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ANALYSIS OF FIN
submitted to
University of Mumbai
submitted by: -
1. Joshi Abhishek ( 21 )
2. Kanekar Savita ( 25 )
3. Korgoankar Mrunal ( )
4. Ikale Balaji ( 19 )
2018-19
Date: 12/04/2019
PROBLEM DESCRIPTION:
This exercise consists of an analysis of an electronics component cooling design using fins: All
electronic components generate heat during the course of their operation. To ensure optimal
working of the component, the generated heat needs to be removed. This is done by attaching
fins to the device which aid in rapid heat removal to the surroundings.
PROBLEM STATEMENT:
An electronic circuit is made of copper with thermal conductivity of 386 W/mºK and that it
generates heat at the rate of 1 W. The enclosing container is made of a steel with thermal
conductivity of 17 W/mºK. The fins are made of aluminum with thermal conductivity of 180
W/mºK. There is convection along all the boundaries except the bottom, which is insulated. The
film (convection) coefficient is h=50 W/m2ºK and the ambient temperature is 20ºC.
Determine maximum temperature on the circuit if optimal number of fins to use on the
component are 3.
GEOMETRY:
Nodal temperature contour plot of model
Nodal temperature list:
PRINT TEMP NODAL SOLUTION PER NODE
NODE TEMP
1 399.19
2 399.37
3 399.25
4 399.30
5 399.34
6 399.37
7 399.39
8 399.41
9 399.41
10 399.41
11 399.40
12 399.37
13 399.42
14 399.45
15 399.47
NODE TEMP
2419 399.03
2420 399.01
2421 398.99