Welcome to the January 2006 digital edition of Printed Circuit Design & Manufacture.

To enter the digital issue, please click anywhere on this page.

Endorsed by pcdandm.com JANUARY 2006

PLUS:
2006
BUYERS
GUIDE!

The Principles of PCB Design

RISING SUN:
The Thriving
Board Shops of JAPAN

SPECIAL:
Productronica Review
 HAS YOUR PCB SOLUTION REACHED
THE LIMIT OF ITS CAPABILITIES?

INTEGRATED SYSTEM DESIGN + DESIGN FOR MANUFACTURING + ELECTRONIC SYSTEM LEVEL DESIGN + FUNCTIONAL VERIFICATION

Expedition Series As IC/FPGA complexities increase with multi-gigabit

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passive and HDI/microvia capabilities. To find out more, go to mentor.com/techpapers or

call us at 800.547.3000.

©2005 Mentor Graphics Corporation. All Rights Reserved. Mentor Graphics is a registered trademark of Mentor Graphics Corporation.
 Endorsed by pcdandm.com JANUARY 2006

PLUS:
2006
BUYERS
GUIDE!

The Principles of PCB Design

RISING SUN:
The Thriving
Board Shops of JAPAN

SPECIAL:
Productronica Review
 Lead-Free Technology.
Yes We Can.

The transition to lead-free processing is more than just a movement,

it’s a reality. And MacDermid Electronics Solutions has you completely
covered. From oxide to final finish, from copper plating to interconnect, our
technologies are already used to produce millions of lead-free circuit
boards every day, enabling you to drop in any of our proven solutions
right now, without having to worry about performance later.

When you want to be ahead of the curve in lead-free processing, count on

the company that says "Yes We Can." MacDermid.

Metallization • Circuit Formation • Imaging Systems • Final Finishes • Interconnect • Advanced Technologies

245 Freight Street, Waterbury, CT 06702 USA • Telephone: +1 203.575.5700 • www.macdermid.com/electronics

© 2005 MacDermid, Inc. All rights reserved.
 JANUARY 2006 • VOL. 23 • NO. 1

FEATURES
ON THE COVER
School days are here again.
6 SHOW BIZ
Cover artwork by Katherine Haddox
Productronica Recap
Talk of Eastern Europe overshadowed fabrication equipment rollouts.
by MIKE BUETOW

POINT OF VIEW 17 COVER STORY

BACK TO BASICS
4 OUR LINE It’s easy for new PCB designers to be overwhelmed. But organization
Where the grads are.
and education can help you get started right. by SUSY WEBB
Andy Shaughnessy

12 ROI
Make decisions now to set the tempo
for your new year.
Peter Bigelow
14 COUNTDOWN TO LEAD-FREE
How 40 µm was found to be the
maximum acceptable whisker length
for high-rel product.
Joe Smetana and Ron Gedney
22 GLOBAL MARKETS
Japan’s PCB Industry
Japan’s board makers continue to grow – and invest heavily abroad.
by DR. HAYAO NAKAHARA
32 PCD&M ANNUAL BUYERS GUIDE
Looking for laminate? How about a design service bureau? Find the
suppliers, products and services you need in 2006.
32 Buyers Guide – Special Suppliers Section
Contact information for selected industry suppliers.
36 Buyers Guide – Products and Services Section
Quickly look up the specific products and services you seek.

48 NO MYTHS ALLOWED
Why do engineers fear the 90˚ bend?
Do corners really cause reflections?
Dr. Eric Bogatin DEPARTMENTS

8 AROUND 42 AD INDEX 46 PRINTED

THE WORLD CIRCUIT
44 MARKETPLACE
EXCHANGE
10 HAPPENINGS

ONLINE AT www.pcdandm.com
THIS MONTH AT www.circuitsassembly.com
FLEX ASSEMBLY
FLEX MARKETS Installing Flash LEDs on Flex
Nothing like a good price war Recommendations on soldering and bending processes when components
Dominique Numakura are mounted on a flex circuit. by SHEREEN LIM

PB-FREE TRANSITION
Processes and Their Parameters
Although many important aspects required to establish the “ultimate” profile
for wave or reflow soldering have not yet been investigated, there are several
that can be used as a starting point. by MARKUS WALTER

POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & MANUFACTURE, P.O. Box
35646, Tulsa, OK 74153-0646
Two RoHS/WEEE compliance webinars
Get the up to date facts at these live events

The RoHS deadline is approaching — will you be ready? Webinar Session Two
EMA is hosting two webinars on Restriction of Hazardous Substances “The EMA RoHS/WEEE Toolkit for Compliance”
(RoHS) and Waste of Electrical and Electronic Equipment (WEEE). Date: Wednesday, January 25, 2006 • Time: 2:00 PM EST
RoHS and WEEE are both environmental directives mandated by the
Learn why you must not wait until the end of the design cycle to assure
European Union (EU). Non-compliance can prevent businesses from
RoHS compliance and why you must consider RoHS compliance at the
selling or distributing in Europe, and can result in sizeable penalties.
very beginning of the design phase—before component selection. Our
live demonstration will illustrate, step by step, how to execute and
Webinar Session One
implement a compliance plan within the RoHS and WEEE environment.
“RoHS and WEEE - The Facts: What You Need to Know Now”
Alan Diamond, EMA consulting services group manager and Gopakumar
Date: Wednesday, January 18, 2006 • Time: 2:00 PM EST
(Gopu) Achath, EMA RoHS development manager, will be presenting
This Webinar will be presented by Walter Jager, VP of engineering at this Webinar.
Ageus Solutions and chairman of the Canadian Committee on
Environmental Standards for Electronics. Jager is a renowned industry Register for these free events
expert on the RoHS and WEEE directives. He will present an overview Seating is limited, pre-registration required. For more information or
of RoHS and WEEE directives and their impact on the design process. to register visit www.ema-eda.com/toolkit
He will also discuss what effects the RoHS and WEEE directives are
having on the PCB design infrastructure and data management;
achieving compliance of the electronics and mechanicals; how to
design for manufacturability; and managing the RoHS/WEEE impact
on the supply chain.

©2005 EMA Design Automation, Inc. All rights reserved in the U.S. and other countries.
EMA Design Automation and the EMA logo are trademarks of EMA Design Automation.
Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc.
 OUR LINE

Where The www.pcdandm.com

Grads Are
NE inescapable part of the job of editor is opening unso-
EDITORIAL
EDITOR: Andy Shaughnessy, 678-589-8844,
ashaughnessy@upmediagroup.com

ANDY
O licited press releases. Every day I receive up to 100 press
releases in my inbox. Most are fairly unremarkable.
Recently, one announcement caught me by surprise. A cer-
ASSISTANT EDITOR: Tracy Heffner, 678-589-8853,
theffner@upmediagroup.com
EDITORIAL OFFICE: 2018 Powers Ferry Road, Suite 600,
Atlanta, GA 30339
678-589-8800; fax 678-589-8850
SHAUGHNESSY tain industrial zone in China – I won’t mention its name – EDITORIAL REVIEW BOARD: Dr. Eric Bogatin
boasted that its center city was home to 200,000 “experienced (Synergetix), Susy Webb (Suntron), Jack Fisher
(ITC), Kathy Nargi-Toth (Technic), Mark Geise
scientists, engineers, and technical and vocational specialists.” (Zuken)
The area is also home to 13 colleges and “scientific research institutions,” 700 CONTRIBUTING EDITOR: Dr. Hayao Nakahara
training centers and five vocational schools. COLUMNISTS: Peter Bigelow, Dr. Eric Bogatin, Ted
Daywalt, Jeff Jarvis, Jeff Miller, Dominique
If this were a city in the U.S., some of you entrepreneurial types might be planning to Numakura, Abe Riazi
open a plant or an office there as soon as possible. An educated populace living in a low-
rent district (and willing to work for, ahem, competitive wages) is hard to argue with. PRODUCTION
MANAGING EDITOR: Katherine Haddox,
We’ve heard all the stories about India and China graduating hundreds of thou- khaddox@upmediagroup.com
sand more engineers than North America and Europe. So I asked myself: What part of PRODUCTION MANAGER: Javier Longoria,
the U.S. can boast the most educated work force? jlongoria@upmediagroup.com

Let’s settle on a bachelor’s degree as evidence of education, because the U.S. Cen-
SALES
sus Bureau tracks that sort of data by city, county and state. What city in the U.S. has NATIONAL SALES MANAGER: Wes Gifford, 678-589-
the highest concentration of people with a BS or BA? According to the Census 8805, fax 678-589-8850,
wgifford@upmediagroup.com
Bureau’s 2004 data, Seattle has the highest percentage of residents over the age of 25
EXHIBIT SALES MANAGER: Brooke Anglin,
with a bachelor’s degree – 51.3%. Seattle also took the top spot in 2003 with 51.6%. 678-589-8833, fax 678-589-8850,
Seattle nearly doubles the national average: In 2004, 27% of U.S. residents over banglin@upmediagroup.com
SALES ASSOCIATE: Kamden Robb, 678-589-8843,
25 had bachelor’s degrees. Why? One obvious influence is the concentration of high- krobb@upmediagroup.com
tech corporations like Microsoft and Boeing in Seattle. And the presence of the Uni- ASIA SALES (EXCEPT KOREA): Jan Vardaman,
versity of Washington helps to drive up the numbers, although the Census Bureau jvardaman@upmediagroup.com, 512-372-8887,
fax 512-372-8889
data excludes those living in college dorms. KOREA SALES: Young Media Inc., +82 2 2273 4818,
San Francisco came in second with 51%, and third at 49.7% was Raleigh, NC fax +82 2 2273 4866, ymedia@ymedia.co.kr
(the margin of error means it could be a three-way tie). San Francisco and Raleigh PRINT REPRINTS: Joe Basil, FosteReprints,
866-879-9144 ext. 135, fax 219-561-2015,
have traded second and third spots for the past couple of years, and it’s not hard to jbasil@fostereprints.com
see why. Silicon Valley is still home to a number of high-tech companies; even five ELECTRONIC REPRINTS:
pcdm_reprints@upmediagroup.com
years after the dot-com bust, the Valley is home to the largest group of PCD&M sub-
LIST RENTAL: Rubin Response, 847-619-9800,
scribers. And Research Triangle Park is expanding like a pre-Internet San Jose. In fact, fax 847-619-0149
PCB Design Conference East will be held in nearby Durham this year.
Educated people move to Seattle, San Francisco and Raleigh to be near their new CIRCULATION
DIRECTOR OF AUDIENCE DEVELOPMENT: Jennifer Schuler
jobs. Same goes for the cities that came in fourth and fifth: Washington, D.C. (47.7%)
CIRCULATION AND SUBSCRIPTION INQUIRIES/
and Austin (45.1%). ADDRESS CHANGES: jschuler@upmediagroup.com,
But because jobs that demand a degree are often concentrated in cities, the percent- fax 918-496-9465

ages of degreed folks drop precipitously when we look at states instead of cities. Count-
UP MEDIA GROUP, INC.
ed as a state, Washington, D.C. ranked No. 1 in 2004, with 47.7% of its over-25 resi- PRESIDENT: Pete Waddell
dents bearing a college sheepskin. Massachusetts was second, but at 37.4%, followed by MARKETING MANAGER: Ronda Faries, 678-589-8827
Maryland (34.8%), Connecticut (34.6%) and Colorado (33.7%). Washington state rfaries@upmediagroup.com

came in tenth (31.3%), California thirteenth (29.4%) and North Carolina thirty-first.
It’s tough for cities like Seattle or Raleigh to compete with an industrial zone that
boasts 200,000 scientists. The scale is just too great.
Fortunately, when execs are deciding where to open up that next office or facility,
there’s more to the decision-making process than finding the city with the highest concen-
tration of “educated” residents. Some U.S. companies are finding that out the hard way.
We’re already seeing electronics companies pull back offices and resources from overseas
locations. The promise of a cheap, educated labor force hasn’t been all it was cracked up
to be, and problems with quality, communication and hidden costs abounded.
The U.S. can’t match the sheer quantity of college grads and engineers in Asia, but
we can compete on quality. American universities are some of the best in the world;
why else would so many foreign students be enrolled here?
There are plenty of quality graduates living in the U.S. And in the new economy,
quality beats quantity every time.
Printed Circuit Design & Manufacture is distributed without
charge to qualified subscribers. For others, annual Subscrip-
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4 PRINTED CIRCUIT DESIGN & MANUFACTURE JANUARY 2006

 Allows users to annotate any error
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A product of © 2005 DownStream Technologies, LLC. CAM350 and Streams Rule Check www.downstreamtech.com
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DownStream Technologies, LLC. All other trademarks are the property
of their respective owners.
 SHOW BIZ
TALK OF EASTERN EUROPE OVERSHADOWED FABRICATION EQUIPMENT ROLLOUTS
Productronica Recap
It’s remarkable how a region that has been reduced to a shell
of its former self can still turn out the people when the show
comes to town. While Productronica remains the king of
trade shows for all things assembly, it has fallen behind com-
petitive events in Shanghai, Tokyo, Taipei, Seoul and else-
where as the place to see new fabrication equipment. Still, the
Munich exhibition opened in November to strong crowds,
massive booths and general optimism.
Much of the business talk centered on Eastern Europe.
While some opined that the region, in particular Russia, has the
potential to compete with China, others asserted that high infla-
tion, the lack of Western investment and a dearth of large OEMs
would negate any location and logistics advantages. Although
engineers from the region are considered highly competent, and
the cost structure is low, most of the technology is garden vari-
ety single- and double-sided boards, with capabilities for flex
and four-layer boards just coming online. The hot gossip was
the folding of the largest Eastern European PCB maker. Found-
ed as a JV between Videoton and Fuba, VT Circuits (2004 sales:
$13 million) reportedly closed. A better story is that of
Eldos Co., the Poland-based fabricator that has reportedly near-
ly doubled staffing to 105 employees in the past year and which
is now selling to Volvo and other large auto suppliers in Europe.
Turkey seems to have cornered the local market on TV manu-
facturing, with three single-sided board makers of decent size.
Among those companies showing strength is HMS
Höllmüller (www.hms-germany.de), who showed the Com-
Plate G4, a horizontal plating line with contacts on both sides
and that is capable of low current densities (10 ASF com-
bined), which managing director Joe Kresky says does not
stress the system or chemistry. Interestingly, Kresky said a few
customers are considering using the machine for pattern plat-
ing, and even using plated tin as a solder resist (5 µm thick).
HMS has rebounded from the 2001-02 crash, with sales
expected to reach 30 million euros this year, and the firm is
building a factory – its fourth overall – to be opened in June.
Pluritec (www.pluritecindustries.com) debuted a high-
speed modular drill capable of processing panels up to 24.8
x 30.12˝ and with positioning accuracy of 0.0002˝ and
drilling accuracy of +/-0.00059˝. Up to six machines can be
linked side by side. It also launched a 250,000 rpm, four-
spindle double-gantry drill capable of 0.002˝ holes.
Lauffer (www.laufferusa.com) showed a four-opening vacuum
press sized for 24 x 27.5˝ PCBs and capable of operating temper-
atures up to 716˚F, and a high-performance six-opening press, of
which it said units had been sold to Ruwel and Circuit Stampati.
Concoat (www.concoat.co.uk), fresh off a Nov. 14 merg-
er with Chase Corp. (the parent company of Humiseal),
unveiled a UV curable conformal coating and a water-based
cleaner for lead-free. It’s “business as usual” for Concoat’s
sales and distribution, company officials said. Now that it
has finalized the purchase of Concoat, expect Humiseal
(www.humiseal.com) to make a global push.
In a press conference, Isola CEO Ray Sharpe said the
laminate supplier is pushing hard into higher-performance
6 PRINTED CIRCUIT DESIGN & MANUFACTURE
materials. Although those products made up just 8.4% of the
company’s revenues in the third quarter, that figure is trend-
ing up toward the company goal of 25% of revenues within
three years. Isola’s (www.isola-group.com) drive toward Six
Sigma manufacturing has helped cut laminate scrap rates to
about 3.5% from 6% in the past year, and prepreg scrap has
fallen from over 6% to under 4%.
Taiyo America (www.taiyo-america.com) is launching an
LDI soldermask. The company is starting its push into Europe.
Over at Atotech (www.atotech.com), the Berlin-based
chemicals supplier said it foresees use of ENIG as a finish
growing, especially for automotive and backplanes used in
routers and servers. HASL will drop, predicts manager of
electronics marketing Harald Ahnert, but lead-free HAL
won’t gain much share. Currently, immersion silver and
immersion tin are about 5% each of surface area processed,
he said. He expects that will grow to 15 to 20% each. The
company debuted InPulse 2 HF, a horizontal plater for filling
buried microvias and through-holes.
Meanwhile, the transition to lead-free solders for assem-
bly is happening much more slowly than anticipated. One
leading vendor, Kester (www.kester.com), said 30% of the
company’s global production is lead-free alloy, and the firm
expects to reach 50 to 60% this month. Henkel
(www.henkel.com) says sales are currently 80% SnPb and
they expect 30 to 40% to be lead-free by April.
The IPC Solder Products Value Council previewed a
soon-to-be-released report on voiding in lead-free solder
joints. In what is likely to stir some controversy, the Council
(made up of most of the world’s leading solder vendors)
found no correlation between voids and failures.
Fresh off its wildly successful TraceExpert manufacturing
execution system, Valor (www.valor.com) is looking to expand
into manual assembly and box-build. “We want to create mean-
ingful data for customers, and help them turn SPC databases
into knowledge,” Europe president David Bengal told PCD&M.
“We want to create a ‘dashboard’ for the manufacturing man-
ager who sits outside the floor and helps with decision-making
based on real-time and historical data.” Stay tuned for that.
Adeon (www.adeon.nl), the Dutch software vendor, intro-
duced CXInsight, a project and content management system
for electronics designers, fabricators and assemblers. (Adeon is
a longtime distributor for Valor.)
Not seen – yet: Equipment brands made by Chinese
OEMs. However, one president of a major equipment com-
pany told PCD&M he thinks knockoffs of Western SMT
equipment brands would surface soon in North America.
This was Productronica’s 30th year, as illustrated by a
large memorial with pictures of past events. Walking the dimly
lit and eerily quiet exhibit proved a brief but welcome breather
from the bustle of the rest of the show. With Apex on tap next
month, the respite will be all too short. – Mike Buetow
Ed.: For the assembly report please see www.circuits
assembly.com.
JANUARY 2006
New Performance Standards & Unsurpassed Reliability

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The Process for High Performance Materials

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• Patented solvent system
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E-PREP® system with patented solvent swell.
sequential build applications
• Designed for vertical and
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• Compatible with conven-
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systems

Competitive permanganate desmear process
on 170ºC Tg material. Note lack of topography
on hole wall. This condition is not conducive to
copper adhesion or continuity of the copper
deposit.
Electrochemicals E-PREP® Desmear Process • Stable resin etching rate
with patented solvent swell (170ºC Tg material) for ease of process main-
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enhances continuity of the copper deposit as
well as adhesion to the hole wall. cost

www.electrochemicals.com

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 AROUND THE WORLD
Word is Bond
Olin Metals Lab
Wins Quality
Improvement Award
WATERBURY, CT – Olin Metals
Research Laboratories has won a
Connecticut Quality Improvement
Award (CQIA) Partnership’s gold
Innovation Prize for its CopperBond
XTF peelable ED copper foil.
Olin’s 1 micron CopperBond
XTF foil is attached to a 1 oz. rolled
copper carrier with an inorganic
release layer, so that it can be
released even after laminating above
425˚ C (800˚ F). It is principally
applied in flexible and rigid PCBs.
“Our customers can now use
XTF as a possible replacement for
the Semi-Additive Process,” said
Harvey P. Cheskis, manager of spe-
cial products, Olin Somers Thin
Strip. “The low treatment profile
and uniform thin foil results in less
undercutting during etching, so
yields can be higher. And we contin-
ue to see additional benefits of our
rolled copper carrier system in
enhancing product quality.”
Air Products Raises
Some Chemical Prices
LEHIGH VALLEY, PA – Air Products will
raise prices for its entire line of its ACT
specialty chemicals. The percentage
price increase will range from 3 to 7%,
according to specific products. The
chemicals affected are etch residue
removers and photoresist strippers.
Teradyne
Completes Sale
BOSTON – Teradyne Inc. has complet-
ed the sale of its Connection Systems
Division to Amphenol Corp. The
company announced in October that
it had entered into a definitive agree-
ment to sell the division to Amphe-
nol for approximately $390 million
in cash.
8 PRINTED CIRCUIT DESIGN & MANUFACTURE
EDITED BY ANDY SHAUGHNESSY
IT’S AMINO WORLD
Dow Named Specialty Company of the Year
MIDLAND, MI – Dow Corning has been ket potential, proof of success, new mar-
named Specialty Chemicals Company of ket penetration and company visibility.
the Year by market analysts Frost & Sul- Frost & Sullivan said it was impressed
livan. The market analysts highlighted with the chemical company’s ability to
Dow Corning’s ability to drive innova- champion the use of innovative practices
tion, its customer solutions approach, in all aspects of the business. Dow Corn-
success in geographic expansion, and ing seeks to derive approximately 20% of
financial results as areas distinguishing sales from products less than five years
the company. old, and spends roughly 6% of revenues
“We’re proud to be recognized as a on research and development. “We see
leader in the specialty chemicals indus- innovation going far beyond new and
try,” said Stephanie A. Burns, CEO and improved products. We seek to drive
president of Dow Corning. “This award innovation across all areas of our busi-
signifies the hard work, dedication, and ness,” said Burns.
commitment to innovation that is shared Frost & Sullivan also focused on suc-
by all of our employees.” cess in geographic expansion, noting
Dow Corning was selected for the Dow Corning has invested in resources
award based on Frost & Sullivan’s mea- and partnerships to provide customers in
surement criteria, including factors such emerging countries with the same level of
as degree of strategy innovation, techno- support and materials offered in the U.S.
logical innovation and leadership, mar- and Europe.
UPS AND DOWNS
Book-to-Bill: Rigid Up, Flex Down
BANNOCKBURN, IL – The North American rigid board book-to-bill ratio for October
2005 rose to 1.14, while the continent’s flex book-to-bill ratio declined sharply to
1.10. The combined (rigid and flex) industry book-to-bill ratio in October 2005
declined slightly to 1.13. But the combined ratio has become less relevant to analysts,
however, due to the divergence between the rigid PCB and flexible circuit segments of
the industry in growth rates and book-to-bill patterns.
These ratios are based on monthly data collected from PCB producers partici-
pating in IPC’s monthly PCB Statistical Program. The ratios are calculated by divid-
ing the value of orders booked over the past three months by the value of sales billed
during the same period from the companies in IPC’s survey sample. A ratio of more
than 1.00 suggests that current demand is ahead of supply, which indicates probable
near-term growth.
Rigid PCB shipments are down 3.6% and bookings are up 31.5% in October
2005 from October 2004. Year to date, rigid PCB shipments are down 4.6% and
bookings are up 1.5%. Rigid PCB shipments from the survey sample decreased
18.3% from the previous month and rigid bookings decreased 12.8% from the pre-
vious month.
Flexible circuit shipments are up 49.1% and bookings are down 62.7% in Octo-
ber 2005 from October 2004. Year to date, flexible circuits shipments are up 29.9%
and bookings are up 17%. Compared to the previous month, flexible circuit ship-
ments from the survey sample increased 14.7% and flex bookings decreased 77.3%.
For rigid PCBs and flexible circuits combined, industry sales billed (shipments) in
October 2005 increased 8.5% from October 2004, and orders booked decreased
0.4% from October 2004. Year to date, combined industry shipments are up 1.9%
and bookings are up 5.3%. Combined industry shipments for October 2005 are
down 10.2% over the previous month, and bookings are down 35.9% over the pre-
vious month.
JANUARY 2006
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 HAPPENINGS

EVENTS FACES

JANUARY
17-19 Pan Pacific Microelectronics Symposium Michael Sapienti has joined Teledyne Printed Circuit Technolo-
& Tabletop Exhibition gy (Hudson, NH) as director of business development. He has
Big Island of Hawaii held numerous senior sales management positions at
Contact: www.smta.org
Rolm/IBM, Zycon/Hadco, Gold Circuit Global Sales, Endicott
18-20 InterNepcon World Japan Interconnect Technologies, and most recently with Parlex Corp.
Tokyo Big Sight, Japan
Contact: www.nepconworld.jp/english/
Steven W. Richards has been named CFO of TTM Technologies.
24-26 ATW on Fuel Cell Electronics Packaging
Scottsdale, AZ He joined TTM in May 2000 and has served as vice president
Contact: www.imaps.org/fuelcell and treasurer of the company.

FEBRUARY
6-9 DesignCon
Santa Clara Convention Center R. Douglas Norby, CFO of Tessera Technologies, plans to
Santa Clara, CA retire. Norby, 70, will remain in his current role as senior vice
Contact: www.designcon.com
president and CFO until a successor is named. The search for
8-10 IPC Printed Circuits Expo/APEX his successor is currently underway.
Anaheim Convention Center
Anaheim, CA
Contact: www.ipc.org Chuck Quinby has been appointed business
13-17 PCB Foundation Course development manager for conductive prod-
Staffordshire University, UK ucts at InteliCoat Technologies. Quinby has
Contact: www.eda.co.uk/trainPCBFound.html been with InteliCoat for more than 20 years. In
27-March 3 Measurement Science Conference addition to managing the R&D analytical
Anaheim, CA chemistry lab, he has led InteliCoat environ-
Contact: www.msc-conf.com
mental, health and safety initiatives, directed
MARCH

20-23 IMAPS International Conference and Exhibition on quality and ISO programs and helped oversee procurement
Device Packaging of materials and technical manufacturing.
Scottsdale, AZ.
Contact: www.imaps.org/devicepackaging.
22-24 CPCA Show 2006 Gene H. Weiner & Associates has appointed Dr. Alan
Shanghai, China Poskanzer to the position of senior associate of the Danbury, CT
Contact: www.cpca.org.cn/en/ consultancy. Poskanzer, of Poskanzer & Associates, has 20
26-31 PCB DESIGN CONFERENCE WEST years of experience as a technologist evaluating new technolo-
Santa Clara Convention Center gies, including 11 years in academia managing a portfolio of
Santa Clara, CA patented technologies. He holds a Ph.D. in physical chemistry.
Contact: www.pcbwest.com
APRIL

25-27 CICMT 2006: IMAPS/ACerS International Conference

and Exhibition on Ceramic Interconnect and Ceramic
Rohm and Haas Electronic Materials has appointed Robert J.
Microsystems Technologies Ferguson to the position of circuit board technologies gener-
Denver, CO al manager for North America and Europe. Ferguson has
Contact: www.cicmt.org over 20 year’s experience in the circuit board industry and
25-27 KPCA Show 2006 was most recently GM of Circuit Board Technologies North
Pacific Hall, COEX America. Prior to this, he was vice president of sales and
Seoul, Korea marketing for North America for the Shipley’s PCB business.
Contact: www.kpca.or.kr
26-27 Del Mar Electronics Show 2006
Del Mar Fairgrounds San Diego, CA
Contact: delmar@vts.com
IT’S A DEAL
MAY

4-5 Science, Engineering & Technology Congressional

Visits Day
Washington, D.C.
Uyemura International Corp. (UIC) and Umicore-Galvanotech-
Contact: www.ieeeusa.com nik GMBH (GT) have signed a new multiyear sales agreement
10-11 NEPCON East/Assembly East covering the North American market. The agreement gives
Boston, MA UIC exclusive sales rights to GT’s electroplating products in
Contact: www.nepconeast.com the U.S. and Canadian markets and expands the agreement
15-18 International Conference and Exhibition to allow non-exclusive coverage in Mexico. UIC also signed
on High Temperature Electronics Matrix USA to sell sell Uyemura, UmicoreGT and MEC
Santa Fe, NM chemistries to Matrix’s customer base in California, Utah,
Contact: www.imaps.org/hitec
New Mexico, Nevada, Arizona, Oregon and Washington,
JUNE

6-8 Military, Aerospace, Space and Homeland Security along with Baja California and British Columbia. UIC’s sales
(MASH): Packaging Issues and Applications and service group will support Matrix’s efforts and customers.
Washington, D.C.
Contact: www.imaps.org/mash
Service bureau CADParts & Consulting has opened a facility
in Marlboro, NJ. The remodeled 2,200 foot2 facility allows the
company to offer library and design services as well as new
services, including circuit design, in-circuit testing, function-
al testing and RoHS compliancy services.

10 PRINTED CIRCUIT DESIGN & MANUFACTURE JANUARY 2006

 Scotchgard is ™

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air pockets, cracking and flaking. It’s
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© 3M 2004
 ROI
What Kind of Year Will 2006 Be For You?
Decisions made today will set the tempo for your new year.
HAPPY NEW YEAR! Now that the party’s
over, the big question is this: What are
you going to do differently, and better,
this year?
And how will you commit your time,
talent and treasure to outperform the
industry, if not your own personal best?
PETER If you desire reaching significantly high-
BIGELOW er levels of performance or successfully
embarking in a bold, new direction, then
it’s time to figure out what you want to
accomplish and how you are going to accomplish it. Here
are a few suggestions to get you started.
Planning. It sounds trite and easy, but it has been
proven over and over that success begins with a plan. In its
most basic form planning is simply thinking through what
you want to do with your available
resources. As with any “to do” list, it is
essential to make sure that you are reach-
ing for an attainable goal, that you have
an idea of the cost in both dollars and
man-hours, and you know how you are
going to measure success or failure.
Sit down with your staff and/or advi-
sors and talk through what you want your company to
accomplish this year and what resources you think you will
need. Write down in the simplest terms what you want to
get done. If your plan is to, say, increase sales by 30% don’t
spend 50 pages saying so. Just write “Objective 1 is to
increase sales by 30%.”
Even if you are a one-man operation, you need to plan
the allocation of your resources (especially time) for what is
important. This means that if your first objective is to
increase sales by 30%, you need to elaborate on how you
are going to make this happen. Again, when you commit
the plan to paper keep it simple. Equally, if you want to
achieve Objective 1 then simply say, for example, you will
“increase sales 30% by adding a salesperson/representative
for a new geographic territory/market” or whatever.
Networking. It is easy to get stuck in a rut, whether it’s
sitting behind a desk or just seeing the same people every
day. Networking is both the prevention and the cure for
being stuck in a rut. Networking means making a commit-
ment to improve your business by meeting new people. It is
making a commitment to share with others and find the next
good idea, outstanding employee or cutting-edge technology.
Most importantly, networking is about being positive.
No matter where you are located, there are local and
regional organizations that can offer a wealth of informa-
tion and ideas to improve your business. Regional organiza-
12 PRINTED CIRCUIT DESIGN & MANUFACTURE
tions focus on everything from family business issues to
technology development to workforce training and develop-
ment. Local organizations such as the Chamber of Com-
merce or regional manufacturing and technology develop-
ment organizations provide great venues for discussing ways
to reduce generic costs such as health care, business insur-
ance or taxes. Local networking can also be a great source
for locating talented employees.
Industry-specific networking is another way to grow.
Local chapters of IPC’s Designers Council and the SMTA
attract local attendees specifically from our industry.
Communication. No matter how well you think you
communicate, there is always room for improvement! Once
you have prepared a plan and stepped out of your comfort
zone to network with new people, communication is essen-
tial. The most important people to communicate with are
It’s time to figure out
WHAT YOU WANT TO ACCOMPLISH
and how you want to accomplish it.
your employees and your advisors, but remember that what
you communicate to each might not be the same message,
presented in the same way. Equally, communication is not a
one-time affair, but must be consistent and supported in
word and deed.
Action. One of the best employers I ever worked for
used to send me articles that were interesting or relayed a
message to me. One article basically said that it does not
matter how much you know if you do not take that knowl-
edge, communicate it and then take action with or because
of it. His message was clear. Taking action, however,
requires a plan – one that is based on knowing what is
going on within the industry, including what will be done
by whom, how and with what resources. The plan needs to
be communicated to those who might need to approve it,
such as investors, banks, advisory or corporate boards. The
plan also needs to be communicated to those who will
implement it – your employees.
So here we are beginning 2006 with new opportunities
to prosper, grow and excel on a personal and corporate
level. It is time to plan, network, communicate and take
action to achieve your goals. Let’s get going. PCD&M
PETER BIGELOW is president and CEO of IMI
(www.imipcb.com). He can be reached at
pbigelow@imipcb.com.
JANUARY 2006
Turning the Industry on its Side
Enter in the Promotional Code : “Sideways”
to Receive 20% off your next
Production order of 50 pcs or more!

www.eFabPCB.com
Instant Quote, Instant Order, Instant Satisfaction
 COUNTDOWN TO LEAD-FREE
Tin Whisker Management Guidelines, Part 2
How 40 µm was found to be the maximum acceptable whisker length for high-rel product.
JOE SMETANA SAMPLE SIZE. To ensure a consistent
AND plating process, testing should be done
RON GEDNEY on three different plating finish lots, with
different date codes and plated at least
one week apart, or plated on different plating lines. The final
sample sizes recommended were a tradeoff to accommodate
user needs without being an excessive burden to suppliers.
TABLE 3 (online) shows iNEMI recommendations for
number of samples and sample preparation. The proposed
JESD 201 modifies the sample sizes slightly.
Preconditioning. Preconditioning samples prior to test con-
dition exposure helps simulate actual use conditions. Three dif-
ferent preconditions are recommended. The two reflow condi-
tions (described below) require an initial four weeks at ambient.
1. No conditioning: Components sit for a minimum of four
weeks at room temperature. Four weeks permits the effect
of intermetallic growth (such as Cu6Sn5) to be seen.
Intermetallic thickness grows at half power (square root)
of time, thus the percentage increase in the thickness of
the intermetallic is:
■ 1-2 wks., the increase is 41%.
■ 2-3 wks., the increase is 20%.
■ 3-4 wks., the increase is 17%.
Although growth will continue beyond four weeks, the
intermetallic growth is substantial enough after a month
to see the effect during subsequent test conditions.
2. Reflow simulation at 215˚C, which is representative of
SnPb assembly.
3. Reflow at 255˚C, which represents components assem-
bled with lead-free SnAgCu solder.
Whisker Length
Because testing for whisker growth is critical, it is necessary
to determine what whisker length can be tolerated. To
determine end-item requirements, a number of questions
need to be answered:
1. What is the maximum whisker length we can permit
without a short?
2. What happens if a tin whisker breaks off? Where does it go?
3. What whisker length can be permitted without an
adverse affect on RF/high-speed performance?
4. What are the sources of error in testing, and what safety
factor is required to accommodate for these errors in set-
ting final length requirements?
The iNEMI Tin Whisker User Group took these questions
into consideration in developing recommendations. In the worst
case, which assumes that two whiskers grow directly toward
each other from either side, the maximum allowable whisker
length is equal to half the distance from one lead to another, to
a lead on another component, or 1x the distance to the nearest
trace on the PCB. TABLE 4 (online) provides an example of the
14 PRINTED CIRCUIT DESIGN & MANUFACTURE
analysis of mechanical spacing of typical components.
With regard to electrical analysis, the effect of whisker
length on circuit performance was modeled by Alcatel’s
microwave group. The negative effect starts at 6 GHz RF or
higher or roughly trise of 58 psec (or less in a digital circuit).
To simplify the test requirements for whisker growth, it was
determined that if the maximum whisker length could be
kept below 75 µm, the effect was negligible. The maximum
frequency analyzed to arrive at this limit was 20 GHz.
The iNEMI team determined that 40 µm was the maxi-
mum acceptable whisker length for high reliability (typically
class 2) applications.
Industry discussions have led to a minor adjustment of
iNEMI’s original recommendation. The maximum length in the
JESD 201 draft remains 40 µm for the two isothermal condi-
tions, but has been increased to 45 µm for the thermal cycling
condition where, according to data, saturation is expected.
Ongoing Monitoring
Manufacturers need to establish a system to periodically
monitor processes for whisker generation.
■ A representative sample of components should be taken
for each designated time period (at least monthly).
■ Storage conditions for these components should include a
relative humidity of 60% or greater.
■ Samples should be inspected for whiskers six months from
the date of plating.
■ Results should be compared to baseline measurements. If
exceeded, the manufacturer should take appropriate cor-
rective actions.
Tin whiskers can potentially have a major impact on the
reliability of electronics systems. Properly managed, the
exposure can be minimized and the result will, hopefully, be
transparent to the end-user. One JEDEC specification has
been issued, and two more nearing release will provide
much needed guidance. Meanwhile, the iNEMI recommen-
dations can serve as interim guidelines. PCD&M
Ed.: Part 1 was published in the December issue. Both parts
and all figures are available online at www.pcdandm.com.
JOE SMETANA is principal engineer, advanced technology,
Alcatel (www.alcatel.com); joseph.smetana@alcatel.com.
RON GEDNEY is a consultant to iNEMI lead-free and tin
whisker projects; rgedney@nemi.org.
BIBLIOGRAPHY
1. G.T. Gaylon and Ron Gedney, “Avoiding Tin Whisker Reliability Prob-
lems,” Circuits Assembly, August 2004.
2. Joe Smetana, “Minimizing Tin Whiskers,” SMT, August 2005.
All iNEMI documents can be found at inemi.org/cms/projects/ese/
tin_whisker_activities.html.
JANUARY 2006
“I'VE NEVER FOUND A DESIGN PROBLEM
I COULDN'T SOLVE WITH ALLEGRO”
“WITH CADENCE ALLEGRO PCB DESIGN TOOLS AND EMA CUSTOMER SUPPORT,
I HAVE AN UNBEATABLE PCB DESIGN SOLUTION”
Paul Frechette - Principal
Number Nine Design, Seymour, Connecticut

Solving a wide range of PCB design problems

The goal of Number Nine Design is to be a leader in the printed circuit board design arena. They have extensive
knowledge of transmission line theory, sequential routing, line termination techniques, line length control,
impedance calculation and control, shielding, and cross talk avoidance. Number Nine Design's customers rely on
them for a wide range of PCB designs from high speed communications and super computers to the toy market.
Allegro is the tool of choice
Number Nine Design has tackled many types of design problems, and in all cases their choice is the Cadence®
Allegro® suite of PCB design tools. The Allegro platform provides industry-leading design entry, PCB editing,
PCB routing, and constraint management. Frechette has been using Allegro since the very first release.
Why? “Allegro gives PCB designers like me the power and scalability they need to solve any design problem,”
said Frechette.
Find out more
For more information about how the Allegro suite of PCB design tools can solve your design challenges, log-on to
www.ema-eda.com/AllegroUsers or call EMA Design Automation, a Cadence Solutions Provider, at 1-877-EMA-EDA1.
Tell us your story
Are you using Allegro tools to solve your PCB design challenges? Log on to www.ema-eda.com/AllegroUsers and
let us know.

©2004 EMA Design Automation, Inc. All rights reserved in the U.S. and other countries.
Cadence and Allegro, are registered trademarks of Cadence Design Systems, Inc.
All other marks are the property of their respective owners.
 In the electronics design industry,
if you’re not eating someone’s lunch
they’re eating yours…

These days, there’s a whole lot more involved in PCB design than “connect-the- CONFERENCE:
dots.” Even if you’re not directly involved in the marketing of your company’s prod- March 26-31, 2006
ucts, you sure need to do your part to get them to market ahead of the competi- EXHIBITION:
tion. In business, someone else’s fork is always raised and ready, and the three- March 28-29, 2006
second-rule only applies when you’re the victor. Think of attending PCB Design
Santa Clara Convention Center
Conference West 2006 as a sublimely prepared seven-course meal for your career.
Santa Clara, CA
Register online now to attend the West Coast’s premier conference and exhibition
for PCB engineering, design and manufacture professionals! www.pcbwest.com

GOLD SPONSOR SILVER SPONSOR MEDIA SPONSORS

 Conference: March 26-31, 2006
Education, Inspiration and Solutions
Join us in Santa Clara, CA, in March 2006 for the 15th anniversary PCB Design
Exhibition: March 28-29, 2006 Conference West—the premier West Coast conference and exhibition for PCB
engineering, design and manufacture professionals.

Exhibition Hours: To celebrate PCB West’s 15th anniversary, we’ve put together a
targeted PCB design training and networking experience that’s
March 28 — 10 am - 6:30 pm superior to any other in the PCB industry. This year’s conference
March 29 — 10 am - 4 pm theme—Education, Inspiration and Solutions—says it all. No
other conferences deliver on that promise like the PCB Design
Conferences. If you design PCBs or related technologies—and
Location: Santa Clara Convention especially if you can only attend one conference a year—choose
the conference that truly focuses on your personal goals and professional needs:
Center in Santa Clara, CA PCB West 2006.

WHERE YOU AND YOUR COLLEAGUES OBTAIN QUALITY PCB DESIGN EDUCATION!
Gold Sponsor Every designer’s dilemma is how to become a better and more confident design-
er without making costly design mistakes or overlooking technological opportu-
nities. At PCB West 2006, we’ve tailored our conference program to match your
needs. Create your own personlized educational experience by choosing from:
Silver Sponsor • An unparalleled Professional Development Certificate program of two 2-day
Design Excellence Curriculum courses and 10 full-day tutorials—all taught by
industry experts (see pages 6-7).
• A diverse and targeted Technical Conference program of more than 40 short
courses ranging from one-hour lectures to half-day seminars (see pages 8-11).
• A selection of FREE classes and Exhibitor Showcase presentations on FREE
Tuesday (see page 9).

Media Sponsors WHERE TOP DESIGNERS, MANAGERS AND EXHIBITORS GET INSPIRED!
What if your skills and ideas could save your company time and money on a future
product? PCB West 2006 is packed full of time-saving and cost-cutting ideas,
design and manufacture strategies, and new technologies that will continue to
inspire you for months after attending this year’s conference.

WHERE THE PCB INDUSTRY’S MOVERS AND SHAKERS FIND SOLUTIONS!

Thousands of PCB engineering, design and manufacture professonals attend
PCB West each year to take classes, network with their peers, meet with
Contents
Special Events . . . . . . . . . . . . . . . . . . . . . .3
exhibitors, and find technological solutions for a wide range of projects and end
products. You and your colleagues should be there, too—especially if you engi-
neer/design PCBs, or you recommend/purchase PCB design or manufacturing
Conference-at-a-Glance . . . . . . . . . . . . .4-5
products and services for your company. See you there!
Professional Development . . . . . . . . . . .6-7
Technical Conference . . . . . . . . . . . . .8-11
Speaker Biographies . . . . . . . . . . . . . . . .12
Hotel and Travel . . . . . . . . . . . . . . . . . . .13
Registration Packages . . . . . . . . . . . . . .14
Registration Instructions . . . . . . . . . . . .14
Conference Chair
Registration Form . . . . . . . . . . . . . . . . . .15
PCB Design Conferences

2 P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
 Special Events
Sunday, March 26 Sponsored by EMA Design Automation
Casino Night
Sponsored by Printed Circuit Design & Manufacture 7 - 11 pm in the Santa Clara
Professional Development Attendee Ballroom at the Hyatt
Regency
Welcome Luncheon
Viva Las Vegas! If you love to gam-
12 - 1 pm in the Cypress Room ble—especially with someone else’s
Sunday Professional Development Certificate Program attendees will “funny money”—you’ll no doubt be excited
enjoy a complimentary plated luncheon—complete with dessert and about our professionally
coffee—while conversing and networking with their peers and speak- run casino event!
ers. Plus, a special surprise is sure to put a smile on every attendee’s Sponsored by EMA Design
face! Exhibits-only attendees, Automation, Casino Night
will feature craps, roulette,
Monday, March 27 blackjack and a special
Texas Hold ‘Em
Sponsored by Printed Circuit Design & Manufacture Tournament — plus food,
drinks and live music sup-
Trivia Night plied by the Porch Dawgs
7 - 9 pm in the Hyatt Regency Lobby Bar (pictured here from PCB
After dinner, power down your laptop, turn off the TV and head to the West 2005).
Lobby Bar for Trivia Night! Whether you’re a nut about trivia or you
just enjoy the thrill of competition, join your fellow PCB West atten-
dees and put your knowledge of general esoteria to the test by joining Wednesday, March 29
or forming a trivia team. Winning teams will receive fun and whacky
prizes. The event will be hosted by PCD&M Editor Andy Shaughnessy. General Session
8 - 9 am in Ballrooms E & F
Tuesday, March 28 See the description for the General Session on Tuesday for details.

General Session Cyber Café

8-9 am in Ballrooms E & F
Professional Development and Technical Conference attendees,
speakers and exhibitors are invited to attend Tuesday’s General
Session, where you will enjoy a free continental breakfast as you learn
about the day’s schedule, watch an entertaining program that will be
announced at a later date, network with your peers and more. During
the session, UP Media Group will present special awards to the show’s
15-year exhibitors. Plus, a door prize will be awarded to one lucky
Tuesday General Session attendee!
FREE Tuesday!
9 am - 6:30 pm in the Convention Center & Exhibit Hall
FREE Tuesday will feature a program of FREE technical sessions and
Exhibitor Showcase presentations PLUS a distraction-free afternoon
for spending quality time on the show floor. See page 9 and watch the
PCB West Web site for additional announcements!
Cyber Café
10 am - 6:30 pm in the Exhibit Hall
Maximize the time you have to visit the show
floor and meet with exhibitors by checking
your e-mail in the conveniently located Cyber
Café.
15th Anniversary Opening Night
Reception
5 - 6:30 pm in the Exhibit Hall
The more the merrier! Celebrate the 15th anniversary of PCB West on
the show floor at the Opening Night Reception. You’ll be able to check
out the exhibits and network with your colleagues in a relaxed atmos-
phere—complete with complimentary hors d’oeuvres and beverages
served in collectible glasses.
10 am - 4 pm in the Exhibit Hall
Maximize the time you have to visit the show floor and meet with
exhibitors by checking your e-mail in the conveniently located Cyber
Café
Year of the Designer
Reception
5:30 - 6:30 pm by the pool at the
Hyatt Regency
In October 2005, UP Media Group officially
designated 2006 to be the Year of the
Designer. As part of this yearlong celebra-
tion that will honor PCB designers, the Year
of the Designer Reception at PCB West will
provide you with hors d’oeuvres and drinks
as you celebrate your professional and socialize with your fellow
designers. For more information on Year of the Designer and upcom-
ing events, visit www.yearofthedesigner.com.
Thursday, March 30
Dinner With Strangers
6 pm near the Hyatt Regency Lobby Escalator
Whether you’re attending the show on your own—or you just don’t
want to eat alone—take the opportunity to get to know your peers and
enjoy a great meal at the same time! Simply meet up with other atten-
dees at 6 pm in the lobby near the escalator. Introduce yourselves, pair
up or form groups for dinner. It’s a great way to expand your horizons
and make new industry friends! The hotel staff can recommend a
great Santa Clara or San Jose restaurant, help you with any necessary
reservations, and even advise you on transportation.

S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 ! 3
Conference-at-a-Glance

Sunday, March 26 Monday, March 27 Tuesday, March 28

8 am - 10 am 8 am - 4 pm 8 am - 6 pm
Registration Registration Registration

9 am - 5 pm 9 am - 5 pm 8 am - 9 am
Professional Development Professional Development General Session
Certificate Program courses Certificate Program courses
DEC 1 - High-Speed Design—Signal Integrity, DEC 1 continued… 8 am - 11 pm
EMI and Crosstalk DEC 2 continued… FREE TUESDAY!
DEC 2 - HDI/Microvias and Embedded Passives Enjoy FREE sessions, Exhibitor Showcase
Design Challenges 9 am - 11 am presentations, and more—PLUS spend
T1 - PCB Design For Real-World EMI Control: Technical Conference courses your free afternoon on the show floor!
EMC is NOT Magic! 010 - Complete EMC Analysis the UMR Way See page 9 plus visit the show Web site
T2 - Advanced IC Packaging Technologies 011 - Mixed Signal Board Design for future FREE Tuesday announcements.
T3 - PCB Design 101 012 - Skin Effect on PCB Traces
013 - Vias and Their Effects on High-Speed 9 am - 11 am
T4 - The ABCs of Grounding, Including
Digital Signals FREE Workshops
Analog/Digital Planes
030 Lead-Free Panel: The Designer Toolkit for
T5 - Signal Integrity Issues in PCB Design
11 am - 1:30 pm RoHS and WEEE Compliance
12 - 1 pm Lunch break for Technical 031 - Land Pattern Creation “Wayne’s Way”
Professional Development Conference attendees
10 am - 11 am
Attendee Welcome
12 pm - 1 pm FREE Lectures
Luncheon
Professional Development 032 - Circuit Routing for Complex Profiles
attendee plated lunch 033 - Using Network Analyzers to Measure
PCBs at GHz Frequencies
1:30 pm - 5 pm 034 - Next-Generation M/ECAD Collaboration
Technical Conference courses 035 - Matching Router Technology With Design
020 - Wayne’s Route Challenges
021 - The Lead-Free Mandate and the
Production Line 10 am - 6:30 pm
022 - EMI and Crosstalk: Theory, Simulation Exhibits Open
and Control Cyber Café
023 - Designing for Asian Fabrication
11 am - 1 pm
3 pm - 4 pm Lunch Break on show floor
Technical Conference courses
024 - The Impact of Lead-Free on Fabrication 1 pm - 1:30 pm
025 - Decoupling Capicitor Design for High- FREE Paper Session
Speed PCBs 040 - PCI Signaling and Differential Coupling
026 - Effective Library and Design Data
2 pm - 2:30 pm
Management
FREE Paper Session
027 - Efficient RF Design Workflows
041 - Digital Legend Printing
7 pm - 9 pm
3 pm - 5 pm
Trivia Night
FREE Exhibitor Showcase pre-
sentations
Final schedule to be announced on the show
Web site and in the official show guide

5 pm - 6:30 pm
15th Anniversary Opening Night
Reception

7 pm - 11 pm
Casino Night

4 P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
 Conference-at-a-Glance

Wednesday, March 29 Thursday, March 30 Friday, March 31

8 am - 4 pm 8 am - 3 pm 8 am - 10 am
Registration Registration Registration

8 am - 9 am
General Session
9 am - 12 pm
Technical Conference courses
050 - Designing With BGA Packages
051 - Impedance Analysis and Specifications
052 - Fundamentals of DFT
10 am - 4 pm
Exhibits Open
Cyber Café
11 am - 12 pm
Technical Conference courses
053 - FPGA I/O design
054 - The “Ground” Myth
12 pm - 1:30 pm
Lunch Break on show floor
1:30 pm - 5 pm
Technical Conference courses
060 - Advanced HDI Engineering
061 - Designing With Your “Thumbs”
062 - Introduction to Fullwave SI and EMC
Modeling
3 pm - 5 pm
Technical Conference courses
063 - E/CIT and Embedded Passives
064 - Alternative Interconnect and Packaging
065 - Grounding to Control Noise and EMI
066 - Constraints-Based High-Speed PCB
Design
9 am - 11 am 9 am - 5 pm
Technical Conference courses Professional Development
070 - Current Flow in PCB Traces Certificate Program courses
071 - Introduction to Embedded Passives T6 - Placement and Routing of Complex PCBs
T7 - Get Flexible: A Flex Circuits Investigation
9 am - 12 pm T8 - DFM For Lead-Free Manufacturing
Technical Conference courses T9 - Electronics Principles and Signal Integrity
072 - Best Practices in Implementing Lead- T10 - Everything You Need to Know About
Free Assembly, Part 1 Bypassing, Including BGAs
073 - Materials for Lead-Free, High-Speed and
High-Freqency Applications 12 - 1 pm
Professional Development
11 am - 12 pm attendee plated lunch
Technical Conference courses
074 - DFM, Test and Assembly Strategies
11 am - 1:30 pm
Lunch on your own
1:30 - 5 pm
Technical Conference courses
080 - High-Speed Clock Control
081 - Embedded Passives in PCBs Now!
082 - RF and Microwave PCB Design and Base
Materials
083 - Best Practices in Implementing Lead-
Free Assembly, Part 2
084 - Through-Hole in HDI Conversions
6 pm
Dinner With Strangers

5:30 pm - 6:30 pm
Year of the Designer Reception
New for 2006!
FREE TUESDAY!
Conference and Expo-only attendees are
invited to attend Tuesday sessions for
FREE! PLUS, visit the show floor for a
program of FREE Exhibitor Showcase
presentations in the afternoon. Finally, cap
off an exciting FREE day at PCB West by
networking with your peers at the 15th
Anniversary Opening Night Reception,
followed by the
Casino Night Party!

S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 ! 5
Professional Development
Professional Development Certificate Program
Twelve courses are available in this year’s Professional Development Certificate Program—two 2-day Design Excellence Curriculum courses and
nine 1-day Tutorials. These technical courses are taught by industry expers who will provide you with the technology, theory, application and best-
practice information that you need to achieve professional growth and development. You’ll receive a certificate of completion for each Professional
Development course that you attend and complete. Note: Professional Development courses are not included on the Technical Conference
Proceedings CD-ROM.
TWO-DAY DEC COURSES
SUN MAR 26 and MON MAR 27 • 9 AM - 5 PM
DEC 1 - High-Speed
Design—Signal Integrity,
EMI and Crosstalk
Speaker: Rick Hartley, L-3
Communication, Avionics
Systems
Attendees: PCB designers, engi-
neers and managers interested
in learning and applying high-speed concepts to
electronic products.
Updated for PCB West! This two-day course is a
compete introduction to the high-speed design
concepts needed to ensure success with designs
utilizing the fast and ultra-fast ICs of today and
tomorrow. In today’s printed circuit boards, it’s not
so much the rate at which the circuit is clocked, but
the output edge rate (rise/fall time) of ICs that
causes signal integrity problems, EMI and
crosstalk. The course will cover circuit parasitics,
high-frequency currents, signal and wave propaga-
tion, propagation time and velocity, control of sig-
nal crosstalk, power distribution and decoupling,
types of EMI, source control of EMI, control of EMI
coupling, split planes and plane islands, PCB layer
stackups, filters and filtering techniques, system
RF shielding and grounding, metal vs. plastic enclo-
sures, slots in enclosures, and conducted EMI fil-
ters. Attendees will learn about interfacing with the
fabricator, PCB fabrication methods and concerns,
PCB fabrication drawings, impedance testing, test
coupons and cost differential of controlled imped-
ance PCBs.
DEC 2 - HDI/Microvias and
Embedded Passives Design
Challenges
Speakers: Happy Holden,
Asian Pacific Materials; and
Mike Fitts, Mentor Graphics
Corp.
Attendees: PCB design engi-
neers, designers, managers and
others interested in utilizing
HDI, embedded passives and
other advanced technologies.
Updated and enhanced for PCB
West! This year, both Holden’s
lecture and Fitts’ hands-on
exercises using working CAD
tools will take place on both
days, instead of holding lecture sessions on
Monday and hands-on exercises on Tuesday as in
past years. This two-day course will examine
design techniques for the interconnection of area
array components—from ASIC packaging and
portable products to high-performance computing,
telecom and dense multi-chip modules. PCB design
rules, materials and selection of PCB structures
(blind, buried, and microvias) will be examined
and compared. This course also will explain the
6 P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
costing and electrical performance of embedded
passives technology. The hands-on exercises will
begin with a discussion of CAD toolsets and will
continue with attendees using actual toolsets to
strengthen their understanding of how HDI and
buried passives can help solve everyday design
challenges. Previous CAD tool experience is
required. Participants are encouraged to bring
along their technical questions for discussion and
be prepared to work in teams on a competitive
basis. Day 1: Introduction to Advanced PCBs
and HDI/Microvias, by Holden and Fitts.
Discussion will feature design challenges, break-
out and routing of fine-pitch and high I/O devices,
BGA/LGA layout, design rules and stackup, microvia
structures, simplifying multilayers, designing blind
and buried vias, and design aspects of electrical
performance and signal integrity of HDI structures.
Hands-on exercises will focus on HDI/microvias.
Day 2: Designing with HDI/Microvias and
Buried Passives, by Holden and Fitts.
Discussions will cover very tiny SMT and embedded
passives, materials for distributed capacitance,
resistors and capacitors (including buried resistor
and capacitor technologies), alternative SMT tech-
nologies, design rules, and embedded passives
costing/performance tradeoffs. Hands-on exercises
with EP include selecting BOM components for
embedding, utilizing a cost tradeoff worksheet, and
designing EP resistors and capacitors.
ONE-DAY TUTORIALS
SUN MAR 26 • 9 AM - 5 PM
NEW!
T1 - PCB Design For Real-
World EMI Control: EMC is
NOT Magic!
Speaker: Dr. Bruce
Archambeault, IBM
Attendees: PCB designers, design
and layout engineers, and EMI/EMC engineers
interested in better understanding the causes of
EMC at the PCB level, and how to control these
signals. Managers interested in making better
trade-off decisions and providing proper emphasis
to EMC design issues are welcome.
Proper EMC design for PCBs can make a signifi-
cant difference in the final product’s performance
in the EMC lab. Unfortunately, EMC design is con-
sidered to be magic. This tutorial focuses on the
basic causes of EMC problems, and how to over-
come these problems. Attendees will not merely
learn a list of rules of thumb; instead, this tutorial
will help attendees understand why EMC problems
happen, and what can be done to eliminate them.
The course’s primary focus is to help working engi-
neers understand the causes of EMC problems so
this knowledge can be applied to real-world product
design immediately. Formulas and equations are
not required and are minimized throughout the
seminar. Understanding the causes of EMC prob-
lems will allow engineers to make difficult design
trade-off decisions! Topics to be studied include:
antennas, the grounding myth, partial and incom-
plete inductance, intentional and unintentional
signals, critical signals, common-mode and differ-
ential-mode emissions, crosstalk coupling, multi-
level/cascade crosstalk, guard traces vs. physical
separation, direct radiation from traces, board edge
effects, stitching capacitors, board resonance, exci-
tation modes, splits in ground-reference plane in
I/O area, effects of optimum net termination on
EMC, critical net return current flow, grounding
heatsinks to motherboard, internal radiation from
wires and cables, filter design, shielding, and the
use of commercial SI tools to help reduce EMC.
Attendees will receive copies of all transparencies
used in the presentations. Catch the author of the
popular “EMI/EMC Computational Modeling
Handbook” at PCB West!
NEW!
T2 - Advanced IC Packaging
Technologies
Speaker: Joe Fjelstad,
SiliconPipe
Attendees: PCB designers, prod-
uct engineers, development
engineers, manufacturing engi-
neers and others needing a better understanding of
advanced IC packaging technologies.
The line between the IC package and the printed
circuit was once very sharp and well defined.
However, over the last few years that line has
blurred as product developers attempt to put more
function into ever-decreasing sizes. Packaging
technology has now attained virtual parity in
importance with the IC chip itself. This course will
guide the participants though the world of IC pack-
ages and will include a review of some of the most
recent innovations. Attendees will better under-
stand not only what packaging choices and options
are available, but also how they are built, their
strengths and their weaknesses. Tutorial topics will
include: IC packaging origins and options, assem-
bly processes, flip chip and wire bonding, chip scale
and wafer-level packaging, stacked technologies,
test and reliability issues, the impact of lead-free
requirements on IC package assembly, new and
evolving IC packaging concepts.
NEW!
T3 - PCB Design 101
Speakers: Gary Ferrari,
Ferrari Technical Services;
and Susy Webb, Suntron
Corp.
Attendees: Entry-level PCB
designers and anyone else inter-
ested in an introduction to PCB
design.
Managers often ask, “Where
can I send my entry-level
designers to learn the tricks of
the trade?” This tutorial is the
answer! Technical sessions at
conferences often emphasize
the latest techniques and tech-
nologies, but unfortunately

those classes are usually too in-depth for the typi-
cal novice designer. This class is targeted at the
entry-level PCB designer or someone just starting
out in this profession. Attendees will begin with
the components and the schematic, and continue
through layout and post-processing. Attendees will
learn how to interpret component specification
sheets and schematics, how to plan component
placement, as well as routing strategies, DFM, DFT,
post-processing and more.
NEW!
T4 – The ABCs of
Grounding, Including
Analog/Digital Planes
Speaker: Robert Hanson,
Americom Seminars
Attendees: PCB designers, design
engineers and others with an understanding of
basic design techniques.
This tutorial will discuss the properties behind
grounding. The concept that high-speed current
follows the path of least inductance will be ana-
lyzed, as well as how this causes crosstalk in solid
and slotted ground planes. This tutorial will
address the following questions and more: Which
should be used for your design – single ground,
modified or multipoint ground? Do guard traces
really stop crosstalk, and can they resonate? What
causes near-end and far-end crosstalk and how is it
measured and simulated? What’s the best way to
separate analog from ECL/PECL and TTL/CMOS?
What are picket fences and the 20H rule, and what
can they do to suppress emissions? How should
shields be tied to ground to minimize radiation and
circulation current? Why does the loss of the
ground plane in cables cause crosstalk, radiation,
reflections and propagation delay? Is earthground
an equal potential? Why are solid ground planes
best? What is intelligent parts placement, and what
is its effect on ground return current? Attendees
will learn about the concept of moats/floats/draw-
bridges, how to layout split planes – CMOS/TTL,
PECL, and analog – using the same bias voltage.
Discussion will focus on how to stack PCB layers
(e.g., 4, 6 and 10 layers) for characteristic imped-
ance and crosstalk control.
T5 - Signal Integrity Issues
in PCB Design
Speaker: Doug Brooks,
UltraCAD
Attendees: PCB designers and
design managers.
Designers now recognize that
faster component rise times
mean that the circuit board itself has become an
active circuit component. However, many do not
appreciate how significant certain layout decisions
can be in the ultimate performance and EMI certi-
fication of designs. This tutorial will look at layout
practices that can lead to noise and radiation,
explain why those practices cause problems, and
show how to control or eliminate noise and EMI.
Emphasis will be placed on transmission lines, loop
areas, bypass capacitors and crosstalk.
Fundamental issues to be covered include: what is
noise vs. EMI, what causes noise and EMI, why
noise and EMI can be harmful, signal reflections
and their control with transmission lines, crosstalk
and its relationship to EMI, power system noise and
the role of bypass caps. Attendees of this session
should have a basic familiarity with PCB design.
S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 !
FRI MAR 31 • 9 AM - 5 PM
NEW!
T6 - Placement and Routing
of Complex PCBs
Speakers: Rick Hartley, L-3
Communications, Avionics
Systems; and Susy Webb,
Suntron Corp.
Attendees: PCB designers,
design engineers and others
wishing to gain an understand-
ing of the concepts behind parts
placement and routing of com-
plex PCBs.
Everything you ever wanted to
know about placement and rout-
ing! The concepts behind parts
placement and trace routing
always seem to pique the interest of PCB design-
ers. The reality is, there is seldom one perfect way
to place parts on a PCB. And once parts are placed,
there are hundreds of possibilities for routing the
many transmission lines of the circuit.
Determining which placement and routing
schemes optimize the design is a matter of physics,
fit and opinion. This tutorial will focus on both the
science behind placement and routing and the
opinions of the two instructors. Attendees will
learn about placement for optimum routing, place-
ment “rooms” (several views), and placement’s
effects on the schematic, EMI, board stack-up, fab-
rication, testability, repair and assembly. It will also
cover a typical design flow, routing plans, routing
for best signal integrity, what’s most important
when routing, signals of greatest concern, I/O
structures, differential pairs, analog vs. digital, and
much more.
NEW!
T7 – Get Flexible: A Flex
Circuits Investigation
Speaker: Joe Fjelstad,
SiliconPipe
Attendees: PCB designers, prod-
uct engineers, development
engineers, manufacturing engi-
neers and others who seek to create products using
flexible circuit technology.
Flexible circuit technology is perhaps the most ver-
satile of all electronic interconnection technolo-
gies. While similar to rigid PCBs, flexible circuits
have unique qualities that set them apart from
other interconnection structures and they thus
require special knowledge to employ them success-
fully. Attendees will gain a solid foundation for
understanding and applying this unique technology
that bridges the worlds of mechanical and electrical
interconnections. Topics covered in the course
include materials, structures (single-sided, double-
sided, multilayer and rigid-flex), processes, design
practices, assembly and applications.
NEW!
T8 – DFM For Lead-Free
Manufacturing
Speaker: Gary Ferrari,
Ferrari Technical Services
Attendees: PCB designers, layout
technicians and anyone inter-
ested in learning DFM tech-
niques for the lead-free manufacture of PCBs.
Technological advancements continue to drive our
Professional Development
industry. Lead-free assembly is the latest techno-
logical change to affect the PCB designer. Cost-
effective design and manufacture in leaded and
lead-free environments form the fundamental
building blocks for this full-day session. The class
will be broken into separate interactive discussion
groups to look at material issues such as lead-free
laminates, high performance, HDI and surface fin-
ishes for lead-free assembly. The groups will
explore further the challenges that the Restrictions
of Hazardous Substances lead-free directive pose
for the fabrication and assembly processes. Lastly,
the groups will look at new and innovative ways to
test and verify a product’s integrity in both leaded
and lead-free products. There will be ample time
allocated to look at individual challenges faced by
the attendees. The attendee should come out of
this session with a clear understanding of overall
DFM issues and how they relate to the RoHS lead-
free directive. Attendees with all levels of interest
in the PCB design process are invited.
T9 – Electronics Principles
and Signal Integrity
Speaker: Doug Brooks,
UltraCAD
Attendees: PCB designers and
anyone interested in learning
more about signal integrity.
Do inductors and capacitors
confuse you? Are you unsure what lead inductance
means and why we worry about bypass capacitors?
Then this course is for you! We’ll start with an
overview of resistors, capacitors, inductors and
diodes, and how and why they do what they do.
Next we’ll look at what happens to resistance and
impedance when we combine these components
together in various ways in our circuits. Then we’ll
look at how these principles apply to the primary
signal integrity issues board designers face today –
EMI, crosstalk, signal reflections and transmission
lines, and power supply conditioning to prevent
ground bounce. At the conclusion of the course
attendees will understand the basic causes of these
signal integrity problems, and many of their solu-
tions will become apparent.
NEW!
T10 – Everything You Need
to Know About Bypassing,
Including BGAs
Speaker: Robert Hanson,
Americom Seminars
Attendees: PCB designers, design
engineers, EMC specialists, system architects, IC
package designers and others.
In today’s high-frequency designs, clock speeds of 1
GHz and edge rates less than 1 nsec are common.
These high frequencies and their harmonics must
be bypassed properly between power and ground to
insure power delivery, switching fidelity and control
of radiated emissions. To ensure that the power
delivery system meets its objectives, the intelligent
placement, value, size and type of capacitors must
be achieved. Also, at higher frequencies the die and
interplane capacitance must be optimized. Proper
via placement for return current pathway mini-
mization, laying out digital/analog interfaces, pours
(Cu fills) and splits must be carefully analyzed. This
full-day tutorial will illustrate a layout process that
achieves 0.1 ohm up to the knee frequency and pro-
vides methods to minimize serial/parallel reso-
nance and achieve constant ESR.
7
Technical Conference
MONDAY, MARCH 27
9 AM – 11 AM
NEW!
010 – Complete EMC Analysis The UMR Way
Speaker: Ralf Bruening, Zuken
Attendees: PCB designers, design engineers and
engineering managers interested in EMC analysis.
EMC is one of the most critical problems facing the
electronics industry today, and the University of
Missouri-Rolla EMC lab is a pioneer in this field! A
new EMC analysis approach utilizes the EMC
Expert System Consortium work at the University
of Missouri-Rolla (UMR) EMC lab. Attendees will
learn how to bridge the gap between EMC science
and practice, as well as how to perform fast analy-
sis of complex PCBs and utilizing EMC-related
“what if” capabilities. This approach covers all
major EMC effects occurring on PCBs and allows an
EMC optimization during the design process.
NEW!
011 – Mixed-Signal Board Design
Speakers: Imran Kahn, Syed Rizvi and Wasif
Ali of Nexlogic
Attendees: PCB designers and anyone with a basic
knowledge of PCB design.
Designing mixed-signal boards calls for certain
considerations that are critical for achieving opti-
mum performance. Analog and digital devices have
different characteristics, including power ratings,
current, voltage callouts, and heat dissipation
requirements. Attendees will learn the steps to
effectively design mixed-signal components on a
PCB, as well as the various adverse results of not
properly designing these two different technologies
on a PCB.
012 – Skin Effect on PCB Traces
Speaker: Doug Brooks, UltraCAD
Attendees: PCB designers and others interested in
the skin effect
Many of us learned that the impedance of capaci-
tors and inductors varies with frequency, but resist-
ance does not. As rise times continue to get faster
and frequency harmonics on our boards continue
to get larger, this assumption about resistance is
no longer true. Skin effect causes the effective
resistance of a wire or trace to increase with fre-
quency. If you don’t know what skin effect is, how
it affects resistance and what the proximity effect
is, this is the class for you. Attendees will learn
what causes skin effect, when it becomes an issue,
how it effects our circuits, and what, if anything,
can be done about it.
NEW!
013 – Vias and Their Effects on High-Speed
Digital Signals
Speaker: Robert Hanson, Americom
Seminars
Attendees: PCB designers, design managers and
others interested in the properties behind vias.
Vias are much more than holes; they can have a
profound effect on your digital signal. This course
will cover the mechanical properties of vias – from
drilling and plating, to lamination, electrolysis and
electroplating. Attendees will learn more about the
capacitance and inductance of vias; return current
and its relation to vias; through-hole, blind, buried
and microvias; methods for drilling; aspect ratios;
and cost tradeoffs. Discussion will focus on
8 P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
whether vias and autorouters are HDI compatible,
via discontinuity and via resonance concerns,
capacitance and inductance of vias (through-hole,
blind, buried), eliminating reflections of vias, and
return current and intelligent via placement.
1:30 PM – 5 PM
NEW!
020 – Wayne’s Route
Speaker: Wayne Pulliam, AMD
Attendees: PCB designers and anyone else with
basic PCB physical design knowledge.
Wayne’s Route—excellent! This workshop is for any-
one wishing to learn hand-routing skills or improve
their existing routing skills. This presentation will
cover designing single-sided assemblies with four-
layer board construction and multilayer assemblies
with higher layer counts. An abbreviated overall
design flow will be followed by a detailed placement
and routing strategy. Many specific routing examples
will be shown for discussion. General placement and
routing tips will be covered thoughout the presenta-
tion and listed at the end for easy review.
NEW!
021 – The Lead-Free Mandate and the
Production Line
Speaker: Robert Hanson, Americom
Seminars
Attendees: PCB designers, fabricators and anyone
worried about the move to lead-free PCB assembly.
With the advent of the EU’s RoHS and WEEE direc-
tives, the PCB industry must address the legal and
technical ramifications of non-compliance. Legally,
the main questions are: Who will catch violators
and what type of penalty will they face? On the
technical side, what type of failures can you expect
on the production line because of printing or com-
ponents? What are the recommended solder paste
formulas for reflow and wave? Attendees will learn
the facts about issues such as high-temperature
reflow and wave soldering reliability, quality and
aesthetics. The dilemma of tin whiskers (including
real-world tragedy case studies) will also be
addressed.
022 - EMI and Crosstalk: Theory, Simulation
and Control
Speaker: Doug Brooks, UltraCAD
Attendees: Attendees of this session should have a
basic familiarity with PCB design. Engineers who
have not had formal training in crosstalk will find
this course useful.
Crosstalk is one of the more difficult noise prob-
lems for designers to understand and control. And
many engineers use rules of thumb that they really
don’t understand. This course will first look at for-
wards and backwards crosstalk to help attendees
understand the sources and differences between
the two. Then results from an analysis tool will be
used to help attendees see the strengths and weak-
nesses behind such tools, and to help the student
visualize the crosstalk effects. Finally, some design
considerations will be reviewed to show how
crosstalk can be managed, minimized, and perhaps
even eliminated!
NEW!
023 - Designing For Asian Fabrication
Speaker: Happy Holden, Asian Pacific
Materials
Attendees: PCB designers, design managers, layout
technicians and others interested in this topic.
If there were ever a time to have a full understand-
ing of DFM, then having your boards built in China
is that time! This workshop will highlight the
issues, choices, alternatives and conditions that
designers need to consider in order to make a
printed circuit board manufacturable in Asia, espe-
cially China. Attendees will learn how to determine
if a fabricator is capable of handling an order; how
to use IPC-9151 capability benchmarking to select
fabricators; when you should use controlled imped-
ance; plating, finishes and thickness distribution;
mechanical and image tolerances; materials, multi-
layer stackup and hole plugging; thieving, plating
concerns and why plating thickness varies; calcula-
tions vs. 2D field solvers; and much more.
3 PM – 4 PM
NEW!
024 - The Impact of Lead-Free on Fabrication
Speaker: Zulki Kahn, Nexlogic
Attendees: PCB fabricators, PCB designers and any-
one interested in manufacturing PCBs in the era of
RoHS and WEEE.
Get the lead out! The movement to lead-free assem-
bly is having a distinct impact on PCB fabrication.
Removing lead from the picture often causes an
increase in contact time, bump speed, and peak
temperature. In this one-hour workshop, attendees
will learn how board thickness and surface finish
affect lead-free fabrication. Attendees will learn
about lead-free-compliant surface finishes (ENIG,
immersion silver, OSP, etc.), why they are impor-
tant to lead-free PCB fabrication, and discuss the
various tradeoffs and key advantages associated
with each finish.
NEW!
025 – Decoupling Capacitor Design for High-
Speed PCBs
Speaker: Bruce Archambeault, IBM
Attendees: PCB designers, design engineers and oth-
ers interested in decoupling cap design.
Decoupling of power and ground-reference planes
is an important issue for both EMI emissions con-
trol and circuit functionality. This class will focus
on the sources of noise that the decoupling capaci-
tors are intended to control, the physics involved in
the noise propagation and how to properly analyze
the decoupling capacitor performance. Time-
domain analysis is a transient analysis and will
help determine how well the current is delivered to
the IC, and ultimately how large (or small) the gen-
erated noise pulse will become. Real-world exam-
ples of measurements, as well as computer simula-
tions, will be used to demonstrate the optimal
decoupling strategy.
026 – Effective Library and Design Data
Management
Speaker: Steve Chidester, Cadence
Attendees: PCB designers, design managers and
CAD librarians.
Historically, product data management (PDM) has
been focused in the mechanical domain. But board-
level library and design data management intro-
duce challenges not present in the mechanical
world. This course will describe methods for inte-
grating the board-level design flow with a data
management system, how this integration enables
the engineering team to collaborate and how this
leads to more effective design and manufacturing

outsourcing. Discussion will also focus on addi-
tional benefits of electronic design management,
such as revision control and design reuse.
NEW!
027 – Efficient RF Design Workflows
Speakers: Tim Haag and Dale Hanzelka,
Intercept Technology
Attendees: PCB designers and layout professionals
with a basic understanding of RF and digital design.
Rapid development of RF circuits demands flexible,
layout-driven design capabilities. This often entails
constructing a physical layout using parametric RF
models, analyzing the circuit with a microwave
simulator, and perhaps synthesizing a schematic
via the board database. This session will focus on
RF design techniques that utilize some of today’s
top RF design applications. Attendees will discover
rapid layout-driven design techniques for creating
RF circuits, design optimization through RF simu-
lation, automatic schematic generation, and merg-
ing RF circuits into a mixed RF/digital design in a
few easy-to-follow steps.
FREE TUESDAY!
Conference and Expo-only attendees
are invited to attend the following
Tuesday classes and paper sessions
for FREE! Then visit the exhibit show
floor for a program of FREE Exhibitor
Showcase presentations.
Finally, cap off an exciting day at PCB
West by networking with your col-
leagues at the FREE 15th Anniversary
Opening Night Reception, followed by
the FREE Casino Night Party!
TUESDAY, MARCH 28
FREE WORKSHOPS • 9 AM – 11 AM
NEW!
030 – Lead-Free Panel: The Designer Toolkit
for RoHS and WEEE Compliance
Moderator: Greg Roberts, EMA Design
Automation
Attendees: PCB designers, design managers and
other executive and departmental managers.
Waiting until the end of the design cycle to assure
RoHS compliance might be acceptable for designs
currently in production, but for new designs, com-
panies must consider RoHS compliance at the very
beginning of the design phase. The panel agenda
will include RoHS and WEEE implications on the
design process; managing the impact of RoHS and
WEEE on the supply chain, PCB design infrastruc-
ture and data management; the practical impact of
the directives; and achieving compliance of the
electronics and mechanicals under RoHS and WEEE
– is declaring self-compliance an option? The panel
discussion will be followed by a Q&A session and a
networking opportunity to meet each panelist, other
knowledge experts, and fellow attendees.
NEW!
031 – Land Pattern Creation “Wayne’s Way”
Speaker: Wayne Pulliam, AMD
Attendees: PCB designers and anyone with basic
S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 !
knowledge of PCB physical design.
This workshop simplifies the land creation process.
Attendees will learn how to quickly extract the
information needed to make land patterns, calcu-
late pad size and determine pad location. Parts to
be discussed include through-hole lead, surface
mount, and edge connectors. Learn tips on pad
shapes – round or oval vs. rectangular or square.
Tips on silkscreen will help you deal with your
assembler and engineers.
FREE LECTURES • 10 AM – 11 AM
NEW!
032 – Routing for Complex Shapes
Speaker: Bruce Rietdorf, Zuken
Attendees: PCB designers, CAD managers who are
interested in the challenge of routing.
This course analyzes the added design difficulties
created by flexible circuits, mainly routing for
applications with complex shapes. Attendees will
review how these barriers can be overcome using
design engineering techniques and by applying dif-
ferent software. Discussion will also focus on
issues associated with true curved routing, as well
as how to deal with the unique problems posed by
rigid-flex.NEW!
032 - Using Network Analyzers to Measure
PCBs at GHz Frequencies
Speaker: Bruce Archambeault, IBM
Attendees: PCB designers, design engineers and oth-
ers interested in measurements at GHz frequencies.
This course discusses the various calibration tech-
niques, their pros and cons, and other time domain
gating techniques that can extend the useful fre-
quency range of the network analyzer.
Understanding the loss for different dielectric
materials, trace configurations and connectors is
vital to optimizing the design. But simple network
analyzer measurements can be misleading at fre-
quencies above about 5 GHz. Mismatch between
the SMA connectors used to inject the signal and
the actual trace on the board can cause resonances
that will predict significant distortion on the actual
trace. However, this is a measurement artifact that
can be eliminated with careful calibration and
other techniques. Attendees will learn these tech-
niques and other tricks for using network analyzers
at GHz frequencies.
NEW!
034 - Next-Generation M/ECAD Collaboration
Speaker: Chad Hawkinson, PTC
Attendees: PCB designers, design managers and
others involved in MCAD and ECAD design.
Even the best implementations of IDF-based or
ODB-based integration solutions for MCAD and
ECAD leave much room for improvement.
Companies must still deal with the challenges
resulting from the lack of coordination between
mechanical and electrical disciplines during
design. Attendees will discuss these problems and
the approaches that are being developed to over-
come them. Discussion will include the latest
approaches to MCAD-ECAD real-time integration,
change identification, process management and
thermal analysis.
NEW!
035 - Matching Router Technology With
Design Challenges
Speaker: Dave Wiens, Mentor Graphics
Technical Conference
Attendees: PCB designers, layout technicians and
others.
The complexity of PCBs continues to steadily
rise, driven by requirements for decreased design
size and increased functionality. Today’s chal-
lenges include: high-speed and manufacturability
constraints that can easily consume 95% of the sig-
nals on a design with several thousand nets, sig-
nificantly reducing routing flexibility; a choice
between multigigabit serial signals traveling in dif-
ferential pairs or tightly tuned and impedance
matched parallel bus paths; and the struggle to get
a design done on time utilizing a team with unique
skill sets working on multiple continents.
Attendees will learn more about current design
trends and challenges as well as technologies
emerging to cut design time while enabling
increased product quality and functionality.
FREE PAPER SESSION • 1 - 1:30 PM
NEW!
040 - PCI Signaling and Differential Coupling
Speaker: Ray Mitchell, PLX Technology
Attendees: PCB designers and other layout profes-
sionals interested in PCI Express technology.
Get on the PCI Express! One of the challenges of
designing boards with PCI Express technology is
laying out differential lanes as tightly coupled
pairs. In a tightly coupled pair, the two halves of the
differential pair are close enough together that sig-
nificant crosstalk between the two halves is creat-
ed. The difficulty in layout is that any perturba-
tions—vias, for example—must occur on both
halves of the pair at the same physical location.
Attendees will examine the pros and cons of tightly
vs. loosely coupled differential pairs as it pertains
to PCI Express. The instructor will discuss both
stripline and microstrip architectures as they
relate to signal integrity and susceptibility to noise,
and share key results and conclusions.
FREE PAPER SESSION • 2 - 2:30 PM
NEW!
041 - Digital Legend Printing
Speaker: Greg Blake, Printar
Attendees: Fabricators and anyone interested in
learning about digital legend printing on PCBs.
Fabricators understand the benefits associated
with adding traceability to individual bare printed
circuit boards. Traditional traceability schemes add
cost and time to the manufacturing process,
because an extra (and manually intensive) step
involving stamping, scribing, secondary screening
or labeling is required. Fabricators have been chal-
lenged to accomplish the impossible, that is, imple-
ment traceability on their products while at the
same time reducing manufacturing costs and pro-
duction cycle times. Attendees will learn about a
viable and cost-effective solution that can help fab-
ricators accomplish both these goals.
FREE TUESDAY sessions end here. Technical
Conference courses continue on Wednesday.
9
Technical Conference
WEDNESDAY, MARCH 29
9 AM – 12 PM
050 - Designing With BGA Packages
Speaker: Wayne Pulliam, AMD
Attendees: All PCB interconnect designers currently
using or planning to use BGA packages.
This presentation will cover footprint construction
and placing and routing of BGAs. Attendees will
learn how to calculate layer requirements for BGAs
based on package information and design rules.
Attendees will also learn about general design con-
cerns and pitfalls to be avoided, including tips on
placement, general routing, power distribution and
assembly. A design checklist is included in the
presentation for easy review of the material. This is
a must for anyone wanting to design low-cost, low
layer-count PCBs with BGAs.
051 – Impedance Analysis and
Specifications
Speaker: Happy Holden, Asian Pacific
Materials
Attendees: PCB engineers, designers, managers and
others interested in controlled impedance boards.
This workshop is an introduction to controlled
impedance. It explains in simple terms why con-
trolled impedance is required. The various equa-
tions will be presented, as well as numerical solu-
tions and field solvers. These will be compared with
“as-measured” TDR readings. Resources for
impedance analysis on the Internet will be detailed
and the variability of impedance due to manufac-
turing tolerances will be explained. Finally, how
controlled impedance should be documented on
fabrication drawing will be illustrated.
052 - Fundamentals of DFT
Speaker: Gary Ferrari, Ferrari Technical
Services
Attendees: PCB designers, design managers, layout
technicians and others.
The term “DFT” (design for test) has a different
meaning depending on whether you are dealing
with a bare printed board, a final assembly or a
board in the field. This course will help you define
DFT issues as they relate to design and cost in the
fabrication and assembly processes. The discus-
sions will focus on fabrication and assembly issues
that affect the design of a product. These “snap-
shots” will fortify the discussion, as well as provide
you with guidelines for applying IPC standards to
your designs in order to more easily produce cost-
effective, right-the-first-time PCBs.
11 AM – 12 PM
053 – FPGA I/O Design
Speaker: Bruce Riggins, Mentor Graphics
Attendees: PCB designers and anyone interested in
a more efficient process for designing FPGA I/Os.
In this workshop, attendees will examine the FPGA
I/O design process in detail and learn to overcome
the obstacles to leveraging FPGA devices during
complex system design implementation. The class
will also examine the FPGA I/O design process by
focusing on the common challenge of connecting a
FPGA device to a modern memory device. At the
conclusion of the discussion, attendees should
understand that FPGA I/O design is a team sport
that can lower PCB manufacturing costs.
10
NEW!
054 – The “Ground” Myth
Speaker: Bruce Archambeault, IBM
Attendees: PCB designers, design engineers and
anyone interested in learning more about ground.
This presentation discusses the origin of the word
“ground,” what we really mean when we use the
term, and how to optimize our designs to achieve
the over all goals for our reference strategy. Ground
is considered to be a zero potential region with
zero resistance and zero impedance at all frequen-
cies. But this is just not the case in practical high-
speed designs. The one thing that should be
remembered whenever the term ground is used is
that “Ground is a place where potatoes and carrots
thrive!” By keeping this firmly in mind, we can
avoid many SI and EMC emissions problems.
1:30 PM – 5 PM
NEW!
060 – Advanced HDI Engineering
Speaker: Happy Holden, Asian Pacific
Materials
Attendees: PCB designers, design and packaging
engineers and others interested in HDI.
As finer pitch devices all come into common use
higher speed logic, the need for advanced PCBs is
essential – both as the board and as the package.
Attendees will investigate advanced technologies
for the interconnection of area array components,
from ASIC packaging, portable products, high-per-
formance computing, and telecom to dense multi-
chip modules. PCB wiring modeling, design rules,
materials and selection of PCB structures (blind,
buried and microvias) will be examined and com-
pared. The overview of HDI technology is particular-
ly useful for those not familiar with this technology.
061 – Designing With Your “Thumbs”
Speaker: Susy Webb, Suntron
Attendees: PCB designers and layout professionals.
Have you ever wished someone would compile a list
all the general rules of thumb for laying out different
kinds of boards? Have you ever wanted to sit with a
mentor and really absorb all those little tidbits of
information that he understands so well and uses so
readily? How about a set of general guidelines for
routing, planes, stackup, high speed, EMI and more?
This course is a compilation of pieces of information
gleaned from many technical sources and years of
design work. It will provide general rules of thumb
for the ways things can be done to achieve success-
ful board designs, and give brief explanations about
why they need to be done that way.
NEW!
062 – Introduction to Fullwave SI and EMC
Modeling
Speaker: Bruce Archambealt, IBM
Attendees: PCB designers, design engineers, and
anyone interested in fullwave modeling for signal
integrity and EMC.
Based on the instructor’s popular book “EMI/EMC
Computational Modeling Handbook,” this class pro-
vides a summary of the various modeling tech-
niques available today, and more importantly, the
strengths and weaknesses of each technique.
EMI/EMC compliance and signal integrity are much
more important than ever before, due to higher-
speed electronics in lower-cost packages. New sim-
ulation tools allow a more accurate estimation of
the EMI/EMC/SI effects on a system, before that
P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
system is ever built. This workshop will help atten-
dees understand which modeling technique will
work best for a given set of problems. Class discus-
sion will focus on validation of modeling tech-
niques and modeling codes, as well as standard
modeling problems to allow engineers a more com-
plete evaluation against potential vendor software
packages.
3 PM - 5 PM
NEW!
063 - E/CIT And Embedded Passives
Development
Speaker: Richard Snogren, Bristlecone LLC
Attendees: PCB designers, design engineers, fabrica-
tors and anyone interested in embedded passives.
Who says taxpayers don’t what they pay for! For the
past two years, the NAVSEA-Crane naval base in
Indiana has been assisting industry with emerging
interconnect technology development and imple-
mentation. This program, known as Emerging
Critical Interconnect Technology (E/CIT), encom-
passes several projects, including Embedded
Passives Test Bed. Attendees will learn details about
the project’s activities: developing and demonstrat-
ing processes with current commercial embedded
passive material sets; the design, fabrication and
testing of high-frequency test vehicles for capacitor
and resistor materials; the evaluation of CAD and
CAM tool sets; and providing product emulator
design, fabrication and reliability testing to OEMs.
NEW!
064 - Alternative Interconnect and Packaging
Technology
Speaker: Joe Fjelstad, Silicon Pipe
Attendees: PCB designers, product engineers, R&D
engineers, manufacturing engineers and others.
Traditional approaches to electronic interconnec-
tion and packaging are being pressed to their very
limits by the ceaseless demand for greater per-
formance at lower cost with reduced power. The
result is that new approaches to interconnection
are becoming key elements to opening the door to
meet those requirements. Future electronic
designs will resemble today’s, but will also redefine
the design practice to capture the potential benefit
lying dormant in the IC. The course is designed to
help participants understand the ground shift
that’s necessary to make the step up to the next
level of cost and performance.
NEW!
065 – Grounding to Control Noise and EMI
Speaker: Rick Hartley, L-3 Communication,
Avionics Systems
Attendees: PCB designers, circuit design engineers
and managers interested in learning proper circuit
grounding techniques.
This new short course is an introduction to the
concepts needed in high-speed circuits and printed
circuit design regarding grounding a circuit for
proper operation, to minimize noise and EMI. The
course will cover why we call it ground, the many
different “things” known as ground, circuit para-
sitics, high-frequency currents, basic transmission
line concepts, partner planes, successful PCB
stackups, grounding to help eliminate EMI, split-
ting vs. not splitting ground (the pros and cons of
each), islands in ground, ground in IC packages
and connectors, grounded guard traces (the pros
and cons), and RF shielding techniques.

NEW!
066 – Constraints-Based High-Speed PCB
Design
Speaker: Ralf Bruening, Zuken
Attendees: CAD managers and PCB designers who
are focused on high-speed digital PCB designs.
The definition of design constraints within EDA
applications has become more important with the
rise in component speed and increased board com-
plexity. While the design process is made much
“safer” with these constraints, it is easy to over-
constrain the design, making it impossible to com-
plete routing and placement. This tutorial will pro-
vide an overview of the constraints used in high-
speed design, and how to implement them correct-
ly. Attendees will focus on how to judge constraints
and any potential trade-offs between different con-
straints (as these may sometimes contradict), as
well as EMC/EMI design constraints.
THURSDAY, MARCH 30
9 – 11 AM
070 – Current Flow in PCB Traces
Speaker: Doug Brooks, UltraCAD
Attendees: PCB designers and anyone interested in
the flow of currents in PCB traces
We have heard the definition “the current is the
flow of electrons.” But there is considerable confu-
sion over flow as a drift velocity of electrons and
flow at the speed of light. Also, people wonder how
electrons can flow across a capacitor or out through
space (EMI). Attendees will learn what is meant by
the “flow of electrons” and why that definition
(which has been around for 150 years) is still valid.
How can there be a propagation delay as current
flows, while current is also constant everywhere
along a trace, simultaneously? Learn how currents
flow down transmission lines, terminated and
unterminated, and down differential traces.
NEW!
071 - Introduction to Embedded Passives
Speaker: Richard Snogren, Bristlecone LLC
Attendees: Anyone interested in embedded passives,
but unfamiliar with EP technology.
This is a practical ground-floor workshop to intro-
duce embedded passives to designers and others
unfamiliar with the technology. This course pres-
ents market drivers, product performance benefits,
and relative cost factors, as well as an overview of
the state-of-the-art of embedded passive resistor
and capacitor materials and processes. This highly
informative workshop is an excellent starting point
for engineers and designers wanting to strengthen
their understanding before launching their own
embedded passives journey. Embedded passive
novices should take this course before taking the
more advanced class Thursday afternoon.
9 AM – 12 PM
NEW!
072 – Best Practices in Implementing Lead-
Free Assembly, Part 1
Speaker: Ron Lasky, Indium Corp.
Attendees: Anyone interested in learning how to
implement a lead-free assembly process.
This may be the only workshop that focuses on the
“how to” of implementing lead-free at your factory.
It covers all of the relevant issues: PCB finishes,
components, alloys and SMT processes. It also
S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 !
reviews actual implementations of lead-free
assembly processes by Motorola and Hewlett-
Packard. The workshop will finish with a section on
establishing your lead-free implementation plan.
The morning course includes a review of current
legislation and practices in lead-free electronics
assembly. We’ll review the current alloys in use and
why and how they were selected, as well as PCB fin-
ishes and component concerns in lead-free assem-
bly. This is a complete class that can be taken with
or without Part 2 on Thursday afternoon.
NEW!
073 – Materials for Lead-Free, High-Speed
and High-Frequency Applications
Speaker: Rick Hartley, L-3 Communications,
Avionics Systems Inc.
Attendees: PCB designers, circuit design engineers,
systems engineers and managers.
In a high-speed or high-frequency circuit, perform-
ance is dependent upon a number of characteris-
tics and variables. Several of these issues are driv-
en from the PCB’s base material characteristics. At
high frequencies materials can and do have a pro-
found impact on performance. This course will dis-
cuss all of the base materials commonly used in
high-speed digital and high-frequency analog cir-
cuits (including FR-4), looking at their advantages
and disadvantages, and will detail how to calculate
their impact on circuit performance, hence how to
choose a cost-effective material for any specific
application. Attendees will also learn how each of
these materials fits into today’s lead-free products.
11 AM – 12 PM
NEW!
074 - DFM, Test and Assembly Strategies
Speaker: Zulki Kahn, Nexlogic
Attendees: PCB designers, test engineers, layout
engineers and assembly personnel.
Product and technology evolution continues to play
a significant and ever changing role in PCB design
for manufacture (DFM), test, and assembly. DFM,
test and assembly strategies must focus on the
OEM’s specific product needs and the required
techniques and methodologies used. Attendees will
learn details of each aspect of DFM, test, and
assembly, as well as methods for deploying correct
strategies at specific levels of products: consumer,
industrial, medical and mil/aerospace. Examples of
ineffective DFM, test, and assembly techniques will
also be discussed.
1:30 PM – 5 PM
080 – High-Speed Clock Control
Speaker: Robert Hanson, Americom
Seminars
Attendees: PCB designers, design engineers and others.
This class will discuss the issues of skin effect,
proximity and dielectric loss on transmission char-
acteristics. Edge rate harmonics, pre-emphasis,
equalization, harmonic amplification, PAM 4 cod-
ing and line length vs. attenuation will be covered.
081 – Embedded Passives in PCBs Now!
Speaker: Richard Snogren, Bristlecone LLC
Attendees: PCB designers and others interested in
state-of-the-art embedded passives technology.
Note: This is not an introductory class. Attendees
are strongly urged to take Snogren’s “Introduction
to Embedded Passives” Tuesday morning.
This half-day workshop is an intense review of the
Technical Conference
state-of-the-art of today’s commercially available
embedded passive technology. The course starts with
passive component functions and performance driv-
ers to embedded passives. This leads into an in-depth
discussion of today’s commercial material sets; their
electrical and physical characteristics; a useable
selection rationale; design, test, and trim tools; and
DFM guidelines for implementation. The presenta-
tion includes a detailed discussion of the relative
costs of the various technologies and a methodology
for cost analysis. The class concludes with a review of
industry initiatives on embedded passives.
082 – RF and Microwave PCB Design and
Base Materials
Speaker: Rick Hartley, L-3 Communications,
Avionics Systems
Attendees: PCB designers, engineers, technicians
and managers.
Ultra-high signal integrity and noise control are
the keys to full functionality when designing very
high frequency analog applications. This workshop
is geared to help better understand the “whats” and
“whys” of PCB layout and the effect of the PCB
materials in high-frequency analog circuits. The
course will cover impedance matching and balance,
signal wavelength, propagation delay, critical trace
length, noise, reflections, skin effect, loss tangent,
waveguides and other RF transmission lines, and
microstrip vs. stripline vs. co-planar waveguides.
Other highlights include PCB stackups for RF cir-
cuits, shields and shielding, RF PCB base material
properties, choosing RF base materials, RF PCB
fabrication, and RF PCB assembly.
NEW!
083 - Best Practices in Implementing Lead-
Free Assembly, Part 2
Speaker: Ron Lasky
Attendees: Anyone interested in implementing a
lead-free assembly process.
In this half-day seminar, you will learn the best
practices in SMT processes for lead-free assembly,
printing, placement, reflow and wave soldering.
Case studies will be reviewed, including a Motorola
study on implementing a lead-free process to
assemble 9 million cell phones, and a Hewlett-
Packard study on large board implementation. You
will also learn how to establish your company’s
lead-free implementation plan. This is a complete
class that can be taken with or without Part 1
Thursday morning.
084 – Through-Hole to HDI Conversions
Speaker: Gary Ferrari, Ferrari Technical
Services
Attendees: PCB designers, layout technicians and
others.
The dilemma: Add layers or go to HDI? PCB design-
ers are often faced with the challenge of estimating
how many conductive layers a particular board
design would require. How many times have we
run out of routing channels only to have to add an
additional layer pair? This session looks at the vari-
ables that must be analyzed to predict the routing
requirements of a design as well as alternative HDI
structures. Design rules, performance gains and
cost comparisons highlight this session. The
attendee will gain a clear understanding of the crit-
ical identifiers that will lead them to an HDI
design, which is a more cost-effective alternative
than adding additional layers to a current through-
hole design.
11
Speaker Biographies
WASIF ALI is a design engineer at Nexlogic
Technologies. He received his BSEE from N. E. D.
University of Engineering and Technology in
Pakistan.
E-mail: wasif@nexlogic.com
DR. BRUCE ARCHAMBEAULT is the lead
EMC engineer at IBM in Raleigh, NC, responsible
for EMC tool development and use on a variety of
products. He has a BSEE from the University of
New Hampshire, an MSEE from Northeastern
University and a Ph.D. from the University of New
Hampshire. Archambeault developed computation-
al electromagnetic EMC-related software tools at
Digital Equipment Corp. and SETH Corp., and in
1997 he joined IBM. Archambeault is the author of
“PCB Design for Real-World EMI Control,” and is
the lead author of “EMI/EMC Computational
Modeling Handbook.”
E-mail: barch@us.ibm.com
GREG BLAKE is U.S. East Coast manager for
Printar Ltd. He has 22 years of PCB experience
with companies including Optrotech and Hadco
Corp. He holds a BS in industrial technology/indus-
trial electronics and an MA in technology strategy.
E-mail: gregory_b@printar.com
DOUGLAS BROOKS has a BSEE and MSEE
from Stanford University and a Ph.D. from the
University of Washington. He has held positions in
engineering, marketing and general management
with Hughes Aircraft, Texas Instruments and
ELDEC. In 1992 he formed UltraCAD Design Inc., a
service bureau in Bellevue, WA. He is the author of
“Signal Integrity Issues and Printed Circuit Board
Design.”
E-mail: doug@eskimo.com
RALF BRUENING is a product manager for
Zuken’s high-speed design, SI & EMI verification
tools at Zuken. He has been working in EDA for
more than 16 years. He has worked for Nixdorf
Computer AG and CADLAB. In 1994 joined INCAS-
ES, which was acquired by Zuken in 2000. Since
then he has been involved in product planning,
development and product marketing of Zuken’s
PCB simulation and verification tools.
E-mail: ralf.bruening@zuken.de
STEVE CHIDESTER has been with Cadence
Design Systems for more than 12 years. He is cur-
rently working with a team developing board-level
library and design data management solutions.
During his 25 years in the PCB design business,
Chidester has worked as a schematic drafter, print-
ed circuit designer and applications engineer.
E-mail: smchid@cadence.com
JOSEPH FJELSTAD, co-founder of SiliconPipe,
has more than 33 years of experience in electronic
interconnection and packaging technology. He is
the author, co-author and editor of several books on
electronic interconnection technologies.
E-mail: jfjelstad@siliconpipe.com
GARY FERRARI is the owner of Ferrari
Technical Services, a consulting firm specializing
in technical support and customized training. He is
the past executive director and cofounder of the
IPC Designers Council. He has over 38 years of
experience in electronic packaging with an empha-
sis on PCB design and manufacturing. Ferrari
received the IPC President’s Award in 1990.
E-mail: gary@garrickglobal.com
MICHAEL FITTS is product marketing manager
for layout products at Mentor Graphics. He has
been involved in the design of HDI substrates since
1992. Since 1995, he has been lecturing and con-
12
sulting on advanced technology and design.
Previously, Fitts was president of The Solution Fitts
Inc., an electronic engineering consulting firm
located near Boulder, CO.
E-mail: mike_fitts@mentorg.com
TIM HAAG is an application specialist at
Intercept Technology. He has been active in the
design community for over 25 years, working in
positions from PCB design to design management.
E-mail: Tim_Haag@intercept.com
ROBERT HANSON, MSEE, is president of
Americom Seminars. As a digital design engineer
at Boeing, Rockwell, Honeywell and Loral, Hanson
designed and provided prototype operational analy-
sis on many high-speed designs, including PCBs,
for the AWACS, B1-B, 747-400, missiles and ground
support test equipment. He currently teaches high-
speed digital design courses throughout the United
States, Europe and Asia.
E-mail: americomseminars@aol.com
DALE HANZELKA is a principal application
specialist for Intercept Technology. He has worked
in the design field for over 10 years.
E-mail: dale_hanzelka@intercept.com
RICK HARTLEY is a senior design engineer and
PCB specialist at L-3 Communication, Avionics
Systems. He has 39 years of experience in the elec-
tronics industry and has dedicated the past 29
years to PCB and circuit development with empha-
sis on control of signal integrity and control of EMI,
in both digital and RF PCBs.
E-mail: rhartley@columbus.rr.com
CHAD HAWKINSON is currently the director
of high technology market strategy for PTC. He lec-
tures at Northeastern University in high technolo-
gy management, and holds a BS in engineering
from Virginia Tech and an MBA from the MIT Sloan
School of Management.
E-mail: chawkinson@ptc.com
HAPPY HOLDEN is director of OEM Marketing
and Customer Support for Asian Pacific Materials.
Previously, he was the manager of Advanced
Technology for Westwood Associates, and a senior
consultant at TechLead Corp. and Merix. He retired
from Hewlett-Packard in 1996. He holds a BS in
chemical engineering and an MS in computer sci-
ence from Oregon State University. He has pub-
lished over 80 technical papers and contributed to
three books.
E-mail: htholden@asianpm.com.com
DALE HANZELKA is a principal application
specialist for Intercept Technology. He has worked
in the design field for over 10 years.
E-mail: dale_hanzelka@intercept.com
IMRAN KHAN is a PCB design engineer at
Nexlogic Technologies. He has over four years
experience as a PCB designer.
E-mail: imran_khan@nexlogic.com
ZULKI KHAN is president and founder of
Nexlogic Technologies in San Jose. He holds a
BSEE from the N.E.D. University of Engineering
and Technology in Pakistan and an MBA from the
University of Iowa.
E-mail: zulki@nexlogic.com
DR. RON LASKY is a senior technologist at
Indium Corp. and a visiting professor at Dartmouth
College. Prior to these assignments, he had over 20
years of experience in electronic and optoelectron-
ic packaging at IBM, Universal Instruments and
Cookson Electronics. Lasky holds numerous patent
disclosures and is the developer of several new con-
P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
cepts in SMT processing software related to cost
estimating, line balancing and process optimiza-
tion. He has four college degrees, including a Ph.D.
in materials science from Cornell University. Lasky
is the recipient of the 2003 SMTA Founder’s Award.
E-mail: ronlasky@aol.com
RAYMOND MITCHELL is a senior hardware
engineer at PLX Technology. He holds a BSEE and
BS in physics from Stanford University.
E-mail: rmitchell@plxtech.com.
WAYNE PULLIAM is a PCB interconnect archi-
tect at Advanced Micro Devices, where he floor-
plans PCBs for future microprocessor products and
advises on current PCB designs. He is a member of
the PCB Design Conference Top Gun Hall of Fame.
E-mail: wayne.pulliam@amd.com
BRUCE RIETDORF is a senior applications
engineer for Zuken USA Inc. He has more than 30
years of experience in electronic packaging with an
emphasis on PCB design and manufacturing.
Rietdorf has been a PCB designer, PCB design
service group manager, coordinator of electrical
CAD/CAM operations, and served as administrator
of electrical drafting standards at Magnavox in Fort
Wayne, IN. He has chaired a number of IPC techni-
cal committees, and he received the IPC
President’s Award in 1988.
E-mail: bruce.rietdorf@zuken.com
BRUCE RIGGINS is a product marketing man-
ager in the Systems Design Division of Mentor
Graphics. He has a BSEE and has worked for over
12 years in the EDA industry.
E-mail: bruce_riggins@mentor.com
SYED RIZVI is a senior design engineer at
Nexlogic Technologies. He has over eight years
experience as a PCB design engineer.
E-mail: syed@nexlogic.com
GREG ROBERTS is the director of marketing at
EMA Design Automation. He has over 15 years of
experience in the EDA industry. Roberts holds a BS
in information and computer science from the
University of California, Irvine.
E-mail: gregr@ema-eda.com
RICHARD SNOGREN is the founder of
Bristlecone LLC, a technology consulting service
supporting military and industry clients. Snogren’s
background includes active membership in the
recent Advanced Embedded Passive Technology
Research Consortia, an interdisciplinary research
project funded by NIST, and director of field appli-
cations engineering for Coretec Inc.
E-mail: rsnogren@earthlink.net
SUSY WEBB is a senior PCB designer with 26
years of design experience. She has worked in a
variety of fields, including point-to-point
microwave network systems, oceanographic oil
exploration equipment, and CPCI and ATX comput-
er motherboards. Webb has set up standards, pro-
cedures and library conventions for departmental
use. She is CID certified, and is an active member
of the IPC Designers Council, a past president of
the council’s Houston Chapter and a current mem-
ber of its national executive board, high speed and
education committees.
E-mail: susan.webb@suntroncorp.com
DAVID WIENS is the business development
director for the Systems Design Division of Mentor
Graphics. He holds a BS in computer science from
the University of Kansas.
E-mail: david_wiens@mentor.com
 Hotel and Travel
Headquarters Hotel
Hyatt Regency Santa Clara
(formerly the Westin Santa Clara)
5101 Great America Parkway
Santa Clara, CA 95054
T 800-233-1234
www.hyatt.com
PCB West 2006 single/double room rate:
$169.00*

*When booking this hotel, you must use the telephone

number listed above. Be sure to mention the group name
“PCB West” to receive the group rate, which is subject to
prevailing state and local taxes at the time of your arrival.
The group rate is guaranteed, based upon room availabili-
ty, until February 23, 2006, at 5 pm PT. Check-in time is 3
pm. The Hyatt Regency Santa Clara is connected to the
Santa Clara Convention Center.

Located in the center of Silicon Valley, the Hyatt Regency

Santa Clara offers the utmost in convenience to the busi-
ness traveler. Guest services include high-speed Internet,
cable-TV with on-demand movies, valet parking, concierge services, a swimming pool, an indoor exercise facility and guest priv-
ileges at the adjacent Santa Clara Golf & Tennis Club. For more information, visit the hotel Web site.

Exhibition & Conference Center

The Santa Clara Convention Center
5001 Great America Parkway, Santa Clara, CA 95054
T 408-748-7000
www.santaclara.org
Parking: FREE for show attendees

Travel
Car Rental
Information
Avis is the official
car rental agency for PCB West. Call 800-331-
1600 or visit www.avis.com to rent a car. Refer
to Avis Worldwide Discount (AWD) #D900888
when making your reservation to receive our
special meeting rate.

Driving Directions
Mineta San Jose International Airport is locat-
ed a short cab ride from the hotel and convention center. For driving direc-
tions from Mineta San Jose International Airport, San Francisco International
Airport or Oakland International Airport, visit www.santaclara.org. For infor-
mation about alternate transportation — including local light rail — visit
www.santaclara.org.

S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 ! 13
Registration Information
DISCOUNTS
PCB West 2006 is pleased to offer the following dis-
counts to qualifying attendees, depending on the pack-
age purchased. Except for the Early-Bird Discount, all
other discounts are only available by phone. Call the reg-
istraton desk at 918-496-1476 for more information or to
register using these discounts.
Early-Bird Discount – Anyone who registers by
March 3, 2006, for the Registration Packages shown at
right will automatically receive $100 off regular tuition
pricing.
Alumni Discount – Alumni of a previous PCB
Design Conference (West, East or Road Series) are eli-
gible for a discount of $50 US on 3, 4 or 5-day packages.
Association/User Group Discount – A member
of IPC Designers Council and/or another recognized
industry user group is eligible for a discount of $50 US
on 3, 4, or 5-day packages.
Group Discount – Companies registering 3 or more
attendees at the same time for 4-Day or 5-Day Special
Value Passports are eligible to receive a $100 discount
per attendee, deducted from the applicable package pric-
ing (Early-Bird or regular). All three (or more) registra-
tion forms must be received or called in together. Please
note: group discounts are not available through online
registration. Call 918-496-1476 for more information.
REGISTRATION POLICIES
Registration – Complete one Registration Form for
each registrant. All 5 sections must be completed.
Payment – Payment must be made by credit card,
check or U.S. government Purchase Order.
Registrations without complete payment information
will not be processed. If paying by PO, please include a
$25 US processing fee per PO in addition to the regis-
tration package fees. A signed and dated PO (compete
with a PO#) and/or full payment must be received prior
to the conference in order for the attendee to be
admitted into classes. For more information about our
payment policies, call 918-496-1476.
Refunds and Cancellations – All refund requests
must be made in writing by fax or mail to PCB Design
Conference West no later than February 27, 2006. Mail
refund requests to: PCB West, Attn. AS, 2018 Powers
Ferry Road, Suite 600, Atlanta, GA 30339. Fax to 678-
589-8850 or e-mail your refund or cancellation request
to askarbek@upmediagroup.com. “No shows” who
have not made a written request by Feb. 27, 2006, are
fully liable for conference tuition/fees. Registrations
made after Feb. 18 are considered confirmed and no
refund requests will be accepted; registrants will be
fully liable for conference tuition/fees and will be
invoiced accordingly.
Program Changes – The technical program of PCB
West 2006 is subject to change should unforeseeable
circumstances arise with respect to individual speak-
ers. Check the PCB West Web site for the latest
updates on sessions and speakers.
ADA Accommodations – If you require special
accommodations as outlined under the ADA, please
contact Alyson Skarbek, Show Manager, at 678-589-
8865 by Feb. 27, 2006.
14 P C B D E S I G N C O N F E R E N C E W E S T 2 0 0 6 | W W W. P C B W E S T. C O M
PCB WEST 2006
REGISTRATION PACKAGES
After you look through the list of Professional Development and Technical
Conference courses on pages 6-11, you’ll need to decide which registra-
tion package best fits your needs and your budget. You’ll also have to reg-
ister for specific courses. To help you make this decision, each package is
described in detail below. For pricing, see the Registration Form on page
15. If you have questions about our packages, discounts or policies, please
contact the Registration Desk at 918-496-1476.
PROFESSIONAL DEVELOPMENT ONLY
• One-Day Tutorial Only Passport – Includes a one-day tutorial, course
handouts, plated lunch and Certificate of Completion, plus admission to the
Welcome Luncheon (if taking a Sunday tutorial), FREE Tuesday sessions, two-
day exhibition, General Sessions, Opening Night Reception, Casino Night,
and Year of the Designer Reception. See page 15 for pricing. Note: Alumni and
Association/User Group discounts do not apply for this package.
• Two-Day DEC Only Passport – Includes a two-day Design Excellence
Curriculum (DEC) course, course handouts, plated lunch (both days) and
Certificate of Completion, plus admission to the Welcome Luncheon, FREE
Tuesday sessions, two-day exhibition, General Sessions, Opening Night
Reception, Casino Night, and Year of the Designer Reception. See page 15 for
pricing. Note: Alumni and Association/User Group discounts do not apply for
this package.
TECHNICAL CONFERENCE ONLY
• 1-Day Technical Conference Passport – Includes your choice of
morning and afternoon sessions during a single day of the Monday,
Wednesday and Thursday Technical Conference, plus FREE Tuesday sessions
and admission to the two-day exhibition, General Sessions, Opening Night
Reception, Casino Night, and Year of the Designer Reception. See page 15 for
pricing. Note: Alumni and Association/User Group discounts do not apply for
this package.
• 3-Day Technical Conference Passport – Includes your choice of ses-
sions during the entire Monday, Wednesday and Thursday Technical
Conference, plus FREE Tuesday sessions and admission to the two-day exhi-
bition, General Sessions, Opening Night Reception, Casino Night, and Year of
the Designer Reception. See page 15 for pricing.
SPECIAL VALUE PASSPORT PACKAGES
• 4-Day Special Value Passport (a terrific education value) – Includes
any combination of Professional Development courses and Technical
Conference sessions taken during five days (choose from
SUN/MON/WED/THU or MON/WED/THU/FRI), plus FREE sessions on Tuesday
and admission to the two-day exhibition, General Sessions, Opening Night
Reception, Casino Night, and Year of the Designer Reception. (Note:
Professional Development Tutorials and DEC courses include a plated lunch.)
See page 15 for pricing.
• 5-Day Special Value Passport (the most bang for your buck) – Includes
any combination of Professional Development courses and Technical
Conference sessions (SUN/MON/WED/THU/FRI)—you decide—plus FREE
Tuesday sessions and admission to the to the Welcome Luncheon, two-day
exhibition, General Sessions, Opening Night Reception, Casino Night, and
Year of the Designer Reception. (Note: Professional Development Tutorials
and DEC courses include a plated lunch.) See page 15 for pricing.
EXHIBITION ONLY
• Exhibition Only Package – Includes admission to the FREE Tuesday ses-
sions, two-day exhibition on Tuesday and Wednesday, General Sessions,
Opening Night Reception, Casino Night, and Year of the Designer Reception.
 Registration Form
1. PROVIDE YOUR CONTACT INFORMATION
Please clearly print the following information as it will appear on your badge. All information is
required. SPECIAL EARLY-BIRD
PRIORITY CODE: PCDMD106 PRICING!
Save $100 on most registration packages
Your Name when you register by March 3, 2006!
Your Title

easy

4
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ways to
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Telephone Fax*
register
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*By including your e-mail and fax above, you are granting UP Media Group permission to contact you via those methods
regarding the PCB Design Conferences and other UPMG products and services.
ONLINE: www.pcbwest.com
PHONE: Pre-show 918-496-1476
2. CHOOSE YOUR REGISTRATION PACKAGE On-site 918-408-5366
See the registration package and discount descriptions on page 14 for details. Register by March 3, 2006, FAX: 918-496-9465
to save $100 on all registration packages! To take advantage of our Alumni Discount ($50 US) or our
Association/User Group Member Discount ($50 US), you must call 918-496-1476 for a discount code, then MAIL: PCB West 2006
use the code when you register online or by phone. The Group Discount is not available through online 2018 Powers Ferry Rd., Ste. 600
registration.
Through After Amount
Atlanta, GA 30339
3/3/06 3/3/06 Due
PROFESSIONAL DEVELOPMENT ONLY
❏ One-day Tutorial Only Passport, each $455 $555 _______ 5. PROVIDE DEMOGRAPHIC INFO
❏ Two-day DEC Only Passport, each $845 $945 _______ Please answer all six questions below.
TECHNICAL CONFERENCE ONLY
1. Do you wish to receive a FREE digital subscription to
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Printed Circuit Design & Manufacture magazine?
❏ 3-Day Technical Conference Passport – MON/WED/THU + FREE TUE! $845 $945 _______
❏ Yes ❏ No
SPECIAL VALUE PASSPORT PACKAGES
❏ 4-Day Special Value Passport – SUN/MON/WED/THU + FREE TUE! $1,195 $1,295 _______ 2a. With which aspect of printed circuit board design or
❏ 4-Day Special Value Passport – MON/WED/THU/FRI + FREE TUE! $1,195 $1,295 _______ manufacture is your company involved?
❏ 5-Day Special Value Passport – SUN/MON/WED/THU/FRI + FREE TUE! $1,395 $1,495 _______ ❏ Design ❏ Manufacture ❏ Both ❏ Neither ❏ Turnkey
EXHIBITION ONLY
❏ PCB West 2006 EXHIBITION ONLY — TUE and WED + FREE TUE! FREE FREE FREE 3. Is your primary employer/facility an:
❏ General Sessions (TUE and WED) (includes a continental breakfast) FREE FREE FREE 1. ❏ OEM
❏ FREE Tuesday sessions (see page 9 and make your selections below) FREE FREE FREE 2. ❏ Service Bureau
3. ❏ Both OEM & Service Bureau
4. ❏ Merchant Fabricator
Total Amount Due: $ ____________
5. ❏ Captive PCB Fabricator
6. ❏ Both Merchant & Captive Fabricator
7. ❏ Consultant/Educator/Financial Analyst
3. CHOOSE A PAYMENT METHOD
Make checks payable to UP Media Group (reference PCB West 2006). 4. Which of the following most closely describes your
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1. ❏ Design/System/Electrical Engineering
❏ Charge my credit card: ❏ Visa ❏ AMEX ❏ Mastercard
2. ❏ Engineering Management
Credit Card Number Exp. Date 3. ❏ PCB Design/Layout/Circuit Design/Circuit System
Signature Packaging Design/Other Design (including
management)
Print name as it appears on card
4. ❏ Corporate Management
Billing Address 11. ❏ Sales & Marketing (including management)
12. ❏ Consulting
PAYMENT INSTRUCTIONS: Payment must be made by check or credit card with your completed registration. Your 13. ❏ University Professors/Instructors/Students
registration will not be processed without payment. If paying by US government purchase order, please include a $25 99. ❏ Other (specify) __________________________
(in U.S. funds) processing fee per P.O.# in addition to the registration fees listed above. IMPORTANT NOTICE: A signed
and dated PO (coplete with a PO #) and/or full payment must be received prior to the conference in order for you to be 5. In my capacity in the job function noted above, I am
admitted into conference courses. involved with recommending/specifying, authorizing
(buying) the tools in my area with a budget of
approximately:
4. CHOOSE YOUR COURSES 1. ❏ Less than $10,000 per year
You must select the courses that you will attend below. Pay special attention to days and times and make 2. ❏ $10,001 to $50,000 per year
sure that your choices do not conflict. You may only register to attend one course per time slot. 3. ❏ $50,001 to $100,000 per year
SUN MAR 26 MON MAR 27 FREE TUESDAY! WED MAR 29 THU MAR 30 4. ❏ $200,001 to $500,000 per year
DEC 1 DEC 2 010 011 012 013 TUE MAR 28 050 051 052 053 070 071 072 073 5. ❏ $500,001 to $999,999 per year
T1 T2 T3 T4 T5 020 021 022 023 030 031 032 033 054 060 061 062 074 080 081 082 6. ❏ $1 million plus per year
024 025 026 027 034 035 040 041 063 064 065 066 083 084
6. Can PCB West 2006 exhibitors and sponsors contact you
FRI MAR 31 via e-mail? ❏ Yes ❏ No
T6 T7 T8 T9 T10

S P E C I A L E A R LY- B I R D P R I C I N G | R E G I S T E R B Y M A R C H 3 A N D S AV E $ 1 0 0 ! 15
 Conference: March 26-31, 2006
Exhibition: March 28-29, 2006
Santa Clara Convention Center in Santa Clara, CA
www.pcbwest.com

Education, Inspiration and Solutions

2018 Powers Ferry Road

Suite 600
Atlanta, GA 30339

Back to BASICS
It’s easy for new PCB designers to be overwhelmed. But organization
and education can help you get started right. by SUSY WEBB
So you’re becoming a PCB designer.
You’re new to the field, and you have
lots of questions about how to take a
design from concept to reality. There
are no magic formulas, but there are
some areas that should be given special
attention along the way. We will discuss
them in the order of the design process.
Get Organized
First of all, get organized. You will need
every bit of organizational skill you can
muster. The job we do can be extremely
complex and any little piece of informa-
tion forgotten can spell disaster. Design-
ers are often asked to manage more than
one project at a time. Anything that can
be done to break your work down into
more manageably-sized pieces should be
considered. One way to organize your
work is with project documents and
checklists that keep all the relevant
pieces of information together and give
everyone involved something to check
their progress against. Another way is to
set standards for the way you and your
co-workers work.
It takes a little extra time to get
organized in the beginning, but the
effort pays off dramatically in good
documentation and transition. After
all, when you do a project right the
first time, people notice.
Get ready to work with a team of
(usually) great people. They’ll need you
to provide input into the project and to
check the results. As a board designer,
you will need to understand the circuit
design engineer’s ideas and priorities
and how to implement them. You will
also interact with representatives of the
JANUARY 2006
mechanical, fabrication, assembly, and
test teams regarding information like
clearances, impedances, placement,
panelization, and test procedures. You
need to be sure that the information
you send at data handoff can actually
be implemented.
Get Started
When a new project comes in, you will
need to gather and understand the data
sheets for the required parts. The engi-
neer is going to talk in terms of memory,
processors, switches and buffers and you
will want to know which parts he’s talk-
ing about. Get into the habit of looking
carefully at all data sheets and under-
standing the standard information vs.
what is specific to this part. You’ll need
to immerse yourself in function, foot-
print, gates, speed, voltage and suggested
layout, and more. One thing you don’t
want to know about is long lead time!
Early in the design process you
must check for parts and symbols in
your company’s library. Some compa-
nies ask their PCB designers to imple-
ment the schematic, but others delegate
this to the design engineer. Assuming
that the designer is responsible for the
schematic, you will need to build any
new symbols and be sure that they will
translate properly into parts for the
board. The symbols should be built so
that they have enough of the same
appearance that they can easily be
placed together into a schematic, and
have a consistent flow and appearance.
Symbols should show all pins, to help
clarify that a pin is not connected or
forgotten. The design group should
COVER STORY
decide which footprint standard will be
used for building the parts, and devia-
tion should only occur when absolute-
ly required. All PCB footprints should
be checked for size and connection
accuracy by comparing them to the
symbols as well.
When designing for multiple pro-
jects, it can become confusing remem-
bering which parts worked properly
and which did not. Setting up a sepa-
rate library for parts that have been
used successfully can be very helpful in
precluding the re-use of bad parts.
If you are asked to do the schemat-
ic, you’ll need to work within some
basic guidelines. If a block diagram is
not provided, it may be very helpful to
create one; block diagrams can break
down a project into pieces that are
more manageably sized.
Set up the schematic’s design flow
from left to right, with inputs on the
left and outputs on the right. Use off-
page ports to supply information about
the signal’s destination, information
that may not be readily available to
someone who does not completely
understand the circuit. Understand the
the required electronic groupings by
working with the data sheets and talk-
ing with the design engineers. Minimize
the crossing of signal lines for readabil-
ity and clarity. And lastly, limit the
amount of information on a page to
what is easily readable. More pages are
better than one page that is too stuffed
with information to be followed easily.
The transfer of information is the
truth serum of the design! It tells us
how well we have done our work,
PRINTED CIRCUIT DESIGN & MANUFACTURE 17

because this is where the translation
between the symbol and part will or
will not work as planned. It is also the
place where those pesky single pin nets
and unused gates will be discovered.
The engineer may have hooked up
something with two different net
names on two different parts of the
schematic when he meant to use only
one, so check the netlist information
before you move on.
Next, your design software takes all
this information and throws all the
parts and connections into one big
chaotic mess on the board. Now is the
time for breaking everything into those
small pieces. Group the parts according
to the block diagram and schematic
groupings. Place the groups that func-
tion together near each other. Inside the
board outline, the I/O connections and
fixed location parts go down first, fol-
lowed by the best combinations of parts
grouped according to speed, logic fami-
ly, voltage, function and flow. Addition-
al grouping considerations might be
grid, routing channels, noise, heat and
potential trace length. Parts can also be
grouped by their location on the top
side or bottom side of the board.
The plane setup and board stack-up
come next; these must be considered for
power distribution and return current.
If plane setup and board stack-up are
not addressed early, the board could
suffer power problems, signal integrity
issues and EMI failure. With the speeds
of today’s parts, even the slower signals
must be no more than one dielectric
layer away from a plane for return pur-
poses, and the signals should not cross
splits in those planes. A good power
and ground plane pair also provides
extra high-frequency capacitance for
those high-speed parts. Other items to
consider are the number of routing lay-
ers needed, the impedance needed,
material, construction and balance.
Now may be a good time to add
design constraints to the board. Some
software systems take this step in the
schematic, some at the board level. At
the board level you may want to call out
certain elements, such as trace widths
and clearances, classes to keep certain
groups away from other groups, sizes of
vias for classes, and layer-restricted
routing. Design constraints are always a
JANUARY 2006
COVER STORY
good idea, but use as few as necessary to
do the job correctly to keep the DRC MAKE YOUR NEXT
check from bogging down.
PCB LAYOUT
Man or Machine?
A decision must be made whether to
A MASTERPIECE
hand-route or autoroute the board.
Signal integrity is almost always better
with hand-routing, but autorouting
has the benefit of speed. No matter
how the routing will be done, use both
to help determine what is best for any
particular board. Autorouting can help
with fanout, as well as determining
layer count and identifying areas of dif-
ficulty in the placement. Hand-routing
can help with layer-paired routing, crit-
ical signals, and following the data
sheet design rules.
Now you are actually going to
route the board. This is not about con-
necting the ratsnest, but knowing and
implementing the principles that gov-
ern this portion of the job. There are
several types of routing, and you need
to understand how they’re used. For
instance, memory must be daisy chain- PADS® PCB Design Solutions
routed, but clock signals are usually
star-routed. You absolutely must know
the reasoning behind decoupling and What Michelangelo did for the
power distribution on a board in order Sistine Chapel you can do for
to understand the placement and rout-
your layout when you use PADS
ing needs of the planes and different
value capacitors. complete PCB design solution.
Fanout factors include allowing If you are striving for
room between the antipads for return
excellence for an easy to use,
current and knowing whether the
fanout vias will also be used as test- intuitive solution, PADS gives
points. The issues that affect impedance you the freedom and power to
must be clear for a designer to under-
create, at an affordable price.
stand how the signals will perform –
and how they can be controlled – with- To find out more, download the
in the board structure. Trace width and latest technical paper at
distance to the nearest plane are key.
www.mentor.com/rd/padspaper
The order of routing will be determined
by circumstances such as whether the or call us at 800.547.3000.
signal is considered critical and whether
it is part of a bus or an I/O signal. Also
to be considered before routing are the
following: routing the “hardest” areas
of the board first, the presence of
repeating circuits, matched length rout-
ing and differential trace matching.
You have finished routing the
board. Don’t stop now! Any finishing
and checking scenario will give you a Copyright 2005 Mentor Graphic Corporation. All Rights Reserved.
Mentor Graphics is a registered trademark of Mentor Graphics Corporation.
few more steps to complete. The parts All other company and/or product names are the trademarks and/or
registered trademarks of their respective owners.
should be resequenced to make it easier
PRINTED CIRCUIT DESIGN & MANUFACTURE 19
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Two premier PCB industry publishers, UP Media Group and PCB007, have com-
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• “The Impact of RoHS on the Design Process” fea-
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nical training Webinars, visit www.pbrseminars.com now.
 COVER STORY

for the people who must test, use and
repair the board. After back-annotation
to the schematic, importing the netlist
one last time verifies that the board and
schematic are completely in sync. A last
visual and DRC check should be per-
formed to ensure all problems have
been cleared up. Have the engineer
check the board a final time against a
checklist of potential problems. Create
output files and check them thoroughly
for anything unexpected. And finally,
save only one copy of the board in a
safe place, so that there is only one
place to retrieve a database to start any
engineering change orders (ECOs).
The Business
Don’t forget that there’s more to being
a designer than actually designing
boards. To stay employed, you’ll need
to keep current on a whole raft of
evolving, everchanging technologies
and techniques. A great way to keep
informed is by networking. Get to
know people in every segment of the
business, so that you’ll have sources to
the design-related user forums, includ-
ing the ones sponsored by PCD&M
(PCDList), the IPC Designers Council
(DC List and Technet), and the EDA
software vendors. These forums allow
designers to talk about issues and ask
DON’T
questions, and all can be helpful, even if
you just “listen in” to the regulars.
Also, join the local chapters of profes-
sional organizations such as the Design-
ers Council and the Surface Mount
BLINK
Technology Association (SMTA). The
meetings present great topics and it’s
easy to get to know other designers. Be
nice to these people; they represent a
future source of jobs.
You’ll need to get every bit of edu-
cation and training that you can. The
most obvious sources for design educa-
tion are conferences such as the PCB
Design Conferences. Training can
include anything from classes and
workshops at conferences to Webinars
and courses held at your local commu-
nity college. Read magazines, books,
Internet articles and PCB standards. If
you have questions, go to your net- HyperLynx ®

turn to when you have questions or
ideas that you’d like to bounce off
other designers (you will). This
requires getting out of your darkened
office and actually talking to people.
We designers tend to be solitary, but
trying to do things on our own can
lead to wasted time and effort, bad
habits and few allies.
There are numerous networking
opportunities in this business. Get on
work of friends and teachers and talk
things over with them. Remember that
the educated, informed designer is
more likely to keep his job when the
chips are down.
Volunteer! The Designers Council
and SMTA are always looking for
help, and members can influence the
selection of speakers and presenta-
tions. Get involved. You’ll never regret
volunteering.
The above information is not
meant to be a comprehensive list of
everything that needs to be done to
design a board. There are hundreds of
variables to be considered on any
design, variables that make it unique
from every other design. But this
should help get you started, or fill in a
few blanks if you’re already working.
I encourage you to always keep
reading and learning about PCB design
throughout your design career. PCD&M
Compatible with PADS®
and all major PCB flows
If faster edge rates and new bus
technologies are part of your
next design, you need the right
tools and they need to be easy
to use. HyperLynx is the
industry leading high-speed
solution that allows you to make
pre-route design tradeoffs,
including trace topologies, buffer
technologies, termination tradeoffs,
as well as crosstalk, EMC, power,
and cost tradeoffs _ all before
routing a single net. To find out
more, download the latest
hands-on high-speed tutorial from
www.mentor.com/rd/hxdemo
or call us at 800.547.3000.

SUSY WEBB is a senior PCB designer

at Suntron Corp. She has 26 years of
design experience and is scheduled to
teach a PCB basics class at PCB West Copyright 2005 Mentor Graphic Corporation. All Rights Reserved.
Mentor Graphics is a registered trademark of Mentor Graphics Corporation.
2006. She can be reached at All other company and/or product names are the trademarks and/or
registered trademarks of their respective owners.
susy.webb@suntroncorp.com.

JANUARY 2006 PRINTED CIRCUIT DESIGN & MANUFACTURE 21

 GLOBAL MARKETS
JAPAN’S PCB Industry
Japan’s board makers continue to grow – and invest heavily abroad.
by DR. HAYAO NAKAHARA
In 2004, Japanese PCB production
reached $10.3 billion, about 90% of its
past peak. Japanese overseas produc-
tion of PCBs was $3 billion. This
amounted to over $13 billion in domes-
tic and overseas production in 2004,
approximately 33.5% of the world’s
production of $38.8 billion. On the
other hand, Japan’s strongest rival in
the past, the U.S., produced about $6.5
billion altogether in the U.S. and over-
seas, half that of Japan in 2004. Why?
The Japanese electronics industry is
diversified, with each sector of the indus-
try equally divided: consumer electron-
ics, computers, telecommunications,
automotive and semiconductor package
substrates. The Japanese PCB industry is
blessed by this diversification.
Business practices in Japan also
help its PCB industry. Short lead time,
higher standards of quality, higher
technology requirements, low-vol-
ume/high-mix ordering and flexibility
required in delivery deter neighboring
Asian PCB producers from entering
Japan in a big way.
On the contrary, the U.S. electron-
ics market is heavily dependent on
computers and telecommunication
equipment. Now, military electronics is
strong and nearly 20% of domestically
produced PCBs go to military applica-
tions ($850 million). Automotive
PCBs, which once made up more than
15% of U.S. PCB production, have all
gone to Asia, practically speaking.
Today, a huge proportion of PCB
assembly for U.S. PCB users takes place
in China, which pushes EMS providers
to purchase more PCBs in China. But
22 PRINTED CIRCUIT DESIGN & MANUFACTURE
Japan still does more than 80% of its
PCB assembly in-house to keep Japan-
ese PCB makers busy. The ups and
downs of PCB orders in Japan are not
as drastic as experienced in the U.S.
History Class
TABLE 1 is borrowed from Japan Elec-
tronics Packaging and Circuits Associ-
ation (JPCA) statistics and highlighted
by this author. The author basically
agrees with this data, but he shall pin-
point some of discrepancies later.
Despite small faults, data collection
is improving every year as Japanese PCB
makers, who report in the beginning of
each year, are becoming more coopera-
tive. The most difficult task lies in mea-
suring flex output. Japanese flex produc-
tion is dominated by several large makers
such as Nippon Mektron, Fujikura
Corp., Sumitomo Denko, Nitto Denko,
Sumitomo Bakelite, Maruwa Manufac-
turing Co. and Sony Chemical. All of
these board makers have substantial
overseas production. As a matter of fact,
today, more than half of the output of
Nippon Mektron and Fujikura is derived
from overseas operations. In reporting
their output, some of them mix domestic
and overseas production because it is dif-
ficult to draw a line between the value of
the front-end processes done in Japan
and the back-end processes performed
largely at overseas facilities.
Microvia board production is also
difficult to quantify, particularly in the
“module” (IC substrate) category. A sub-
stantial portion of microvia IC substrates
is sold to Intel. Because of non-disclosure
agreements between Intel and its suppli-
ers, accurate data was not reported to
JPCA until recently. But everyone knows
approximately how much Intel is buying
from Ibiden, Shinko Electric and NTK,
as these suppliers seem to report more
accurate figures.
After the Plaza Accord in 1985, the
value of the Japanese yen skyrocketed. In
order to cope with this difficult situation,
the Japanese rushed to Southeast Asia for
manufacturing. Today, a good portion of
PCB production in Southeast Asia is
made by Japanese transplants, to the
tune of $1.3 billion per annum – about a
half of SEA (Singapore, Malaysia,
Indonesia, Thailand, Vietnam and Philip-
pines) production. Today, more than
10% of China’s PCB production is made
by Japanese transplants there.
Approximately $300 million in
overseas flex output contains flex
assembly (TABLE 2). Whether or not the
JPCA statistics in Table 1 contain this
flex assembly value is not known.
Microvia board production value is also
flawed. Ibiden, CMK and Meiko are
three major microvia multilayer board
producers in China. Fujitsu Vietnam,
Toppan-NEC Philippines and Hitachi
Chemical Singapore also produce
microvia multilayer boards. Daisho-
Microline, a Japanese-Hong Kong JV in
Huizhou, makes microvia boards. The
value of microvia boards made by this
JV is not accounted for because its
Japanese partner, Daisho, is a minority
shareholder. The production totals for
these makers comes to about $200 mil-
lion ($108 million in the table).
The IC substrate category is com-
plex to understand. It is estimated that
JANUARY 2006
TABLE 1. Japan’s PCB production from 2000-2005*
PCB CATEGORY 2000 2001 2002 2003 2004 2005(F)
Rigid SSB 648 421 341 311 311 299
DSB
MLB MLB TTL
2190
5562
1754
4302
1567
3518
1529
3561
1578
3665
1590
3902 PADS
4L
6L
1922
1869
1487
1551
1349
1101
1333
1084
1321
1081
1364
1134
IT’S EVERYWHERE
8L 894 660 724 795 840 951
10+L 876 604 345 349 423 446
Microvia 4L 40 25 16 42 58 86
(included in MLB) 6L 653 526 355 426 442 474
8L 359 373 509 527 600 700
10+L 138 107 77 65 65 70
microvia TTL 1190 1031 941 1060 1165 1330
Rigid Total 8400 6477 5426 5401 5554 5791
Flex SSB 1085 830 887 955 871 923
DSB 542 492 542 806 934 1060
MLB 142 105 191 282 246 274
Microvia (inclusive) 0.4 1.5 0.2 12.4 17
Rigid-Flex 56 23 41 201 191 240
Flex Total 1825 1450 1661 2244 2242 2497
Module Rigid 2297 1907 1837 1848 2063 2141
Tape 494 324 674 803 884 992
Microvia (inclusive) 292 538 1063 1058 1237 1326
Module Total 2791 2231 2511 2651 2947 3467 ® ®
PADS and HyperLynx
Microvia Total 1482.4 1569 2005.5 2118.2 2414.4 2673 Available through Value Added Resellers
GRAND TOTAL 13016 10158 9598 10296 10745 11755
Source: JPCA & N.T. Information Ltd. *In hundreds of millions of yen.
PADS resellers are full-service
companies that provide sales,
Ibiden produced about $180-$200 mil- Kyosha in Tijuana, Mexico, which was
tech support and customized
lion worth of IC substrates in the closed at the end of March.
Philippines, all of which were of In Europe, Nippon Mektron’s JV, services in your region. These
microvia structure. Sumitomo Metal Freudenberg-Mektec, operates two resellers are our partners; they
Electro Device in Malaysia had BGA plants in Germany and one in Bud-
understand your needs and
and CSP production worth approxi- weise, Czech Republic. CMK had a
mately $60 million in 2004. These add single-sided board plant in Belgium, can help you grow your
up to $260 million instead of the $148 but it was closed last year. business. PADS resellers provide
million indicated in Table 1. In China, we find Ibiden, CMK
solutions that will improve the
(three locations plus the JV CMK-GBM),
Overseas Production Nippon Mektron (three locations), quality of your designs on time
It is unknown who reports to JPCA Meiko (two plants in Nansha, a third and within budget. Visit
regarding Japan’s overseas production, one yet to be built, and one more to be www.mentor.com/rd/buypads
although this author can venture a built in Wuhan), YKC (one location and
or call us at 800.547.3000
good guess. TABLE 3 shows Japanese a JV), Fujikura, Cosmo Denshi, Daisho
overseas production in 2004 by coun- (a JV), Yamamoto Mfg., Sony Chemical, to find your local reseller.
try, both according to JPCA. The total Nitto Denko, Sumitomo Denko (a col-
value (3,040.4 x 100 million yen) laborator and a new plant), Santa Light
shown in this table does not match the Metal, Shirai Denshi (a JV), Kyosha,
value in Table 1 (2,709.4 x 100 million Maruwa Mfg. and Matsushita Electric
Yen). This is an error made by JPCA. Works. This totals 17 plus two JVs with
The number of makers reported does Japanese minority shares.
not add up to the total because some In Taiwan, there are four Japanese
makers have multiple plants in different makers: Hitachi Chemical, Nippon Mek- Copyright 2005 Mentor Graphic Corporation. All Rights Reserved.
Mentor Graphics is a registered trademark of Mentor Graphics Corporation.

countries. In North America, there were tron (two plants), Tai Hong Circuit All other company and/or product names are the trademarks and/or
registered trademarks of their respective owners.

two PCB makers: Ibiden at Elgin, IL, and Industry (two plants plus one in China)

JANUARY 2006 PRINTED CIRCUIT DESIGN & MANUFACTURE 23

 GLOBAL MARKETS

TABLE 2. Japan’s overseas production by board type excluding the “assembly value” mainly involving flex.
PCB TYPE NO. OF MAKERS 100 MILLION YEN $US MILLIONS PCB trade between Japan and Asian countries has
increased dramatically (TABLES 4 and 5). About 30% of Japan-
SSB 11 494.3 449
ese exports to Asia go to Intel, which operates in the Philip-
DSB 12 305.7 278
pines, Malaysia and China. Most of the remaining exports go
MLB 11 478.9 435 to Japanese OEMs, which indicates increased Japanese elec-
Microvia 6 118.5 108 tronics manufacturing activities in non-Japan Asia.
Rigid Total 1278.9 1162 More than a third of Japan’s exports are IC substrates,
Flex 8 1,267.10 1,152 mainly to Intel, Samsung Electronics and other semiconduc-
tor makers. Most exports are complex products that cannot
IC Substrate 2 163.3 148
be fabricated easily overseas.
TOTAL 24 2,709.40 2,463
Of about $1.3 billion in imports in 2004, less than half
Source: JPCA & N.T. Information Ltd. come from foreign board makers. In other words, a major
portion of imports are from Japanese PCB makers operating
TABLE 3. Japan’s 2004 overseas production by country in Asia. Unlike North America and Europe, which are bom-
COUNTRY NO. OF MAKERS VALUE VALUE NO. OF MAKERS barded with imports from Asian countries (very few from
REPORTED 100 M YEN $ MILLION ACTUAL (NTI) their own stocks), Japanese imports from non-Japanese PCB
N. America 1 30.0 28.6 2 makers are relatively low, especially considering that Japan is
Europe 2 62.2 59.2 2 surrounded by low-cost countries.
China 11 1076.3 1025.0 17 There are several reasons for this import/export imbalance.
Taiwan 4 328.0 312.4 4
PCBs used in Japan generally require higher density than those
mass produced in non-Japan Asia. Quality requirements are also
Malaysia 7 261.2 248.8 5
tough. Many Asian PCB makers lament that Japanese demand
Singapore 2 30.0 28.6 1 “international price with Japanese specs.” Requirements for
Philippines 4 428.2 407.8 6 “green” PCBs are also increasing rapidly in Japan, much faster
Others 11 824.5 785.2 8 than in the rest of Asia. Short delivery time requirements chal-
TOTAL 26 3,040.4 2,895.6 30 lenge Asian makers. And most Asian makers are not efficiently
Source: JPCA & N.T. Information Ltd.
set up to handle Japan’s typical high-mix, low-volume orders. As
Japanese PCB makers have been stepping up overseas expan-
sion, it is a tough slope to climb for foreign makers to export
TABLE 4. Japan’s PCB export history*
into Japan, but the reward is high once they succeed.
REGION 1998 1999 2000 2001 2002 2003 2004
N&S America 1,312 1,398 1,301 791 604 659 437 Microvia Production
Europe 157 385 426 280 189 130 180 Although non-Japan Asian countries are rapidly growing
Asia 804 1,433 1,750 1,361 1,335 1,399 2,639 their microvia production, Japan still leads this field with
Others 2 8 33 81 322 364 31
$2.3 billion (at 1.05 yen/$US exchange rate) in 2004, accord-
ing to JPCA. Actually, this author believes the figure was
Total 2,275 3,224 3,510 2,513 2,450 2,552 3,287
more like $2.55 billion. Of the estimated $350 million rigid-
TOTAL ($M) 2,106 2,985 3,250 2,327 2,268 2,363 3,043 flex boards produced in Japan, two thirds had microvia
Source: JPCA & N.T. Information Ltd. *In hundreds of millions of yen. 108 yen/$US conversion used. structures not accounted for by JPCA.
In 2004, Ibiden was the largest microvia board maker in
and Panasonic Electronic Devices. the world, with approximate production of $1 billion, of
In Malaysia, there are five: Hokuriku Denko, CMK, Sumit- which 75% was IC substrates. Ibiden makes a substantial
omo Metal Electro Devices, Maruwa Mfg. and Elna. portion of this in the Philippines (somewhere around $200
In Singapore, Hitachi Chemical is the only Japanese PCB million, as mentioned). This author’s estimate of microvia IC
manufacturer. CMK got out of manufacturing and Senri went substrate production in Japan in 2004 is about $1.32 billion.
bankrupt and was bought by Circuit Plus (its manufacturing Overseas production of Japan’s microvia boards in 2004
plant is in Malaysia and no longer considered Japanese). is estimated to have been $375 million (Ibiden had the lion’s
CMK maintains just a sales and service office in Singapore. share). Therefore, the total Japanese microvia board produc-
In the Philippines, there are six manufacturers: Ibiden, tion including domestic and overseas productions was about
Toppan-NEC, Itabashi Seiki, Nippon Circuits, Sumitomo $2.925 billion in 2004, or about 47% of the total global pro-
Denko (First Sumiden) and Sumitomo Bakelite. duction of $6.25 billion that includes IC substrates.
The “others” mentioned by JPCA are probably Vietnam IBM Yasu (now Kyocera SLC Technology) developed the
(Sumitomo Bakelite, Fujitsu, Nitto Denko), Thailand (Toei Den- first microvia technology called Surface Laminar Circuits in
shi, Panasonic Electronic Devices, Nippon Mektron and Fujiku- the late 1980s and commercialized the technology in 1991. It
ra) and Indonesia (CMK and Kyosha). For those who have was based on a photosensitive dielectric material, “Probimer
time, please count the total. The total enumeration of Japanese 52,” developed by Ciba Geigy. Today, few parts are fabricated
overseas PCB production by this author is about $2.815 billion, with the “photovia” process and only in Japan. The majority

24 PRINTED CIRCUIT DESIGN & MANUFACTURE JANUARY 2006

 ™
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 GLOBAL MARKETS
of microvia boards are fabricated using the laservia process.
However, in Japan, there are other variations of microvia
processes, such as ALIVH, B2it, FACT-EV, PALAP, NMBI, etc.
The total output by these technologies is estimated to be about
$400 million ($320 million from ALIVH alone).
It is useful to compare microvia output for 2003 and 2004
(TABLES 6 and 7). It is estimated that in monetary terms, about
50% of microvia boards were those used for cell phones world-
wide in both 2003 and 2004. However, the situation is differ-
ent in Japan. Japan had much more diversified applications of
microvia boards. Besides IC substrates that took up more than
half of the microvia boards produced in Japan, cell phones, car
navigation systems, digital still cameras, video cameras, battery
drivers, camera modules, Bluetooth modules and a variety of
other applications are found in Japan. More than 50 PCB mak-
ers are actively engaged in the manufacture of microvia boards
in Japan with about 1,200 laser drilling machines.
Japan’s PCB Manufacturers
A list of the top 2004 Japanese PCB makers is shown in
TABLE 8. There are approximately 320 PCB makers in Japan.
In 2004, the top 40 makers produced $8.647 billion in Japan
($11.59 billion including overseas) and $2.948 billion over-
seas. Since the total domestic production was about $10.23
billion, the $8.647 billion output by the top 40 makers
accounted for 85%. When it comes to overseas production,
nearly 100% was manufactured by the top 40 board makers.
Their overseas production will continue to expand as they
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ph: (856) 769-9050, fax: (856) 769-9058
www.compufab.com
26 PRINTED CIRCUIT DESIGN & MANUFACTURE
add new plants and expand existing operations. This is sim-
ilar to the case of the large U.S. makers such as Multek,
Viasystems, Sanmina-SCI, M-Flex, Innovex, 3M, Parlex, etc.
Other PCB makers will probably show up in the top
2005 list, such as Sharp Corp., which commenced a new flex
operation. Japanese PCB makers are investing more than
$1.2 billion in the 2005/2006 time frame – not only in China
and other Asian countries, but also in Japan. This investment
is for new plants, the expansion of existing plants and new
equipment. This amount of investment will certainly bear
fruit in the 2006/2007 period. There will be a new Ibiden
plant in Beijing, a new Nippon Mektron plant in Suzhou,
two new Meiko plants (one in Nansha and one in Wuhan), a
new Sumitomo Denko plant in Suzhou, a new CMK plant in
Thailand or Vietnam, and much more.
After the IT bubble burst in 2000, laminate production in
Japan stayed low for a few years, though the volume kept
inching up. Then, 2004 saw a big jump in production volume
(TABLE 9).
Japanese laminate production is unique in that rigid FR-
4 is much less than CEM-3. The majority of double-sided
boards for consumer products are made of CEM-3 laminates.
Paper phenolic laminate production volume has dwindled,
with only one small subcontract board maker engaged in
paper laminate production. Eventually, paper laminate pro-
duction will disappear in Japan.
Matsushita Electric Works makes more than 500,000 m2
per month in China (Suzhou) and 700,000 m2 in Thailand
(Ayuthaya). Sumitomo Bakelite makes about 1 million m2 per
month in Malaysia (Johor). Hitachi Chemical also makes about
1 million m2 per month in Johor. The Sumitomo and Hitachi
plants are five minutes apart. The total production volume by
these three paper laminate makers is about the same as at the
peak volume in Japan 15 years ago.
These three laminators make also glass epoxy laminates in
China. Matsushita in Guangzhou (located very close to Taiwan’s
Grace Electron) has current capacity of about 200,000
m2/month. Matsushita closed its Oregon glass epoxy laminate
plant in June 2005 and moved the majority of that equipment to
Suzhou. The Suzhou plant, scheduled to commence production
in the end of 2006, will have glass epoxy laminate production
capacity of 200,000 m2/month. In the meantime, Matsushita
trimmed its Taiwan capacity in from 640,000 m2/month to
400,000 m2/month by closing one of the two factories in
Hsinchu. This Matsushita operation, NPL, is a JV between Mat-
sushita and Compeq. Matsushita operates two plants in Europe
– one in Austria, one in Italy. Both are engaged in the manufac-
ture of glass epoxy laminates.
Sumitomo Bakelite makes glass epoxy laminate and
CEM-3 in Macao, where Nittobo has a glass cloth manufac-
turing operation (2 million m2/month). Hitachi Chemical
commenced glass epoxy laminate production in Hong Kong
in collaboration with Hong Kong-based Meadville Group
(Mica-Ava). Hitachi recently expanded its capacity to
150,000 m2/month. Hitachi’s laminates made in Hong Kong
are high-Tg and halogen-free laminates.
As the investment by Japanese PCB makers is increasing in
China, Risho Kogyo (little known outside Japan) also con-
JANUARY 2006
TABLE 5. Japan’s PCB trade history*
TRADE 2004 2002 2000
PARTNERS Export Import Export Import Export Import
China 718 555 553 291 359 194
S.Korea 507 148 361 79 355 61
Hong Kong 352 14 221 13 254 12
Taiwan 310 279 138 190 245 142
Philippines 257 60 287 66 327 76
Thailand 182 141 89 53 106 52
Malaysia 140 9 228 7 252 8
Vietnam 122 1 41 1 3 0
Singapore 85 6 89 5 172 3
U.S.A. 329 39 200 20 326 24
Others 257 140 243 88 562 50
TOTAL 3259 1392 2450 813 2961 622
$ Millions 3018 1290 2268 753 2742 576
Source: JPCA & N. T. Information Ltd. *In hundreds of millions of yen.

TABLE 6. Japan’s HDI microvia board production in 2003

LAYER 100 $ meters2 $/meters2 $/sq. in
COUNT MILLION Y MILLION in 1000s
4 42.4 40.4 112.3 360 0.233
6 425.7 405.4 740.9 547 0.355
8 527.4 502.6 747.1 673 0.437
10+ 64.6 61.5 47.8 1,287 0.835
Subtotal 1060.1 1009.9 1648.1 613 0.398
Flex microvia 0.2 0.2 0.2 1,000 0.992
IC Substrate 1057.9 1007.0 582.4 1,652 1.072
TOTAL 2118.2 2017.1 2230.7 904 0.587
Source: JPCA & N.T. Information Ltd. Note: In 2004 exchange rate.

TABLE 7. Japan’s HDI microvia board production in 2004

LAYER 100 $ meters2 $/meters2 $/sq. in
COUNT MILLION Y MILLION in 1000s
4 58.3 55.5 140.3 396 0.257
6 441.5 420.5 809.9 519 0.337
8 599.5 571.0 814.4 701 0.455
10+ 65.2 62.1 67.9 889 0.577
Subtotal 1164.5 1109.1 1832.5 605 0.393
Flex microvia 12.4 11.5 9.5 1210 0.786
IC Substrate 1236.6 1178.0 743.4 1,585 1.028
TOTAL 2413.5 2298.6 2585.4 889 0.577
Source: JPCA & N.T. Information Ltd.

structed a laminate plant in Suzhou. The average annual rev-

enue growth of Japanese PCB makers in China is expected to
be between 13 and 14%, according to JPCA inquiry. The
growth of laminate consumption by Japanese PCB makers in
China is expected to be in the vicinity of 8 to 9%.
Current monthly production capacity of rigid PCBs in China
by Japanese makers stands at about 300,000 m2, of which 20%
is for microvia boards. There are several PTH board makers in
China that have similar production capacity per month, but the
value of the PCBs Japan produces seems to be higher than that of
conventional PTH boards.

JANUARY 2006 PRINTED CIRCUIT DESIGN & MANUFACTURE 27

 GLOBAL MARKETS

TABLE 8. Top 40 Japanese PCB makers, in millions of U.S. dollars

RANKING 2003 2004 2004 OVERSEAS PLANT
TOTAL TOTAL OVERSEAS LOCATIONS
1 Ibiden 1076 1226 400 China, Philippines, US
2 Nippon Mektron 1175 1205 540 Taiwan, Thailand, China, Europe
3 CMK 1099 1105 240 China, Malay, Indonesia
4 Shinko Electric Industry 635 715 Large Intel business
5 Hitachi Chemical 657 658 240 Taiwan, Singapore
6 Fujikura 419 540 380 Thailand, China
7 Panasonic Elec Devices 333 340 50 Taiwan, Thailand
8 Nitto Denko 300 339 85 China, Vietnam
9 Meiko Electronics 260 335 140 China
10 Kyoden PCB Group 276 321 55 Vietnam
11 Toppan-NEC 314 295 40 Philippines
12 Sumitomo Denko 267 285 90 China, Philippines
13 MCS (Mitsui Mining) 245 257 No. 1 in COF
14 Mitsusbishi GC Group 240 253 140 Taiwan, China
15 Daisho Denshi 240 251 JV in China
16 Elna 187 228 35 Malaysia
17 Sumitomo Bakelite 210 219 68 Vietnam, Philippines
18 Sony Chemical 210 219 80 China (flex)
19 Shirai Denshi 175 219 90 China JV
20 Fujitsu Interconnect Tech 232 214 54 Vietnam
21 Shindo Denshi 200 210 Similar to MCS
22 NTK 170 175 Collaborate w/ Nanya
23 Maruwa Corp. 109 171 63 Indonesia, Malay, CN
24 Shinko Mfg 161 169 Sumitomo Mining
25 Kyosha 102 138 61 China, Indonesia
26 Sanwa Denshi Ckt 127 133 Combined 4 units
27 Eastern Co Ltd. 95 125 60% CSP
28 Yamamoto Mfg 116 124 18 China
29 Casio Micro-Electronics 106 120 Reel-to-Reel FBGA
30 Arrk PCB Group 0 111 Newly created
31 Airex Inc. 152 109 Tokyo Computer SVC
32 Sakai Denshi 95 98 Subcon for Sharp
33 Itabashi Seiki 95 98 10 Philippines
34 Yamanashi MEW 92 97 10 China
35 Hitachi Cable 86 95 2-metal flex BGA
36 Santa Light Metal 89 93 4 China (flex back end)
37 Kyocera SLC Tech 82 90 $180M new plant
38 Kyoei Sangyo 74 78 Struggling
39 Nihon Auto Giken 73 70 Masslam
40 Hokuriku Denko 65 67 55 STH operation, Malay
TOP 40 TOTAL 10,639 11,595 2,948
Source: N.T. Information Ltd. Note: 105 yen/$US conversion used.

stances (RoHS) directives seriously.

RoHS and WEEE Usage of halogen-free laminates and sol-
The Japanese to take the Waste Electri- der resist is becoming more pronounced
cal and Electronic Equipment (WEEE) each year. JPCA inquired about the pro-
and Restrictions on Hazardous Sub- portion of halogen-free laminates to the

28 PRINTED CIRCUIT DESIGN & MANUFACTURE JANUARY 2006

 GLOBAL MARKETS
total in Japan in 2001. About TABLE 9. Japan’s domestic laminate production, 2000-2004 and depict shipment trends
3% of glass epoxy laminates CATEGORY 2000
and 5% of paper laminates
Paper
were halogen-free in 2001.
CEM-3
Since then, for some reason,
JPCA stopped making FR-4
inquiries regarding halogen- ML
free laminates. Masslam
Although the accurate Prepreg
percentage of halogen-free
TOTAL
laminates out of all laminates
Source: Japan Synthetic Resin Association. Note: Units are meters2 (in thousands)
produced in Japan is not
known, it is considered to be
in the vicinity of 10 to 15% in 2005,
more in paper laminates than epoxy
glass laminates, according to the lami-
nators interviewed.
Use of lead-free soldering is more
in the limelight than halogen-free sub-
stances because the WEEE and RoHS
directives forbid the use of six sub-
stances, including lead, as of July 1,
2006 in the European Union. Many
variations of lead-free solder have been
suggested and used. However, the
SnAgCu combination seems to be the
most popular, making up probably
90% of today’s lead-free solder.
Due to the higher soldering temper-
atures required compared to that of
PbSn solder, SnAgCu solder causes some
problems – damage to components, lam-
inates and solder tanks. However, one
American EMS engineer recently com-
mented that among 20 or so solders he
tried, the top five solders from the view-
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30 PRINTED CIRCUIT DESIGN & MANUFACTURE
2001 2002 2003 2004 compiled by JEITA, which
covers about 70% of the
2,935 1,174 2,547 1,568 688
total shipments in Japan.
10,802 8,552 9,062 8,222 8,577
Although Japan’s PCB
3,885 3,074 3,408 3,599 3,837 shipments started to decline
21,995 15,337 15,587 16,580 19,701 around August 2004 and
3,327 2,006 2,051 2,054 2,180 stayed fairly flat for the next
35,366 26,321 27,118 30,467 36,370 nine months, there is a sign of
activities from the end of the
78,310 56,464 59,773 62,490 71,353
second quarter of 2005. The
author predicts plus or minus
zero growth for Japan’s PCB
point of performance (wettability, industry in 2005, considering a poor first
repairbility and reliability in soldered half but a reasonably strong second half.
joint) came from Japanese suppliers. Mass production of commodity
It is recognized that 100% lead-free PCBs will continue to migrate to China
solder is not possible. So the world seems and other low-cost Asian countries.
to have accepted a final lead content Technology development is the key ele-
below 0.1%, at least for the time being. ment for the Japanese PCB industry, not
Various attempts are being made in only for survival but also for growth.
Japan to improve lead-free soldering. A With the loss of nearly all of the captive
more highly active flux to compensate shops that provided much of the R&D
for the poorer wettability of lead-free in the past, the collaboration among
solder is one idea, but in solving one PCB, equipment and material makers
problem it creates another: worse long- are an absolute necessity for the devel-
term reliability. SnZn solder is being opment of advanced technologies.
investigated in an effort to reduce high These manufacturers are doing
soldering temperature of SnAgCu sol- exactly that. Such collaboration is visi-
der, whose melting point is between ble in laser drilling technologies, AOI
220˚C and 230˚C. equipment, laser direct imaging, more
Although the PCB industry in stable halogen-free laminates, lead-free
Japan saw healthy growth in 2004, the soldering, production equipment of
business in the first half of 2005 was flex (reel-to-reel), and adhesiveless
lukewarm. FIGURES 1 and 2 (online) FCCL, to name a few. In the two years
are borrowed from Custer Consulting from 2005 through 2006, Japanese
PCB makers will spend about $1.2 bil-
lion for expansion and new plants in
Japan and abroad. The fruits of this
DOWNLOAD OUR FREE PCB SOFTWARE
www.free-pcb-software.com investment will come after 2006 and
Japan will still be able to maintain
above 30% share of the global PCB
production for the foreseeable future.
Yes, China’s production will exceed
that of Japan, but 90% of China’s pro-
duction comes from foreign transplants,
including Japanese board makers.
Japan’s presence in China will continue
to increase, considering the heavy
investment being made there. PCD&M
Ed.: The entire article with all figures
can be found at www.pcdandm.com.
08 54 1
: 1877t.c3om9
DR. HAYAO NAKAHARA (nakanti@
REE
) L F
L
TO s@beta-layou yahoo.com) is president of N.T.
sale Information (Huntington, NY) and a
contributing editor at PCD&M.
JANUARY 2006
 ?

How do you manage risk

when you can’t identify it?
Use Innov-X analyzers and mitigate Trust but Verify. Innov-X Alpha Series™ handheld XRF
and Hawk-i Series™ micro XRF bench top analyzers provide
the impact of RoHS / WEEE.
fast, precise, “point-and-shoot,” non-destructive screening
for prohibited hazardous
Based on RoHS/WEEE Directives, Electrical and
materials in plastic parts,
Electronic Equipment (EEE) products must be free
circuit boards and electronic
of hazardous amounts of six restricted materials.
components. Toxic metals are
screened for compliance
The Risk. I f y o u a r e a verification and documented
manufacturer, component traceability. In just seconds,
s u p p l i e r, c o n t r a c t prohibited materials are
manufacturer or service screened and documented. Hawk-i Series™ micro XRF.
provider of EEE products,
the presence of prohibited Contact Innov-X today. Find out how soon you can
amounts of any of these be managing your product’s risks. Also, plan to attend
materials could prove and visit us at one of the RoHS / WEEE Industry Panel
Alpha Series™
very costly to manufacturing, handheld XRF. Discussions conducted by the Alliance of Service Providers
supply chain management, & Manufacturers in Palo Alto, Irvine, Austin, Chicago,
and in fines or litigation. Boston and New York.

Important Questions. How can you be sure your EEE TM

products are free of hazardous materials ? You can’t see

them. Certifications are helpful. But what if someone
else makes a mistake ? Are you still liable ? Will your
customers hold you fully accountable ?
I n n o v a t i v e X R F Te c h n o l o g i e s
Innov-X Systems, Inc. Worldwide Headquarters, Woburn, MA USA
(781) 938-5005 (866) 4-Innov-X www.Innov-Xsys.com
©2005 Innov-X Systems, Inc. All rights reserved.
 2006 BUYERS GUIDE • SPECIAL SUPPLIERS SECTION
3M
3M Center
St Paul, MN 55144
651-733-6577, fax 651-736-1587
www.3m.com/phototool
SEE OUR AD ON P. 11
Abba Rubber International
Inc.
13510 E. Philadelphia St.
Ontario, CA 91761
909-947-1244, fax 909-947-6997
www.abbarubber.com
ABBA Rubber International, Inc., is the
worldwide leading manufacturer of
precision rubber rollers. ABBA re-
covers and fabricates precision products
for variety of printed circuit board
manufacturers’ equipment, such as,
laminator, tacky, wet process rollers and
molded parts. ABBA is also the exclusive
manufacturer of the ACCUTHERM™
roller. The ACCUTHERM™ rollers
contain proven isothermal technology
providing nearly perfect temperature
profiles form end to end compared to
conventional rollers. The ACCUTHERM™
rollers can be fabricated for most
laminators.
Accutrace Inc.
3072 Scott Blvd.
Santa Clara, CA 95054
847-806-0003, fax 847-806-0004
www.PCB4U.com
Accutrace is a trusted partner for
customers looking for a Value Added
PCB supplier. Using our “Service is
Second to None” approach, Accutrace
has become “The Choice” vendor to
customers requiring high quality Single,
Double and Multi-layer Prototypes or
Production at a competitive price.
Email: sales@PCB4u.com
SEE OUR AD ON P. 45
32 PRINTED CIRCUIT DESIGN & MANUFACTURE
Arlon Technology Enabling
Innovation
9433 Hyssop Dr.
Rancho Cucamonga, CA 91730
909-987-9533, fax 909-987-8541
www.arlon-med.com
Arlon Materials for Electronics
manufactures copper clad laminates and
prepregs (bonding materials) for high
performance, SMT, R/F and Microwave
double-sided or multilayer printed wiring
boards. Arlon products include high
temperature (polyimide and epoxy)
thermoset systems, low dielectric
constant/low loss materials based on
PTFE and other resin systems, high
dielectric constant laminates, laser-
ablatable nonwoven aramid materials for
SMT and microvia applications
(including a new “Green” system), and a
variety of products designed for thermal
management and heat sink bonding.
SEE OUR AD ON P. 28
Beta Layout
2033 Gateway Place, Suite 500
San Jose, CA 95110
877-390-8541, fax 866-557-1249
www.pcbpool.com
SEE OUR AD ON P. 30
CMR Summit Technologies
850 Selkirk
Pointe-Claire, Quebec, H9R 3S3
Canada
514-428-1229, fax 514-428-5953
www.cmrsummit.com
CMR Summit Technologies specializes in
providing its customers the ideas,
products and services they need to
sustain a valuable competitive
advantage. With you from start to finish.
Computer aided engineering design and
manufacturing of specialty circuit boards.
For updates, visit www.pcdandm.com/bguide
Chemcut Corporation
500 Science Park Rd.
State College, PA 16803
814-272-2825, fax 814-272-5205
www.chemcut.net
Chemcut Corporation is a leading
supplier of wet processing equipment to
the PCB industry and backs them up with
the best support team in the
marketplace. We deliver superior
machines, competitive pricing, the finest
etch quality and replacement parts
shipped within 24 hours. More than
15,000 wet processing systems sold.
Circuit Design Specialties
Inc.
600 Development Dr., Suite 100
Plano, TX 75074
972-424-1007, fax 972-424-0278
www.circuitdesign.com
CDS offers complete, quick-turn assembly
services from prototypes to mid-level
production quantities. Our trained,
certified technicians and production
equipment can assemble through-hole or
SMT boards, even fine-pitch BGAs.
Repair and rework is also available.
Compufab Inc.
P.O. Box 68
Woodstown, NJ 08098
856-769-9050, fax 856-769-9058
www.compufab.com
SEE OUR AD ON P. 26
DownStream Technologies
563 Main St.
Bolton, MA 01740
800-535-3226
www.downstreamtech.com
SEE OUR AD ON P. 5
JANUARY 2006
2006 BUYERS GUIDE • SPECIAL SUPPLIERS SECTION

EMA Design Automation metallic silver, immersion tin, ENTHONE Hallmark Circuits, Inc. – “The Time Critical
P.O. Box 23325 DSR solder masks, ENVISION DMS-E Advanced Technology PCB Specialists.”
Rochester, NY 14692 metallization system, CUPROSTAR coppers For reliability, and solutions to your PCB
585-334-6001, fax 585-334-6693 and AlphaPREP oxide alternatives. challenges and Speed & Technology
www.ema-eda.com SEE OUR AD ON P. 25
requirements (impedance, B&B, VIP, HDI
microvia, RF, mixed dielectrics,) and/or MIL,
SEE OUR ADS ON PP. 3, 9, & 15
& AeroSpace, please contact our value
added engineering support team. Visit us at
eFabPCB www.HallmarkCircuits.com & tour our
2001 Landmeier Rd. state-of-the-art 72,000 sq. ft. facility.
Elk Grove Village, IL 60007
877-332-2722, fax 847-290-9823
www.efabpcb.com Flex Interconnect
SEE OUR AD ON P. 13 Technologies
1603 Watson Court
Milpitas, CA 95035
Electrochemicals 408-635-3550, fax 408-956-8278 Imagineering Inc.
5630 Pioneer Creek Dr. www.fit4flex.com 180 Martin Lane
Maple Plain, MN 55359 Flex Interconnect Technologies designs, Elk Grove Village, IL 60007
763-479-2008, fax 763-479-3344 manufactures and assembles Flex circuits, 847-806-0003, fax 847-806-0004
www.electrochemicals.com Rigid-flex and HDI flex from quickturn www.pcbnet.com
prototypes to high volume production. Founded in 1985, Imagineering, Inc. is a
SEE OUR AD ON P. 7
Capabilities include fine line, micro vias, value added PCB company specializing
high layer count, RoHS compliance and in FAST TURN Prototypes and
Mil-spec compliance. Sales contact: Sue Production. Rigid or Flex, Single to Multi-
Electronic Interconnect
Graham. Email: sue@fit4flex.com. layer, whether on the phone, or on the
2700 West Touhy Ave.
web, Imagineering will continue to
Elk Grove Village, IL 60007
provide you with the Best Service and
800-364-4844, fax 847-364-4892
Price. Email: sales@PCBnet.com
www.eiconnect.com
Front Panel Express SEE OUR AD ON P. 44
SEE OUR AD ON P. 27
309 S Cloverdale St., #E7
Seattle, WA 98108
Electronics Workbench 206-768-0602, fax 206-768-0679 Innov-X Systems
801-111 Peter St. www.frontpanelexpress.com 10 Gill St., Suite Q
Toronto, M5V 2H1 Woburn, MA 01801
SEE OUR AD ON P. 46
Canada 781-938-5005, fax 781-938-0128
416-977-5550, fax 416-977-1818 www.innov-xsys.com
www.electronicsworkbench.com GHDsign SEE OUR AD ON P. 31
19800 MacArthur Blvd., Suite 520
SEE OUR AD ON COVER 2
Irvine, CA 92612
949-553-7777, fax 949-553-7778
www.ghdsign.com
SEE OUR AD ON P. 46
Intercept Technology Inc.
1819 Peachtree Rd., #100
Atlanta, GA 30309
Enthone Inc./
Cookson Electronics 404-352-0111, fax 404-352-3744
350 Frontage Rd. www.intercept.com
West Haven, CT 06516 Intercept Technology Inc. offers Pantheon
203-799-4904, fax 203-799-1513 for RF, Hybrid, MCM, Analog, Digital, and
www.cooksonelectronics.com Mixed-Signal design layout, all within one
Hallmark Circuits Inc. application, seamlessly integrated with
Enthone Inc. offers total, integrated
13500 Danielson St. Mozaix schematic capture, INDX library
process solutions to the PWB fabrication
Poway, CA 92064 management, and 25+ database translators
industry. ENTHONE chemistry includes
858-513-2200, fax 858-453-1409 for an easy transition path. With ASCII-
ENTEK PLUS OSPs, AlphaLEVEL organo-
www.HallmarkCircuits.com

JANUARY 2006 For updates, visit www.pcdandm.com/bguide PRINTED CIRCUIT DESIGN & MANUFACTURE 33
 2006 BUYERS GUIDE • SPECIAL SUPPLIERS SECTION
based, platform-independent design
applications, Intercept provides users with
real time, leading-edge design technology.
K & F Electronics
33041 Groesbeck Hwy
Fraser, MI 48026
586-294-8720, fax 586-294-5999
www.circuitboards.com
K & F Electronics Inc. has over 30 years
of experience in printed circuit board
manufacturing. We are a company that
strives to gain a partnering relationship
with our customers. Special procedures
or needs are very adaptable with our 30
years of experience in the business.
Premium delivery is available on a 24
hour, 48 hours, 72 hours, or 5 day basis.
3-4 Week standard delivery.
MacDermid Inc.
245 Freight St.
Waterbury, CT 06702
203-575-5700, fax 203-575-7990
www.macdermid.com
SEE OUR AD ON P. 1
McCurdy Circuit Supply
4848 Lakeview Ave., Suite 202-C
Yorba Linda, CA 92886
714-425-3235, fax 714-242-1952
www.mccurdy.com
Test Fixture pins and fixturing supplies -
New and Recycled
34 PRINTED CIRCUIT DESIGN & MANUFACTURE
Mentor Graphics
Corp.
1811 Pike Rd.
Longmont, CO 80501
800-547-3000, fax 720-494-1266
www.mentor.com
You can find the answers to all your PCB
design challenges with solutions from
Mentor Graphics. Our three market-
leading flows, PADS, Expedition and
Board Station are each unique, yet
complementary in their strengths. No
other company can offer you such
complete, scalable solutions. Mentor
Graphics PCB design solutions will
deliver you a high return-on-investment,
eliminate the risk in your buying decision
and reduce your design times.
SEE OUR ADS ON PP. 19, 21, 23 & COVER 4
Midwest Accurate Grinding
17211 Morse St.
Lowell, IN 46356
219-696-4060, fax 219-696-4062
www.midwestaccurate.com
SEE OUR AD ON P. 46
National Graphic Supply
1848 West 11th St., #H
Upland, CA 91786
909-981-5655, fax 909-981-6332
www.ngspcb.com
National Graphic Supply, founded in
1974, is a national distributor for Konica
and Fuji silver films and NGS and Folex
diazo films, along with other related
phototool products. We provide a high
level of technical support from our 10
Technical Specialists to enhance our
customers artwork. We are the only
company that offers a Photo Quality
Management System.
For updates, visit www.pcdandm.com/bguide
NexLogic
345 E. Brokaw Rd.
San Jose, CA 95112
888-639-5644, fax 408-436-8156
www.nexlogic.com
Nexlogic is a premier provider for all
PCB Design Services, PCB Fabrication,
and PCB Assembly and Lead-Free
Assembly, Contract Manufacturing
Services. Our customers rely on us to
handle all the features of their printed
circuit boards projects.
Oak-Mitsui Technologies
80 1st St.
Hoosick Falls, NY 12090
518-686-8088, fax 518-686-8080
www.oakmitsui.com
Oak-Mitsui Technologies provides licensed
Buried Capacitance (BC) material under 1
mil. Our FaradFlex material is available in
24,16,12 and 8 micron dielectric thickness.
It is compatible with standard inner layer
processing and is strong and flexible. All
product is pre Hi-Pot (High-Potential)
tested at 500 volts. Higher Dk, ceramic
loaded versions are now available.
Online Electronics
1550 Higgins Rd., #122
Elk Grove Village, IL 60007
847-290-8690, fax 847-290-8691
www.pcb4less.com
SEE OUR AD ON P. 45
PCB Cart
Chang Ban Li 1-2-401
Chang Ban Xiang
Hangzhou, Zhejiang 310014, China
86-571-87013819, fax 86-571-87036705
www.pcbcart.com
SEE OUR AD ON P. 45
JANUARY 2006
2006 BUYERS GUIDE • SPECIAL SUPPLIERS SECTION

PCB Fab Express Starflex

1070 West Evelyn Ave.
Sunnyvale, CA 94086
408-857-0039
www.pcbfabexpress.com
SEE OUR AD ON P. 44
Polyclad Laminates Inc./
Cookson Electronics
40 Industrial Park Dr.
Franklin, NH 03235
603-934-5642, fax 603-934-2670
www.cooksonelectronics.com
Polyclad Laminates offers total, integrated
process solutions to the PWB fabrication
industry. POLYCLAD materials include high
reliability CAF resistant laminates,
prepregs, and resin-coated foils; Polyclad
halogen-free and polyimide materials.
Precision Technologies Inc.
1500 Midway Court, Bldg. W103
Elk Grove Village, IL 60007
847-439-5447, fax 847-439-5448
www.eprotos.com
SEE OUR AD ON P. 44
Printed Circuits Corp.
4467 Park Dr., Suite E
Norcross, GA 30093
770-638-8658, fax 770-638-8659
www.pcc-i.com
Printed Circuits Corp. is a high tech
Printed Circuit Board Manufacturing and
Assembly facility. PCC is a 25,000 s.f., fully
equipped facility, located in Norcross,
(Atlanta), Georgia. Quality is Priority One,
Zero Defect is our Goal and Customer
Satisfaction is our Pride. Please feel free
to visit our website at: www.pcc-i.com.
RBP Chemical Technology
Inc.
150 S. 118th St.
P.O. Box 14069
Milwaukee, WI 53214
414-258-0911, fax 414-258-7908
www.rbpchemical.com
Chemistries for circuit metaliztion,
preparation of innerlayers for multilayer
lamination, hole proparation and
electrolytic plating baths.
Rohm and Haas
Electronic Materials
455 Forest St.
Marlborough, MA 01752
508-229-7646, fax 508-229-0854
electronicmaterials.rohmhaas.com
Imaging and Metallization products used
to fabricate rigid and rigid flex printed
circuit boards. New product areas
include technologies for ink jet
soldermask, lead-free HASL and NPE-
free materials. Our product lines cover
the broad array of materials and
chemistry used in PCB fabrication such
as electroless and electrolytic plating
chemistries, liquid and dry film
photoresist, liquid and dry film solder
mask, alternative and conventional oxide
coatings, developers, strippers, surface
finishing, surface preparation chemicals,
laminates and lamination materials,
embedded optical waveguide materials,
embedded passives and process
equipment.
52 Meadowcroft St.
Lowell, MA 01852
978-937-3889, fax 978-453 2821
www.starflex.com
SEE OUR AD ON P. 46
Superior Processing
1115 Las Brisas Place
Placentia, CA 92870
714-524-8525, fax 714-524-8526
www.superior-processing.com
SEE OUR AD ON P. 45
Technic Inc.
1 Spectacle St.
Cranston, RI 02910
401-781-6100, fax 401-781-2890
www.technic.com
Real Time Analyzer (RTA) for on line
analysis and control of electrolytic
copper plating systems.
Uyemura
240 Town Line Rd.
Southington, CT 06489
860-793-4011, fax 860-793-4020
www.uyemura.com
Uyemura is the world’s leading supplier
of electroless nickel/immersion gold and
electroless gold systems. We are also the
leader in North America and have the
highest account retention in the industry.
We also offer a superior immersion silver
process and truly unique, high throw
nickel and acid copper processes.
SEE OUR AD ON P. 18

QA Technology Co. Inc. Sierra Proto Express Vicor Corp.

110 Towle Farm Rd. 1108 West Evelyn Ave. 25 Frontage Road
Hampton, NH 03842 Sunnyvale, CA 94086 Andover, MA 01810-5413
603-926-1193, fax 603-926-8701 800-763-7503, fax 408-735-1408 800-735-6200, fax 978-475-6715
www.qatech.com www.protoexpress.com www.vicr.com
SEE OUR AD ON P. 29 SEE OUR AD ON COVER 3 SEE OUR AD ON P. 46

JANUARY 2006 For updates, visit www.pcdandm.com/bguide PRINTED CIRCUIT DESIGN & MANUFACTURE 35
 20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

Visit the interactive PCD&M Buyers Guide at www.pcdandm.com/bguide for contact information for the companies listed in the Guide.
See the special Suppliers Section on page 32 for more information on bolded companies.
For updates, or to add or change your listing, visit www.pcdandm.com/bguide.

AIR DRIERS BEVELERS CLEANROOM COMPONENTS – PASSIVE

Advanced West Ceco Industries Inc. EQUIPMENT Accurate Screw Machine Corp.
BB Services Inc. Unichem Industries Christopher Associates Inc. Allied Electronics
C. A. Litzler Co. Inc. Julie Static Controls Excelsus Technologies Inc.
Domnick Hunter Inc. BLOWERS Midstates Marketing Fairchild Semiconductor
Genesys Industries Allied Electronics Knight Electronics
Integrated Process Systems Inc. Julie Static Controls CLEANROOM SUPPLIES Midstates Marketing
Midstates Marketing TechMarCon Inc. Blue Thunder Technologies Inc. Pulse
Multiline Technology Inc. GMP Graphic Media Products Inc. Raychem Circuit Protection
BRIGHTENER CHEMISTRY High-Tech Conversions Inc.
Mylydia Inc. Samtec
TechMarCon Inc. Electrochemicals (p. 33) Sprague-Goodman Electronics Inc.
Enthone Inc./Cookson Electronics (p. 33) COATING THICKNESS
Zander MEASUREMENT Taiyo Yuden (USA) Inc.
PCI Specialty Chemistry Inc. Teradyne Connection Systems
AIR EXHAUST SYSTEMS RBP Chemical Technology Inc. (p. 35)
SYSTEMS
BETZ & Co. Technic Inc. (p. 35) Fischer Technology COMPONENTS –
TechMarCon Inc. Uyemura (p. 35) Matrix Metrologies SOCKETS
Oxford Instruments Analytical Allied Electronics
AIR KNIVES CAM WORKSTATIONS Aries Electronics
Direct Logix COMPONENTS – ACTIVE
Integrated Process Systems Inc. Knight Electronics
Julie Static Controls Photo Chemical Systems Inc. 3Star Technologies Plaschem Specialty Products Pte. Ltd.
Spraying Systems Co. Allied Electronics Samtec
CAMERAS Fairchild Semiconductor
TechMarCon Inc. SOS Engineering
Lowrance Knight Electronics
ANALYZERS Quality Control Solutions Inc. Mohawk Innovative Technology Inc. COMPONENTS –
ATOMIC29 T-Tech Inc. SURFACE MOUNT
COMPONENTS – BGA
Mayer Associates Allied Electronics
CARTRIDGE FILTERS Doosan Cooperation Electro-Materials
Technic Inc. (p. 35) Dialight Corp.
KTH Sales Inc. BG Fairchild Semiconductor
ANODE BAGS Photo Chemical Systems Inc. Fairchild Semiconductor Knight Electronics
Ibiden Philippines Inc. S1 Technology Knight Electronics Kyocera America Inc.
IMC Serfilco Ltd. Kyocera America Inc. OhmCraft Inc.
KTH Sales Inc. Technic Inc. (p. 35) SOS Engineering Plasma Etch Inc.
Photo Chemical Systems Inc. Raychem Circuit Protection
CHEMICAL CLEANERS COMPONENTS – CHIP
S1 Technology SCALE Samtec
T-Tech Inc. Allied Electronics SOS Engineering
Technic Inc. (p. 35) Electrochemicals (p. 33) Altera Corp.
Sprague-Goodman Electronics Inc.
Titan International Inc. HengShui New Eastern Chemical Fairchild Semiconductor
Teradyne Connection Systems
Univertical Corp. Industry Co. Ltd. Kyocera America Inc.
International Products Corp. COMPONENTS – TCP
ANODE BASKETS COMPONENTS –
PCI Specialty Chemistry Inc. Knight Electronics
CONNECTORS
IMC Photo Chemical Systems Inc.
RBP Chemical Technology Inc. (p. 35) Allied Electronics CONFORMAL COATING
Photo Chemical Systems Inc.
RD Chemical Co. Aries Electronics ENCAPSULANTS –
S1 Technology
Technic Inc. (p. 35) Technic Inc. (p. 35) Automation Systems Interconnect (ASI) UNDERFILL –
Titan International Inc.
Inc. APPLICATION
CHILLERS Excel Cell Electronics (USA) Corp. EQUIPMENT
Univertical Corp.
Aqua Products Co. Inc. In2Connect Spraying Systems Co.
AUTOMATIC Technic Inc. (p. 35) Knight Electronics W. M. Hague Co. Inc.
LOADERS/UNLOADERS Midstates Marketing
Blackstone Scale Systems CIM SOFTWARE Samtec CONFORMAL COATING
Bacon Software SOS Engineering ENCAPSULANTS –
Ceco Industries Inc.
Cimnet Systems Inc. Teradyne Connection Systems UNDERFILL – CHEMICALS
Christopher Associates Inc. & EQUIPMENT
Dosco Products Co. Direct Logix TVS- Electronics
Technic Inc. (p. 35) EchoMail Inc. Christopher Associates Inc.
KUKA Controls GmbH
COMPONENTS – FLIP- W. M. Hague Co. Inc.
Universal Instruments CHIP
Optimal Electronics Corp. Zymet Inc.
AUTOMATIC OPTICAL Tecnomatix Unicam Doosan Cooperation Electro-Materials
INSPECTION/TEST BG CONFORMAL COATING
CLEAN AIR SYSTEMS Kyocera America Inc. ENCAPSULANTS –
AkroMetrix LLC UNDERFILL –
Christopher Associates Inc. Ceco Filters
COMPONENTS – LEADED ENCAPSULANTS,
Janus Technologies Corp. Christopher Associates Inc. UNDERFILL
JTAG Technologies Micron Solutions International Fairchild Semiconductor
Knight Electronics Lackwerke Peters GmbH + Co KG
Lloyd Doyle Midstates Marketing
Kyocera America Inc. Paradign Inc. div Peters
Micro-Vu Corp. Spraying Systems Co.
Lumex Inc. Tra-Con Inc.
PCB Prototyping
CLEANING EQUIPMENT Raychem Circuit Protection Zymet Inc.
Photo Chemical Systems Inc.
Quality Control Solutions Inc. BETZ & Co. Sprague-Goodman Electronics Inc.
CONNECTORS
GMP Graphic Media Products Inc.
BAG FILTERS COMPONENTS – Allied Electronics
Integrated Process Systems Inc.
LEADLESS Aries Electronics
KTH Sales Inc. Kelleys Engineering Works
Fairchild Semiconductor CDM North America
Photo Chemical Systems Inc. Photo Chemical Systems Inc.
Knight Electronics In2Connect
S1 Technology SDI
Kyocera America Inc. Knight Electronics
Serfilco Ltd. Spraying Systems Co.
Raychem Circuit Protection Methode Electronics Inc.
Technic Inc. (p. 35) Teknek
Samtec
Western Magnum Corp.
Teradyne Connection Systems

36 PRINTED CIRCUIT DESIGN & MANUFACTURE For updates, visit www.pcdandm.com/bguide JANUARY 2006
20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

COPPER ANODES Photo Chemical Systems Inc. DRY-FILM DEVELOPERS – Altium Inc.
Enthone Inc./Cookson Electronics (p. 33) Technic Inc. (p. 35) SEMIAQUEOUS Applied Wave Research
Fine-Line Circuits Ltd. Enthone Inc./Cookson Electronics (p. 33) AutoTRAX EDA Ltd.
DRILL BIT SHARPENERS Cadence Design Systems Inc.
IMC PCI Specialty Chemistry Inc.
Points North Inc. RD Chemical Co. ChipData
Photo Chemical Systems Inc.
Tycom Ltd. Direct Logix
S1 Technology
Technic Inc. (p. 35)
DRY-FILM DEVELOPERS – Electronics Workbench (p. 33)
DRILL BITS SOLVENT
Titan International Inc. EMA Design Automation (p. 33)
Darth’s Supplies & Services Enthone Inc./Cookson Electronics (p. 33) Intercept Technology Inc. (p. 33)
Univertical Corp.
Insulectro KAW/USA Ltd.
Victron Enterprises DRY-FILM LAMINATORS –
Laaper International Co. Mentor Graphics Corp. (p. 34)
COPPER CHEMISTRY LPKF Laser & Electronics CUT SHEET Oztronics
CLEANERS Midwest Circuit Technology Paramount Laminates Inc. PCB DFM Software
Enthone Inc./Cookson Electronics (p. 33) Photo Chemical Systems Inc. PCB Prototyping Plano CAD Engineering Inc.
IMC Points North Inc. Photo Chemical Systems Inc. Polar Instruments
PCI Specialty Chemistry Inc. Strel & Co. R4 Systems Inc.
T-Tech Inc. DRY-FILM LAMINATORS – Sigrity Inc.
Photo Chemical Systems Inc. HOT ROLL
RBP Chemical Technology Inc. (p. 35) DRILLING ACCESSORIES Trilogic
Advanced West Visionics
RD Chemical Co.
GMP Graphic Media Products Inc. Akash Technology
Technic Inc. (p. 35)
Midwest Circuit Technology Photo Chemical Systems Inc. EDA SOFTWARE – CAE
COPPER CONDITIONERS Mitsubishi International Corp. SOFTWARE
Multiline Technology Inc. DRY-FILM LAMINATORS – Agilent EEsof EDA
Electrochemicals (p. 33) VACUUM
Enthone Inc./Cookson Electronics (p. 33) Points North Inc. Altium Inc.
Sierra Polymer Co. Advanced West Ansoft Corp.
PCI Specialty Chemistry Inc.
Photo Chemical Systems Inc. DRY-FILM PHOTORESIST – Applied Wave Research
DRILLING MACHINES –
Technic Inc. (p. 35) LASER PRIMARY IMAGING Cadence Design Systems Inc.
ChipData
COPPER FOILS Accu-Tech Laser Processing Circuit Image Systems Inc.
Conversion Factors Inc.
BETZ & Co. DuPont Electronic Technologies
Circuit Foil Trading EMA Design Automation (p. 33)
Hitachi Digital Graphics (USA) Inc. Enthone Inc./Cookson Electronics (p. 33)
Gould Electronics Inc. Intercept Technology Inc. (p. 33)
LPKF Laser & Electronics Insulectro
Insulectro Mentor Graphics Corp. (p. 34)
Micron Laser Technology Inc. Kolon Scena Inc.
Ohmega Technologies Inc. Ohio Design Automation Inc.
Photo Chemical Systems Inc. MacDermid Inc. (p. 34)
Olin-Somers Thin Strip Router Solutions Inc.
PCI Sales & Marketing Inc.
PCB Material World DRILLING MACHINES – Trilogic
Photo Chemical Systems Inc.
Photo Chemical Systems Inc. MECHANICAL Zuken USA Inc.
T&K Electrical Trading Co.
Polyclad Laminates Inc./Cookson Advanced West
Electronics (p. 35)
EDA SOFTWARE – CAM
BETZ & Co. DRY-FILM PHOTORESIST – SOFTWARE
Sierra Circuits Pvt. Ltd. Burkle North America SOLDERMASK
Trisala Laminates Pvt. Ltd. Adiva Corp.
Ceco Industries Inc. BHEL
Altium Inc.
DEBURRING EQUIPMENT Hitachi Digital Graphics (USA) Inc. Enthone Inc./Cookson Electronics (p. 33)
Cadence Design Systems Inc.
Imbach Engineering PCI Specialty Chemistry Inc.
BETZ & Co. Denali Software Inc.
LPKF Laser & Electronics Photo Chemical Systems Inc.
HPT Precision Spindles & Drives Inc. Direct Logix
Northcoast Drilling DownStream Technologies (p. 32)
Photo Chemical Systems Inc.
Photo Chemical Systems Inc.
DRYERS
Electronics Workbench (p. 33)
DEFOAMERS T-Tech Inc. C. A. Litzler Co. Inc.
Frontline PCB Solutions
Integrated Process Systems Inc.
Enthone Inc./Cookson Electronics (p. 33) DRILLING SOFTWARE GraphiCode
Photo Chemical Systems Inc.
Lackwerke Peters GmbH + Co KG Intercept Technology Inc. (p. 33)
FASTechnologies Corp. Technic Inc. (p. 35)
PCI Specialty Chemistry Inc. Mentor Graphics Corp. (p. 34)
Photo Chemical Systems Inc.
Photo Chemical Systems Inc. EDA SOFTWARE – Ohio Design Automation Inc.
RBP Chemical Technology Inc. (p. 35) DRILLING SPINDLES ANALYSIS SOFTWARE Optimal Electronics Corp.
RD Chemical Co. GSI Group – Westwind Air Bearings Agilent EEsof EDA PentaLogix LLC
Technic Inc. (p. 35) HPT Precision Spindles & Drives Inc. Altium Inc. Router Solutions Inc.
Jevco International Inc. Cadence Design Systems Inc. Tecnomatix Unicam
DESMEAR CHEMISTRY Trilogic
Mohawk Innovative Technology Inc. Denali Software Inc.
Electrochemicals (p. 33) Electronics Workbench (p. 33) Valor Computerized Systems Inc.
Photo Chemical Systems Inc.
Enthone Inc./Cookson Electronics (p. 33) EMA Design Automation (p. 33) WISE Software Solutions Inc.
Points North Inc.
MacDermid Inc. (p. 34) Mentor Graphics Corp. (p. 34) Zuken USA Inc.
Photo Chemical Systems Inc. DRY-FILM DEVELOPERS – Signal Integrity Software Inc.
RBP Chemical Technology Inc. (p. 35) AQUEOUS EDA SOFTWARE –
Sigrity Inc. LAYOUT SOFTWARE
Technic Inc. (p. 35) Electrochemicals (p. 33) SynaptiCAD
Agilent EEsof EDA
DESMEAR EQUIPMENT Enthone Inc./Cookson Electronics (p. 33) TDA Systems Inc.
CAD Design Software
Insulectro Trilogic
Integrated Process Systems Inc. Cadence Design Systems Inc.
PCI Specialty Chemistry Inc. Zuken USA Inc.
Photo Chemical Systems Inc. CadSoft Computer Inc.
Photo Chemical Systems Inc.
Technic Inc. (p. 35) EDA SOFTWARE – Conversion Factors Inc.
RBP Chemical Technology Inc. (p. 35)
RD Chemical Co. AUTOROUTER SOFTWARE Electronics Workbench (p. 33)
DIAZO FILM EMA Design Automation (p. 33)
Technic Inc. (p. 35) Altium Inc.
DuPont Electronic Technologies Holophase Inc.
CAD Design Software
GMP Graphic Media Products Inc. DRY-FILM DEVELOPERS – Intercept Technology Inc. (p. 33)
Cadence Design Systems Inc.
Insulectro EQUIPMENT Mentor Graphics Corp. (p. 34)
ConnectEDA
InteliCoat Technologies Advanced West Ohio Design Automation Inc.
Electronics Workbench (p. 33)
National Graphic Supply (p. 34) BETZ & Co. R4 Systems Inc.
EMA Design Automation (p. 33)
Photo Chemical Systems Inc. Integrated Process Systems Inc. Trilogic
Mentor Graphics Corp. (p. 34)
Paramount Laminates Inc. Trilogic Zuken USA Inc.
DIRECT METALLIZATION
PROCESSES PCI Specialty Chemistry Inc. Zuken USA Inc. EDA SOFTWARE – MCM
Photo Chemical Systems Inc. DESIGN
Electrochemicals (p. 33) EDA SOFTWARE – CAD
Technic Inc. (p. 35)
Enthone Inc./Cookson Electronics (p. 33) SOFTWARE CAD Design Software
MacDermid Inc. (p. 34) Adiva Corp. Cadence Design Systems Inc.

JANUARY 2006 For updates, visit www.pcdandm.com/bguide PRINTED CIRCUIT DESIGN & MANUFACTURE 37
 20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

Harvard Thermal Inc. Router Solutions Inc. ETCHANTS – OTHER Photo Chemical Systems Inc.
Intercept Technology Inc. (p. 33) SynaptiCAD Enthone Inc./Cookson Electronics (p. 33) Process Technology
Mentor Graphics Corp. (p. 34) Trilogic General Chemical Corp. Serfilco Ltd.
Zuken USA Inc. Technic Inc. (p. 35) Technic Inc. (p. 35)
EDA SOFTWARE –
EDA SOFTWARE – UTILITIES Uyemura (p. 35) HOLE INSPECTION
PLD/FPGA SOFTWARE Altium Inc. ETCHANTS – SULFURIC SYSTEMS
Altera Corp. Cimmetry Systems Corp. PEROXIDE Ceco Industries Inc.
Altium Inc. Conversion Factors Inc. Electrochemicals (p. 33) Christopher Associates Inc.
Denali Software Inc. Electronics Workbench (p. 33) Enthone Inc./Cookson Electronics (p. 33) Integrated Reliability Test Systems (IRTS)
Electronics Workbench (p. 33) Intercept Technology Inc. (p. 33) General Chemical Corp. Micro-Vu Corp.
EMA Design Automation (p. 33) Mentor Graphics Corp. (p. 34) Photo Chemical Systems Inc. Photo Chemical Systems Inc.
Mentor Graphics Corp. (p. 34) Oztronics Technic Inc. (p. 35) Quality Control Solutions Inc.
Trilogic
ELECTROLESS ETCHBACK CHEMISTRY IMAGING EQUIPMENT
EDA SOFTWARE – CHEMISTRY CLEANERS Advanced West
PROJECT/LIBRARY Electrochemicals (p. 33)
Enthone Inc./Cookson Electronics (p. 33) Enthone Inc./Cookson Electronics (p. 33) Burkle North America
MANAGEMENT PCI Specialty Chemistry Inc. Christopher Associates Inc.
SOFTWARE General Chemical Corp.
Photo Chemical Systems Inc. Mitsubishi International Corp. Lighting Technologies International
Accelerated Designs Inc. RBP Chemical Technology Inc. (p. 35) Photo Chemical Systems Inc.
RBP Chemical Technology Inc. (p. 35)
Cadence Design Systems Inc. Technic Inc. (p. 35) Technic Inc. (p. 35) INKS – MARKING
Electronics Workbench (p. 33) Uyemura (p. 35)
EMA Design Automation (p. 33) ETCHING EQUIPMENT Coates Circuit Products – Sun Chemical
Intercept Technology Inc. (p. 33) ELECTROLESS PLATING Electrochemicals (p. 33)
CHEMISTRY Advanced West
Mentor Graphics Corp. (p. 34) BETZ & Co. Enthone Inc./Cookson Electronics (p. 33)
Omnify Software Electrochemicals (p. 33) Lackwerke Peters GmbH + Co KG
Cemco FSL
PCB Libraries Inc. Enthone Inc./Cookson Electronics (p. 33) Photo Chemical Systems Inc.
Chemcut Corp. (p. 32)
Tecnomatix Unicam Hunter Chemical LLC Technic Inc. (p. 35)
Circuit Chemistry Equipment
Trilogic MacDermid Inc. (p. 34)
Dalux Equipment Service Corp. INSOLUBLE ANODES
Zuken USA Inc. Photo Chemical Systems Inc.
Integrated Process Systems Inc.
RBP Chemical Technology Inc. (p. 35) Eltech Systems Corp.
EDA SOFTWARE – Oxford V.U.E. Inc.
Technic Inc. (p. 35) IMC
SCHEMATIC CAPTURE PTG Industries
Titan International Inc. Uyemura (p. 35)
SOFTWARE Paramount Laminates Inc.
Uyemura (p. 35)
Agilent EEsof EDA Photo Chemical Systems Inc. INSPECTION SYSTEMS
Altium Inc. ELECTROLYTIC PLATING Spraying Systems Co.
Acu-Gage Systems
CAD Design Software CHEMISTRY Technic Inc. (p. 35)
AkroMetrix LLC
Cadence Design Systems Inc. Atotech Headquarters EXPOSURE UNITS Camtek Ltd.
CadSoft Computer Inc. Electrochemicals (p. 33) Christopher Associates Inc.
Advanced West
Conversion Factors Inc. Enthone Inc./Cookson Electronics (p. 33) Ciposa
Anvik Corp.
Electronics Workbench (p. 33) General Chemical Corp. Integrated Reliability Test Systems (IRTS)
Automa-Tech, SA
EMA Design Automation (p. 33) Hunter Chemical LLC Janus Technologies Corp.
Burkle North America
Holophase Inc. MacDermid Inc. (p. 34) Micro-Vu Corp.
Colight
Intercept Technology Inc. (p. 33) PCB Prototyping Operations Technology Inc. – Optek
Dosco Products Co.
Mentor Graphics Corp. (p. 34) Photo Chemical Systems Inc. Optical Gaging Products Inc.
Douthitt Corp.
R4 Systems Inc. RBP Chemical Technology Inc. (p. 35) Orbotech Inc.
Paramount Laminates Inc.
Trilogic S1 Technology PCB Prototyping
Photo Chemical Systems Inc.
Zuken USA Inc. Technic Inc. (p. 35) Photo Chemical Systems Inc.
TJS Inc.
Titan International Inc. Quality Control Solutions Inc.
EDA SOFTWARE – Univertical Corp.
SIMULATION SOFTWARE FEEDERS/STACKERS
Uyemura (p. 35) IR FUSING CHEMISTRY
Dosco Products Co.
Agilent EEsof EDA Enthone Inc./Cookson Electronics (p. 33)
ELECTRONIC Photo Chemical Systems Inc.
Altium Inc. PCI Specialty Chemistry Inc.
MEASUREMENT DEVICES Technic Inc. (p. 35)
Applied Simulation Technology Photo Chemical Systems Inc.
Applied Wave Research BioMfg Engineers & Consultants FILM PUNCH RBP Chemical Technology Inc. (p. 35)
Cadence Design Systems Inc. Fischer Technology
American Circuit Technology IR FUSING EQUIPMENT
CST of America Inc. Integrated Reliability Test Systems (IRTS)
Billows Protocol Ltd.
Denali Software Inc. Matrix Metrologies Hamamatsu Corp.
C.A. Picard GmbH & Co. KG
Electronics Workbench (p. 33) Trek Inc. Photo Chemical Systems Inc.
Multiline Technology Inc.
EMA Design Automation (p. 33)
EMULSION PROTECTION Photo Chemical Systems Inc. LAMINATE RESINS
Harvard Thermal Inc.
FILMS Yamaha Corp. of America
Interactive Products Corp. Mitsubishi International Corp.
Intusoft 3M (p. 32) FILTER SYSTEMS Polyclad Laminates Inc./Cookson
Mentor Graphics Corp. (p. 34) InteliCoat Technologies Electronics (p. 35)
KTH Sales Inc.
R4 Systems Inc. Photo Chemical Systems Inc. Taiwan Union Technology
Photo Chemical Systems Inc.
SynaptiCAD Purex International Ltd.
ENTRY & BACKUP LAMINATES – BT
TDA Systems Inc. MATERIALS Serfilco Ltd.
Tecnomatix Unicam Hitachi Chemical Co. America Ltd.
Dosco Products Co. Technic Inc. (p. 35)
Trilogic Isola Laminate Systems
Virtio Global Laminates Inc. GOLD PLATING Mitsubishi International Corp.
Zuken USA Inc. Insulectro CHEMISTRY Nan Ya CCL
Mitsubishi International Corp. Nelco
Enthone Inc./Cookson Electronics (p. 33)
EDA SOFTWARE – Photo Chemical Systems Inc. Polyclad Laminates Inc./Cookson
Photo Chemical Systems Inc.
TRANSLATORS REService Co. Electronics (p. 35)
S1 Technology
Altium Inc. Technic Inc. (p. 35)
ETCHANTS – ALKALINE LAMINATES –
Cadence Design Systems Inc. Uyemura (p. 35)
Enthone Inc./Cookson Electronics (p. 33) COMPOSITE
ChipData
Conversion Factors Inc. General Chemical Corp. HEATERS & CONTROLLERS Global Laminates Inc.
Intercept Technology Inc. (p. 33) Old Bridge Chemicals Inc. Isola Laminate Systems
Circuit Chemistry Equipment
Mentor Graphics Corp. (p. 34) Photo Chemical Systems Inc. Paramount Laminates Inc.
Integrated Process Systems Inc.
Midwest CAD Design Inc. PCB Material World
KTH Sales Inc.

38 PRINTED CIRCUIT DESIGN & MANUFACTURE For updates, visit www.pcdandm.com/bguide JANUARY 2006
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LAMINATES – CYANATE Isola Laminate Systems Paramount Laminates Inc. LIQUID PHOTORESIST
ESTER Matsushita – EMD PCB Material World EQUIPMENT – ROLLER
Hitachi Chemical Co. America Ltd. Mitsubishi International Corp. Photo Chemical Systems Inc. COATERS
Nelco Nelco Polyclad Laminates Inc./Cookson Burkle North America
Paramount Laminates Inc. Electronics (p. 35) Technic Inc. (p. 35)
LAMINATES – EMBEDDED PCB Material World
CAPACITANCE Photo Chemical Systems Inc. LAMINATES – TEFLON MECHANICAL
DuPont Electronic Technologies Polyclad Laminates Inc./Cookson Arlon Technology Enabling Innovation MEASUREMENT DEVICES
Hitachi Chemical Co. America Ltd. Electronics (p. 35) (p. 32) AEI
Oak-Mitsui Technologies (p. 34) Trisala Laminates Pvt. Ltd. Nelco Ceco Industries Inc.
True Laminates Inc. PCB Material World Darth’s Supplies & Services
LAMINATES – EMBEDDED Rogers Corp., ACMD Micro-Vu Corp.
RESISTANCE LAMINATES – OTHER Taconic Operations Technology Inc. – Optek
DuPont Electronic Technologies Arlon Technology Enabling Innovation Taconic International Ltd. ADD Quality Control Solutions Inc.
(p. 32)
LAMINATES – EPOXY Doosan Electro-Material Co. Ltd. LAMINATION PRESSES – METALLIC FINISHES –
Accurate Plastics Inc. Mitsubishi International Corp.
HYDRAULIC COPPER (OSP)
Arlon Technology Enabling Innovation Nelco Advanced West Electrochemicals (p. 33)
(p. 32) Polyclad Laminates Inc./Cookson OEM Press Systems Inc. Enthone Inc./Cookson Electronics (p. 33)
Gee Pee Mica Pvt. Ltd. Electronics (p. 35) Photo Chemical Systems Inc. MacDermid Inc. (p. 34)
Global Laminates Inc. Taiwan Union Technology Technical Machine Products Technic Inc. (p. 35)
Hitachi Chemical Co. America Ltd. Trisala Laminates Pvt. Ltd. Uyemura (p. 35)
Insulectro LAMINATES – PAPER
Isola Laminate Systems Hitachi Chemical Co. America Ltd. LAMINATION PRESSES – METALLIC FINISHES –
VACUUM HASL
Mitsubishi International Corp. Nilu Laminates
Nelco Paramount Laminates Inc. Advanced West ACS Technologies Corp.
Nilu Laminates Burkle North America Advanced West
Paramount Laminates Inc. LAMINATES – OEM Press Systems Inc. Enthone Inc./Cookson Electronics (p. 33)
Polyclad Laminates Inc./Cookson
POLYIMIDES Operations Technology Inc. – Optek Grant Mfg & Alloying Inc.
Electronics (p. 35) Hitachi Chemical Co. America Ltd. Photo Chemical Systems Inc. Photo Chemical Systems Inc.
Polymer Plastics Corp. Isola Laminate Systems Technical Machine Products S1 Technology
Tra-Con Inc. Kaneka High Tech Materials Inc.
Nelco
LAMINATORS – REEL-TO- METALLIC FINISHES –
LAMINATES – FLEXIBLE REEL IMMERSION GOLD
PCB Material World
DuPont Electronic Technologies Polyclad Laminates Inc./Cookson Western Magnum Corp. Enthone Inc./Cookson Electronics (p. 33)
Insulectro Electronics (p. 35) MacDermid Inc. (p. 34)
LASER DIODE PUMP
Rogers Corp., ACMD Rogers Corp., ACMD Photo Chemical Systems Inc.
Coherent Inc. Printed Circuits Corp. (p. 35)
Sheldahl
LAMINATES – PREPREG Technic Inc. (p. 35)
LAMINATES – HALOGEN- LASER VIA FORMATION
Arlon Technology Enabling Innovation SYSTEMS Uyemura (p. 35)
FREE (p. 32)
Accu-Tech Laser Processing METALLIC FINISHES –
Dosco Products Co. Dosco Products Co.
Hitachi Chemical Co. America Ltd. DuPont Electronic Technologies
Anvik Corp. NICKEL-GOLD
LaserVia Corp. Enthone Inc./Cookson Electronics (p. 33)
Isola Laminate Systems Hitachi Chemical Co. America Ltd.
LPKF Laser & Electronics Printed Circuits Corp. (p. 35)
Mitsubishi International Corp. Insulectro
Micron Laser Technology Inc. Technic Inc. (p. 35)
Nan Ya CCL Isola Laminate Systems
PhotoMachining Inc. Uyemura (p. 35)
Nelco Mitsubishi International Corp.
Photo Chemical Systems Inc. Nelco LIQUID PHOTORESIST – METALLIC FINISHES –
Polyclad Laminates Inc./Cookson Paramount Laminates Inc. PRIMARY IMAGING PALLADIUM
Electronics (p. 35) Photo Chemical Systems Inc. Coates Circuit Products – Sun Chemical
Taconic International Ltd. ADD Polyclad Laminates Inc./Cookson RD Chemical Co.
Enthone Inc./Cookson Electronics (p. 33) Technic Inc. (p. 35)
Electronics (p. 35) Lackwerke Peters GmbH + Co KG
LAMINATES – Taconic International Ltd. ADD
MICROWAVE Technic Inc. (p. 35) METALLIC FINISHES –
Trisala Laminates Pvt. Ltd. Translab SILVER-BASED
Arlon Technology Enabling Innovation
(p. 32) LAMINATES – RELEASE Enthone Inc./Cookson Electronics (p. 33)
LIQUID PHOTORESIST – MacDermid Inc. (p. 34)
Nelco SHEETS SOLDERMASK
PCB Material World Accurate Plastics Inc. RD Chemical Co.
Advanced West Technic Inc. (p. 35)
Polyclad Laminates Inc./Cookson Ceco Industries Inc.
Circuit Automation Uyemura (p. 35)
Electronics (p. 35) InteliCoat Technologies
Coates Circuit Products – Sun Chemical
Rogers Corp., ACMD Polyclad Laminates Inc./Cookson METALLIC FINISHES – TIN
Electrochemicals (p. 33)
Taconic Electronics (p. 35)
Enthone Inc./Cookson Electronics (p. 33) ACS Technologies Corp.
Taconic International Ltd. ADD Sentrex Co. Inc.
Lackwerke Peters GmbH + Co KG Enthone Inc./Cookson Electronics (p. 33)
Translab PCI Sales & Marketing Inc.
LAMINATES – RESIN Grant Mfg & Alloying Inc.
LAMINATES – COATED FOIL Photo Chemical Systems Inc. IMC
MULTIFUNCTIONAL Hitachi Chemical Co. America Ltd. Technic Inc. (p. 35) MacDermid Inc. (p. 34)
Arlon Technology Enabling Innovation Nan Ya CCL RD Chemical Co.
LIQUID PHOTORESIST
(p. 32) Nelco Technic Inc. (p. 35)
EQUIPMENT – CURTAIN
CSS International Corp. Paramount Laminates Inc. COATERS Uyemura (p. 35)
Hitachi Chemical Co. America Ltd. Polyclad Laminates Inc./Cookson Spraying Systems Co. METALLIC FINISHES – TIN-
Insulectro Electronics (p. 35) NICKEL
Nan Ya CCL LIQUID PHOTORESIST
LAMINATES – RIGID EQUIPMENT – DIP ACS Technologies Corp.
Nelco
Dosco Products Co. COATERS IMC
Polyclad Laminates Inc./Cookson
Global Laminates Inc. Technic Inc. (p. 35)
Electronics (p. 35) Integrated Process Systems Inc.
Hitachi Chemical Co. America Ltd. MICROETCHANTS
LAMINATES – Insulectro LIQUID PHOTORESIST
MULTILAYERS EQUIPMENT – OTHER Electrochemicals (p. 33)
Isola Laminate Systems
3M Electronic Solutions Division (p. 32) Enthone Inc./Cookson Electronics (p. 33)
Nan Ya CCL Advanced West
Hitachi Chemical Co. America Ltd. PCI Specialty Chemistry Inc.
Nilu Laminates Photo Chemical Systems Inc.
Photo Chemical Systems Inc.

JANUARY 2006 For updates, visit www.pcdandm.com/bguide PRINTED CIRCUIT DESIGN & MANUFACTURE 39
 20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

RBP Chemical Technology Inc. (p. 35) Global Communications Rohm and Haas Electronic Materials Screaming Circuits
Technic Inc. (p. 35) Gold Circuit Sales and Service (p. 35) Sedona Board Services
Jenne Industries Dev.Co. Ltd.d. Sark Synertek Limited Select Circuits
MICROSCOPES Knight Electronics Sedona Board Services Sierra Proto Express (p. 35)
Edax Inc. Midstates Marketing SEP Co. Ltd. Southwest PCB Design Inc.
Intelligent Vision Solutions P. D. Circuits Inc. Sheldahl Strataflex Corp.
Micro-Vu Corp. Sinbon Technologies T-Tech Inc.
Quality Control Solutions Inc. PCB INSPECTION/REWORK Solectron Technology Teradyne Connection Systems
AkroMetrix LLC SOS Engineering TouchPad Design
MICROSECTIONING Blackthorn Enterprises Southwest PCB Design Inc. Trilogy Circuits Inc.
EQUIPMENT Integrated Reliability Test Systems (IRTS) Sovereign Circuits Inc. Unicircuit Inc.
Struers Inc. Janus Technologies Corp. Speedy Circuits United Electronics
MULTILAYER PRESSES Micro-Vu Corp. Starry Line Circuit Limited Vin Electronics
Microtek Labs Strataflex Corp. Westak
Advanced West Quality Control Solutions Inc. Teledyne Printed Circuit Technology
Burkle North America Quick Turn Services Teltronics Inc. PCB PROTOTYPING
LPKF Laser & Electronics ReMAPP Industrial Teradyne Connection Systems EQUIPMENT
OEM Press Systems Inc. Trilogy Circuits Inc. ACD Technologies
PCB Prototyping PCB MANUFACTURING – Varian Electronics Advanced West
Photo Chemical Systems Inc. PRODUCTION Westak BETZ & Co.
T-Tech Inc. Accutrace Inc. (p. 32) Buehler Ltd.
Winonics Inc.
Trisala Laminates Pvt. Ltd. Acronics Systems Inc. Hollmuller Maschinenbau GmbH
World Wide PCB
MULTILAYER Add-Plus International Pte. Ltd. JTAG Technologies
REGISTRATION Advanced Circuits PCB MANUFACTURING – Kuttler Automation Systems GmbH
EQUIPMENT AT&S Austria Technologie PROTOTYPE LPKF Laser & Electronics
Systemtechnik Accutrace Inc. (p. 32) Maintech Inc.
Advanced West
Axon Circuit Inc. ACDI Mania Technologie (USA) Inc.
BETZ & Co.
Bartlett Mfg. Co. Inc. Advanced Circuits OEM Press Systems Inc.
Billows Protocol Ltd.
Burkle North America Calumet Electronics Corp. Advanced Interconnection Technology PCB Prototyping
C.A. Picard GmbH & Co. KG Chain Electronics – Atlanta T-Tech Inc.
Ceco Industries Inc. China Circuit Technology (Shantou) Ambitech International Tamarack Scientific Co. Inc.
Dosco Products Co. Corp. Axon Circuit Inc. Universal Instruments
Laaper International Co. Circuit Manufacturing LLC Baselectron s.r.l.
Circuitech Beta Layout (p. 32) PCB SOFTWARE
Multiline Technology Inc. PROGRAMS
Photo Chemical Systems Inc. Clarydon Electronic Services Ltd. C&C CAD abd CAM Services Co. Ltd.
Quality Control Solutions Inc. CMR Summit Technologies (p. 32) Ceda Altium Inc.
Compeq International Century Circuits Inc. Alvarion
NICKEL ANODES CSS International Corp. Chain Electronics AutoTRAX USA Inc.
Enthone Inc./Cookson Electronics (p. 33) Delta Precision Circuits Circuit Services Worldwide LLC Avid Technologies Inc.
IMC Dynamics Research Corp. Cirexx Corp. CAD Connections
S1 Technology EECO Switch CMR Summit Technologies (p. 32) CadSoft Computer Inc.
Technic Inc. (p. 35) eFabPCB (p. 33) Compeq International ChipData
Titan International Inc. Electropac Co. Inc. Crown Circuits Circuitry Parts
Univertical Corp. Endicott Interconnect Technologies CSS International Corp. Direct Logix
Engineering Development Laboratory Delta Precision Circuits Dynamic Soft Analysis Inc.
NICKEL PLATING Inc. (EDL) Design Solutions Inc. Electronics Workbench (p. 33)
CHEMISTRY eSat Ltd. Dynamic Details Inc. (DDi) EMA Design Automation (p. 33)
Enthone Inc./Cookson Electronics (p. 33) Faraday International Limited Electropac Co. Inc. Intercept Technology Inc. (p. 33)
Hunter Chemical LLC Fine-Line Circuits Ltd. Engineering Development Laboratory Mental Automation Inc.
IMC Firan Technology Group Inc. (EDL) Mentor Graphics Corp. (p. 34)
S1 Technology Flex Interconnect Technologies (p. 33) Firan Technology Group Novarm Software
Technic Inc. (p. 35) GBM-YuanMao Electronics Co. Ltd. Flex Interconnect Technologies (p. 33) Ohio Design Automation Inc.
Univertical Corp. Global Communications Global Communications PCB Prototyping
Uyemura (p. 35) GS Praezisions AG Hallmark Circuits Inc. (p. 33) PCB123
Hitachi Chemical Co. America Ltd. Hitachi Chemical Co. America Ltd. Polar Instruments Inc.
OPTICAL COMPARATORS Imagineering Inc. (p. 33) HPT Precision Spindles & Drives Inc. R4 Systems Inc.
Changchun XinXin Optical Electron IMI Inc. Imagineering Inc. (p. 33) Sedona Research Corp.
Technology In-Tech Electronics Ltd. IMI Inc. Taylor Scheduling Software
Micro-Vu Corp. Innovative Circuits Inc. Innovative Circuits Inc. Trilogic
Optical Gaging Products Inc. Insulectro Jet Technologies Visiprise
Quality Control Solutions Inc. Juniper Circuits Inc. Juniper Circuits Inc.
Vision Engineering Inc. K & F Electronics (p. 34) K & F Electronics (p. 34)
PCB STIFFENERS
King Circuit King Circuit Compufab Inc. (p. 32)
ORGANIC SURFACE
PROTECTANTS (OSPS) Liconix Industries Inc. LPKF Laser & Electronics
Metro Circuits
PHOTOGRAPHIC FILM
Marcel Electronics International PROCESSORS
Enthone Inc./Cookson Electronics (p. 33) Multek Flexible Circuits Inc. Mass Design
Technic Inc. (p. 35) Multicircuits Inc. Merix Corp. National Graphic Supply (p. 34)
Myro Electronic Control Devices Multek Flexible Circuits Inc. Photo Chemical Systems Inc.
OVENS Precision Images LLC
Nelson Design Services Inc. Multicircuits Inc.
ACS Technologies Corp.
NexLogic (p. 34) Myro Electronic Control Devices PHOTOIMAGEABLE
Advanced West
North Texas Circuit Board Inc. NexLogic (p. 34) DIELECTRICS
Integrated Reliability Test Systems (IRTS)
NTU Electronics North Texas Circuit Board Inc.
Photo Chemical Systems Inc. Coates Circuit Products – Sun Chemical
Online Electronics Inc. (p. 34) NTU Electronics
PC BoardWorks Enthone Inc./Cookson Electronics (p. 33)
OXIDE CHEMISTRY Overnite Protos
PCB Lanka (PVT) Ltd. Lackwerke Peters GmbH + Co KG
Enthone Inc./Cookson Electronics (p. 33) PCB Fab Express (p. 35)
MacDermid Inc. (p. 34) PCB Cart PCB Cart PHOTOPLOTTERS
PCI Specialty Chemistry Inc. PCBpro PCBexpress
Cad Resources
Photo Chemical Systems Inc. Philway Products Inc. PCBpro
First EIE SA
RBP Chemical Technology Inc. (p. 35) Photocircuits Corp. Photocircuits Corp.
RD Chemical Co. Precision Technologies Inc. (p. 35) Precision Technologies Inc. (p. 35) PHOTOPLOTTERS – LASER
Technic Inc. (p. 35) Printed Circuits Corp. (p. 35) Printed Circuit Board Design & Trading Christopher Associates Inc.
Printed Circuits Inc. Printed Circuits Corp. (p. 35)
PCB DISTRIBUTORS OR Pycon Technology Philippines Inc. Procyon PCB Inc. PHOTORESIST – DRY FILM
BROKERS QDOS Flexcircuits SDN BHD Prototron Circuits Inc. Changzhou Qiangli Chemical Co. Ltd.
Fein-Line Associates Inc. Reptron Manufacturing Services Quality Circuits Inc. DuPont Electronic Technologies

40 PRINTED CIRCUIT DESIGN & MANUFACTURE For updates, visit www.pcdandm.com/bguide JANUARY 2006
20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

Enthone Inc./Cookson Electronics (p. 33) PREPREG STORAGE ROUTER BITS Enthone Inc./Cookson Electronics (p. 33)
Hitachi Chemical Co. America Ltd. SYSTEMS Best Carbide Cutting Tools Inc. Lackwerke Peters GmbH + Co KG
MacDermid Inc. (p. 34) Ceco Industries Inc. Darth’s Supplies & Services Parelec Inc.
Photo Chemical Systems Inc. Trisala Laminates Pvt. Ltd. Laaper International Co. Technic Inc. (p. 35)
Trisala Laminates Pvt. Ltd. LPKF Laser & Electronics
PREPREG TREATERS SCREENING INKS –
PHOTORESIST LIQUID Midwest Circuit Technology SOLDERMASK
C. A. Litzler Co. Inc. Photo Chemical Systems Inc.
Coates Circuit Products – Sun Chemical Simex Technologies Inc. Enthone Inc./Cookson Electronics (p. 33)
Points North Inc.
Enthone Inc./Cookson Electronics (p. 33) Lackwerke Peters GmbH + Co KG
Quality Tech Tool Inc.
Lackwerke Peters GmbH + Co KG PRESS PADS T-Tech Inc.
PCI Sales & Marketing Inc.
MacDermid Inc. (p. 34) Ceco Industries Inc. Photo Chemical Systems Inc.
Technic Inc. (p. 35) Laaper International Co. ROUTERS – BARE & Technic Inc. (p. 35)
Photo Chemical Systems Inc. POPULATED BOARDS
PLASMA DESMEAR SCRUBBERS – BRUSH
BETZ & Co.
EQUIPMENT PROCESS CONTROL R4 Systems Inc. Advanced West
March Plasma Systems EQUIPMENT BETZ & Co.
Acromag Inc. ROUTING EQUIPMENT Paramount Laminates Inc.
PLATING CHEMISTRY – Acu-Gage Systems Burkle North America
OTHER SCRUBBERS – PUMICE
Anorad, Rockwell Automation Hitachi Digital Graphics (USA) Inc.
ECI Technology Baker Technology Associates HPT Precision Spindles & Drives Inc. Advanced West
Enthone Inc./Cookson Electronics (p. 33) Blackstone Scale Systems Photo Chemical Systems Inc.
Hunter Chemical LLC
SILVER FILMS
Blackthorn Enterprises SCS Co. Ltd.
PCI Specialty Chemistry Inc. Cambridge Applied Systems DuPont Electronic Technologies
T-Tech Inc.
Photo Chemical Systems of Florida Inc. Flowserve Flow Control National Graphic Supply (p. 34)
Rhodium Masters Micro-Vu Corp. SAW BLADES Photo Chemical Systems Inc.
S1 Technology PerfecTest Corp. Midwest Accurate Grinding Service SOLDER
Technic Inc. (p. 35) Quality Control Solutions Inc. (p. 34)
Titan International Inc. Technic Inc. (p. 35) AIM
Popular Tools
TrueLogic Co. Allied Electronics
PLATING EQUIPMENT – SCORING EQUIPMENT Christopher Associates Inc.
AUTOMATIC PULSE PLATERS AccuSystems Corp. Enthone Inc./Cookson Electronics (p. 33)
Baker Technology Associates Baker Technology Associates Burkle North America IMC
Circuit Chemistry Equipment Integrated Process Systems Inc. Laaper International Co. Photo Chemical Systems Inc.
Eidschun Engineering Inc. Technic Inc. (p. 35) Photo Chemical Systems Inc. S1 Technology
Integrated Process Systems Inc. Points North Inc. Taracorp Inc.
M.E. Baker Co. PUMPS Telmec SrL The Waveroom Plus
Paramount Laminates Inc. Integrated Process Systems Inc. Titan International Inc.
Photo Chemical Systems Inc. KTH Sales Inc. SCREEN CHASES
SOLDER – SOLID
Serfilco Ltd. Photo Chemical Systems Inc. Photo Chemical Systems Inc. DEPOSITED
Technic Inc. (p. 35) Serfilco Ltd.
Technic Inc. (p. 35) SCREEN DEVELOPERS Sipad Systems Inc.
PLATING EQUIPMENT – Enthone Inc./Cookson Electronics (p. 33) SOLDER ANODES
MANUAL RECTIFIERS Photo Chemical Systems Inc.
Baker Technology Associates Enthone Inc./Cookson Electronics (p. 33)
Baker Technology Associates
Integrated Process Systems Inc. SCREEN MESH IMC
Circuit Chemistry Equipment
Knight Electronics Photo Chemical Systems Inc. Metallic Resources Inc.
Eltech Systems Corp.
Photo Chemical Systems Inc. Wire Belt Co. of America Photo Chemical Systems Inc.
Integrated Process Systems Inc.
Technic Inc. (p. 35) S1 Technology
LPKF Laser & Electronics
SCREEN PRINTERS Technic Inc. (p. 35)
PCB Prototyping
Photo Chemical Systems Inc. REGISTRATION DEK International GmbH Titan International Inc.
EQUIPMENT Interalia Inc. Univertical Corp.
Serfilco Ltd.
T-Tech Inc. American Circuit Technology Photo Chemical Systems Inc. SOLDER COATING
Technic Inc. (p. 35) Billows Protocol Ltd. T-Tech Inc. EQUIPMENT – HOT AIR
Burkle North America LEVELING
PLATING RACKS C.A. Picard, Production Technology SCREEN SQUEEGEES
ACS Technologies Corp.
Associated Rack Corp. Dosco Products Co. DEK International GmbH Advanced West
Circuit Chemistry Equipment GCA Technology International Photo Chemical Systems Inc. Gyrex Corp.
IMC Lamination Technology Integrated Process Systems Inc.
Multiline Technology Inc. SCREEN TENSION
M&B Plating Racks METERS Photo Chemical Systems Inc.
Photo Chemical Systems Inc. Photo Chemical Systems Inc.
QDOS Photo Chemical Systems Inc. SOLDER COATING
REGISTRATION PINS & EQUIPMENT – ROLLED TIN
Technic Inc. (p. 35) ACCESSORIES SCREEN WASHOUT UNITS ACS Technologies Corp.
PLATING TANKS American Circuit Technology Integrated Process Systems Inc.
Circuit Chemistry Equipment Billows Protocol Ltd. Photo Chemical Systems Inc. SOLDER CONDITIONERS
Integrated Process Systems Inc. C.A. Picard GmbH & Co. KG Enthone Inc./Cookson Electronics (p. 33)
Eastprint Inc. SCREENING EMULSIONS PCI Specialty Chemistry Inc.
KTH Sales Inc.
LPKF Laser & Electronics GMP Graphic Media Products Inc. Photo Chemical Systems Inc. Photo Chemical Systems Inc.
Photo Chemical Systems Inc. Multiline Technology Inc. RBP Chemical Technology Inc. (p. 35)
SCREENING EQUIPMENT Technic Inc. (p. 35)
T-Tech Inc. REPAIR EQUIPMENT – – MANUAL
Technic Inc. (p. 35) PCB SOLDER FLUXES
Photo Chemical Systems Inc.
POLYMER THICK FILM Christopher Associates Inc. Allied Electronics
LPKF Laser & Electronics SCREENING EQUIPMENT Enthone Inc./Cookson Electronics (p. 33)
Circuit Image Systems Inc. -AUTOMATIC
Production Basics PCI Specialty Chemistry Inc.
Coates Circuit Products – Sun Chemical
T-Tech Inc. DEK International GmbH Photo Chemical Systems Inc.
DuPont Electronic Technologies
Technic Inc. (p. 35) RBP Chemical Technology Inc. (p. 35)
Micro Invention Sd. Bhd. SCREENING INKS – RD Chemical Co.
Techni-Met Inc. ROLLERS NOMENCLATURE S1 Technology
POST-PROCESSING Abba Rubber International Inc. (p. 32) Enthone Inc./Cookson Electronics (p. 33) Technic Inc. (p. 35)
REGISTRATION SYSTEM GMP Graphic Media Products Inc. Lackwerke Peters GmbH + Co KG
Integrated Process Systems Inc. Photo Chemical Systems Inc. SOLDER LEVELERS
Burkle North America ACS Technologies Corp.
Multiline Technology Inc. PVA Unlimited Technic Inc. (p. 35)
Advanced West
PREPREG – PRODUCTION ROLLERS – RUBBER SCREENING INKS – Enthone Inc./Cookson Electronics (p. 33)
MACHINERY Abba Rubber International Inc. (p. 32) PRIMARY IMAGE Photo Chemical Systems Inc.
Dow Corning Corp. RD Chemical Co.
Multiline Technology Inc.

JANUARY 2006 For updates, visit www.pcdandm.com/bguide PRINTED CIRCUIT DESIGN & MANUFACTURE 41
 20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

SOLDER STRIPPING AQL Manufacturing Services TIN/LEAD CHEMISTRY Enthone Inc./Cookson Electronics (p. 33)
CHEMISTRY Janus Technologies Corp. CLEANERS General Chemical Corp.
Enthone Inc./Cookson Electronics (p. 33) McCurdy Circuit Supply (p. 34) Enthone Inc./Cookson Electronics (p. 33) RBP Chemical Technology Inc. (p. 35)
PCI Specialty Chemistry Inc. QA Technology Co. Inc. (p. 35) PCI Specialty Chemistry Inc. RD Chemical Co.
Photo Chemical Systems Inc. Quick Turn Services RBP Chemical Technology Inc. (p. 35)
T-Tech Inc. WASTE TREATMENT
RBP Chemical Technology Inc. (p. 35) RD Chemical Co. SYSTEMS
RD Chemical Co. Zero Defects Technic Inc. (p. 35)
Technic Inc. (p. 35) BETZ & Co.
TEST SYSTEM TOOLING PINS KTH Sales Inc.
SOLDER STRIPPING ACCESSORIES Photo Chemical Systems Inc.
American Circuit Technology
EQUIPMENT Janus Technologies Corp.
Billows Protocol Ltd. Serfilco Ltd.
Advanced West Tecnomatix Unicam Technic Inc. (p. 35)
C.A. Picard GmbH & Co. KG
Circuit Chemistry Equipment TEST SYSTEMS Ceco Industries Inc.
Photo Chemical Systems Inc. WATER TREATMENT
Darth’s Supplies & Services SYSTEMS
Technic Inc. (p. 35) BETZ & Co.
Everett Charles Technologies Midwest Circuit Technology
KTH Sales Inc.
Multiline Technology Inc.
SOLDERMASK – DRY-FILM GCA Technology International Technic Inc. (p. 35)
DuPont Electronic Technologies HDI Solutions TOOLING PRESS PLATES
Enthone Inc./Cookson Electronics (p. 33) Industrial Measurement Systems Inc. WET PROCESSING
Integrated Reliability Test Systems (IRTS) Billows Protocol Ltd. SYSTEMS – CONVEYORIZED
PCB Prototyping C.A. Picard GmbH & Co. KG
Photo Chemical Systems Inc. Janus Technologies Corp. Advanced West
JTAG Technologies Multiline Technology Inc.
Baker Technology Associates
SOLDERMASK – EPOXY Konica Minolta Corp. OEM Press Systems Inc.
Photo Chemical Systems Inc.
Luther & Maelzer Photo Chemical Systems Inc.
Coates Circuit Products – Sun Chemical Technic Inc. (p. 35)
Lackwerke Peters GmbH + Co KG Matrix Metrologies TOOLING REGISTRATION
PCI Sales & Marketing Inc. MicroCraft Inc. TABLES X-RAY INSPECTION
Photo Chemical Systems Inc. National Graphic Supply (p. 34) EQUIPMENT
Billows Protocol Ltd.
Technic Inc. (p. 35) Paramount Laminates Inc. Advanced West
Photo Chemical Systems Inc. Multiline Technology Inc.
Agilent Technologies
SOLDERMASK – LIQUID Polar Instruments Inc. TOOLS Dosco Products Co.
PHOTOIMAGEABLE Seica SpA FeinFocus USA Inc.
Allied Electronics
Coates Circuit Products – Sun Chemical W. M. Hague Co. Inc. Fischer Technology
Ceramic Technologies Inc.
Enthone Inc./Cookson Electronics (p. 33) Focal Spot Inc.
TEST SYSTEMS – T-Tech Inc.
Lackwerke Peters GmbH + Co KG Glenbrook Technologies Inc.
PCI Sales & Marketing Inc.
PROGRAMMABLE Innov-X Systems Corp. (p. 33)
UV CURING UNITS
Photo Chemical Systems Inc. Blackstone Scale Systems Matrix Metrologies
Janus Technologies Corp. Advanced West
Taiyo America Inc. Christopher Associates Inc. Multiline Technology Inc.
Technic Inc. (p. 35) JTAG Technologies Operations Technology Inc. – Optek
Luther & Maelzer Electro-Lite Corp.
Photo Chemical Systems Inc. Phoenix X-ray Systems + Services Inc.
SOLDERMASK – UV Paramount Laminates Inc. VJ Electronix
Quality Control Solutions Inc. UV Process Supply
Coates Circuit Products – Sun Chemical
Enthone Inc./Cookson Electronics (p. 33) Trilogic WARPAGE X-RAY REGISTRATION
Lackwerke Peters GmbH + Co KG W. M. Hague Co. Inc. MEASUREMENT EQUIPMENT
PCI Sales & Marketing Inc. Billows Protocol Ltd.
Photo Chemical Systems Inc.
TEST SYSTEMS – AkroMetrix LLC
SOLDERABILITY/WETTING Christopher Associates Inc. Burkle North America
Technic Inc. (p. 35) BALANCE Dosco Products Co.
WASTE TREATMENT Multiline Technology Inc.
SOLDERMASK W. M. Hague Co. Inc.
CHEMICALS Operations Technology Inc. – Optek
APPLICATION – CURTAIN
COAT TEST SYSTEMS –
SURFACE INSULATION
PCI Sales & Marketing Inc. RESISTANCE
Photo Chemical Systems Inc.
Spraying Systems Co.
W. M. Hague Co. Inc. ADVERTISING INDEX
ADVERTISER INFORMATION To learn more about the advertisers in this issue, go to
TESTERS – IN-CIRCUIT www.pcdandm.com and select “Advertiser Information” in the Magazine
SOLDERMASK
APPLICATION – ROLLER JTAG Technologies section of the home page menu. This will provide you with direct links to the home or
Midwest Circuit Technology product pages of each advertiser in this index.
PCI Sales & Marketing Inc.
Photo Chemical Systems Inc. TESTERS – OTHER
ADVERTISER PAGE # ADVERTISER PAGE #
SOLDERMASK GCA Technology International
Integrated Reliability Test Systems (IRTS) 3M 11 Innov-X Systems 31
APPLICATION – SPRAY
JTAG Technologies Accutrace 45 MacDermid 1
Advanced West K & F Electronics (p. 34)
PCI Sales & Marketing Inc. American Progressive Circuits 46 Mentor Graphics - Expedition Cover 4
Midstates Marketing
Photo Chemical Systems Inc. Polar Instruments Arlon 28 Mentor Graphics - PADS 19, 21, 23
Spraying Systems Co. Test Technology Intl. Inc. Beta Layout 30 Midwest Accurate Grinding 46
SOLDERS – NO-LEAD TIN PLATING CHEMISTRY Compufab 26 Online Electronics 45
(FOR HAL)
Enthone Inc./Cookson Electronics (p. 33) DownStream Technologies 5 PBR Seminars 20
Enthone Inc./Cookson Electronics (p. 33) General Chemical Corp.
IMC eFabPCB 13, 45 PCB Cart 45
Hunter Chemical LLC
Photo Chemical Systems Inc. IMC Electrochemicals 7 PCB Fab Express 44
PCI Specialty Chemistry Inc. Electronic Interconnect 27 PCB West 2006 16
STATIC CONTROL
Photo Chemical Systems Inc.
All-Spec Industries RD Chemical Co. Electronics Workbench Cover 2 Precision Technologies 44
Allied Electronics S1 Technology EMA Design Automation - webinar 3 QA Technology 29
Julie Static Controls Technic Inc. (p. 35)
TechMarCon Inc. EMA Design Automation - OrCAD 9 Sierra Proto Express Cover 3
Titan International Inc.
Trek Inc. EMA Design Automation - Allegro 15 Starflex Inc. 46
TIN/LEAD ANODES Enthone Inc./Cookson Electronics 25 Superior Processing 45
TAPES Enthone Inc./Cookson Electronics (p. 33)
Argon IMC Front Panel Express 46 Uyemura 18
Compass Technology Metallic Resources Inc. GHDsign 46 VetJobs 21
Insulectro Photo Chemical Systems Inc. IPC Apex 47 Vicor Corp. 46
S1 Technology
TAPING MACHINES Technic Inc. (p. 35) Imagineering 44
Start International Titan International Inc.
The advertising index is published as an additional service. The publisher does not assume
Univertical Corp.
TEST FIXTURES any liability for errors or omissions.

42 PRINTED CIRCUIT DESIGN & MANUFACTURE For updates, visit www.pcdandm.com/bguide JANUARY 2006
20 06 BUYERS GUIDE • PRODUCTS AND SERVICES

SERVICES
ASSEMBLY
ADCO Circuits
Avatar Engineering
Circuit Design Specialties Inc. (p. 32)
Design Solutions Inc.
Flex Interconnect Technologies (p. 33)
FlexOne Technologies Inc.
In-Tech Electronics Ltd.
Isis Surface Mounting
Jardon Engineering Inc.
KinTech Manufacturing Inc.
Kyocera America Inc.
MEC Midwest
Nelson Design Services Inc.
Optimum Manufacturing Services
Phoenix Designs
Printed Circuits Corp. (p. 35)
Southwest PCB Design Inc.
Teltronics Inc.
Teradyne Connection Systems
The Morey Corp.
Trilogy Circuits Inc.
CAM TOOLING
Artnet Pro Inc.
Ceda
Cimnet Systems Inc.
CMR Summit Technologies (p. 32)
Janus Technologies Corp.
Precision Images LLC
TopCAD
Tri-C Design Inc.
CERTIFIED LABORATORY
TESTING
Microtek Labs
National Technical Systems
CONSULTANTS
4th Dimension PCB Inc.
Altium Inc.
American Computer Aided Engineering
Brander International Consultants
Cadence Design Systems Inc.
CADVantage Inc.
Capitol Technologies LLC
Catalyst Sales Inc.
Circuit Search
Compudraft Engineering
Conductor Analysis Technologies Inc.
Contract Manufacturing Consultants
Inc.
Custer Consulting Group
DB Management Group
Design Chain Associates LLC
Design Solutions Inc.
Greenline Group
Howell Electronic Services
Integrated Designs
CONSULTANTS
Intercept Technology Inc. (p. 33)
Janus Technologies Corp.
KinTech Manufacturing Inc.
MLM & Associates
Montrose Compliance Services Inc.
Phoenix Designs
Sedona Board Services
Signal Integrity Software Inc.
Silent Solutions LLC
SMT Plus Inc.
Tri-C Design Inc.
Weiner & Associates Inc.
Zuken USA Inc.
DESIGN
4th Dimension PCB Inc.
ACDI
Adaptive Micro-Ware Inc.
American Computer Aided Engineering
Avatar Engineering CADParts & Consulting LLC Eastern Electronics Co., Ltd.
Avid Technologies Inc. CADVantage Inc. Flomerics
Berkshire Design Co. Ceda Harvard Thermal Inc.
Byte Design Pty. Ltd. CMR Summit Technologies (p. 32) Howell Electronic Services
CA Design Compudraft Engineering Jacyl Technology Inc.
CADParts & Consulting LLC Denali Software Inc. KinTech Manufacturing Inc.
CADVantage Inc. Design Solutions Inc. Nelson Design Services Inc.
CMR Summit Technologies (p. 32) Elcad Nikso Technologies
Compudraft Engineering EMA Design Automation (p. 33) Pacific Shores Engineering
Design Solutions Inc. Flex Interconnect Technologies (p. 33) Phoenix Designs
DPAC Technologies Corp. GlobeArt Precience Inc.
EMA Design Automation (p. 33) HiGain Design Services Rochester MicroSystems Inc.
Flex Interconnect Technologies (p. 33) Howell Electronic Services Signal Integrity Software Inc.
Fujitsu Interconnect Technologies Integrated Designs Sunrise Labs Inc.
GDA Technolgies Inc. Integrity PCB Design Inc.
GlobeArt Jacyl Technology Inc. MASS LAMINATION
Howell Electronic Services Jardon Engineering Inc. CCMP Inc.
Integrated Designs KinTech Manufacturing Inc. J-Three International Holding Co. Ltd.
Integrity PCB Design Inc. Mass Design
Jacyl Technology Inc. Nelson Design Services Inc.
PERSONNEL
RECRUITMENT
Jardon Engineering Inc. Pacific Shores Engineering
KinTech Manufacturing Inc. PCB DesignWorks Circuit Search
Optimum Design Associates Inc. Phoenix Designs NDS Associates Ltd.
Pacific Shores Engineering Printed Circuits Corp. (p. 35) PHOTOPLOTTING
Sedona Board Services Rochester MicroSystems Inc.
Southwest PCB Design Inc. Sedona Board Services Advance Reproductions Corp.
Teltronics Inc. Sintecs BV CMR Summit Technologies (p. 32)
Trident Enterprises SMT Plus Inc. Infinite Graphics
Southwest PCB Design Inc. Precision Images LLC
DESIGN SERVICE Texas PCB Design Printed Circuits Corp. (p. 35)
BUREAU Tri-C Design Inc. PLATING
4th Dimension PCB Inc. Tri-Tec Design Inc.
ACDI Kyocera America Inc.
Trident Enterprises
Altium Inc. Printed Circuits Corp. (p. 35)
American Computer Aided Engineering DRILL REPOINTING
RECYCLING & RECLAMATION
Avid Technologies Inc. Darth’s Supplies & Services
Berkshire Design Co. Global Laminates Inc.
Midwest Circuit Technology
Byte Design Pty. Ltd. S1 Technology
C&B PWB Design Services Inc. DRILLING
REPAIR
CA Design Accu-Tech Laser Processing
BB Services Inc.
CADParts & Consulting LLC Insulectro
BEST Inc.
CADVantage Inc. J-Three International Holding Co. Ltd.
Circuit Technology Center Inc.
Cadwerx PC Board Design Micron Laser Technology Inc.
Electronic Spin
Ceda
E-COMMERCE Janus Technologies Corp.
Circuit Design Specialties Inc. (p. 32)
Blackstone Scale Systems Photo Chemical Systems Inc.
CMR Summit Technologies (p. 32)
Cadtransformers.com LLC Precision Images LLC
Compudraft Engineering
EchoMail Inc. Printed Circuits Corp. (p. 35)
Design Solutions Inc.
Quick Turn Services
GHDsign (p. 33)
GlobeArt
EDUCATION/TRAINING
ROUTING
HiGain Design Services 4th Dimension PCB Inc.
Altium Inc. EMA Design Automation (p. 33)
Howell Electronic Services
American Electroplaters & Surface Pacific Shores Engineering
Integrated Designs
Integrity PCB Design Inc. Finishers SOLDERMASKING
Jardon Engineering Inc. Bogatin Enterprises
SolderMask Inc.
Layers/The House of PCB Design Cadence Design Systems Inc.
Net Results in CAD Ceda TEST
Optimum Design Associates Inc. Design Chain Associates LLC
AkroMetrix LLC
Pacific Shores Engineering EMA Design Automation (p. 33)
Delsen Testing Laboratories
Paragon Technology Inc. Flex Interconnect Technologies (p. 33)
Integrated Reliability Test Systems (IRTS)
PCB Design Express Howell Electronic Services
Janus Technologies Corp.
Print Layout Techniek ciere bv Microtek Labs
Jardon Engineering Inc.
Sedona Board Services Montrose Compliance Services Inc.
JTAG Technologies
Sysacom R&D plus inc. NextLevelEDA
Luther & Maelzer
Tri-C Design Inc. SMT Plus Inc.
Microtek Labs
Trident Enterprises TDA Systems Inc.
National Technical Systems
Trilogy Circuits Inc. Zuken USA Inc.
Quick Turn Services
Tropical PCB Design Services
ELECTRICAL TEST TOOL & DIE
UltraCAD Design Inc.
Xtera Design Services Inc. Electronic Test Center Inc.
BEM CNC
HDI Solutions
Multiline Technology Inc.
DESIGN/LAYOUT Integrated Reliability Test Systems (IRTS)
4th Dimension PCB Inc. Janus Technologies Corp. USED & REFURBISHED
ACDI Knight Electronics EQUIPMENT DEALERS
Adaptive Micro-Ware Inc. Luther & Maelzer Advanced West
Altium Inc. Billows Protocol Ltd.
ENGINEERING
American Computer Aided Engineering DoveBid
Artnet Pro Inc. Adaptive Micro-Ware Inc. Equipment Technologies Inc.
Artnet Pro Inc.
Avatar Engineering Matrix Metrologies
Avid Technologies Inc. Avatar Engineering OEM Press Systems Inc.
Berkshire Design Co. Blackstone Scale Systems Universal Instruments
Byte Design Pty. Ltd. D2M Technologies
CA Design Design Solutions Inc.

JANUARY 2006 For updates, visit www.pcdandm.com/bguide PRINTED CIRCUIT DESIGN & MANUFACTURE 43
 MARKETPLACE

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Senior PCB Specialist/Manufacturing Engineer

Vicor, a leader in power conversion technology, is seeking a Sr. PCB Specialist/Manufacturing Engineer
who will be responsible for managing and coordinating all technical issues associated with
the outsourced manufacturing of our bare Printed Circuit Boards. Among other things,
this will include both supplier selection & qualification, and material selection & qualification.

The successful candidate will possess the following qualifications:

• BSME, BSEE or equivalent
• 5- 10 years experience in Board Fabrication and/or Board Assembly along with strong industry knowledge
• Strong knowledge of DFM requirements for Board Fabrication/Assembly
• Ability to assess mechanical attributes and properties that effect PCB and package performance, manufacturability
and acceptance to requirements.

Please forward resume to: Email: hr@vicr.com • Fax: 978-749-7700 • Human Resources, Vicor Corporation,
400 Federal Street, Andover, MA 01810. For more information please visit our website at: www.vicr.com
Vicor is an Equal Opportunity Employer

PCB Shop for Lease To place a Classified

or Marketplace ad,
Turnkey Operation in Franklin NH.
please contact:
Formerly known as
Flexible Circuits, Inc. and ACSI. Kamden Robb
Shop Floor approx. 15,000sf, 678-589-8843
additional 10,000sf for office area
and light assembly also available. krobb@upmediagroup.com
Facility Lease $2.50/sf NNN
($3125/mo.)
or
Equipment in place and in operating Wes Gifford
condition – Lease/Purchase
678-589-8805
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46 PRINTED CIRCUIT DESIGN & MANUFACTURE JANUARY 2006

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February 8–10, 2006

Wednesday, Thursday and Friday
ANAHEIM CONVENTION CENTER, ANAHEIM, CA
e-mail: shows@ipc.org • www.GoIPCShows.org
 NO MYTHS ALLOWED
Riddle Me This
Why do engineers fear the 90˚ bend? Do corners really cause reflections?
DO YOU THINK a 90˚ bend in a trace will
affect a signal and cause problems? Of
the thousands of engineers I’ve taught,
about half admit to harboring this con-
cern. I think I know why.
It is absolutely correct that in sensi-
tive analog microwave circuits built on
DR. ERIC thick Teflon substrates, a 90˚ bend in a
BOGATIN trace can sometimes affect circuit perfor-
mance. I suspect that a number of early
board designers were exploring the
design of serpentine delay lines and discovered the huge
problem a pair of 90˚ corners could create. But what is a
90˚ corner’s impact on high-speed digital circuits?
As part of a series of demo boards for my public classes,
I designed a simple serpentine line, which, if unwound,
would be 21˝ long (FIGURE 1). This yields a delay of about
3.5 nsec. The line has a characteristic impedance of roughly
50 Ω. Each leg is 3˝ long and there are seven segments. The
time delay of each segment is about 0.5 nsec. At the end of
each segment are two 90˚ bends, very close together.
If we send a very fast rising signal into this serpentine,
what would we expect to see as the reflected signal? Of
course, the reflected signal displayed on a TDR is caused by
the incident edge reflecting off of impedance discontinuities.
As it propagates down the serpentine, the signal will see a
uniform 50 Ω line and no reflection for the first 3 inches.
Then, the fast edge will see the first pair of corners.
How will a corner affect a signal? Some believe that
electrons zipping around the bend at nearly the speed of
light will slow down, cause excessive radiation and
crosstalk, which will cause an impedance discontinuity and
losses in the transmitted signal.
This is totally wrong.
A corner will affect a signal by changing the instantaneous
impedance the signal sees. Of course, if the line width were con-
stant, there would be no change in the instantaneous impedance
and no reflection. It’s the presence of the extra metal associated
with the corner that adds capacitance at the corner, causing a
drop in impedance and a negative reflected voltage.
The two corners at each 3˝ interval will have twice the
capacitance of one bend and should give rise to a negative
reflected signal. If corners affect signals, we should see a
reflection from the first bend, after about 1 nsec. This is
FIGURE 1. A 50 Ω serpentine microstrip, with seven legs each 3˝ in
length. Images courtesy of GigaTest Labs.
48 PRINTED CIRCUIT DESIGN & MANUFACTURE
half a nanosecond for the edge to go down, and half a
nanosecond for the reflection to make it back to the TDR.
FIGURE 2 is the measured TDR response from this ser-
pentine trace. Sure enough, there is a negative dip after 1
nsec, a pretty large reflection. The reflected voltage is about
40 mV, with an incident signal of 200 mV. This is a 20%
reflection, with a rise time of about 50 psec.
We would expect that each of the double bends should
show a similar reflection as the fast edge hits it. Sure
enough, every 1 nsec there is an additional reflected signal –
6 in all. But if the reflections we see are from corners, why
does the peak value drop off with each corner?
The magnitude of the reflection will depend on the rise
time of the signal and the amount of capacitance in each
pair of corners. If the geometry is the same for each bend,
the capacitance is the same. What could cause the rise time
to increase with each corner? One possibility is the losses in
the FR-4. As the edge propagates down this 21˝ intercon-
nect, the rise time will get longer, and the magnitude of the
reflection from each capacitor will get lower.
The measured response from this serpentine is exactly
like what we would expect if the reflections were caused by
the corners. And the magnitude is huge: 20% with a 50
psec edge. This certainly seems to demonstrate that corners
cause reflections, and large ones at that.
I think this observation is what leads many engineers to
believe corners cause reflections and should be avoided. But
is this the right explanation?
Here is your challenge: Can you come up with another
possible explanation for these dips in the reflected signal?
E-mail me your answers and in two months I will report
some of your responses in this column. I look forward to
hearing from you. PCD&M
ERIC BOGATIN is the CTO of IDI and president of Bogatin
Enterprises; eric@bethesignal.com.
FIGURE 2. Measured TDR and TDT responses
from the test serpentine line.
JANUARY 2006
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