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IGBT
Insulated Gate
Bipolar Transistor
Pin Configuration
Absolute Maximum Ratings YY = Year Sealed
YYWW
Parameter Value WW = Week Sealed
GN2470 L = Lot Number
Collector-to-emitter voltage 700V LLLLLLL = “Green” Packaging
Gate-to-emitter voltage ±20V
TO-252 (D-PAK) (K4)
Operating junction and storage
-55 C to +150 C
O O
temperature range
Soldering temperature* 300OC
Absolute Maximum Ratings are those values beyond which damage to the device may
occur. Functional operation under these conditions is not implied. Continuous operation
of the device at the absolute rating level may affect device reliability. All voltages are
referenced to device ground.
Thermal Characteristics
IC IC Power Dissipation θjc θja
Package
(continuous) (pulsed) @TA = 25OC (OC/W) (OC/W)
Electrical Characteristics (T A
= 25OC unless otherwise specified)
VDD
10% 10% D.U.T.
OUTPUT INPUT
0V 90% 90%
1.5
Current (A)
1.0
G
0.5
0.0
-0.5 E
-1.00E-05 -5.00E-06 0.00E+00 5.00E-06 1.00E-05
Time (5µ s/div)
Saturation Characteristics
5.0
VGE=10V
4.5
4.0 VGE=9V
3.5
3.0 VGE=8V
IC (A)
2.5
VGE=7V
2.0 VGE=6V
1.5
VGE=5V
1.0
VGE=4V
0.5
0.0
0 2 4 6 8 10
VCE (V)
Transfer Characteristics
5.0
4.5 -55oC
o
4.0 25 C
3.5
3.0
125oC
IC (A)
2.5
2.0
1.5
1.0
0.5
0.0
0 1 2 3 4 5 6 7 8 9 10
VGE (V)
0.9
0.5
0.8
0.4
0.7
0.3
0.6 VGE(th) @1mA
0.2
0.5
0.1
0.4
0.0
0.3
-55 -25 0 25 50 75 100 125 150
0.2 o
Temperature ( C)
0.1
0.0
-55 -25 0 25 50 75 100 125 150
Temperature (oC)
1.10
1.15
BVCES (normalized)
1.05
1.10
1.00
BVCES @250uA
BVCES (normalized)
1.05
0.95
1.00
0.90
BVCES @250uA
0.95
0.85
0.90
0.80
0.85-55 -25 0 25 50 75 100 125 150
Temperature (oC)
0.80
Transconductance
-55 vs.
-25 Collector
0 Current
25 50 75 100 125 150
o
1.2 Temperature ( C)
-55oC
1.1
1.0
0.9
0.8
Gfs (siemens)
0.7 25oC o
125 C
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0 2.3 2.5 2.8 3.0 3.3 3.5
IC (A)
4 L3
θ1
D1 H
1 2 3 L4
L5
Note 1
b2 View B
e b
Gauge
Plane A1
Seating
L2 Plane
θ
L
L1
View B
Note:
1. Although 4 terminal locations are shown, only 3 are functional. Lead number 2 was removed.
Symbol A A1 b b2 b3 c2 D D1 E E1 e H L L1 L2 L3 L4 L5 θ θ1
MIN .086 .000* .025 .030 .195 .018 .235 .205 .250 .170 .370 .055 .035 .025* .045 0O
0O
Dimen-
.090 .108 .020
sion NOM - - - - - - .240 - - - - .060 - - - - -
BSC REF BSC
(inches)
MAX .094 .005 .035 .045 .215 .035 .245 .217* .265 .182* .410 .070 .050 .040 .060 10 O
15O
JEDEC Registration TO-252, Variation AA, Issue E, June 2004.
* This dimension is not specified in the original JEDEC drawing. The value listed is for reference only.
Drawings not to scale.
Supertex Doc. #: DSPD-3TO252K4, Version D081408.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives an
adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability to the
replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and specifications
are subject to change without notice. For the latest product specifications refer to the Supertex inc. website: http//www.supertex.com.