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MIL-STD-1835D
1 June 2004
SUPERSEDING
MIL-STD-1835C
15 August 2000
DEPARTMENT OF DEFENSE
INTERFACE STANDARD
ELECTRONIC COMPONENT CASE OUTLINES
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense (DoD).
2. The Department of Defense is committed to identifying and using standard electronic parts at reasonable cost
and highest reliability. The electronic component case outline is important in this context, and must be selected
with this objective in mind.
3. Significant changes have occurred in the design, manufacturer, and variety of electronic device encapsulation and
attachment methods. These changes are reflected in this standard with new and revised case outlines.
4. Before the publication of this standard, electronic case outlines were listed in appendix C to MIL-M-38510.
5. Comments, suggestions, or questions on this document should be addressed to Commander, Defense Supply
Center Columbus ATTN: DSCC-VA, P O Box 3990, Columbus, OH 43218-3990 or emailed to
STD1835@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
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MIL-STD-1835D
CONTENTS
PARAGRAPH PAGE
1. SCOPE ........................................................................................................................................ 1
1.1 Scope .................................................................................................................................. 1
1.2 Purpose ............................................................................................................................... 1
1.2.1 Tailoring .............................................................................................................................. 1
1.2.2 Classification ......................................................................................................................... 1
1.2.3 Component case outline presentation ................................................................................. 1
3. DEFINITIONS .............................................................................................................................. 3
3.1 Definitions ........................................................................................................................... 3
3.1.1 Electronic device component case outline (package) ......................................................... 3
3.1.2 Configuration ....................................................................................................................... 3
3.1.3 Package style ...................................................................................................................... 3
3.1.4 Package type ...................................................................................................................... 3
3.1.5 Chip carrier (CC) package .................................................................................................. 3
3.1.6 Can package ....................................................................................................................... 3
3.1.7 In-line package (IP) ............................................................................................................. 3
3.1.8 Flat package (FP) ................................................................................................................ 3
3.1.9 Grid array (GA) package ..................................................................................................... 3
3.1.10 Index ................................................................................................................................... 3
3.1.11 Index area ........................................................................................................................... 3
3.1.12 Base plane .......................................................................................................................... 3
3.1.13 Seating plane ...................................................................................................................... 3
3.1.14 Coplanarity .......................................................................................................................... 3
3.1.15 Dimension ........................................................................................................................... 4
3.1.16 Reference dimension .......................................................................................................... 4
3.1.17 Basic dimension (BSC) ....................................................................................................... 4
3.1.18 True position ....................................................................................................................... 4
3.1.19 Datum .................................................................................................................................. 4
3.1.20 Land .................................................................................................................................... 4
3.1.21 Land pattern ........................................................................................................................ 4
3.1.22 Lead position overlay .......................................................................................................... 4
3.1.23 Cavity-up, cavity-down ........................................................................................................ 4
3.1.24 Tailoring .............................................................................................................................. 4
3.1.25 Dimensioning symbols ........................................................................................................ 5
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MIL-STD-1835D
CONTENTS
PARAGRAPH PAGE
6. NOTES ........................................................................................................................................ 24
6.1 Intended use ....................................................................................................................... 24
6.2 Tailoring guidance for contractual application ..................................................................... 24
6.3 Subject term (key word) listing ............................................................................................ 24
6.4 Package cross-reference list ............................................................................................... 25
6.5 Plastic encapsulated microcircuit packages ....................................................................... 27
6.6 Changes from previous issue .............................................................................................. 28
FIGURES
TABLES
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MIL-STD-1835D
CONTENTS
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MIL-STD-1835D
1. SCOPE
1.1 Scope. This standard establishes and maintains a compilation of electronic component case outlines and
should be useful to all levels of manufacturing that culminate in the production of reliable and logistically supportable
electronic equipment.
1.2 Purpose. The purpose of this standard is to assure complete mechanical interchangeability of all electronic
component case outlines of a particular style and type, regardless of source, commensurate with the requirements of
high density electronic equipment manufacturing.
1.2.1 Tailoring. Some tailoring of case outlines is to be accomplished by users of this standard. Details for
tailoring are presented with each style of case outline (when required, see 3.1.3 and 6.2).
1.2.2 Classification. Electronic component case outlines are of the styles and types identified in accordance with
the descriptive designation system used herein (see 4.7). A cross-reference is included in section 6 indicating the
relationship between old designations from MIL-M-38510 appendix C and the new designations used herein.
1.2.3 Component case outline presentation. All case outlines presented in this standard are drawn in orthogonal
projections. Dimensions are as shown, presented in both inch and metric units of measurement. The dimensions
are labeled with the symbols listed in 3.1.25 herein. The drawings are intended only as illustrations of a case outline
style. In some instances, the drawings show added detail for emphasis; in most instances, the drawings are distorted
by intent.
1
MIL-STD-1835D
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This
section does not include documents cited in other sections of this standard or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this
standard, whether or not they are listed.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
2.3 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
(Copies of these documents are available from www.asme.org or ASME, 3 Park Avenue, New York, NY 10016.)
JEDEC Publication 95 - Registered and Standard Outlines for Solid State and Related Products.
(Copies of this document are available online at www.jedec.org/ or from the Electronics Industries Alliance, 2500
Wilson Boulevard, Arlington, VA 22201-3834).
2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
2
MIL-STD-1835D
3. DEFINITIONS
3.1 Definitions. For the purpose of this standard, the definitions contained in the DoD specifications and
standards referenced in 2.2.1, and other DoD specifications and standards as applicable, should apply. The
following definitions should also apply.
3.1.1 Electronic device case outline (package). The embodiment of the external geometric characteristics of a
electronic device including dimensions and dimensional tolerances. Hereafter, the case outline will be referred to as
a package.
3.1.2 Configuration. The relative disposition of the external elements of a package including lead form.
3.1.3 Package style. All packages whose generic design and nomenclature are identical.
3.1.4 Package type. A package with a unique case outline, configuration, materials (including bonding wire and
die attach), piece parts (excluding preforms which differ only in size), and assembly processes. 1/
3.1.5 Chip carrier (CC) package. A rectangular or square package having terminals on all four sides of the
package periphery.
3.1.6 Can package. A cylindrical shaped package with leads attached to one end.
3.1.7 In-line package (IP). A rectangular package having one row (or two or more parallel rows) of terminals
oriented perpendicular to the package seating plane.
3.1.8 Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two
opposing sides of the package periphery.
3.1.9 Grid array (GA) package. A rectangular or square package with terminals attached perpendicular to a
"major surface" in a grid matrix.
3.1.10 Index. A unique mechanical or visual (or both) package feature which (using package orientation rules in
accordance with JEDEC Publication 95) identifies the location of the first terminal position, (e.g., reference mark,
extended terminal, chamfer, tab, notch, flat, groove, etc.). The index location varies with different package styles, but
only as specified herein.
3.1.11 Index area. The area in which all or a portion of the index must be located.
3.1.12 Base plane. The reference plane, parallel to the nominal seating plane, through the lowest plane on the
body of a package.
3.1.13 Seating plane. The reference plane which designates the interface of the package terminals with the
mounting surface to which the terminals are attached, (for DIP's, see 5.2.4).
3.1.14 Coplanarity. Coplanarity is the condition of two or more surfaces having all elements in one plane, (e.g.,
the seating plane of all the leads on a electronic device, see 5.2.7).
__________
1/ This definition of package type is taken from MIL-PRF-38535, appendix A. Note, however, that this standard
does not specify package interior attributes.
3
MIL-STD-1835D
3.1.15 Dimension. A numerical value expressed in appropriate units of measure and indicated on a drawing and
in other documents along with lines, symbols, and notes to define the size or geometric characteristic, or both, of a
part or part feature. 2/
3.1.16 Reference dimension. A dimension, usually without tolerance, used for information purposes only. It is
considered auxiliary information and does not govern production or inspection operations. A reference dimension is
a repeat of a dimension or is derived from other values shown on the drawing or on related drawings. 2/
3.1.17 Basic dimension (BSC). A numerical value used to describe the theoretically exact size, profile,
orientation, or location of a feature or datum target. It is the basis from which permissible variations are established
by tolerances on other dimensions, in notes, or in feature control frames. 2/
3.1.18 True position. The theoretically exact location of a point, line, or plane of a feature established by basic
dimensions in relationship with a datum reference(s) or other feature. 2/
3.1.19 Datum. A theoretically exact point, axis, or plane derived from the true geometric counterpart of a
specified datum feature. A datum is the origin from which the location or geometric characteristics of features of a
part are established. 2/
3.1.20 Land. A portion of a conductive pattern usually, but not exclusively, used for the connection, or
attachment, or both of components.
3.1.21 Land pattern. A combination of lands intended for the mounting and interconnection of a particular
component.
3.1.22 Lead position overlay. An optical gauge used to measure lead dimensions, land pattern, and other
package feature-relating requirements.
3.1.23 Cavity-up, cavity-down. The orientation of the package body cavity opening, away from the seating plane
for cavity-up or toward the seating plane for cavity-down (see 5.2.8).
3.1.24 Tailoring. The process by which package requirements are evaluated to determine the extent to which
they are most suitable for military systems and equipment applications; and modified as permitted by this standard,
and as necessary to ensure application suitability (see 6.2).
__________
2/ From ASME Y14.5M, see 2.2.
4
MIL-STD-1835D
A: Body dimensions.
∅b: Terminal lead diameters.
b: Terminal lead widths.
c: Terminal lead thicknesses.
∅D: Body diameters.
D: Body lengths.
E: Body widths.
e: Terminal lead spacing.
F: Flange dimensions.
k: Index dimensions, length.
L: Terminal lead lengths.
Q: Standoff height. The height from the seating plane to the base plane or a reference plane parallel to
the seating plane.
S: Distance between terminal leads and the body end or body center lines.
α: Angular dimensions.
h: Chamfered corner dimension.
R: Radius Dimensions.
: Straightness.
: Flatness.
Profile of a line.
:
Profile of a surface.
:
: Perpendicularity.
: Position.
∅ : Diameter.
: Basic dimension.
Datum feature.
:
5
MIL-STD-1835D
4. GENERAL REQUIREMENTS
4.1 Package design. Package design shall be in accordance with this standard.
4.2 Package terminal identification. Package terminal identification shall be in accordance with the applicable
device specification.
4.3 Package index implementation. A permanent index shall be clearly visible on the top and, as an added
option, bottom of a package. The index shall be used for locating terminal 1. The location of the index shall be as
specified in the outline requirements for each package style (see table VI).
4.4 Package dimensions and symbols. The package dimensions shall be in accordance with this standard. All
dimensions shall apply to assembled sealed packages. Symbols and tolerances shall be interpreted in accordance
with ASME Y14.5M-1994 and this standard. Unless otherwise specified, the package design controlling dimension
shall be the inch. For all new package designs after January 1, 1992, it shall be metric.
4.5 Dimension verification. Unless otherwise specified, dimensions identified by a single symbol, which are
repeated at more than 15 package locations may be verified by measurement at 15 randomly selected locations on
the package. All package dimensions may be verified using calibrated gauges, overlays, or other comparative
dimension verification devices. These devices shall be designed to the limits of size and relative location of package
features. These devices and their application shall be subject to the approval of the qualifying activity. Recorded
variables data for out of tolerance package features shall be available for review by the qualifying activity.
4.6 Package material characteristics. Package material characteristics, including internal elements that
contribute to the uniqueness of a package type, shall be in accordance with the requirements of the device
specification.
4.7 Package descriptive designation system. This standard uses a descriptive designation system to
communicate package identification (see figure 1). This system describes materials, terminal location, case outline
style, lead form, terminal count, and options. A type designator has been constructed, using this system, for all
packages in this standard (see tables VI and VII). The type designators for packages selected from this standard
shall be referenced in applicable detail specifications. See the example on figure 2.
4.7.1 Case outline letter/Part or Identifying Number (PIN) designator. The PIN case outline letter designator
shall be as specified herein and shall be referenced in applicable device specifications. The case outline designator
may include numbers or letters with the following limitations:
c. The letters X, Y, Z, U, T, M, N, and the numbers 4, 5, 6, 7, and 8 are undedicated "wildcards"; they may be
used repeatedly, but only one time in a single device specification, see the example using the letter "X" on
figure 2.
4.8 Inactive for new design. The packages in table VII are inactive for new design. They are acceptable only for
use in equipment designed or redesigned on or before the date indicated in the applicable footnote in table VII.
6
MIL-STD-1835D
7
MIL-STD-1835D
Code Material
C Cofired ceramic, metal-seal
G Ceramic, glass-seal
L Glass
M Metal
X Other
Code 1/ Style
CC Chip-carrier package, square or rectangular body profile
CY Cylinder or can package, round body profile
FM Flange mount package, variable body profile
FP Flat pack package, square or rectangular body profile
GA Grid-array package, square or rectangular body profile
IP In-line package, rectangular body profile (e.g., DIP/SIP/ZIP)
SS Special-shape package
1/ The package outline style will be followed with a suffix number when additional
differentiation is required.
8
MIL-STD-1835D
9
MIL-STD-1835D
Code Options 1/
A Additional terminal pads added on the top of leadless
chip carrier style packages.
B Cofired metal heat conduction pads; as specified
herein or in the applicable military detail specification.
C Cavity up
D Cavity down
E Window lid
G, H, K, L Other; as specified in the applicable military detail
specification.
10
MIL-STD-1835D
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
5962 - XXXXX 01 M E X
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
01 XXXXX XXXXXXXXXXXXXXXX
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A
for device class M.
11
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Flat pack style 4/
GDFP1-F10 H 101, A F-4 22 10 .050 MS-033 AA
CDFP2-F10 H 101, B F-4 22 10 .050 none
CDFP3-F10 101, B F-4A 22 10 .050 MO-098 AA
GDFP1-F14 D 101, A F-2 22 14 .050 MS-033 AB
CDFP2-F14 D 101, B F-2 22 14 .050 none
CDFP3-F14 101, B F-2A 22 14 .050 MO-098 AB
GDFP1-F16 101, A F-13 22 16 .050 MO-070 AA
GDFP2-F16 F 101, A F-5 22 16 .050 MS-033 AC
CDFP3-F16 F 101, B F-5 22 16 .050 none
CDFP4-F16 101, B F-5A 22 16 .050 MO-098 AC
GDFP1-F18 101, A F-14 22 18 .050 MO-070 AB
GDFP2-F18 101, A F-10 22 18 .050 MO-092 AD
GDFP1-F20 101, A F-15 22 20 .050 MO-070 AC
GDFP2-F20 S 101, A F-9 22 20 .050 MS-033 AD
CDFP3-F20 S 101, B F-9 22 20 .050 none
CDFP4-F20 101, B F-9A 22 20 .050 none
GDFP1-F24 101, A F-16 22 24 .050 MO-070 AD
GDFP2-F24 K 101, A F-6 22 24 .050 MS-033 AE
CDFP3-F24 K 101, B F-6 22 24 .050 none
CDFP4-F24 101, B F-6A 22 24 .050 none
GDFP1-F28 101, A F-17 22 28 .050 MO-070 AE
GDFP2-F28 101, A F-11 22 28 .050 MS-033 AF
CDFP3-F28 101, B F-11A 22 28 .050 none
CDFP4-F28 101, B F-12 22 28 .050 none
CDFP1-F32 101, B F-18 22 32 .050 MO-115 AA
GDFP1-F48 101, A F-19 22 48 .025 MO-146 AA
GDFP1-F56 101, A F-20 22 56 .025 MO-146 AB
Flatpack style with gullwing leads 4/
GDFP1-G10 117 FG-1 22 10 .050 none
GDFP1-G14 117 FG-2 22 14 .050 none
GDFP1-G16 117 FG-3 22 16 .050 none
GDFP1-G20 117 FG-4 22 20 .050 none
12
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Dual-in-line package style 4/
GDIP1-T8 P 102, A D-4 28 8, .300 .100 MS-030 AA
CDIP2-T8 P 102, C D-4 28 8, .300 .100 MS-015 AA
GDIP1-T14 C 102, A D-1 28 14, .300 .100 MS-030 AB
CDIP2-T14 C 102, C D-1 28 14, .300 .100 MS-015 AB
GDIP1-T16 E 102, A D-2 28 16, .300 .100 MS-030 AC
CDIP2-T16 E 102, C D-2 28 16, .300 .100 MS-015 AC
GDIP1-T18 V 102, A D-6 28 18, .300 .100 MS-030 AD
CDIP2-T18 V 102, C D-6 28 18, .300 .100 MS-015 AD
GDIP1-T20 R 102, A D-8 28 20, .300 .100 MS-030 AE
CDIP2-T20 R 102, C D-8 28 20, .300 .100 MS-015 AE
GDIP1-T22 W 102, A D-7 28 22, .400 .100 MS-031 AA
CDIP2-T22 W 102, C D-7 28 22, .400 .100 MS-015 BB
GDIP1-T24 J 102, A D-3 28 24, .600 .100 MS-032 AA,
MO-103 AA
CDIP2-T24 J 102, C D-3 28 24, .600 .100 MS-015 CA
GDIP3-T24 L 102, A D-9 28 24, .300 .100 MS-030 AF
CDIP4-T24 L 102, C D-9 28 24, .300 .100 MS-015 AG
GDIP5-T24 102, A D-11 28 24, .400 .100 none
CDIP6-T24 102, C D-11 28 24, .400 .100 MS-015 BC
GDIP1-T28 102, A D-10 28 28, .600 .100 MS-032 AB,
MO-103 AB
CDIP2-T28 102, C D-10 28 28, .600 .100 MS-015 CB
CDIP3-T28 102, C D-15 28 28, .300 .100 MS-015 AH
GDIP4-T28 102, A D-15 28 28, .300 .100 MS-030 AG,
GDIP1-T32 102, A D-16 28 32, .600 .100 MS-032 AC,
MO-103 AD
CDIP2-T32 102, C D-16 28 32, .600 .100 MS-015 CC
GDIP1-T40 Q 102, A D-5 28 40, .600 .100 MS-032 AD,
MO-103 AC
CDIP2-T40 Q 102, C D-5 28 40, .600 .100 MS-015 CE
GDIP1-T48 102, A D-14 28 48, .600 .100 none
CDIP2-T48 102, C D-14 28 48, .600 .100 MS-015 CF
GDIP1-T50 102, A D-12 28 50, .900 .100 none
CDIP2-T50 102, C D-12 28 50, .900 .100 MS-015 DA
CDIP1-T64 102, C D-13 28 64, .900 .100 MS-015 DB
13
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Can style 4/
MACY1-X8 G 103 A1 70 8 α, β 45° MO-002 AL
MACY1-X10 I 103 A2 65 10 α, β 36° MO-006 AF
MACY1-X12 103 A3 65 12 α, β 30° MO-006 AG
MACY1-X3 103 A4 3 α45°, β90° TO-5, TO-39
Square leadless chip carrier style 4/
CQCC1-N16 105 C-1 20 16 .050 MS-004 CA
CQCC2-N16 105 C-1A 20 16 .050 MS-004 CA
CQCC1-N20 2 105 C-2 20 20 .050 MS-004 CB
CQCC2-N20 105 C-2A 20 20 .050 MS-004 CB
CQCC1-N24 105 C-3 20 24 .050 MS-004 CH
CQCC2-N24 105 C-3A 20 24 .050 MS-004 CH
CQCC1-N28 3 105 C-4 20 28 .050 MS-004 CC
CQCC2-N28 105 C-4A 20 28 .050 MS-004 CC
CQCC1-N44 105 C-5 20 44 .050 MS-004 CD
CQCC1-N52 105 C-6 20 52 .050 MS-004 CE
CQCC1-N68 105 C-7 20 68 .050 MS-004 CF
CQCC1-N84 105 C-8 20 84 .050 MS-004 CG
Rectangular leadless chip carrier style 4/
CQCC1-N18 105 C-9 20 18 .050 MO-042 AA
CQCC2-N18 105 C-9A 20 18 .050 MO-042 AA
CQCC3-N18 105 C-10 20 18 .050 MO-041 AC
CQCC4-N18 105 C-10A 20 18 .050 MO-041 AC
CQCC3-N20 105 C-13 20 20 .050 MO-041 AD
CQCC4-N20 105 C-13A 20 20 .050 MO-041 AD
CQCC3-N28 105 C-11 20 28 .050 MO-041 AA
CQCC4-N28 105 C-11A 20 28 .050 MO-041 AA
CQCC1-N32 105 C-12 20 32 .050 MO-041 AB
CQCC2-N32 105 C-12A 20 32 .050 MO-041 AB
CDCC1-N4 105 C-14 20 4 .050 MO-041 BA
CDCC1-N6 105 C-15 20 6 .050 MO-041 BB
14
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Gullwing lead chip carrier style 4/
GQCC1-G44 106 C-G1 20 44 .050 MO-084 AB
GQCC1-G68 106 C-G2 20 68 .050 MO-084 AD
GQCC1-G84 106 C-G3 20 84 .050 MO-084 AE
CQCC1-G132 107 C-G7 20 132 .025 MO-104 AA
"J" lead chip carrier style 4/
GQCC1-J28 108 C-J7 20 28 .050 MO-087 AA
CQCC2-J28 109 C-J9 20 28 .050 MO-107 AA
GQCC1-J44 108 C-J1 20 44 .050 MO-087 AB
CQCC2-J44 109 C-J4 20 44 .050 MO-107 AB
GQCC1-J52 108 C-J8 20 52 .050 MO-087 AC
CQCC2-J52 109 C-J10 20 52 .050 MO-107 AC
GQCC1-J68 108 C-J2 20 68 .050 MO-087 AD
CQCC2-J68 109 C-J5 20 68 .050 MO-107 AD
GQCC1-J84 108 C-J3 20 84 .050 MO-087 AE
CQCC2-J84 109 C-J6 20 84 .050 MO-107 AE
Unformed-lead chip carrier style 4/
CQCC1-F84 110 C-U1 20 84 .025 MO-090 AA
CQCC1-F100 110 C-U2 20 100 .025 MO-090 AF
CQCC1-F132 110 C-U3 20 132 .025 MO-090 AB
CQCC1-F144 110 C-U4 20 144 .025 MO-090 AC
CQCC1-F172 110 C-U5 20 172 .025 MO-090 AD
CQCC1-F196 110 C-U6 20 196 .025 MO-090 AE
Grid array style 4/ 5/
CMGA1-PN 111 P-AA 20 81 MAX .100 MO-067 AA
CMGA2-PN 111 P-AB 20 100 MAX .100 MO-067 AB
CMGA3-PN 111 P-AC 20 121 MAX .100 MO-067 AC
CMGA4-PN 111 P-AD 20 144 MAX .100 MO-067 AD
CMGA5-PN 111 P-AE 20 169 MAX .100 MO-067 AE
CMGA6-PN 111 P-AF 20 196 MAX .100 MO-067 AF
CMGA7-PN 111 P-AG 20 225 MAX .100 MO-067 AG
CMGA8-PN 111 P-AH 20 256 MAX .100 MO-067 AH
CMGA9-PN 111 P-AJ 20 289 MAX .100 MO-067 AJ
CMGA10-PN 111 P-AK 20 324 MAX .100 MO-067 AK
15
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Grid array style 4/ 5/
CMGA11-PN 111 P-AL 20 361 MAX .100 MO-067 AL
CMGA12-PN 111 P-AM 20 400 MAX .100 MO-067 AM
CMGA13-PN 111 P-BA 20 81 MAX .100 MO-066 AA
CMGA14-PN 111 P-BB 20 100 MAX .100 MO-066 AB
CMGA15-PN 111 P-BC 20 121 MAX .100 MO-066 AC
CMGA16-PN 111 P-BD 20 144 MAX .100 MO-066 AD
CMGA17-PN 111 P-BE 20 169 MAX .100 MO-066 AE
CMGA18-PN 111 P-BF 20 196 MAX .100 MO-066 AF
CMGA19-PN 111 P-BG 20 225 MAX .100 MO-066 AG
CMGA20-PN 111 P-BH 20 256 MAX .100 MO-066 AH
CMGA21-PN 111 P-BJ 20 289 MAX .100 MO-066 AJ
CMGA22-PN 111 P-BK 20 324 MAX .100 MO-066 AK
CMGA23-PN 111 P-BL 20 361 MAX .100 MO-066 AL
CMGA24-PN 111 P-BM 20 400 MAX .100 MO-066 AM
Staggered grid array style 4/ 5/
CMGA25-PN 116 P-CA 20 145 MAX .100 MO-128 AA
CMGA26-PN 116 P-CB 20 181 MAX .100 MO-128 AB
CMGA27-PN 116 P-CC 20 221 MAX .100 MO-128 AC
CMGA28-PN 116 P-CD 20 265 MAX .100 MO-128 AD
CMGA29-PN 116 P-CE 20 313 MAX .100 MO-128 AE
CMGA30-PN 116 P-CF 20 365 MAX .100 MO-128 AF
CMGA31-PN 116 P-CG 20 421 MAX .100 MO-128 AG
CMGA32-PN 116 P-CH 20 481 MAX .100 MO-128 AH
CMGA33-PN 116 P-CJ 20 545 MAX .100 MO-128 AJ
CMGA34-PN 116 P-CK 20 613 MAX .100 MO-128 AK
CMGA35-PN 116 P-CL 20 685 MAX .100 MO-128 AL
CMGA36-PN 116 P-CM 20 761 MAX .100 MO-128 AM
CMGA37-PN 116 P-CN 20 841 MAX .100 MO-128 AN
CMGA38-PN 116 P-CP 20 1013 MAX .100 MO-128 AP
CMGA39-PN 116 P-CQ 20 1301 MAX .100 MO-128 AQ
16
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Flange mount style 4/
MBFM1-P2 112, A AA 2 .430 TO-3
MBFM2-P2 112, A AB 2 .430 TO-3
MBFM3-P2 112, A AC 2 .430 TO-3
MBFM4-P2 112, B AD 2 .200 TO-66
MBFM1-P15 112, C AE 15 22.5° MO-097
Dual leadless chip carrier style 4/
CDCC1-N28 113 DL-1 20 28 .050 MO-126 AA
CDCC1-N32 113 DL-2 20 32 .050 MO-126 AB
CDCC1-N20 113 DL-3 20 20 .050 MO-126 AC
CDCC2-N20 113 DL-4 20 20 .050 MO-144 AA
CDCC1-N4 105 C-14 20 4 .050 MO-041 BA
CDCC1-N6 105 C-15 20 6 .050 MO-041 BB
Quad leaded chip carrier style with non-conductive tie bar 4/
CQCC2-F100 114 C-T1 20 100 .025 MO-113 AD
CQCC2-F132 114 C-T2 20 132 .025 MO-113 AC
CQCC2-F164 114 C-T3 20 164 .025 MO-113 AA
CQCC2-F172 114 C-T4 20 172 .025 MO-113 AE
CQCC2-F196 114 C-T5 20 196 .025 MO-113 AB
Zig-zag in-line package style 4/
CZIP1-T20 115 Z-1 20, 2.54 mm 2.54 mm MO-176 AA
CZIP1-T24 115 Z-2 24, 2.54 mm 2.54 mm MO-176 AB
CZIP1-T28 115 Z-3 28, 2.54 mm 2.54 mm MO-176 AC
Bottom terminal chip carrier style 4/
CBCC1-N3 118 C-B1 3 TO-276 AA
CBCC2-N3 118 C-B2 3 TO-276 AB
CBCC3-N3 118 C-B3 3 TO-276 AC
Single row flange mount style 4/
MSFM1-P3 119 AA 3 .100 TO-257
MSFM2-P3 119 BB 3 .150 TO-254
MSFM3-P3 119 CC 3 .200 TO-258
17
MIL-STD-1835D
1/ 2/ Terminal 3/
Descriptive Requirement count, EIA
package Case number, Dimensions Row-to-row Terminal similar
type outline Configuration reference θJC spacing pitch package
designator letter letter letter (°C/W) (inch) (inch) designation
Flat pack style 4/
GDFP4-F14 6/ B 101, C F-3 22 14 .050 TO-85
GDFP5-F14 6/ A 101, C F-1 22 14 .050 TO-86
CDFP6-F14 6/ A 101, D F-1 22 14 .050 TO-95
CDFP5-F20 6/ S 101, D F-9 22 20 .050 none
GDFP5-F24 6/ K 101, C F-6 22 24 .050 MO-070 AD
CDFP6-F24 6/ K 101, D F-6 22 24 .050 none
GDFP7-F24 6/ 101, C F-8 22 24 .050 MO-019 AA
CDFP8-F24 6/ 101, D F-8 22 24 .050 none
Dual-in-line package style 4/
CDIP3-T8 7/ P 102, B D-4 28 8, .300 .100 none
CDIP3-T14 7/ C 102, B D-1 28 14, .300 .100 none
CDIP3-T16 7/ E 102, B D-2 28 16, .300 .100 none
CDIP3-T18 7/ V 102, B D-6 28 18, .300 .100 none
CDIP3-T20 7/ R 102, B D-8 28 20, .300 .100 none
CDIP3-T22 7/ W 102, B D-7 28 22, .400 .100 none
CDIP7-T24 7/ J 102, B D-3 28 24, .600 .100 none
CDIP8-T24 7/ L 102, B D-9 28 24, .300 .100 none
CDIP9-T24 7/ 102, B D-11 28 24, .400 .100 none
CDIP4-T28 7/ 102, B D-10 28 28, .600 .100 none
CDIP3-T40 7/ Q 102, B D-5 28 40, .600 .100 none
CDIP3-T50 7/ 102, B D-12 28 50, .900 .100 none
Single-in-line package style
CSIP1-T3 7/ 104 S1 --- 3 .050 TO-260
18
MIL-STD-1835D
19
MIL-STD-1835D
5. DETAILED REQUIREMENTS
5.1 Package styles and package types. Package styles and package types are listed in tables VI and VII with
brief descriptions.
5.2 Unique package features. Unique package features are depicted as follows.
5.2.1 Flat pack end leads. Flat packs which have leads extending from the ends of the body may have different
lead configurations as shown on figure 3. Dimension α applies only to that portion of the lead within dimension E
which bends into the body.
5.2.2 Glass sealed flat pack minimum S1 dimension. The minimum limit of dimension S1 shall be either .000
(0.00 mm) or .005 (0.13 mm) depending on what lead configuration is used (see figure 4). In example A, the
minimum limit is .005 (0.13 mm). In example B, if the lead bends toward the cavity within one lead width as shown,
the minimum limit is .000 (0.00 mm); otherwise the criteria for example A shall apply. For metal-sealed bottom-
brazed leads, dimension S1 shall be measured from the edge of the furthest extension of the metal pad or lead,
whichever is closest to the corresponding edge of the package body.
20
MIL-STD-1835D
5.2.3 DIP lead row center dimension eA. Dimension eA on DIP outlines shall be measured at the center of the
lead bends (see figure 5) or at the centerline of the lead when α is 90°. For side-brazed leads, this dimension shall
be measured at the centerlines of the leads.
5.2.4 DIP dimensions L and Q. Dimensions L and Q on DIP style packages shall be measured from the lead
tips and base plane to the seating plane (see figure 6). The seating plane is located at the lowest point on the lead
at which the lead width exceeds .040 inch (1.02 mm) minimum excluding any half leads at the package ends. (The
illustration shows a tapered lead at the seating plane, other lead shapes in this area are also acceptable, see details
B, C, and D on the DIP drawings.)
21
MIL-STD-1835D
5.2.5 DIP end variations dimension S1. For all DIP configurations, dimension S1 shall be measured from the
edge of the furthest extension of the metal pad or lead whichever is closest to the end of the body (see figure 7).
5.2.6 Leadless chip carrier (LCC) castellation irregularities. Analysis of the chip carrier castellation by
measurement requires that all surface irregularities of the castellation (the shaded area) be within dimensions L3
and B3 as delineated on figure 8. It is also required that the castellation be located within the LCC terminal pad
width, exclusive of the annular ring, as shown on figure 8.
22
MIL-STD-1835D
5.2.7 Coplanarity deviation. The coplanarity deviation of all terminal contact points, as defined by the device
seating plane, shall be determined for surface mounted devices. Measurements shall be made from the device
seating plane (see figure 9). Regardless of package size, any device with one or more terminals that exceed the
specified coplanarity deviations shall constitute a failure.
5.2.8 Package cavity orientation. Unless otherwise specified herein, for most packages, cavity orientation (see
figure 10) is standard in the "cavity-up" position. When a particular package style includes optional cavity
orientation, such as cavity-down, the cavity-down option shall be specified by adding a suffix D to the terminal- count
part of the descriptive type designator (see figure 1).
5.2.9 Package drawings. Detailed package drawings and dimensional criteria shall be as specified in the
individual style requirements.
5.3 Dimensional listings in the individual requirements. Dashes are used to indicate “not specified” and blanks
are used to indicate “not applicable”.
23
MIL-STD-1835D
6. NOTES
(This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.)
6.1 Intended use. Packages conforming to the requirements of this standard are intended for use in electronic
equipment.
6.2 Tailoring guidance for contractual application. For purposes of this standard, tailoring refers to the selection
of optional package features when they are specified in the individual style requirements. For example, one may
select top and bottom terminals and thermal conduction pads on certain chip carrier packages.
ANSI
Basic dimension
Ceramic
Classification
EIA
Gullwing
Interchangeability
Lead position overlay
Package style
Quad
Tailoring
Type designator
24
MIL-STD-1835D
6.4 Package cross-reference list. The following table provides a cross-reference of package type numbers (and
configuration numbers where applicable) that were listed in appendix C of MIL-M-38510, to the package descriptive
type designators listed in this standard. Packages were deleted from appendix C of MIL-M-38510 with the
publication of this standard. The appendix C numbers are in alphanumeric sequence; underlined descriptive type
designators are inactive (see table VIII).
25
MIL-STD-1835D
INACTIVE INACTIVE
D-1, 2 CDIP3-T14 F-1, 4 CDFP6-F14
D-10, 2 CDIP4-T28 F-1, 3 GDFP5-F14
D-11, 2 CDIP9-T24 F-3, 3 GDFP4-F14
D-12, 2 CDIP3-T50 F-6, 4 CDFP6-F24
D-2, 2 CDIP3-T16 F-6, 3 GDFP5-F24
D-3, 2 CDIP7-T24 F-8, 4 CDFP8-F24
D-4, 2 CDIP3-T8 F-8, 3 GDFP7-F24
D-5, 2 CDIP3-T40 F-9, 4 CDFP5-F20
D-6, 2 CDIP3-T18
D-7, 2 CDIP3-T22
D-8, 2 CDIP3-T20
D-9, 2 CDIP8-T24
26
MIL-STD-1835D
6.5 Plastic encapsulated microcircuit packages. The plastic encapsulated microcircuit packages listed in table
IX are recommended for use in those DoD systems that are using plastic packages. The dimensions and tolerances
for the plastic packages listed in table IX are available for use in the JEP-95 outline shown and should be directly
invoked from that document.
27
MIL-STD-1835D
6.6 Changes from previous issue. Marginal notations are not used in this revision to identify changes with
respect to the previous issue due to the extent of the changes.
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at www.dodssp.daps.mil.
28
MIL-STD-1835D
REQUIREMENT 101A
Configuration A
Ceramic, glass sealed
REQUIREMENT 101A
1 June 2004
1
MIL-STD-1835D
Configuration B
Ceramic, metal-sealed, bottom-brazed leads
REQUIREMENT 101A
1 June 2004
2
MIL-STD-1835D
Configuration C
Ceramic, glass sealed, spider leads
REQUIREMENT 101A
1 June 2004
3
MIL-STD-1835D
Configuration D
Ceramic, metal-sealed, bottom-brazed spider leads
REQUIREMENT 101A
1 June 2004
4
MIL-STD-1835D
REQUIREMENT 101A
1 June 2004
5
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
6
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
7
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
8
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
9
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
10
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
11
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
12
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
13
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
14
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
15
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
16
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
REQUIREMENT 101A
1 June 2004
17
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to
that configuration.
REQUIREMENT 101A
1 June 2004
18
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to
that configuration.
REQUIREMENT 101A
1 June 2004
19
MIL-STD-1835D
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one
and shall be located within the shaded area shown. The manufacturer's identification shall
not be used as a pin one identification mark. Alternatively, a tab (dimension k) may be
used to identify pin one. This tab may be located on either side of terminal one as shown
in detail A, or it may be located on terminal one as shown in detail B.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not
apply.
3. This dimension allows for off-center lid, meniscus, and glass overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating
and finish thickness. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead
finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners, see 5.2.5. There is an alternative minimum limit
to dimension S1, see 5.2.2.
7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to
the bottom of the package to cover the leads.
8. Optional, see note 1. If a pin one identification mark is used in addition to this tab, the
minimum limit of dimension k does not apply.
9. Applies to leads exiting the end of the body (short side) and closest to the corners.
10. Lead configuration is optional within dimension E except dimensions b and c apply (see
5.2.1).
11. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from
the body. Dimension Q minimum shall be reduced by .0015 inch (0.038 mm) maximum
when solder dip lead finish is applied.
12. See tables VI and VII for descriptive type designators.
13. Configurations C and D are inactive for applications in new equipment design, see 4.8.
14. Ax is used instead of A for configuration D only.
15. Dimension "A" controls the overall package thickness. When a window lid is used,
dimension "A" must increase by a minimum of .010 inch (0.254 mm) and a maximum of
.040 inch (1.020 mm).
REQUIREMENT 101A
1 June 2004
20
MIL-STD-1835D
REQUIREMENT 102
Configuration A
Ceramic, glass-sealed
REQUIREMENT 102
15 August 2000
1
MIL-STD-1835D
Configuration B
Ceramic, metal-sealed, bottom-brazed leads
REQUIREMENT 102
15 August 2000
2
MIL-STD-1835D
Configuration C
Ceramic, metal-sealed, side-brazed leads
REQUIREMENT 102
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 102
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 102
15 August 2000
5
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
6
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
7
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
8
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
9
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
10
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
11
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
12
MIL-STD-1835D
1/ Symbols in this column that are not on a configuration drawing are not applicable to that configuration.
2/ All configurations except as noted.
REQUIREMENT 102
15 August 2000
13
MIL-STD-1835D
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be
located within the shaded area shown. The manufacturer's identification shall not be used as a pin one
identification mark.
2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead
surfaces, when solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish
thickness.
4. The b2 minimum dimension of .045 inch (1.14 mm) was implemented 30 September 1992. Until that date,
a minimum dimension of .038 (0.97 mm) was acceptable. See 5.2.4
5. Corner leads (1, N, N/2, and N/2+1) may be configured as shown in detail A. For this configuration
dimension b3 replaces dimension b2.
6. This dimension allows for off-center lid, meniscus, and glass overrun.
7. For configuration B, no organic or polymeric materials shall be molded to the bottom of the package to
cover the leads.
8. Pointed or rounded lead tips as shown in details B and C are preferred to ease insertion, but are not
mandatory.
9. Dimension Q shall be measured from the seating plane to the base plane.
10. Measure dimension S1 at all four corners, see 5.2.5.
11. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead
12. N is the maximum number of terminal positions.
13. Braze fillet shall be concave. The maximum dimensions of this fillet include solder dip or tin plate lead
finish, if applied.
14. See tables VI and VII for descriptive type designators.
REQUIREMENT 102
15 August 2000
14
MIL-STD-1835D
REQUIREMENT 103A
CAN STYLE
REQUIREMENT 103A
1 June 2004
1
MIL-STD-1835D
REQUIREMENT 103A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 103A
1 June 2004
3
MIL-STD-1835D
NOTES:
1. (All leads) ∅b applies between L1 and L2. ∅b1 applies between L2 and .500 inches from the reference
plane. Diameter is uncontrolled in L1 and beyond .500 inches from the reference plane.
2. The package feature described by dimension symbols ∅D2 and Q does not exist for variation A4; therefore the
reference, base, and seating planes are the same for this variation.
3. Measured from maximum diameter of the product.
4. α is the basic spacing from the centerline of the tab to terminal 1 and is the basic spacing of each lead or lead
position (N - 1 places) from α , looking at the bottom of the package.
5. N is the maximum number of terminal positions.
6. Leads having a maximum diameter .019 inches measured in gauging plane .054 +.001 -.000 inches below the
base plane of the product shall be within .007 inches of their true position relative to a maximum width tab.
7. This style package may be measured by direct methods or by gauge.
8. See table VI for descriptive type designators.
REQUIREMENT 103A
1 June 2004
4
MIL-STD-1835D
REQUIREMENT 104A
REQUIREMENT 104A
1 June 2004
1
MIL-STD-1835D
S1 S1
(inches) (millimeters)
Symbol Min Nom Max Note Min Nom Max Note
A .055 .060 .065 1.40 1.52 1.65
A2 .012 .014 .018 0.30 0.36 0.46
b .014 --- .021 3 0.36 --- 0.53 3
b1 .014 .016 .018 3 0.36 0.41 0.46 3
c .008 --- .017 0.20 --- 0.43
c1 .008 .010 .014 3 0.20 0.25 0.36 3
D .220 .225 .240 5.59 5.72 6.10
e .050 BSC 1.27 BSC
E .154 .160 .166 3.91 4.06 4.22
L .475 --- --- 12.06 --- ---
M --- --- .003 3 --- --- .08 3
Note 1, 2
NOTES:
1. Dimensioning and tolerancing in accordance with ASME Y14.5M-1994.
2. Controlling dimension, inch.
3. Maximum increase when lead finish A or B is applied.
4. The increase in the b dimension, as a result of lead finishes, does not change the positional tolerance, .010,
which is applied at MMC of .018.
REQUIREMENT 104A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 105
REQUIREMENT 105
15 August 2000
1
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
5
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
6
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
7
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
8
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
9
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
10
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
11
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
12
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
13
MIL-STD-1835D
REQUIREMENT 105
15 August 2000
14
MIL-STD-1835D
NOTES:
REQUIREMENT 105
15 August 2000
15
This page intentionally blank
MIL-STD-1835D
REQUIREMENT 106
REQUIREMENT 106
15 August 2000
1
MIL-STD-1835D
BODY DETAIL
REQUIREMENT 106
15 August 2000
2
MIL-STD-1835D
TERMINAL DETAIL
REQUIREMENT 106
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 106
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 106
15 August 2000
5
MIL-STD-1835D
NOTES:
1. Symbol "N" is the maximum number of terminals. Symbols "ND" and "NE" are the number of terminals along
the sides of lengths "D" and "E" respectively.
2. A terminal 1 identification mark shall be located on the first side clockwise from the index corner, within the
shaded area shown. Terminal numbers shall increase in a counterclockwise direction when viewed as
shown. If the identification mark is not exactly adjacent to terminal 1, terminal 1 is located as follows:
a. If the number of terminals on a side is odd, terminal 1 is the center terminal.
b. If the number of terminals on a side is even, terminal 1 is the terminal which is adjacent to the centerline
of the terminal array in the direction closest to the index corner.
3. When the number of terminals per side is even, datums A, B, and D are located at the terminal array
centers. When the number of terminals per side is odd, datums A, B, and D are located at the centers of the
center terminals. The measurement point for establishing these datums is the package/lead interface at
datum plane H.
4. Dimension "A" controls the overall package height. When a window lid is used, dimension "A" must increase
by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).
5. Corner shape (square, notch, radius, etc.) may vary from that shown on the drawing. The index corner shall
be clearly unique.
6. Chip carriers shall be constructed of a minimum of two ceramic layers.
7. This dimension allows for package edge anomalies caused by material protrusion, such as rough ceramic,
misaligned ceramic layers and lids, meniscus, and glass overrun.
8. The leads on this package style shall be protected from mechanical distortion and damage such that
dimensions pertaining to relative lead/body "true positions" and lead "coplanarity" are always maintained
until the next higher level package attachment process is complete. Package lead protection mechanisms
(tie bars, carriers, etc.) are not shown on the drawing; however, when electronic devices contained in this
package style are shipped for use in Government equipment, or shipped directly to the Government as spare
parts or mechanical qualification samples, lead protection shall be in place.
9. The quad leaded chip carrier drawings in this outline requirement show a "gullwing" lead configuration. An
optional lead configuration can be specified for unformed (straight) leads, see figure 1 and table V
concerning how to designate an option. When either option is selected and straight leads are subsequently
formed by the electronic device user, the resultant lead configuration shall conform to the "gullwing" lead
dimensions and coplanarity requirements specified herein.
10. See table VI for descriptive type designator.
REQUIREMENT 106
15 August 2000
6
MIL-STD-1835D
REQUIREMENT 107A
REQUIREMENT 107A
1 June 2004
1
MIL-STD-1835D
REQUIREMENT 107A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 107A
1 June 2004
3
MIL-STD-1835D
Variation
C-G7 C-G7
(inches) (millimeters)
Symbol Min Nom Max Note Min Nom Max Note
A .060 --- .140 1.52 --- 3.56
A1 .022 .030 .038 0.56 0.76 0.97
b .006 --- .015 7 0.15 --- 0.38 7
b1 .006 --- .013 7 0.15 --- 0.33 7
b2 --- --- .019 --- --- 0.48
c .004 --- .010 7 0.10 --- 0.25 7
c1 .004 --- .008 7 0.10 --- 0.20 7
D/E .935 .950 .960 23.75 24.13 24.38
D1/E1 --- --- .970 --- --- 24.64
e .025 BSC 0.64 BSC
e1 .800 BSC 20.32 BSC
e2 1.080 BSC 27.43 BSC
HD/HE 1.074 1.080 1.086 27.28 27.43 27.58
L .022 .025 .028 0.56 0.64 0.71
L1 --- --- .006 --- --- 0.15
M --- --- .001 --- --- 0.03
N 132 4 132 4
ND/NE 33 5 33 5
R .011 --- .017 0.28 --- 0.43
R1 .010 --- --- 0.25 --- ---
Notes 8, 10
REQUIREMENT 107A
1 June 2004
4
MIL-STD-1835D
NOTES:
1. A terminal 1 identification mark shall be located at the index corner in the shaded area shown. Terminal 1 is
located immediately adjacent to and counterclockwise from the index corner. Terminal numbers increase in
a counterclockwise direction when viewed as shown.
2. Generic lead attach dogleg depiction. May be flat lead configuration.
3. Corner shapes (square, notch, radius, etc.) may vary from that shown on the drawing. The index corner shall
be clearly unique.
4. Dimension N: Number of terminals.
5. Dimension ND/NE: Number of terminals per package edge.
6. No overhang of the lead on the braze pad is allowed.
7. Dimension b and c include lead finish; dimensions b1 and c1 apply to base metal only. Dimension M applies
to plating thickness.
8. The leads of this package style shall be protected from mechanical distortion and damage such that
dimensions pertaining to relative lead/body "true positions" and lead "coplanarity" are always maintained
until the next higher level package attachment process is complete. Package lead protection mechanisms
(tie bars, carriers, etc.) are not shown on the drawing, however when electronic devices contained in this
package style are shipped for use in Government equipment, or shipped directly to the Government as spare
parts or mechanical qualification samples, lead "true position" and "coplanarity" protection shall be in place.
9. The lead tip location may be determined with the use of the lead position gauge shown. Each lead tip and
the body shall simultaneously reside within defined areas of the gauge.
10. The quad leaded chip carrier drawings in this outline requirement show a "gullwing" lead configuration. An
optional configuration can be specified; it is for unformed (straight) leads, see figure 1 and table V
concerning how to designate this option. When either option is selected and straight leads are subsequently
formed by the electronic device user, the resultant lead configuration shall conform to the "gullwing" lead
dimensions and coplanarity requirements specified herein.
11. See table VI for descriptive type designator.
REQUIREMENT 107A
1 June 2004
5
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MIL-STD-1835D
REQUIREMENT 108A
REQUIREMENT 108A
1 June 2004
1
MIL-STD-1835D
REQUIREMENT 108A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 108A
1 June 2004
3
MIL-STD-1835D
REQUIREMENT 108A
1 June 2004
4
MIL-STD-1835D
REQUIREMENT 108A
1 June 2004
5
MIL-STD-1835D
REQUIREMENT 108A
1 June 2004
6
MIL-STD-1835D
NOTES:
1. A terminal 1 identification mark shall be located on the first side clockwise from the index corner, within the
shaded area shown. Terminal numbers shall increase in a counterclockwise direction when viewed as
shown. If the identification mark is not exactly adjacent to terminal 1, terminal 1 is located as follows:
a. If the number of terminals on a side is odd, terminal 1 is the center terminal.
b. If the number of terminals on a side is even, terminal 1 is the terminal which is adjacent to the
centerline of the terminal array in the direction closest to the index corner.
2. This dimension delineates the minimum clearance between the inside of the lead and the top of the body.
One-half of the minimum clearance from the body establishes a limit beyond which package edge
anomalies caused by material protrusion such as rough ceramic, misaligned ceramic layers, glass
meniscus, or overrun shall not extend.
3. Symbol N: Number of terminals.
4. Symbols ND/NE: Number of terminals per package edge.
5. Corner shape (square, notch, radius, etc.) may vary from that shown on the drawing. The index corner shall
be clearly unique.
6. Dimensions b1 and c1 apply to base metal only. Dimension M applies to plating thickness.
7. The leads on this package style shall be protected from mechanical distortion and damage such that
dimensions pertaining to relative lead/body "true positions" and lead "coplanarity" are always maintained
until the next higher level package attachment process is complete. Package lead protection mechanisms
(tie bars, carriers, etc.) are not shown on the drawing; however, when electronic devices contained in this
package style are shipped for use in Government equipment, or shipped directly to the Government as
spare parts or mechanical qualification samples, lead protection shall be in place.
8. The location of each lead seating plane "interface area" may be determined with the use of the lead position
gauge shown. The interface area of each lead and the body shall simultaneously reside within defined
areas of the gauge.
9. UV window is optional. See table VI for descriptive type designator
10. Body contour along dotted lines optional.
11. The minimum arc length "AL" of radius R shall be "AL = 135 π R/180".
12. The quad leaded chip carrier drawings in this outline requirement show a "J" lead configuration. An
optional configuration can be specified; it is for unformed (straight) leads, see figure 1 and table V
concerning how to designate this option. When either option is selected and straight leads are
subsequently formed by the electronic device user, the resultant lead configuration shall conform to the "J"
lead dimensions and coplanarity requirements specified herein.
REQUIREMENT 108A
1 June 2004
7
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MIL-STD-1835D
REQUIREMENT 109A
REQUIREMENT 109A
1 June 2004
1
MIL-STD-1835D
REQUIREMENT 109A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 109A
1 June 2004
3
MIL-STD-1835D
REQUIREMENT 109A
1 June 2004
4
MIL-STD-1835D
REQUIREMENT 109A
1 June 2004
5
MIL-STD-1835D
REQUIREMENT 109A
1 June 2004
6
MIL-STD-1835D
NOTES:
1. A terminal 1 identification mark shall be located on the first side clockwise from the index corner, within the
shaded area shown. Terminal numbers shall increase in a counterclockwise direction when viewed as
shown. If the identification mark is not exactly adjacent to terminal 1, terminal 1 is located as follows:
a. If the number of terminals on a side is odd, terminal 1 is the center terminal.
b. If the number of terminals on a side is even, terminal 1 is the terminal which is adjacent to the
centerline of the terminal array in the direction closest to the index corner.
2. Symbol N: Number of terminals.
3. Symbols ND/NE: Number of terminals per package edge. ND/NE = N / 4
4. Corner shapes (square, notch, radius, etc.) may vary from that shown on the drawing. The index corner shall
be clearly unique.
5. Dimensions b1 and c1 apply to base metal only. Dimension M applies to plating thickness.
6. The leads on this package style shall be protected from mechanical distortion and damage such that
dimensions pertaining to relative lead/body "true positions" and lead "coplanarity" are always maintained
until the next higher level package attachment process is complete. Package lead protection mechanisms
(tie bars, carriers, etc.) are not shown on the drawing, however when electronic devices contained in this
package style are shipped for use in Government equipment, or shipped directly to the Government as spare
parts or mechanical qualification samples, lead protection shall be in place.
7. The location of each lead seating plane "interface area" may be determined with the use of the lead position
gauge shown. The interface area of each lead and the body shall simultaneously reside within defined areas
of the gauge.
8. The maximum "A" dimension allows for an EPROM window lid.
9. The quad leaded chip carrier drawings in this outline requirement show a "J" lead configuration. An optional
configuration can be specified; it is for unformed (straight) leads, see figure 1 and table V concerning how to
designate this option. When either option is selected and straight leads are subsequently formed by the
electronic device user, the resultant lead configuration shall conform to the "J" lead dimensions and
coplanarity requirements specified herein.
10. See table VI for descriptive type designator.
11. D2/E2 = D1/E1 max +.004 inch (0.10 mm).
REQUIREMENT 109A
1 June 2004
7
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MIL-STD-1835D
REQUIREMENT 110
REQUIREMENT 110
15 August 2000
1
MIL-STD-1835D
REQUIREMENT 110
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 110
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 110
15 August 2000
4
MIL-STD-1835D
NOTES:
1. A terminal 1 identification mark shall be located at the index corner in the shaded area shown. Terminal 1 is
located immediately adjacent to and counterclockwise from the index corner. Terminal numbers increase in
a counterclockwise direction when viewed as shown.
2. Generic lead attach dogleg depiction. May be flat lead configuration.
3. Includes lead attach dogleg height and lid height, whichever is greater.
4. Corner shapes (square, notch, radius, etc.) may vary from that shown on the drawing. The index corner shall
be clearly unique.
5. Dimension N: Number of terminals.
6. Dimension ND/NE: Number of terminals per package edge.
7. Regardless of the virtual length, the .002 limit ensures an accurate square trim for subsequent lead forming
tool registration.
8. Lead coplanarity shall be .004 inch (0.10 mm) within .050 inch (1.27 mm) from package body.
9. No overhang of the lead on the braze pad is allowed.
10. Dimensions b1 and c1 apply to base metal only. Dimension M applies to plating thickness.
11. The leads on this package style shall be protected from mechanical distortion and damage such that
dimensions pertaining to relative lead/body "true positions" and lead "coplanarity" are always maintained
until the next higher level package attachment process is complete. Package lead protection mechanisms
(tie bars, carriers, etc.) are not shown on the drawing, however when electronic devices contained in this
package style are shipped for use in Government equipment, or shipped directly to the Government as spare
parts or mechanical qualification samples, lead "true position" and "coplanarity" protection shall be in place.
12. The lead tip location may be determined with the use of the lead position gauge shown. Each lead tip and
the body shall simultaneously reside within defined areas of the gauge.
13. Lead tip coplanarity shall be .030 inch (0.76 mm) at minimum lead length.
14. See table VI for descriptive type designator.
15. The lead tip-to-tip profile is specified by this feature control frame.
REQUIREMENT 110
15 August 2000
5
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MIL-STD-1835D
REQUIREMENT 111
REQUIREMENT 111
15 August 2000
1
MIL-STD-1835D
REQUIREMENT 111
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 111
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 111
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 111
15 August 2000
5
MIL-STD-1835D
REQUIREMENT 111
15 August 2000
6
MIL-STD-1835D
NOTES:
REQUIREMENT 111
15 August 2000
7
MIL-STD-1835D
NOTES - Continued.
16. The PGA alpha numeric grid system for designating terminal positions shall be as follows:
a. A row-column grid system shall be used to designate the terminal positions.
b. With the package viewed looking toward the seating plane and the reference or index corner in the
lower left, the rows of the array shall be designated by the letters of the alphabet excluding I, O, Q, S,
X, and Z from bottom to top. For packages having more than 20 rows, the 21st row shall be
designated AA, the 22nd, AB, etc. The columns of the array shall be numbered from left to right.
c. Since this system designates terminal positions, rows or columns without terminals shall be designated
the same as if terminals were present.
REQUIREMENT 111
15 August 2000
8
MIL-STD-1835D
REQUIREMENT 112
Configuration A
REQUIREMENT 112
15 August 2000
1
MIL-STD-1835D
Configuration B
REQUIREMENT 112
15 August 2000
2
MIL-STD-1835D
Configuration C
REQUIREMENT 112
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 112
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 112
15 August 2000
5
MIL-STD-1835D
Variations
AD AD AE AE
Config. B Config. B Config. C Config. C
(inches) (millimeters) (inches) (millimeters)
Symbol Min Max Min Max Note Min Nom Max Min Nom Max Note
A .250 .340 6.35 8.64 .200 .220 .300 5.08 5.59 7.62
∅a .600 BSC 15.24 BSC
∅b .028 .034 0.71 0.86 4, 6 .025 .030 .035 0.64 0.76 0.89 6
∅D --- .620 --- 15.74 .755 .768 .780 19.18 19.91 19.81
∅D1 .470 .500 11.94 12.70
e .190 .210 4.83 5.33 3
e1 .093 .107 2.36 2.72 3 .300 BSC 7.62 BSC 3
F .050 .075 1.27 1.91 .085 .093 .100 2.16 2.36 2.54
G1 .500 BSC 12.70 BSC
L .360 .500 9.14 12.70 .340 .380 .420 8.54 9.65 10.67
L1 --- .050 --- 1.27 6 --- --- .025 --- --- 0.64 6
∅p .142 .152 3.61 3.86 4 .151 .156 .161 3.84 3.96 4.09 4
q .958 .962 24.33 24.43 1.187 BSC 30.15 BSC
q1 .5935 BSC 15.075 BSC 3
R --- .350 --- 8.89 4 .488 .500 .512 12.40 12.70 13.00 4
R1 .115 .145 2.92 3.68 4 .160 .171 .182 4.06 4.34 4.62 4
S .570 .590 14.48 14.99 6
α 22.5° BSC 22.5° BSC
β 22.5° BSC 22.5° BSC
N 2 2 15 15
Note 1, 2, 5
NOTES:
REQUIREMENT 112
15 August 2000
6
MIL-STD-1835D
REQUIREMENT 113
REQUIREMENT 113
15 August 2000
1
MIL-STD-1835D
REQUIREMENT 113
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 113
15 August 2000
3
MIL-STD-1835D
NOTES:
REQUIREMENT 113
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 114
CERAMIC, QUAD LEADED CHIP CARRIER STYLE WITH NON-CONDUCTIVE TIE BAR
REQUIREMENT 114
15 August 2000
1
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
4
MIL-STD-1835D
NOTE:
The user’s attention is called to the possibility that compliance with this outline requirement may require use of an
invention covered by patent rights; specifically, National Semiconductor, Inc. has stated that U. S. Patent No.
4,796,080 may relate to a certain implementation of this product outline. By publication of this outline requirement,
no position is taken with respect to the validity of this claim of any patent rights in connection therewith.
REQUIREMENT 114
15 August 2000
5
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
6
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
7
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
8
MIL-STD-1835D
REQUIREMENT 114
15 August 2000
9
MIL-STD-1835D
NOTES:
1. A terminal 1 identification mark shall be located at the index corner in the shaded area shown. Terminal 1 is
located immediately adjacent to and counterclockwise from the index corner. Terminal numbers increase in a
counterclockwise direction when viewed as shown.
2. Generic lead attach dogleg depiction. May be flat lead configuration.
3. Includes lead attach dogleg height and lid height, whichever is greater. Dimension A and A1 do not include heat
sinks or other attached features.
4. Corner chamfers and or notches are optional. Pin 1 may have optional feature (larger or smaller chamfer or
notch) for mechanical orientation purposes.
5. Dimension N: Number of terminals.
6. Dimension ND/NE: Number of terminals per package edge.
7. Controlling dimension: Inch.
8. Dimensions b1 and c1 apply to base metal only, dimension M applies to the plating thickness.
9. Optional hole configuration applicable to all four corners.
10. Circular corner hole only. Slotted hole locations are shown on detail D (optional).
11. Lead repair is optional. This view shows the drawn portion of the lead that must reside within these dimensions.
The shape of the repaired lead (as shown) is for reference only.
12. Coplanarity requirements do not apply in this area of a repaired lead.
REQUIREMENT 114
15 August 2000
10
MIL-STD-1835D
REQUIREMENT 115
REQUIREMENT 115
15 August 2000
1
MIL-STD-1835D
NOTES:
REQUIREMENT 115
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 116
REQUIREMENT 116
15 August 2000
1
MIL-STD-1835D
REFERENCE DRAWING
REQUIREMENT 116
15 August 2000
2
MIL-STD-1835D
REQUIREMENT 116
15 August 2000
3
MIL-STD-1835D
REQUIREMENT 116
15 August 2000
4
MIL-STD-1835D
REQUIREMENT 116
15 August 2000
5
MIL-STD-1835D
REQUIREMENT 116
15 August 2000
6
MIL-STD-1835D
REQUIREMENT 116
15 August 2000
7
MIL-STD-1835D
NOTES:
REQUIREMENT 116
15 August 2000
8
MIL-STD-1835D
REQUIREMENT 117A
REQUIREMENT 117A
1 June 2004
1
MIL-STD-1835D
REQUIREMENT 117A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 117A
1 June 2004
3
MIL-STD-1835D
REQUIREMENT 117A
1 June 2004
4
MIL-STD-1835D
NOTES:
1. Index area; A notch or a pin one identification mark shall be located adjacent to pin on and shall be located
within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification
mark. Alternately, a tab (dimension k) may be used to identify pin one. This tab may be located on either
side of terminal one as shown in detail A.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish
thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the
finished lead surface, when solder dip or tin plate lead finish is applied.
5. N is the maximum number of terminal positions.
6. See tables VI and VII for descriptive type designators.
7. Measure dimension S1 at all four corners, see 5.2.5. There is an alternative minimum limit to dimension S1,
see 5.2.2.
REQUIREMENT 117A
1 June 2004
5
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MIL-STD-1835D
REQUIREMENT 118A
Variation
C-B1 C-B1
Symbol (inches) (millimeters) Notes
Min Nom Max Min Nom Max
A .112 .118 .124 2.84 3.00 3.15 1
A1 .010 .015 .020 0.25 0.38 0.51
b .281 .286 .291 7.13 7.26 7.39
b1 .220 .225 .230 5.58 5.72 5.84
b2 .090 .095 .100 2.28 2.41 2.54
b3 .115 .120 .125 2.92 3.05 3.18
D .395 .400 .405 10.03 10.16 10.28
D1 .030 ---- ---- 0.76 ---- ----
E .291 .296 .301 7.39 7.52 7.64
e .075 BSC 1.91 BSC
Notes 2
REQUIREMENT 118A
1 June 2004
1
MIL-STD-1835D
Variation
C-B2 C-B2
Symbol (inches) (millimeters) Note
Min Nom Max Min Nom Max
A .130 .136 .142 3.30 3.45 3.61 1
A1 .010 .015 .020 0.25 0.38 0.51
b .370 .375 .380 9.40 9.53 9.65
b1 .410 .415 .420 10.41 10.54 10.67
b2 .135 .140 .145 3.43 3.56 3.68
b3 .152 .157 .162 3.86 3.99 4.11
D .620 .625 .630 15.75 15.88 16.00
D1 .030 ---- ---- 0.76 ---- ----
E .445 .450 .455 11.30 11.43 11.56
e .105 BSC 2.67 BSC
Note 2
Variation
C-B3 C-B3
Symbol (inches) (millimeters) Note
Min Nom Max Min Nom Max
A .130 .136 .142 3.30 3.45 3.61 1
A1 .010 .015 .020 0.25 0.38 0.51
b .435 .440 .445 11.05 11.18 11.30
b1 .470 .475 .480 11.94 12.07 12.19
b2 .135 .140 .145 3.43 3.56 3.68
b3 .152 .157 .162 3.86 3.99 4.11
D .685 .690 .695 17.40 17.53 17.65
D1 .035 ---- ---- 0.89 ---- ----
E .520 .525 .530 13.20 13.34 13.46
e .120 BSC 3.05 BSC
Note 2
NOTES:
REQUIREMENT 118A
1 June 2004
2
MIL-STD-1835D
REQUIREMENT 119
REQUIREMENT 119
15 August 2000
1
MIL-STD-1835D
Variation
AA AA
Symbol (inches) (millimeters) Notes
Min Nom Max Min Nom Max
A .190 .195 .200 4.83 4.95 5.08
A1 .035 .040 .045 0.89 1.02 1.14
A2 .120 BSC 3.05 BSC
∅b .025 .040 0.64 1.02 1, 2
∅b1 .025 .030 .035 0.64 0.76 0.89 1, 2
D .645 .655 .665 16.38 16.64 16.89
D1 .410 .420 .430 10.41 10.67 10.92
D2 ---- ---- .038 ---- ---- 0.97
e .100 BSC 2.54 BSC
E .410 .415 .420 10.41 10.54 10.67
L .500 .625 .750 12.70 15.88 19.05
L1 .527 .532 .537 13.39 13.51 13.64
∅P .140 .145 .150 3.56 3.68 3.81
Notes 3, 4
Variation
BB BB
Symbol (inches) (millimeters) Notes
Min Nom Max Min Nom Max
A .249 .255 .260 6.32 6.48 6.60
A1 .040 .045 .050 1.02 1.14 1.27
A2 .150 BSC 3.81 BSC
∅b .035 .050 0.89 1.27 1, 2
∅b1 .035 .040 .045 0.89 1.02 1.14 1, 2
D .790 .795 .800 20.07 20.19 20.32
D1 .535 .540 .545 13.59 13.72 13.84
D2 .
e .150 BSC 3.81 BSC
E .535 .540 .545 13.59 13.72 13.84
L .530 .540 .550 13.46 13.72 13.97
L1 .665 .675 .685 16.89 17.15 17.40
∅P .139 .144 .149 3.53 3.66 3.78
Notes 3, 4
REQUIREMENT 119
15 August 2000
2
MIL-STD-1835D
Variation
CC CC
Symbol (inches) (millimeters) Notes
Min Nom Max Min Nom Max
A .240 .255 .270 6.10 6.48 6.86
A1 .035 .040 .045 0.89 1.02 1.14
A2 .140 BSC 3.56 BSC
∅b .055 .070 1.40 1.78 1, 2
∅b1 .055 .060 .065 1.40 1.52 1.65 1, 2
D .815 .825 .835 20.70 20.96 21.21
D1 .530 .540 .550 13.46 13.72 13.97
D2 ---- ---- .092 ---- ---- 2.34
e .200 BSC 5.08 BSC
E .685 .690 .695 17.40 17.53 17.65
L .500 .625 .750 12.70 15.88 19.05
L1 .697 .702 .707 17.70 17.83 17.96
∅P .155 .160 .165 3.94 4.06 4.19
Notes 3, 4
NOTES:
1. Dimension ∅b1 applies to base metal only. Dimension ∅b applies to plated part.
2. Section A-A dimensions apply between .100 inch (2.54 mm) to .150 inches (3.81 mm) from lead tip.
3. Pointed or rounded lead tips are preferred to ease insertion.
4. Methods used for electrical isolation of the terminal feed through shall employ materials that contain a
minimum of 90 percent AL2O3 (ceramic).
5. See table VI for descriptive type designators.
REQUIREMENT 119
15 August 2000
3