SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES

SDLS033 DECEMBER 1983 REVISED MARCH 1988

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1988, Texas Instruments Incorporated

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 DECEMBER 1983 REVISED MARCH 1988

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 DECEMBER 1983 REVISED MARCH 1988

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 DECEMBER 1983 REVISED MARCH 1988

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08 SN7408, SN74LS08, SN74S08 QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 DECEMBER 1983 REVISED MARCH 1988

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

23-Mar-2012

PACKAGING INFORMATION
Orderable Device JM38510/08003BCA JM38510/08003BDA JM38510/08003BDA JM38510/31004B2A JM38510/31004B2A JM38510/31004BCA JM38510/31004BCA JM38510/31004BDA JM38510/31004BDA JM38510/31004SCA JM38510/31004SCA JM38510/31004SDA JM38510/31004SDA M38510/08003BCA M38510/08003BCA M38510/08003BDA M38510/08003BDA M38510/31004B2A M38510/31004B2A M38510/31004BCA M38510/31004BCA M38510/31004BDA M38510/31004BDA M38510/31004SCA M38510/31004SCA M38510/31004SDA M38510/31004SDA SN54LS08J SN54LS08J SN54S08J Status
(1)

Package Type Package Drawing CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP CDIP CDIP CFP CFP CDIP CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP CDIP CDIP CFP CFP CDIP CDIP CDIP J W W FK FK J J W W J J W W J J W W FK FK J J W W J J W W J J J

Pins 14 14 14 20 20 14 14 14 14 14 14 14 14 14 14 14 14 20 20 14 14 14 14 14 14 14 14 14 14 14

Package Qty 1 1 1 1 1 1 1 1 1 25 25 25 25 1 1 1 1 1 1 1 1 1 1 25 25 25 25 1 1 1

Eco Plan TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

(2)

Lead/ Ball Finish A42 A42 A42

MSL Peak Temp N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 A42 A42 A42 A42 A42 A42 A42 A42 A42 A42 A42 N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 A42 A42 A42 A42 A42 A42 A42 A42 A42 A42 N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

23-Mar-2012

Orderable Device SN54S08J SN7408N SN7408N SN7408N3 SN7408N3 SN74LS08D SN74LS08D SN74LS08DBR SN74LS08DBR SN74LS08DBRE4 SN74LS08DBRE4 SN74LS08DBRG4 SN74LS08DBRG4 SN74LS08DE4 SN74LS08DE4 SN74LS08DG4 SN74LS08DG4 SN74LS08DR SN74LS08DR SN74LS08DRE4

Status

(1)

Package Type Package Drawing CDIP PDIP PDIP PDIP PDIP SOIC SOIC SSOP SSOP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC SOIC J N N N N D D DB DB DB DB DB DB D D D D D D D

Pins 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14

Package Qty 1

Eco Plan TBD TBD TBD TBD TBD

(2)

Lead/ Ball Finish A42 Call TI Call TI Call TI Call TI

MSL Peak Temp N / A for Pkg Type Call TI Call TI Call TI Call TI

(3)

Samples (Requires Login)

ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

50 50 2000 2000 2000 2000 2000 2000 50 50 50 50 2500 2500 2500

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

23-Mar-2012

Orderable Device SN74LS08DRE4 SN74LS08DRG4 SN74LS08DRG4 SN74LS08J SN74LS08J SN74LS08N SN74LS08N SN74LS08N3 SN74LS08N3 SN74LS08NE4 SN74LS08NE4 SN74LS08NSR SN74LS08NSR SN74LS08NSRE4 SN74LS08NSRE4 SN74LS08NSRG4 SN74LS08NSRG4 SN74S08D SN74S08D SN74S08DE4 SN74S08DE4

Status

(1)

Package Type Package Drawing SOIC SOIC SOIC CDIP CDIP PDIP PDIP PDIP PDIP PDIP PDIP SO SO SO SO SO SO SOIC SOIC SOIC SOIC D D D J J N N N N N N NS NS NS NS NS NS D D D D

Pins 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14

Package Qty 2500 2500 2500

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI Call TI Call TI

25 25

Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type Call TI Call TI Call TI Call TI

25 25 2000 2000 2000 2000 2000 2000 50 50 50 50

Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

23-Mar-2012

Orderable Device SN74S08DG4 SN74S08DG4 SN74S08J SN74S08J SN74S08N SN74S08N SN74S08N3 SN74S08N3 SN74S08NE4 SN74S08NE4 SNJ54LS08FK SNJ54LS08FK SNJ54LS08J SNJ54LS08J SNJ54LS08W SNJ54LS08W SNJ54S08FK SNJ54S08FK SNJ54S08J SNJ54S08J SNJ54S08W SNJ54S08W
(1)

Status

(1)

Package Type Package Drawing SOIC SOIC CDIP CDIP PDIP PDIP PDIP PDIP PDIP PDIP LCCC LCCC CDIP CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP D D J J N N N N N N FK FK J J W W FK FK J J W W

Pins 14 14 14 14 14 14 14 14 14 14 20 20 14 14 14 14 20 20 14 14 14 14

Package Qty 50 50

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI Call TI Call TI

25 25

Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type Call TI Call TI Call TI Call TI

25 25 1 1 1 1 1 1 1 1 1 1 1 1

Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 A42 A42 A42 N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 A42 A42 A42 N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

23-Mar-2012

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS08, SN54LS08-SP, SN54S08, SN74LS08, SN74S08 :

Catalog: SN74LS08, SN54LS08, SN74S08 Military: SN54LS08, SN54S08 Space: SN54LS08-SP

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product Military - QML certified for Military and Defense Applications Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 5

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Jul-2009

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SSOP SOIC SO DB D NS 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 16.4 16.4 16.4 8.2 6.5 8.2

B0 (mm) 6.6 9.0 10.5

K0 (mm) 2.5 2.1 2.5

P1 (mm) 12.0 8.0 12.0

W Pin1 (mm) Quadrant 16.0 16.0 16.0 Q1 Q1 Q1

SN74LS08DBR SN74LS08DR SN74LS08NSR

2000 2500 2000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Jul-2009

*All dimensions are nominal

Device SN74LS08DBR SN74LS08DR SN74LS08NSR

Package Type SSOP SOIC SO

Package Drawing DB D NS

Pins 14 14 14

SPQ 2000 2500 2000

Length (mm) 346.0 346.0 346.0

Width (mm) 346.0 346.0 346.0

Height (mm) 33.0 33.0 33.0

Pack Materials-Page 2

MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001

DB (R-PDSO-G**)
28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M

PLASTIC SMALL-OUTLINE

0,25 0,09 5,60 5,00 8,20 7,40

Gage Plane 1 A 14 0 8 0,25 0,95 0,55

Seating Plane 2,00 MAX 0,05 MIN 0,10

PINS ** DIM A MAX

14

16

20

24

28

30

38

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30 4040065 /E 12/01

NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Mobile Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Applications Automotive and Transportation www.ti.com/automotive Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2012, Texas Instruments Incorporated