007-4-2 DATE: 2007-4-2
*S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC.NO. PART NO. DESCRIPTION / SPECIFICATION
- 7 -
SCHEMATIC DIAGRAM
1. SCALER
- 30 -
2. POWER & WAFER
- 31 -
3. INVERTER
- 32 -
4. POWER
4 2
3 1
- 33 -
Mar. 2007
P/NO : MFL37893408 Printed in China