Professional Documents
Culture Documents
Specification Update
May 2010
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel High Definition Audio requires a system with an appropriate Intel chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers and speakers. For more information about Intel HD audio, refer to http://www.intel.com/. I2C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation. Intel, Intel System Controller Hub (Intel SCH), and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright 20082010, Intel Corporation. All Rights Reserved.
Specification Update
Contents
Preface ......................................................................................................................5 Summary Tables of Changes......................................................................................6 Identification Information .........................................................................................8 Device and Revision Identification.............................................................................9 Intel SCH Component High-Level Feature Comparison........................................... 11 Errata ...................................................................................................................... 12 Specification Changes.............................................................................................. 17 Specification Clarifications ...................................................................................... 18 Documentation Changes .......................................................................................... 19
Specification Update
Revision History
Revision Number
-001 Initial release
Description
Revision Date
April 2008
-002
Added Errata 12 - 17 Specification Changes: Added support for 2 GB DRAM and 2 Gb devices; changed supported MMC specification to 4.1; updated CLKREQ# and SMB_ALERT# behavior Specification Clarifications: Corrected PMBL register default value; added RTC_Xn input DC Specifications Added Erratum 18 Added Errata 19 - 20 Added New Stepping Identification Information Specification Clarifications: Added note to RTCRST# pin description Added Errata 21 - 22 Specification Clarifications: Definition of SDIO bit PSTATE.WP; Non-Snoop Cycles Specification Clarifications: Correction of LVDS output levels in Reset, Post-Reset; Correction of UHCI Resume Enable Register Added Erratum 23 Specification Clarifications: Removed WAKEEN; corrected Resume well GPIO defaults; clarified other registers in the Resume well
July 2008
August 2008 September 2008 November 2008 December 2008 March 2009
-008
June 2009
Specification Update
Preface
Preface
This document is an update to the specifications contained in the Affected Documents/ Related Documents table below. This document is a compilation of device and documentation errata. It is intended for hardware system manufacturers and software developers of applications, operating systems, or tools. Information types defined in Nomenclature are consolidated into the specification update and are no longer published in other documents. This document may also contain information that was not previously published.
Nomenclature
Errata are design defects or errors. These may cause the Intel SCH behavior to deviate from published specifications. Hardware and software designed to be used with any given stepping assumes that all errata documented for that stepping are present on all devices. Specification Changes are modifications to the current published specifications. These changes will be incorporated in any new release of the specification. Specification Clarifications describe a specification in greater detail or further highlight a specifications impact to a complex design situation. These clarifications will be incorporated in any new release of the specification. Documentation Changes include typos, errors, or omissions from the current published specifications. These will be incorporated in any new release of the specification.
Specification Update
Status
Doc: Plan Fix: Fixed: No Fix: Document change or update will be implemented. This erratum may be fixed in a future stepping of the product. This erratum has been previously fixed. There are no plans to fix this erratum.
Row
Shaded: This item is either new or modified from the previous version of the document.
Specification Update
Errata
Stepping No. D1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X D2 X X X X X X No Fix No Fix No Fix No Fix No Fix No Fix Fixed Fixed No Fix Fixed No Fix Fixed Fixed Plan Fix Fixed Fixed Fixed Fixed No Fix No Fix No Fix No Fix No Fix Audio Pops With High LPC Traffic System Hang With PCIe Upstream Memory Write To FEE00000 With No Data PCIe PLL May Not Power Down In L1 State EHCI ControllerUnable To Mask Wake Events Per Port PCIe Controller Fails To Go Into L1 State In Some Configurations High Definition Audio Does Not Send Interrupts to the CPU using the MSI Incorrect TPM Access LPC Prefetch Outside of FWH Region PATA Maximum Slew Rate Specification Violation USB Client Drops Data Which Causes CRC Errors in Full-Speed Mode System Hang During PCI Configuration Space Access HD Audio Wall Clock Counter Alias Register Reads From the HD Audio Wall Clock Counter Return the Same Value SDIO CMD53 Timeout SDIO Data Buffer Port 20h Read Error Deadlock Causes Hang Condition Entering L1 Unrecognized USB Device PCIE PCIHCT WHQL test hang EHCI Controller Hang PCIe Bridge Detects Correctable Errors During Tests HDCTL and FD registers are reset during D3hot to D0 transition High-speed USB 2.0 VHSOH PCIe Hang Due To Link Disconnect Status Description
Specification Changes
No. 1 SPECIFICATION CHANGES There are no specification changes in this revision of the specification update.
Specification Clarifications
No. 1 SPECIFICATION CLARIFICATIONS There are no specification changes in this revision of the specification update.
Documentation Changes
No. 1 DOCUMENTATION CHANGES There are no specification changes in this revision of the specification update.
Specification Update
Identification Information
Identification Information
Stepping D1 D1 D1 D2 D2 D2 D2
Notes Thin Core (2.08 mm Package Height) Thin Core (2.08 mm Package Height) Thin Core (2.08 mm Package Height) Thin Core (2.08 mm Package Height) Thin Core (2.08 mm Package Height) Thin Core (2.08 mm Package Height) Thin Core (2.08 mm Package Height)
Specification Update
Attribute: Size:
RO 16 bits
Bit
Description Device ID (DID): This is a 16-bit value assigned to the controller. The lower 3 bits of this register are determined by fusing.
Component UL11L US15L US15W US15X DID 8101 8101 8100 8100
15:0
8100 8107h RO
Attribute: Size:
RO 16 bits
Bit
Description Device Identification Number (DID): The lower 3 bits of this register are determined by a fuse. 000b for the UMPC SKU and 001 for MID SKU.
15:0
8108 810Fh RO
Specification Update
Attribute: Size:
RO 8 bits
Bit
Description Revision ID (RID): Matches the value of the RID register in the LPC bridge.
7:0
RO
RID 06
Quality Sample QS
Stepping D1
10
Specification Update
Description External Graphics (on PCI Express*) HW Video Decode HD Support SDVO second Display port Gfx or Display SW capability (LVDS Internal Display Resolution) DRAM Clock pairs DDR/FSB Frequency Memory ranks supported PCI Express Graphics Frequency TDP1 Note:
1Assumes
US15X Enabled High Definition Enabled 0 = All resolutions supported on internal display SM_CK1, SM_CK0 533/400 MHz 2 Port 0, 1 266 MHz 2.5 W
US15W Enabled High Definition Enabled 0 = All resolutions supported on internal display SM_CK1, SM_CK0 533/400 MHz 2 Port 0, 1 200 MHz 2.3 W
US15L Enabled High Definition Enabled 0 = All resolutions supported on internal display SM_CK1, SM_CK0 533/400 MHz 2 Port 0, 1 200 MHz 2.3 W
UL11L Disabled Standard Definition Disabled 1 = Maximum display resolution on internal display limited to 800x480 SM_CK0 400 MHz 1 Port 0 only 100 MHz effective 1.6 W
Specification Update
11
Errata
Errata
1.
Problem: Implication:
Workaround: None. LPC utilization is fairly low after BIOS has been shadowed and should not affect audio play back. Status: For the steppings affected, see the Summary Tables of Changes.
2.
Problem:
System Hang With PCIe Upstream Memory Write To FEE00000 With No Data
When a PCI Express device initiates a FEE00000 write with all byte enable disabled, the Intel SCH turns it into an MSI write, but the Intel SCH continues to wait for a data payload that does not exist. System may hang. This is a PCI Express compliance violation. For the steppings affected, see the Summary Tables of Changes.
Implication: Status:
Workaround: None. Downstream devices should not initiate these types of transactions.
3.
Problem: Implication:
4.
Problem: Implication: Status:
Workaround: None
5.
Problem: Implication:
Workaround: If only one PCIe port is needed in a design, use Port 0 and function disable Port 1. If two PCIe ports exist on the platform, use port 0 first. Status: For the steppings affected, see the Summary Tables of Changes.
12
Specification Update
Errata
6.
Problem: Implication: Status:
High Definition Audio Does Not Send Interrupts to the CPU When Using the MSI
The HDA unit cannot send interrupts to the CPU when using the MSI. OS or media applications will revert to the legacy method to send interrupts. For the steppings affected, see the Summary Tables of Changes.
Workaround: None
7.
Problem: Implication:
8.
Problem:
Implication:
Workaround: Disable BIOS prefetching by setting D31:F0, offset D8h, bit 8 = 0. Overall boot time may increase. This workaround is only required when using devices that do not allow prefetching (such as TPM modules). Status: For the steppings affected, see the Summary Tables of Changes.
9.
Problem:
Implication:
10.
Problem:
Implication:
Workaround: Use USB 2.0 host only with the current USB Client driver to continue USB Client application development and validation. The PV USB Client driver will have an infrastructure that the OEM user-mode application can use to take the appropriate action if the client is connected to a full-speed host.
Specification Update
13
Errata
Status:
11.
Problem:
Implication:
12.
Problem:
Implication: The Wall Clock counter registers are used to synchronize two or more HD audio controllers. Systems based on the Intel SCH will only support a single audio controller and no multi-controller synchronization is required. Workaround:Do not use the aliased register. Status: For the steppings affected, see the Summary Tables of Changes.
13.
Problem:
Reads From the HD Audio Wall Clock Counter Return the Same Value
Consecutive reads of the wall clock counter will, under some circumstances, return the same value.
Implication: The Wall Clock counter register is used to synchronize two or more HD audio controllers by measuring the relative drift between their clocks. Systems based on Intel SCH will only support a single audio controller and no multi-controller synchronization is required. No end user impact is expected. Workaround:None Status: For the steppings affected, see the Summary Tables of Changes.
14.
Problem:
Implication: An SD counter reset occurs after the response completion and at the start of the data, but if data starts (as allowed by the SDIO specification), prior to the response completion the counter does not get reset and time out error occurs. Workaround:Use block mode transfer. Status: For the steppings affected, see the Summary Tables of Changes.
15.
Problem:
14
Specification Update
Errata
Implication: In PIO mode at the time of an upstream SDIO completion cycle, a downstream completion targeting any other Intel SCH Quality device/controller causes the SDIO data to be forced to 0 on the FSB I/F, hence CPU reads/shows a 0 (zero). Workaround:Use only DMA mode transfer. Status: For the steppings affected, see the Summary Tables of Changes.
16.
Problem:
Implication: If a downstream device requests to go into L1 and the link goes to recovery before L1 is entered, the Intel SCH will experience an internal deadlock, thus hanging the system. Workaround:If the system hangs while running a device that may request entry to L1, disable L1. Status: For the steppings affected, see the Summary Tables of Changes.
17.
Problem:
Implication: USB devices can fail to be reported to the end user by the OS. USB devices can fail to operate during operation. Workaround:Set target voltage for the Intel SCH VCC (core voltage) to 1.10V +/-5%. See the table below for updated specifications on affected voltage planes.
Voltage Rail Intel SCH VCC (core) Intel SCH VTT (FSB I/O) CPU VCCP & CPU VCCPC6 (FSB I/O) Minimum -5% -10% -10% Voltage Set Point 1.1V 1.1V 1.1V Maximum +5% +5% +5%
Status:
18.
Problem: Implication: Status:
19.
Problem:
Implication:
Workaround: BIOS should remove all accesses to the listed PCI config registers while the schedule is running, except for 0xC0 (function disable) which can be done before EHCI init. Specialized software that accesses PCI configuration space should be avoided, or modified to avoid these registers. Status: For the steppings affected, see the Summary Tables of Changes.
Specification Update
15
Errata
20.
Problem:
Implication:
21.
Problem:
Implication:
Workaround: BIOS can add ACPI methods (_PS0 specifically) for the HDA Controller to program the following bits during the D3 to D0 transition: Bus 0, Device 27, Function 0, offset 40h. Bit 0 should be 1 to enable Low Voltage (1.5V) mode (needed for 1.5V I/O systems) Bus 0, Device 27, Function 0, offset FCh. Bit 1 should be 1 to disable MSI capability Status: For the steppings affected, see the Summary Tables of Changes.
22.
Problem: Implication: Status:
Workaround: None.
23.
Problem:
Implication: This corruption will subsequently result in system retry failures that will lead to a system hang at an undetermined time. Workaround:PCIe Express Card devices should be plugged in only when the system is powered off or in a suspend state. All attached PCIe devices should keep the PCIe link connected at all times. Status: For the steppings affected, see the Summary Tables of Changes.
16
Specification Update
Specification Changes
Specification Changes
There are no specification changes in this revision of the specification update.
Specification Update
17
Specification Clarifications
Specification Clarifications
There are no specification clarifications in this revision of the specification update.
18
Specification Update
Documentation Changes
Documentation Changes
There are no documentation changes in this revision of the specification update.
Specification Update
19