Professional Documents
Culture Documents
OPA548
SBOS070C – OCTOBER 1997 – REVISED JUNE 2015
• Power Supplies (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Test Equipment
• Transducer Excitation
• Audio Amplifiers
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPA548
SBOS070C – OCTOBER 1997 – REVISED JUNE 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 9.2 Typical Applications ................................................ 14
2 Applications ........................................................... 1 9.3 System Examples ................................................... 21
3 Description ............................................................. 1 10 Power Supply Recommendations ..................... 23
4 Revision History..................................................... 2 10.1 Output Stage Compensation................................. 23
10.2 Output Protection .................................................. 23
5 Description (continued)......................................... 3
6 Pin Configuration and Functions ......................... 3 11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
7 Specifications......................................................... 5
11.2 Layout Example .................................................... 26
7.1 Absolute Maximum Ratings ...................................... 5
11.3 Power Dissipation ................................................. 26
7.2 ESD Ratings.............................................................. 5
11.4 Thermal Considerations ........................................ 27
7.3 Recommended Operating Conditions....................... 5
11.5 Heat Sinking.......................................................... 28
7.4 Thermal Information ................................................. 5
7.5 Electrical Characteristics........................................... 6 12 Device and Documentation Support ................. 30
12.1 Device Support...................................................... 30
7.6 Typical Characteristics .............................................. 8
12.2 Documentation Support ........................................ 30
8 Detailed Description ............................................ 12
12.3 Community Resources.......................................... 30
8.1 Overview ................................................................. 12
12.4 Trademarks ........................................................... 30
8.2 Functional Block Diagram ....................................... 12
12.5 Electrostatic Discharge Caution ............................ 30
8.3 Feature Description................................................. 12
12.6 Glossary ................................................................ 30
8.4 Device Functional Modes........................................ 13
13 Mechanical, Packaging, and Orderable
9 Application and Implementation ........................ 14
Information ........................................................... 31
9.1 Application Information............................................ 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
5 Description (continued)
The Enable/Status (E/S) pin provides two functions. An input on the pin not only disables the output stage to
effectively disconnect the load, but also reduces the quiescent current to conserve power. The E/S pin output can
be monitored to determine if the OPA548 is in thermal shutdown.
The OPA548 device is available in an industry-standard 7-lead staggered and straight lead TO-220 package, and
a 7-lead DDPAK surface-mount plastic power package. The copper tab allows easy mounting to a heat sink or
circuit board for excellent thermal performance. The device is specified for operation over the extended industrial
temperature range, –40°C to 85°C. A SPICE macromodel is available for design analysis.
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
VIN+ 1 I Noninverting input
VIN- 2 I Inverting input
ILIM 3 I Current limit set
V- 4 I Negative power supply
V+ 5 I Positive power supply
VO 6 O Output
E/S 7 I/O Enable/disable control input, thermal shutdown status output
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Output current See Figure 40
Supply voltage, V+ to V– 60 V
Input voltage (V–) –0.5V (V+) + 0.5 V
Input shutdown voltage V+
Operating temperature –40 125 °C
Junction temperature 150 °C
Tstg Storage temperature –55 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Figure 1. Open-Loop Gain and Phase vs Frequency Figure 2. Input Bias Current vs Temperature
Figure 5. Input Bias Current vs Common-Mode Voltage Figure 6. Quiescent Current vs Temperature
Figure 9. Voltage Noise Density vs Frequency Figure 10. Open-loop Gain, Common-Mode Rejection,
and Power-Supply Rejection vs Temperature
Figure 11. Gain-Bandwidth Product and Slew Rate vs Figure 12. Total Harmonic Distortion+Noise vs Frequency
Temperature
Figure 13. Output Voltage Swing vs Output Current Figure 14. Output Voltage Swing vs Temperature
Figure 15. Maximum Output Voltage Swing vs Frequency Figure 16. Output Leakage Current vs Applied Output
Voltage
Figure 17. Offset Voltage Production Distribution Figure 18. Offset Voltage Drift Production Distribution
Figure 19. Small-Signal Overshoot vs Load Capacitance Figure 20. Large-Signal Step Response
Figure 21. Small-Signal Step Response Figure 22. Small-Signal Step Response
8 Detailed Description
8.1 Overview
The OPA548 device uses a PNP input stage (resulting in negative bias currents at each input) without input bias
current compensation so matched resistances on the inputs will reduce errors. After the main voltage gain stage
is the high current output stage with temperature compensated class A/B biasing to reduce crossover distortion.
Local feedback in the output stage may require additional compensation for highly reactive loads (see Output
Stage Compensation).
V+
V-IN
Biasing
V+IN Current Limiting ILIM
Enable/Disable
Alarms
V-
E/S
Figure 23. Output Disable With a Single Supply Figure 24. Output Disable With Dual Supplies
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.2.1.2.4 Safe-Operating-Area
Plotting the load on the Safe-Operating-Area (SOA) curve allows the safety of the application to be assessed.
Figure 40 depicts the 4-Ω load on the curve. With a resistive load, maximum dissipation occurs at an output
voltage one-half of the supply voltage, in this case 7.5 V and 1.875 A for 22.5 W.
Consideration should be given to the condition of a shorted output. In this application this is a stress of 15 V at
2.5 A on the output stage, or 37.5 W which is just within the 50-W SOA of the OPA548. How long the circuit can
withstand a short to ground will be determined by the size of the heatsink. Ultimately the thermal shutdown will
activate providing short circuit protection, although even this is not recommended as a continuous condition.
Figure 28. Thermal Shutdown Status With a Single- Figure 29. Thermal Shutdown Status With Dual-
Supply Supplies
Figure 37. Output Disable and Thermal Shutdown Figure 38. Motor Drive Circuit
Status With a Single Supply
Figure 39. Output Disable and Thermal Shutdown Status With Dual Supplies
11 Layout
Figure 40. 4-Ω Load Plotted on OPA548 SOA for this Application
The safe output current decreases as VS – VO increases. Output short circuits are a very demanding case for
SOA. A short-circuit to ground forces the full power-supply voltage (V+ or V–) across the conducting transistor.
Increasing the case temperature reduces the safe output current that can be tolerated without activating the
thermal shutdown circuit of the OPA548. For further insight on SOA, consult Application Bulletin SBOA022.
DDPAK or TO-220
RθJA= 65°C/W (no heat sink)
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
(1) For improved thermal performance, increase footprint area. See Figure 44.
(2) Mean dimensions in inches. Refer to the mechanical drawings or www.ti.com for tolerances and detailed package
drawings.
www.ti.com 4-Mar-2019
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA548F/500 ACTIVE DDPAK/ KTW 7 500 Green (RoHS CU SN | Call TI Level-2-260C-1 YEAR -40 to 85 OPA548F
TO-263 & no Sb/Br)
OPA548F/500G3 ACTIVE DDPAK/ KTW 7 500 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 85 OPA548F
TO-263 & no Sb/Br)
OPA548FKTWT ACTIVE DDPAK/ KTW 7 250 Green (RoHS CU SN | Call TI Level-2-260C-1 YEAR -40 to 85 OPA548F
TO-263 & no Sb/Br)
OPA548FKTWTG3 ACTIVE DDPAK/ KTW 7 250 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 85 OPA548F
TO-263 & no Sb/Br)
OPA548T ACTIVE TO-220 KVT 7 50 Green (RoHS CU SN | Call TI N / A for Pkg Type -40 to 85 OPA548T
& no Sb/Br)
OPA548T-1 ACTIVE TO-220 KC 7 50 Green (RoHS CU SN | Call TI N / A for Pkg Type -40 to 85 OPA548T
& no Sb/Br)
OPA548T-1G3 ACTIVE TO-220 KC 7 50 Green (RoHS CU SN N / A for Pkg Type -40 to 85 OPA548T
& no Sb/Br)
OPA548TG3 ACTIVE TO-220 KVT 7 50 Green (RoHS CU SN N / A for Pkg Type -40 to 85 OPA548T
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 4-Mar-2019
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2017
Pack Materials-Page 2
MECHANICAL DATA
0.156 (3,96)
0.420 (10,67) DIA 0.185 (4,70)
0.146 (3,71)
0.380 (9,65) 0.175 (4,46)
0.113 (2,87) 0.055 (1,40)
0.103 (2,62) 0.045 (1,14)
0.147 (3,73)
0.137 (3,48)
0.335 (8,51)
0.325 (8,25)
1.020 (25,91)
1.000 (25,40)
1 7
0.125 (3,18)
(see Note C)
4040251 / B 01/95
0.183 (4,65)
0.170 (4,32)
4201284/A 08/01
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated